CN101954552B - Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal - Google Patents

Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal Download PDF

Info

Publication number
CN101954552B
CN101954552B CN2010100012246A CN201010001224A CN101954552B CN 101954552 B CN101954552 B CN 101954552B CN 2010100012246 A CN2010100012246 A CN 2010100012246A CN 201010001224 A CN201010001224 A CN 201010001224A CN 101954552 B CN101954552 B CN 101954552B
Authority
CN
China
Prior art keywords
brazing flux
filler metal
brazing
copper
brazing filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2010100012246A
Other languages
Chinese (zh)
Other versions
CN101954552A (en
Inventor
庄鸿寿
刘占忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Sansheng Electric Co., Ltd
Original Assignee
FOSHAN SHUNDE SANSHENG ELECTRICAL MANUFACTURE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FOSHAN SHUNDE SANSHENG ELECTRICAL MANUFACTURE Co Ltd filed Critical FOSHAN SHUNDE SANSHENG ELECTRICAL MANUFACTURE Co Ltd
Priority to CN2010100012246A priority Critical patent/CN101954552B/en
Publication of CN101954552A publication Critical patent/CN101954552A/en
Application granted granted Critical
Publication of CN101954552B publication Critical patent/CN101954552B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Nonmetallic Welding Materials (AREA)

Abstract

The invention provides a novel non-corrosive brazing flux used for a silver brazing filler metal or a copper-phosphorus-silver brazing filler metal, and aims to solve the technical problems of easy moisture absorption, easy caking, toxic gas generation, corrosivity and the like of the brazing flux in the prior art. The brazing flux provided by the invention comprises the following components in percentage by weight: 10 to 40 percent of lithium fluoride, 20 to 50 percent of boron anhydrous and the balance of potassium tetraborate. Matched with the corresponding brazing filler metal, the brazing flux of the invention is suitable for brazing of low-carbon steel, stainless steel, copper and copper alloys.

Description

A kind of novel non-corrosiveness brazing flux that is used for silver solder or Cu-P-Ag solder
Technical field
The present invention relates to a kind of novel non-corrosiveness brazing flux that is used for silver solder or Cu-P-Ag solder, specially refer to nonhygroscopic, do not lump, do not produce poison gas, non-corrosive a kind of environmental type brazing flux.
Background technology
Current, most widely used brazing flux is QJ102 when adopting silver solder or Cu-P-Ag solder soldering stainless steel, carbon steel, copper and copper alloy, and it is formed part (percentage by weight) and is: 35% boric anhydride (B 2O 3), 42% potassium fluoride (KF), 23% 4 potassium fluorozirconate (KBF 4); External this type brazing flux of being sold contains KHF toward contact except that mentioned component 2
The component of this type brazing flux in use following problem can occur:
Fluoride KF is the moisture absorption very easily, causes the very fast moisture absorption caking of powdery brazing flux, preserves in the time of can not growing, and is particularly outstanding in the humid area; Fluoride KBF 4(or) KHF 2In soldering heating process, decompose, produce toxic gas BF 3Or HF steam, the harm operator ' s health; Fluoride KF is corrosive, and makes the brazing flux residue after the soldering play corrosiveness to workpiece, must clean up, and produces and the wastewater treatment operation thereby increase.
Summary of the invention
For solving the deficiency of this type brazing flux existence that is proposed in the background technology, the present invention proposes a kind of novel non-corrosiveness brazing flux that can overcome above-mentioned deficiency fully.
Technical scheme of the present invention is following:
1, be used for a kind of novel non-corrosiveness brazing flux of silver solder or Cu-P-Ag solder, it is characterized in that, the constituent of this brazing flux (percentage by weight) as follows:
Lithium fluoride 10-40%
Boric anhydride 20-50%
The dipotassium tetraborate surplus
The preferred composition (percentage by weight) of above-mentioned brazing flux does
Lithium fluoride 15-30%
Boric anhydride 25-35%
The dipotassium tetraborate surplus
2, above-mentioned novel non-corrosiveness brazing flux can be made into powdery or paste use.
3, above-mentioned novel non-corrosiveness brazing flux cooperates corresponding solder to be applicable to soldering mild steel, stainless steel, copper or copper alloy.
The characteristics of novel non-corrosiveness brazing flux of the present invention are to utilize active good lithium fluoride (LiF) to substitute the KBF that adopts usually in this type brazing flux 4, KHF 2And KF.LiF is nonhygroscopic, just can not cause the moisture absorption that brazing flux caused, the agglomeration problems that contains the KF component; LiF can not decompose in soldering heating process, just can not cause to contain KBF 4, KHF 2The brazing flux of component is separated out the problem of toxic gas in heating process; LiF does not play corrosiveness to workpiece, to the workpiece non-corrosiveness, thereby makes this brazing flux become an environmental type brazing flux worthy of the name.
The specific embodiment
1. the percentage by weight of brazing flux component:
Lithium fluoride 28%
Boric anhydride 26%
Dipotassium tetraborate 46%
Cooperate solder BAg45CuZn (45Ag-30Cu-20Zn) soldering Q235 carbon steel, 1Cr18Ni9Ti stainless steel, T2 red copper with brazing flux.Corresponding result of the test sees table 1 for details, goes out the comparative test result of QJ102 brazing flux with tabular.
Table 1
Figure G2010100012246D00021
2. the percentage by weight of brazing flux component:
Lithium fluoride 18%
Boric anhydride 30%
Dipotassium tetraborate 52%
Cooperate solder 25Ag-40Cu-33Zn-25Sn soldering Q235 mild steel, 1Cr18Ni9Ti stainless steel, T2 red copper with this brazing flux.Corresponding result of the test sees table 2 for details, goes out the comparative test result of QJ102 brazing flux with tabular.
Table 2
Figure G2010100012246D00031
3. the percentage by weight of brazing flux component:
Lithium fluoride 15%
Boric anhydride 34%
Dipotassium tetraborate 51%
Cooperate solder BCu91P Ag (91Cu-7P-2 Ag) soldering H62 brass with this brazing flux, corresponding result of the test sees table 3 for details, goes out the comparative test result of QJ102 brazing flux with tabular.
Table 3
Figure G2010100012246D00032
In above three embodiment, each component of every kind of brazing flux is evenly mixed, in the humidistat of humidity 60%, place the moisture absorption and the caking situation of observing each brazing flux after two months.
Various brazing fluxes different by brazing metal on solder sprawl interview and test, and measure and sprawl the face size.
Brazing member was by the situation of brazing flux corrosion after brazing flux discharged poison gas situation and soldering in the attention brazing process.Compare simultaneously with soldering result with the QJ102 brazing flux.
The result of the test of above-mentioned three embodiment shows, the QJ102 brazing flux is compared in the novel non-corrosiveness brazing flux that the present invention proposes and the background technology, produces at the brazing flux moisture absorption, caking, poison gas, the corrosivity each side all obviously is superior to the latter, is a kind of environmental type brazing flux.
Brazing flux of the present invention can be made into powdery and paste.

Claims (3)

1. be used for a kind of novel non-corrosiveness brazing flux of silver solder or Cu-P-Ag solder, it is characterized in that, the constituent of this brazing flux (percentage by weight) as follows:
Lithium fluoride 10-40%
Boric anhydride 20-50%
The dipotassium tetraborate surplus.
2. a kind of novel non-corrosiveness brazing flux according to claim 1 is characterized in that, powdery processed by this brazing flux or paste uses.
3. a kind of novel non-corrosiveness brazing flux according to claim 1 is characterized in that this brazing flux cooperates corresponding solder to be applicable to soldering mild steel, stainless steel, copper or copper alloy.
CN2010100012246A 2010-01-08 2010-01-08 Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal Active CN101954552B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010100012246A CN101954552B (en) 2010-01-08 2010-01-08 Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010100012246A CN101954552B (en) 2010-01-08 2010-01-08 Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal

Publications (2)

Publication Number Publication Date
CN101954552A CN101954552A (en) 2011-01-26
CN101954552B true CN101954552B (en) 2012-05-23

Family

ID=43482275

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010100012246A Active CN101954552B (en) 2010-01-08 2010-01-08 Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal

Country Status (1)

Country Link
CN (1) CN101954552B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102398431B1 (en) 2013-03-15 2022-05-13 링컨 글로벌, 인크. Boric acid free flux

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9174310B2 (en) 2013-03-15 2015-11-03 Lincoln Global, Inc. Boric acid free flux
WO2015136360A1 (en) * 2014-03-14 2015-09-17 Lincoln Global, Inc. Boric acid free flux
CN108890172B (en) * 2018-07-12 2021-01-29 浙江新锐焊接科技股份有限公司 Halogen-free acid-washing-free fluxing agent and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1049624A (en) * 1990-06-14 1991-03-06 国家建筑材料工业局人工晶体研究所 Solder, brazing flux and uses thereof
CN101112738A (en) * 2007-08-10 2008-01-30 广州有色金属研究院 Soldering aluminum and brazing flux of aluminum alloy
CN101190483A (en) * 2006-11-22 2008-06-04 上海斯米克焊材有限公司 Cream-like silver brazing fluxes
CN101439449A (en) * 2008-12-18 2009-05-27 广州有色金属研究院 Brazing flux without corrosion for aluminum and aluminum alloy brazing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1049624A (en) * 1990-06-14 1991-03-06 国家建筑材料工业局人工晶体研究所 Solder, brazing flux and uses thereof
CN101190483A (en) * 2006-11-22 2008-06-04 上海斯米克焊材有限公司 Cream-like silver brazing fluxes
CN101112738A (en) * 2007-08-10 2008-01-30 广州有色金属研究院 Soldering aluminum and brazing flux of aluminum alloy
CN101439449A (en) * 2008-12-18 2009-05-27 广州有色金属研究院 Brazing flux without corrosion for aluminum and aluminum alloy brazing

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP昭54-62134A 1979.05.18
JP昭58-132394A 1983.08.06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102398431B1 (en) 2013-03-15 2022-05-13 링컨 글로벌, 인크. Boric acid free flux

Also Published As

Publication number Publication date
CN101954552A (en) 2011-01-26

Similar Documents

Publication Publication Date Title
CN102825398B (en) Soldering flux matched with lead-free solder
CN101244493B (en) Aluminum alloy leadless welding wire containing soldering fluid and method for manufacturing soldering fluid
CN101954552B (en) Novel non-corrosive brazing flux used for silver brazing filler metal or copper-phosphorus-silver brazing filler metal
TW200605982A (en) Solder paste and process
RU2011126155A (en) ANTI-CORROSION FLUX
WO2011151894A1 (en) No-clean lead-free solder paste
CN107009043B (en) Low-residue high-storage-stability low-temperature aluminum solder paste and preparation method thereof
CN103170759A (en) Aluminum welding powder and welding method thereof
CN103692112B (en) Be applicable to carbon steel, stainless steel, Copper and its alloy silver brazing brazing flux
CN102699563A (en) Low-silver lead-free soft solder
JP2011156558A (en) Lead-free solder alloy
JPWO2014061085A1 (en) Low temperature solder paste soldering method
CN101190483B (en) Cream-like silver brazing fluxes
CN103521942A (en) Novel brazing flux used for stainless steel and aluminum brazing
JP5336142B2 (en) Solder alloy
CN101417374B (en) Leadless solder dregs-reducing method
CN100496868C (en) Novel non-corrosion fluoride solder and preparation method
US2357014A (en) Flux composition
JP5773444B2 (en) Solder alloy for aluminum joining
CN104708233B (en) One is applicable to copper aluminum soft soldering cleaning-free scaling powder and preparation method thereof
CN101214589A (en) Multi-component leadless solder
CN108866364B (en) Method for adding easily-oxidizable elements into Sn-based brazing filler metal
CN100453246C (en) No-lead soft brazing alloy
CN106001999A (en) Soldering flux used for soldering of rare earth magnesium alloy and preparation method
CN100364712C (en) Rare earth Er contained SnZn based leadless solder and its preparation method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 528300, Foshan, Shunde, Daliang, Guangdong five, Shunde science and Technology Industrial Park, Xinhui Road, 22

Patentee after: Guangdong Sansheng Electric Co., Ltd

Address before: 528300, Foshan, Shunde, Daliang, Guangdong five, Shunde science and Technology Industrial Park, Xinhui Road, 22

Patentee before: Foshan Shunde Sansheng Electrical Manufacture Co., Ltd.