CN101934557A - Process for carrying out shape cutting on stone by electroplated diamond wire saw - Google Patents
Process for carrying out shape cutting on stone by electroplated diamond wire saw Download PDFInfo
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- CN101934557A CN101934557A CN 201010256569 CN201010256569A CN101934557A CN 101934557 A CN101934557 A CN 101934557A CN 201010256569 CN201010256569 CN 201010256569 CN 201010256569 A CN201010256569 A CN 201010256569A CN 101934557 A CN101934557 A CN 101934557A
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Abstract
The invention relates to a novel process for carrying out shape cutting on stone by an electroplated diamond wire saw, which is used for carrying out shape cutting on stone by utilizing a diamond wire saw manufactured by an electroplating process. The process comprises the following steps of: (1) manufacturing the diamond wire saw by electroplating; (2) installing the wire saw on a wire saw numerical control shape cutting special machine tool; (3) installing and fixing the stone on a machine tool working platform; (4) adjusting the relative positions of the stone and the wire saw; and (5) carrying out numerical control shape cutting to meet the requirement, wherein the stone is cooled by dry ice or water or emulsion or low-temperature gas. The process is used for cutting the stone by utilizing a diamond grinding material fixed on the surface of a metal wire thorough electroplating alloy and has the advantages of no limitation of cutting thickness, high cutting efficiency, low surface roughness of a cutting workpiece, shape cutting realization, and the like.
Description
Technical field
The present invention relates to a kind of electroplating diamond wire saw shaping cutting stone material technology, belong to material cutting processing field.
Background technology
Wire-cut Electrical Discharge Machining is present the most frequently used precision form cutting method, has cutting accuracy height (can reach 0.01mm), the low (R of surface roughness
aValue can be less than 1.6 μ m), the big advantages such as (can reach 500mm) of cutting thickness.But can't processing stone material etc. non-conducting material.
Laser cutting relies on the high power density laser bundle irradiation workpiece of line focus, the material at illuminated place is melted rapidly, gasify, ablate or reach burning-point, blow down melt substance by the coaxial high velocity air of light beam simultaneously, thus a kind of cutting method that workpiece is severed in realization.Be applicable to the cutting thin plate, if use superpower laser, the high-temperature plasma that then produces between laser and workpiece is known from experience obviously reduction working (machining) efficiency, and the eliminating of fused mass is also very difficult, and cut surface is had burn.Therefore, laser can't the cutting stone material slab.
Plasma arc cutting is to utilize high temperature, plasma at a high speed and flame stream thereof to make a kind of cutting method of workpiece material fusing, evaporation and gasification and the matrix that blown off.During the little metal of cutting thickness, cutting speed is fast, and cut surface is brighter and cleaner, and thermal deformation is little, but kerf width is big, and during the stone material of cutting thickness 150mm, width of slit is unexpectedly up to 10～20mm.Therefore, (during 200≤thickness≤500mm), joint-cutting will be wideer to cutting stone material, even can't normally cut.
The high-pressure water jet cutting equipment can be shaped and cut some metal and nonmetallic materials, but cutting thickness is limited, can not the cutting stone material slab.
Diamond wire saw is diamond abrasive to be fixed on the beading steel matrix by plating or powder metallurgy or electroplating technology be made into diamond bead, beading are coupled together by the high-tensile steel wires rope, beading are spaced apart with spring or plastics and a kind of thread-cutting tool of finally being made into.Be widely used in the exploitation of stone material, the processing that is shaped, but its minimum diameter also has 6mm, joint-cutting is too wide.
For the cutting of stone material, present means mainly are wafer saw, band saw and so on, all can only do to cut off processing, and joint-cutting are wide, and smear metal easily adheres to calker, can not form cutting.
Diamond fretsaw is to fix one deck diamond abrasive on the surface of fine wire by electric deposition nickel or heat reactive resin, can cut various materials by precision form.Its advantage: (1) joint-cutting is narrow, the volume recovery height; (2) cutting process is steady, and fragile materials such as cutting silicon wafer, pottery do not collapse the limit; (3) cutting temperature is low, and cut surface does not have burn; (4) energy cutting large size workpiece; (5) environmental pollution is little, makes water as cooling fluid usually.It is a kind of up-and-coming cutting process method.The subject matter that existing diamond fretsaw exists: abrasive material just is embedded in coating or the resinoid bond by embedding mechanically, and abrasive material easily comes off, and the scroll saw life-span is short.
Summary of the invention
At the problem that exists in the existing diamond fretsaw cutting, the object of the invention is to provide a kind of electroplating diamond wire saw shaping cutting stone material technology, be that the diamond fretsaw that utilizes electroplating technology to make forms cutting to stone material, it is characterized in that: may further comprise the steps:
1), electroplate to make diamond fretsaw, scroll saw is made up of metal wire, diamond abrasive, plating bond three parts, the surface formation that diamond abrasive is fixed on metal wire by plating alloy has the scroll saw of cutting function;
2), scroll saw is installed on the scroll saw numerical control formation cutting special purpose machine tool;
3), stone material is fixed on the platen;
4), adjust the relative position of stone material and scroll saw;
5), the numerical control formation cutting stone material, reach requirement, its type of cooling is dried cutting or water or emulsion or cryogenic gas.
The present invention is further comprising the steps of:
Described shaping cutting stone material, wherein crucial cutting parameter is: scroll saw linear velocity Vs:15～25m/s; Scroll saw feed speed Vw:0.2～0.6m/min; Cutting thickness a
p: 100mm～500mm.
Good effect of the present invention is: this technology utilization is fixed on the cutting of the diamond abrasive realization stone material on metal wire surface by plating alloy, it is unrestricted to have cutting thickness, advantages such as cutting efficiency height, cut workpiece surface roughness are low, the cutting that can realize being shaped.
The specific embodiment
Electroplating diamond wire saw shaping cutting stone material technology, be the diamond fretsaw that utilizes electroplating technology to make (external diameter 0.1～3mm) to stone material (100mm≤thickness≤500mm) carry out efficient, precision form cutting may further comprise the steps:
1, electroplate the making diamond fretsaw, scroll saw is made up of metal wire, diamond abrasive, plating bond three parts, and diamond abrasive forms the scroll saw with cutting function by the surface that plating alloy is fixed on metal wire.
2, scroll saw is installed on the scroll saw numerical control formation cutting special purpose machine tool.
3, stone material is fixed on the platen.
4, adjust the relative position of stone material and scroll saw.
5, the numerical control formation cutting stone material reaches requirement, and its type of cooling is dried cutting or water or emulsion or cryogenic gas.
The shaping cutting stone material, wherein crucial cutting parameter is:
Scroll saw linear velocity Vs:15～25m/s;
Scroll saw feed speed Vw:0.2～0.6m/min;
Cutting thickness a
p: 100mm～500mm.
Claims (3)
1. electroplating diamond wire saw shaping cutting stone material technology is that the diamond fretsaw that utilizes electroplating technology to make forms cutting to stone material, it is characterized in that: may further comprise the steps:
1), electroplate to make diamond fretsaw, scroll saw is made up of metal wire, diamond abrasive, plating bond three parts, the surface formation that diamond abrasive is fixed on metal wire by plating alloy has the scroll saw of cutting function;
2), scroll saw is installed on the scroll saw numerical control formation cutting special purpose machine tool;
3), stone material is fixed on the platen;
4), adjust the relative position of stone material and scroll saw;
5), the numerical control formation cutting stone material, reach requirement, its type of cooling is dried cutting or water or emulsion or cryogenic gas;
2. electroplating diamond wire saw shaping cutting stone material technology according to claim 1, it is characterized in that: in the shaping cutting stone material, crucial cutting parameter is in the described step 5): scroll saw linear velocity Vs:15～25m/s; Scroll saw feed speed Vw:0.2～0.6m/min; Cutting thickness a
p: 100mm～500mm.
3. electroplating diamond wire saw shaping cutting stone material technology according to claim 1 is characterized in that: in the described step 1), diamond fretsaw is external diameter 0.1～3mm, and stone material is 100mm≤thickness≤500mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010256569 CN101934557A (en) | 2010-08-18 | 2010-08-18 | Process for carrying out shape cutting on stone by electroplated diamond wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010256569 CN101934557A (en) | 2010-08-18 | 2010-08-18 | Process for carrying out shape cutting on stone by electroplated diamond wire saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101934557A true CN101934557A (en) | 2011-01-05 |
Family
ID=43388249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010256569 Pending CN101934557A (en) | 2010-08-18 | 2010-08-18 | Process for carrying out shape cutting on stone by electroplated diamond wire saw |
Country Status (1)
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| CN (1) | CN101934557A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273008A (en) * | 2015-06-02 | 2017-01-04 | 江苏友和工具有限公司 | Electroplated diamond rope saw preparation technology |
| CN113071012A (en) * | 2021-03-31 | 2021-07-06 | 广东工业大学 | Silicon nitride ceramic substrate and cutting method and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1229980A (en) * | 1967-08-17 | 1971-04-28 | ||
| JPH05261722A (en) * | 1992-03-18 | 1993-10-12 | Nippon Steel Corp | Wire type cutting roller |
| CN2673610Y (en) * | 2003-08-13 | 2005-01-26 | 沈阳工业学院 | Hard brittle material wire cutting device |
| KR20090026488A (en) * | 2007-09-10 | 2009-03-13 | 김정묵 | A manufacturing apparatus for wire saw coated with diamond |
| CN101417478A (en) * | 2008-11-21 | 2009-04-29 | 青岛高校测控技术有限公司 | Cutting wire production method and cutting wire and tyre cutting device |
| CN101531305A (en) * | 2008-03-13 | 2009-09-16 | 东芝电梯株式会社 | Forced deceleration control system for elevator |
| CN101591796A (en) * | 2009-05-13 | 2009-12-02 | 长沙岱勒金刚石制品有限公司 | A kind of production technique for preparing high-performance diamond wire saw |
-
2010
- 2010-08-18 CN CN 201010256569 patent/CN101934557A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1229980A (en) * | 1967-08-17 | 1971-04-28 | ||
| JPH05261722A (en) * | 1992-03-18 | 1993-10-12 | Nippon Steel Corp | Wire type cutting roller |
| CN2673610Y (en) * | 2003-08-13 | 2005-01-26 | 沈阳工业学院 | Hard brittle material wire cutting device |
| KR20090026488A (en) * | 2007-09-10 | 2009-03-13 | 김정묵 | A manufacturing apparatus for wire saw coated with diamond |
| CN101531305A (en) * | 2008-03-13 | 2009-09-16 | 东芝电梯株式会社 | Forced deceleration control system for elevator |
| CN101417478A (en) * | 2008-11-21 | 2009-04-29 | 青岛高校测控技术有限公司 | Cutting wire production method and cutting wire and tyre cutting device |
| CN101591796A (en) * | 2009-05-13 | 2009-12-02 | 长沙岱勒金刚石制品有限公司 | A kind of production technique for preparing high-performance diamond wire saw |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273008A (en) * | 2015-06-02 | 2017-01-04 | 江苏友和工具有限公司 | Electroplated diamond rope saw preparation technology |
| CN113071012A (en) * | 2021-03-31 | 2021-07-06 | 广东工业大学 | Silicon nitride ceramic substrate and cutting method and application thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110105 |