CN101921488A - Silicone resin composite for die bonding - Google Patents

Silicone resin composite for die bonding Download PDF

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Publication number
CN101921488A
CN101921488A CN2010102072326A CN201010207232A CN101921488A CN 101921488 A CN101921488 A CN 101921488A CN 2010102072326 A CN2010102072326 A CN 2010102072326A CN 201010207232 A CN201010207232 A CN 201010207232A CN 101921488 A CN101921488 A CN 101921488A
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composition
sio
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siliciumatom
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木村真司
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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  • Inorganic Chemistry (AREA)
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  • Health & Medical Sciences (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)

Abstract

The object of the present invention is to provide a kind of silicon resin composition, this silicon resin composition is the cured article that the light transmission excellence of high rigidity and thermotolerance, the transparency and low wavelength region may can be provided, and show high chip shearing resistance, be applicable to the silicon resin composition of the die bonding of LED element etc.For this reason, the invention provides a kind of silicone resin composite for die bonding, it contains following compositions (A)～(E): (A) the straight chain shape organopolysiloxane of representing with formula (1); (B) be wax shape or the three-dimensional netted organopolysiloxane resins of solid with formula (2) expression and at 23 ℃; (C) to have 2 organic hydride polysiloxane that are bonded in the hydrogen atom on the Siliciumatom at least in formula (3) expression and per 1 molecule; (D) platinum metals class catalyzer; And, (E) smoke-like silicon-dioxide.

Description

Silicone resin composite for die bonding
Technical field
The present invention relates to be applicable to the silicon resin composition of the die bonding of photodiode (hereinafter referred to as " LED ") element etc.
Background technology
In the past, as the sealing material and the die bonding material (that is, being used to make the mold and the mutually bonding adhesivess of matrix such as assembly of LED element etc.) of LED element, use be Resins, epoxy.Particularly, with regard to the die bonding material, if employed resin is soft excessively, the problem that can't realize engaging in the wire-bonded operation that then can cause after the die bonding operation, carrying out etc., therefore, traditional die bonding material uses is that the caking agent of high rigidity is a Resins, epoxy., in the time of will containing the sealing material of Resins, epoxy and die bonding material and be used for blue led, White LED etc., under the intense UV rays irradiation, can cause flavescence and absorb light, therefore have the problem that causes degradation weather resistance aspect under the LED brightness.
In recent years, further improve for the expectation of the weather resistance of LED, the sealing material of LED element is replaced by the good silicone resin of weather resistance by Resins, epoxy gradually.And identical with sealing material, the die bonding material also has the requirement of weather resistance aspect.And, for the die bonding material, also further require to improve its brightness and strengthen its thermotolerance.From color rendering (Yan look) the aspect consideration, also there are a large amount of uses to launch the possibility of the LED of UV-light in the future.
Based on above-mentioned viewpoint, developed the die bonding material that uses silicone resin.But, because with regard to modulus and bonding force, therefore organosilicon die bonding material may cause chip shearing resistance (die shear strongth) deficiency not as good as traditional Resins, epoxy.
In addition, as prior art related to the present invention, enumerate following document.
The prior art document
Patent documentation 1: TOHKEMY 2002-60719 communique
Patent documentation 2: TOHKEMY 2006-342200 communique
Patent documentation 3: TOHKEMY 2007-63299 communique
Patent documentation 4: TOHKEMY 2007-258317 communique
Summary of the invention
The problem that invention will solve
The present invention finishes in view of above-mentioned background, purpose is to provide a kind of silicon resin composition, this silicon resin composition is the cured article that the light transmission excellence of high rigidity and thermotolerance, the transparency and low wavelength region may can be provided, and show high chip shearing resistance, be applicable to the silicon resin composition of the die bonding of LED element etc.
The method of dealing with problems
The inventor furthers investigate for reaching above-mentioned purpose, found that: the silicone resin composite for die bonding that contains following (A)～(E) composition of specified quantitative respectively can provide the light transmission excellence of high rigidity and thermotolerance, the transparency and low wavelength region may and demonstrate the cured article of high chip shearing resistance, and be applicable to the die bonding of LED element etc., wherein, described (A)～(E) composition is: (A) the straight chain shape organopolysiloxane of an average group accepted way of doing sth (1) expression; (B) an average group accepted way of doing sth (2) expression is wax shape or the three-dimensional netted organopolysiloxane resins of solid at 23 ℃; (C) have 2 organic hydride polysiloxane that are bonded in the hydrogen atom on the Siliciumatom at least in per 1 molecule of an average group accepted way of doing sth (3) expression; (D) platinum metals class catalyzer; (E) smoke-like silicon-dioxide, and finished the present invention based on this discovery.
So, the invention provides following embodiment 1～3 described silicone resin composite for die bonding.
[embodiment 1]
A kind of silicone resin composite for die bonding, it contains following compositions (A)～(E):
(A) straight chain shape organopolysiloxane: 40～10 mass parts,
Should represent with a following average group accepted way of doing sth (1) by (A) composition,
(R 3 3SiO 1/2) 2(R 1R 2SiO) x(R 2 2SiO) y…(1)
(in the formula, R 1Represent alkenyl independently, R 2Representative does not conform to 1 valency alkyl and whole R of aliphatics unsaturated link(age) independently 2In at least 80 moles of % be methyl, R 3Be R 1Or R 2, x is the integer more than 1, y is the integer more than 3, and satisfies 0.01≤x/y≤0.30);
(B) three-dimensional netted organopolysiloxane resins: 60～90 mass parts,
Should (B) composition be with a following average group accepted way of doing sth (2) expression and 23 ℃ be wax shape or the three-dimensional netted organopolysiloxane resins of solid (wherein, (A) composition and (B) total content of composition be 100 mass parts),
(R 5 3SiO 1/2)k(R 4R 5 2SiO 1/2) m(R 4R 5SiO) n(R 5 2SiO) p
(R 4SiO 3/2) q(R 5SiO 3/2) r(SiO 2) s…(2)
(in the formula, R 4Represent alkenyl independently, R 51 valency alkyl of the not fatty family of representative unsaturated link(age) and all R independently 5In at least 80 moles of % be methyl, satisfy 1＞k 〉=0,1＞m 〉=0,1＞n 〉=0,1＞p 〉=0,1＞q 〉=0,1＞r 〉=0,1＞s 〉=0, and m+n+q＞0, q+r+s＞0, and, k+m+n+p+q+r+s=1);
(C) organic hydride polysiloxane: content that should (C) composition make the amount that is bonded in the hydrogen atom on the Siliciumatom in (C) composition with mole count (A) composition and (B) all in the composition be bonded in 0.5～5.0 times of amount of the alkenyl on the Siliciumatom,
Should (C) composition be having 2 organic hydride polysiloxane that are bonded in the hydrogen atom on the Siliciumatom at least in a following average group accepted way of doing sth (3) expression and per 1 molecule,
R 6 aH bSiO (4-a-b)/2…(3)
(in the formula, R 6The 1 valency alkyl that does not replace or replace of the not fatty family of representative unsaturated link(age) and all R independently 6In at least 50 moles of % be methyl, a is for satisfying the number of 0.7≤a≤2.1, b is for satisfying the number of 0.001≤b≤1.0, and a+b is the number that satisfies 0.8≤a+b≤3.0);
(D) platinum metals class catalyzer: significant quantity; And,
(E) smoke-like silicon-dioxide (being thermal silica):, should (E) composition be 1～20 mass parts with respect to total amount 100 mass parts of (A)～(C) composition.
[embodiment 2]
According to above-mentioned embodiment 1 described composition, wherein, in (A)～(C) composition in above-mentioned composition, be bonded on the Siliciumatom and all 1 valency alkyl of not fatty family unsaturated link(age) in 90 moles of % abovely be methyl.
[embodiment 3]
According to above-mentioned embodiment 1 or 2 described compositions, wherein, Shore (Shore) the D hardness of the cured article that is got by above-mentioned composition curing is more than 30.
The effect of invention
Composition of the present invention is can provide high rigidity (in a preferred embodiment, Shore D hardness is more than 30) and demonstrate the cured article of high chip shearing resistance, its die bonding material as the die bonding that is used for LED element etc. is the composition that is particularly useful.
Embodiment
Below, be specifically described at each composition.It is pointed out that " Me " represent methylidene in this specification sheets, " Vi " represents vinyl.
Contain following composition (A)～(E) in the composition of the present invention.
＜(A) composition 〉
(A) composition is to be used to reduce the viscosity of composition, to provide stress relaxation for cured composition simultaneously and to improve the composition of chip shearing resistance.(A) composition is represented with a following average group accepted way of doing sth (1):
(R 3 3SiO 1/2) 2(R 1R 2SiO) x(R 2 2SiO) y…(1)
(in the formula, R 1Represent alkenyl independently, R 21 valency alkyl of the not fatty family of representative unsaturated link(age) and all R independently 2In at least 80 moles of % be methyl, R 3Be R 1Or R 2, x is the integer more than 1, y is the integer more than 3, and satisfies 0.01≤x/y≤0.30.Preferred x+y is 50～50 for making the viscosity of (A) composition under 25 ℃, the scope of 000mPa),
Should (A) composition be siloxane unit (R with alkenyl 1R 2D below is called in the SiO unit ViUnit (will represent the group note of alkenyl to make Vi, but be not limited to vinyl)) and do not have a siloxane unit (R of aliphatics unsaturated link(age) 2 2The D unit below is called in the SiO unit) random copolymers, and be molecular chain two ends end capped by three organic siloxyies, have an organopolysiloxane that is straight catenate molecular structure basically.
Produce stress relaxation in order to solidify the back, must dwindle D to a certain extent at composition ViThe ratio of/D; And, must increase D to a certain extent in order to improve the chip shearing resistance ViThe ratio of/D.That is, must make D ViThe ratio of/D (x/y in the above-mentioned formula (1)) is 0.01≤D Vi/ D≤0.30 especially is preferably 0.02≤D Vi/ D≤0.15.If this ratio is too small, then can cause the stress relaxation of cured article to disappear, easily crack; If this ratio is excessive, can cause the chip shearing resistance to reduce.
Above-mentioned alkenyl (the R in the above-mentioned formula (1) that is bonded on the Siliciumatom 1) carbonatoms be generally 2～8, be preferably 2～4.As its specific examples, can enumerate vinyl, allyl group, butenyl, pentenyl, hexenyl, heptenyl etc., preferred vinyl.
In the organopolysiloxane molecule of (A) composition, the 1 valency alkyl (R in the above-mentioned formula (1) of not fatty family unsaturated link(age) 2) so long as do not have the group of aliphatics unsaturated link(age) and get final product, there is not particular restriction, can be that the carbonatoms that does not for example replace or replace is generally 1～12, preferred 1～10 1 valency alkyl.As this 1 valency alkyl that does not replace or replace, can enumerate for example alkyl such as methyl, ethyl, propyl group, butyl, amyl group, hexyl, heptyl; Cycloalkyl such as cyclohexyl; Aryl such as phenyl, tolyl, xylyl, naphthyl; Aralkyl such as benzyl, styroyl; And the part or all of hydrogen atom of these groups is by chloromethyl, the 3-chloropropyl, 3,3 of the replacement of halogen atoms such as chlorine atom, fluorine atom, bromine atoms, haloalkyls such as 3-trifluoro propyl etc.Preferred alkyl, more preferably methyl.
In the present invention, whole alkyl of above-mentioned not fatty family unsaturated link(age) (whole R 2) at least 80 moles of % (80～100 moles of %), preferred 90～100 moles of %, more preferably 98～100 moles of % are methyl.If methyl is at whole 1 valency alkyl (whole R of above-mentioned not fatty family unsaturated link(age) 2) in 80 moles of % of quantity not sufficient, cause easily then that photostabilization and weathering resistance descend, the cured article variable color.
(A) viscosity of the organopolysiloxane of composition under 25 ℃ is preferably 50～50,000mPa, more preferably 100～10,000mPa.Viscosity is crossed low or too high, all may cause the operability of die bonding material to reduce.It is pointed out that in the present invention viscosity is by the value of rotary viscosity design determining (down together).
(A) organopolysiloxane of composition is by a for example following average group accepted way of doing sth (4) expression.
R 7 cR 8 dSiO (4-c-d)/2…(4)
(in the formula, R 7Representative does not have the 1 valency alkyl that does not replace or replace of aliphatics unsaturated link(age), R independently 8Represent alkenyl independently, c is 1.7～2.1 number, and d is 0.01～0.3 number, and c+d satisfies 2.0～2.2.)
In an above-mentioned average group accepted way of doing sth (4), R 7The group that the 1 valency alkyl that does not replace or replace that does not have the aliphatics unsaturated link(age) of representative is enumerated with 1 valency alkyl of the not fatty family of above-mentioned conduct unsaturated link(age) is identical.In addition, R 8The alkenyl of representative is bonded in the alkenyl on the Siliciumatom with above-mentioned conduct and the group enumerated is identical.
As the organopolysiloxane of (A) composition, can enumerate with the structure of following general formula (5)～(8) expressions etc.:
R 9 3SiO(ViR 9SiO) e(R 9 2SiO) fSiR 9 3…(5)
ViR 9 2SiO(ViR 9SiO) e(R 9 2SiO) fSiR 9 2Vi…(6)
Vi 2R 9SiO(ViR 9SiO) e(R 9 2SiO) fSiR 9Vi 2…(7)
Vi 3SiO(ViR 9SiO) e(R 9 2SiO) fSiVi 3…(8)
(in the formula, R 9Represent the 1 valency alkyl that does not replace or replace of not fatty family unsaturated link(age) independently, e+f is 10～1,000, is preferably 50～500 that e/f is 0.01～0.30, is preferably 0.02～0.15.)
In above-mentioned general formula (5)～(8), as R 9The 1 valency alkyl that does not replace or replace of representative, its carbonatoms is preferably 1～10, more preferably 1～6.As its specific examples, preferred above-mentioned conduct does not contain the aliphatics unsaturated link(age) and is bonded in the organic group on the Siliciumatom and the group enumerated, can enumerate and the identical group of other group except that aryl, aralkyl wherein, but consider from the photostabilization of cured article and the aspect of excellent heat resistance, more preferably alkyl, especially preferable methyl.
As the organopolysiloxane of (A) composition, the preferred structure of representing with for example following Chemical formula 1.
[Chemical formula 1]
Figure BSA00000157125600061
(in the formula, x, y and above-mentioned synonym.)
As the specific examples of (A) composition, can enumerate following polymkeric substance etc.
[Chemical formula 2]
(A) composition can be used alone, and also can be used in combination of two or more.
＜(B) composition 〉
(B) composition is the composition that is used for obtaining to add epistasis (Fill Strong) under the situation of the transparency that keeps cured article.(B) composition is represented, is under 23 ℃ and must contains alkenyl and trifunctional siloxane unit and/or the SiO that is bonded on the Siliciumatom in wax shape or solid and the molecule with a following average group accepted way of doing sth (2) 4/2Unitary three-dimensional netted organopolysiloxane resins.Wherein, described " wax shape " is meant: the viscosity under 23 ℃ is 10,000, and 000mPa is above, preferred especially 100,000, and 000mPa is above and do not show the rubber-like (untreated rubber shape) of self flowability substantially.
(R 5 3SiO 1/2) k(R 4R 5 2SiO 1/2) m(R 4R 5SiO) n(R 5 2SiO) p
(R 4SiO 3/2) q(R 5SiO 3/2) r(SiO 2) s…(2)
(in the formula, R 4Represent alkenyl independently, R 51 valency alkyl of the not fatty family of representative unsaturated link(age) and all R independently 5In at least 80 moles of % be methyl, satisfy 1＞k 〉=0,1＞m 〉=0,1＞n 〉=0,1＞p 〉=0,1＞q 〉=0,1＞r 〉=0,1＞s 〉=0, and m+n+q＞0, q+r+s＞0, and, k+m+n+p+q+r+s=1).
In an above-mentioned average group accepted way of doing sth (2), R 4The alkenyl of representative with in the formula (1) of (A) composition as R 1The alkenyl of representative and the group enumerated is identical, but obtain the aspect and consider in price from being easy to, be preferably vinyl.
R 51 valency alkyl of the not fatty family unsaturated link(age) of representative with in the formula (1) of (A) composition as R 21 valency alkyl of the not fatty family unsaturated link(age) of representative and the group enumerated is identical, but preferred all R 5In at least 80 moles of % (80～100 moles of %), preferred 90～100 moles of %, more preferably 98～100 moles of % are methyl.If methyl is at whole R 5In shared 80 moles of % of ratio less than, then can cause and (A) the consistency variation of composition, thereby composition may produce gonorrhoea, can't obtain the high transparent cured article of target.
Preferred k is 0～0.65, m is 0～0.65, n is 0～0.5, p is 0～0.5, q is 0～0.8, r is 0～0.8, s is 0～0.6 number.And m+n+q is preferably 0.1～0.8, especially is preferably 0.2～0.65 number, and q+r+s is preferably 0.1～0.8, especially is preferably 0.2～0.6 number.
In addition, for the organopolysiloxane resins of (B) composition, the weight-average molecular weight with polystyrene conversion of utilizing GPC (gel permeation chromatography) to measure is preferably 400～100, and 000, especially be preferably 500～50,000.
With respect to every 100g (B) composition, the content that is bonded in the alkenyl on the Siliciumatom in preferred (B) composition is in 0.01～1mol scope, more preferably in 0.05～0.5mol scope.When the content of alkenyl satisfied 0.01～1mol scope, crosslinking reaction can be carried out smoothly, can obtain the higher cured article of hardness.
As the organopolysiloxane resins of (B) composition, the structure of preference as representing with following formula.
(R 5 3SiO 1/2) k(R 4R 5 2SiO 1/2) m(SiO 2) s
(R 4R 5 2SiO 1/2) m(SiO 2) s
(R 4R 5SiO) n(R 5 2SiO) p(R 5SiO 3/2) r
(R 4R 5 2SiO 1/2) m(R 5 2SiO) p(R 4SiO 3/2) q
(R 4R 5 2SiO 1/2) m(R 5 2SiO) p(R 5SiO 3/2) r
(R 5 3SiO 1/2) k(R 4R 5 2SiO 1/2) m(R 5 2SiO) p(R 5SiO 3/2) r
(R 5 3SiO 1/2) k(R 4R 5 2SiO 1/2) m(R 4R 5SiO) n(R 5 2SiO) p(R 5SiO 3/2) r
(in the formula, R 4, R 5, k, m, n, p, q, r and s be identical with the definition in an above-mentioned average group accepted way of doing sth (2).)
As the specific examples of (B) composition, can enumerate following structure etc.
(Me 3SiO 1/2) 0.4(ViMe 2SiO 1/2) 0.1(SiO 2) 0.5、
(ViMeSiO) 0.4(Me 2SiO) 0.15(MeSiO 3/2) 0.45、
(ViMe 2SiO 1/2) 0.2(Me 2SiO) 0.25(MeSiO 3/2) 0.55
(B) composition can be used alone, and also can be used in combination of two or more.
(B) composition is one of important factor of composition of the present invention with (A) components in proportions.With respect to (A) composition and (B) total amount 100 mass parts of composition, the combined amount that must make (B) composition is 60～90 mass parts, preferred 65～80 mass parts, more preferably 70～80 mass parts.If (B) combined amount less than 60 mass parts of composition then possibly can't obtain enough hardness; If surpass 90 mass parts, then the viscosity of composition significantly increases, and then the operability when causing composition as the die bonding material of LED element etc. significantly reduces.
＜(C) composition 〉
(C) composition be as by with (A) composition and (B) the alkenyl generation hydrosilylation reactions in the composition carry out composition that crosslinked linking agent plays a role, simultaneously as being used for the composition that diluted composition plays a role with the reactive diluent that is adjusted to the viscosity that is suitable for using.(C) composition is by having 2 (being generally 2～200) in a following average group accepted way of doing sth (3) expression and per 1 molecule at least, preferably having an organic hydride polysiloxane that (for example about 3～100) more than 3 are bonded in the hydrogen atom (being the SiH yl) on the Siliciumatom.
R 6 aH bSiO (4-a-b)/2…(3)
(in the formula, R 6The 1 valency alkyl that does not replace or replace of the not fatty family of representative unsaturated link(age) and all R independently 6In at least 50 moles of % be methyl, a is for satisfying the number of 0.7≤a≤2.1, b is for satisfying the number of 0.001≤b≤1.0, and a+b is the number that satisfies 0.8≤a+b≤3.0.)
In an above-mentioned average group accepted way of doing sth (3), R 6The 1 valency alkyl that does not replace or replace of the not fatty family unsaturated link(age) of representative with in the formula (1) of (A) composition as R 21 valency alkyl of the not fatty family unsaturated link(age) of representative and the group enumerated is identical, but whole R 6In at least 50 moles of % (50～100 moles of %), preferred 60～100 moles of %, especially preferred 90～100 moles of % be methyl.If methyl is at whole R 6In shared 50 moles of % of ratio less than, then can cause and (A) composition and (B) the consistency variation of composition, produce problems such as gonorrhoea or composition are separated.
Preferred a is 1.0～2.0, b is 0.01～1.0, a+b is 1.1～2.6 number.
In (C) composition, with respect to every 1g (C) composition, the content that preferably is bonded in the hydrogen atom on the Siliciumatom is in 0.001～0.02mol scope, more preferably in 0.002～0.017mol scope.If it is very few to be bonded in the content of the hydrogen atom on the Siliciumatom, possibly can't obtain sufficient hardness; Too much, then may cause reductions such as solidified nature, thermotolerance.
Containedly more than 2 in per 1 molecule, preferred be bonded in the optional position that hydrogen atom (being the SiH yl) on the Siliciumatom can be arranged in molecule chain end, molecular chain more than 3, can also be positioned at above-mentioned two positions simultaneously.In addition, the molecular structure of this organic hydride polysiloxane can be the arbitrary structures in straight chain shape, ring-type, a chain, the tridimensional network, but the ideal Siliciumatom number (or polymerization degree) in per 1 molecule is generally 2～400, preferred 3～200, more preferably about 4～100.
(C) viscosity of organic hydride polysiloxane under 25 ℃ of composition is preferably 1,000mPas following (be generally 1～1,000mPas), 5～200mPas more preferably.
Organic hydride polysiloxane as (C) composition, for example specifically can enumerate 1,1,3, the 3-tetramethyl disiloxane, 1,3,5, the 7-tetramethyl-ring tetrasiloxane, three (hydrogenation dimethylsilane oxygen base) methyl-monosilane, three (hydrogenation dimethylsilane oxygen base) phenyl silane, the hydrogenated methyl cyclopolysiloxane, hydrogenated methyl siloxanes-dimethyl siloxane cyclocopolymer, two ends are by the end capped hydrogenated methyl polysiloxane of trimethylsiloxy, two ends are by the end capped dimethyl siloxane of trimethylsiloxy-its polymers of hydrogenated methyl siloxanes, two ends are by the end capped dimethyl polysiloxane of dimethyl hydrogenation siloxy-, two ends are by the end capped dimethyl siloxane of dimethyl hydrogenation siloxy--hydrogenated methyl silicone copolymers, two ends are by the end capped hydrogenated methyl siloxanes of trimethylsiloxy-diphenyl siloxane multipolymer, two ends are by the end capped hydrogenated methyl siloxanes-diphenyl siloxane of trimethylsiloxy-dimethylsiloxane copolymer, two ends are by the end capped hydrogenated methyl siloxanes-methylphenyl siloxane of trimethylsiloxy-dimethylsiloxane copolymer, two ends are by the end capped hydrogenated methyl siloxanes-dimethyl siloxane of dimethyl hydrogenation siloxy--diphenyl siloxane multipolymer, two ends are by the end capped hydrogenated methyl siloxanes-dimethyl siloxane of dimethyl hydrogenation siloxy--methylphenyl siloxane multipolymer, by (CH 3) 2HSiO 1/2Unit, (CH 3) 3SiO 1/2Unit and SiO 4/2The multipolymer that the unit constitutes, by (CH 3) 2HSiO 1/2Unit and SiO 4/2The multipolymer that the unit constitutes, by (CH 3) 2HSiO 1/2Unit, SiO 4/2Unit and (C 6H 5) 3SiO 1/2The multipolymers that the unit constitutes etc. in addition, can also be enumerated structure with following general formula (9), (10) expression, with the structure of following general formula (chemical formula (3)) expression etc.
R 6 3SiO(R 6HSiO) tSiR 6 3…(9)
Cyclic (R 6HSiO) u(10)
(in the formula, R 6Meaning same as described above, t is 2～30, preferred 2～25 integer, u is 4～8 integer.)
[chemical formula 3]
Figure BSA00000157125600101
(in the formula, R 6Meaning same as described above, h is 5～40 integer, i is 5～20 integer, j is 2～30 integer.)
As the specific examples of (C) composition, can enumerate structure, with the structure of following structural formula (chemical formula 4, chemical formula 5) expression etc. with following general formula (11) expression.
Me 3SiO(MeHSiO) tSiMe 3…(11)
(in the formula, the meaning of t is same as described above.)
[chemical formula 4]
Figure BSA00000157125600102
[chemical formula 5]
(C) composition can be used alone, and also can be used in combination of two or more.
Combined amount as (C) composition, must make the amount that is bonded in the hydrogen atom on the Siliciumatom in (C) composition with mole count (A) composition and (B) all in the composition be bonded in 0.5～5.0 times of amount of the alkenyl on the Siliciumatom, be preferably 0.7～3.0 times of mole.Make the amount that is bonded in the hydrogen atom on the Siliciumatom in (C) composition count (A) composition with mole and (B) when all in the composition are bonded in 0.5～5.0 times of amount of the alkenyl on the Siliciumatom when described combined amount can't satisfy, will cause crosslinkedly can't reaching good balance.
＜(D) composition 〉
(D) composition is that platinum metals class catalyzer is to be used for making the hydrosilylation reactions of above-mentioned (A)～(C) composition to carry out or promote the composition of this reaction.There is no particular restriction for platinum metals class catalyzer, for example can enumerate: platinum metals such as platinum, palladium, rhodium; Platinic chloride, pure modification Platinic chloride, the platinic compound such as coordination compound of Platinic chloride and olefines, vinylsiloxane or acetylide, four (triphenylphosphines) close palladium, chlorine three (triphenylphosphine) closes platinum group metal compounds such as palladium etc.The compound that Platinic chloride obtains after organic-silicon-modified is because good and do not contain chlorine impurity substantially with the consistency of (A)～(C) composition, so preferably.
(D) composition can be used alone, and also can be used in combination of two or more.
(D) combined amount of composition is so long as get final product as the significant quantity of catalyzer, total amount with respect to (A)～(C) composition, when (D) combined amount of composition is scaled the quality of platinum group, be generally 1～500ppm, preferred 3～100ppm, especially preferred 5～40ppm.By this combined amount is adjusted into appropriate value, can more effectively promote hydrosilylation reactions.
＜(E) composition 〉
(E) thus composition is a smoke-like silicon-dioxide to be used for giving the composition thixotropy and to improve operability, form fillet (fillet) simultaneously so that the composition that the chip shearing resistance improves.For this composition is used for die bonding, composition must be made film, and preferably use the little smoke-like silicon-dioxide of particle diameter.
Utilizing the specific surface area of the smoke-like silicon-dioxide of BET method mensuration is 50～500m 2/ g, especially be preferably 100～400m 2/ g.
In order to improve the dispersiveness of smoke-like silicon-dioxide in composition, preferably utilize silicane, silazane class or type siloxane that it is carried out surface treatment.
With respect to total amount 100 mass parts of (A)～(C) composition, (E) combined amount of composition is generally 1～20 mass parts, preferred 3～10 mass parts.If this combined amount is very few, then can cause giving the deficiency of thixotropy effect; If this combined amount is too much, then can cause the reduction of the deterioration and the chip shearing resistance of operability.
＜other composition 〉
Except above-mentioned (A)～(E) composition, can also in the scope of not destroying purpose of the present invention, in composition of the present invention, mix other composition as described below.
As other composition, for example can enumerate: light scattering agent or strongtheners such as crystallinity silicon-dioxide; Fluor; The petroleum-type solvent, do not have the viscosity modifiers such as non-reactive silicone oil of reactive functional groups; Have carbon functional group silane, epoxy group(ing), alkoxyl group, be bonded in the hydrogen atom (being the SiH yl) on the Siliciumatom and be bonded at least a cementability rising agents such as other silicoorganic compound except that (A)～(C) composition in the alkenyls such as vinyl on the Siliciumatom; Electroconductibility imparting agents such as metal-powder such as silver, gold; Be used for painted pigment and dyestuff; Reaction suppressors such as tetramethyl-tetrem thiazolinyl Fourth Ring siloxanes etc.
Other above-mentioned composition can be used alone, and also can be used in combination of two or more.
＜about composition 〉
In (A)～(C) composition in composition of the present invention, when do not contain the aliphatics unsaturated link(age) and be bonded in 80 moles of whole 1 valency alkyl on the Siliciumatom (80～100 moles of %) more than the %, when particularly 90 moles (90～100 moles of %) is for methyl more than the %, its thermotolerance, photostabilization (ultraviolet resistance) excellence, thereby for comprising down that in heat and ultraviolet equal stress (stress) deterioration of variable color has excellent patience, so preferred.
The preparation method
Composition of the present invention can be prepared by mixing with other composition by (A)～(E) composition and difference according to circumstances, for example, in order to ensure sufficient storage stability, also can prepare part that contains (C) composition and the part that contains (D) composition in advance respectively, in use again with this 2 partially mixed use.
Condition of cure
The curing of composition can be carried out under known condition, for example, and can be by being cured in 10 minutes～5 hours 60～180 ℃ of heating.In addition, the Shore D hardness of the cured article that is got by composition curing especially is preferably 50～90 preferably more than 30.
Purposes
Composition of the present invention is especially suitable as the die bonding material of the die bonding that is used for LED element etc.
＜die bonding method 〉
As using composition of the present invention the LED element to be carried out an example of the method for die bonding, can enumerate following method: composition of the present invention is filled in the syringe, utilizing divider (dispenser) it to be coated on the matrixes such as assembly makes it be issued to for example 5～100 μ m thickness in drying regime, then the LED element is arranged on the composition that is coated with, LED element tube core is bonded on the matrix by said composition is solidified.As the condition of cure of composition, condition gets final product as described above.
Embodiment
Below, in conjunction with preparation example, embodiment and comparative example the present invention is described in more detail, but these embodiment are not construed as limiting the present invention fully.It is pointed out that in following example, be provided to show the symbology unit as follows of the average composition of silicone oil or silicone resin.In addition, the representative of the mole number of each silicone oil or silicone resin is the vinyl contained in each composition or the mole number of SiH base.
M H：(CH 3) 2HSiO 1/2
M：(CH 3) 3SiO 1/2
M Vi：(CH 2＝CH)(CH 3) 2SiO 1/2
D H：(CH 3)HSiO 2/2
D：(CH 3) 2SiO 2/2
D Vi：(CH 2＝CH)(CH 3)SiO 2/2
Q：SiO 4/2
The preparation of [preparation example 1] platinum catalyst
The platinum catalyst that uses in the present embodiment is the reaction product of chloroplatinic acid and connection tetramethyl divinyl disiloxane, and is to utilize viscosity this reaction product to be carried out dilution so that platinum content is the catalyzer (catalyst A) of 1.0 quality % for the end capped polydimethylsiloxane of liquid dimethylvinylsiloxy of 0.6Pas.
The median size of (E) composition in the present embodiment is that 10nm, specific surface area are 300m 2/ g, use be that the surface is through the smoke-like silicon-dioxide (silicon-dioxide B) of dimethylsilane oxygen base cell processing.
＜embodiment 1 〉
With toluene solution, the viscosity of silicone resin 80g (65.6 millis rub) is 6, and a 000mPas and an average group accepted way of doing sth are M 2D 416D Vi 22Silicone oil 20g (13.2 the milli rub D Vi/ D=0.05) and the average structure formula with M 2D H 8The hydrogenated methyl siloxanes 11g of expression (16.0 millis rub) mixes, and wherein, described silicone resin is by M unit, M ViUnit and Q unit constitute, and M unit and M ViUnitary mol ratio is 6.25, M unit and M ViThe unitary mol ratio of unitary total amount and Q is 0.8.Under 120 ℃, decompression below the 10mmHg, from the gained liquid form mixt, remove toluene, obtained heavy-gravity liquid under the room temperature.
With respect to this thick liquid 100g, the silicone compounds 5g that contains epoxy group(ing) (42.5 millis rub) that mixes ethynylcyclohexanol 0.1g, tetramethyl-tetrem thiazolinyl Fourth Ring siloxanes 3g (34.8 millis rub), the catalyst A 0.30g as the reaction control agent and represent with following structural formula (12) has obtained transparent liquid form mixt.Further,, mix the silicon-dioxide B of 5 mass parts, obtained the die bonding composition with respect to these mixture 100 mass parts.Utilize said composition, with the silicon die bonding of 1mm * 1mm, thick 0.35mm at silvering (Silver め つ I) on.Making the condition of being heating and curing is 100 ℃, 1 hour+150 ℃, 5 hours.Utilize die bonding tester PTR-1000 ((strain) RHESCA manufacturing) that its chip shearing resistance is measured.In addition, under same condition of cure, make the tabular shaping thing of thickness 2mm, utilized the Shore D sclerometer that Shore D hardness is measured.Chip shearing resistance and the hardness of this moment are as shown in table 1.
[chemical formula 6]
Figure BSA00000157125600141
＜embodiment 2 〉
With toluene solution, the viscosity of silicone resin 80g (65.6 millis rub) is that a 700mPas and an average group accepted way of doing sth are M 2D 176D Vi 20Silicone oil 20g (26.0 the milli rub D Vi/ D=0.11) and the average structure formula with M 2D H 8The hydrogenated methyl siloxanes 13g of expression (18.9 millis rub) mixes, and wherein, described silicone resin is by M unit, M ViUnit and Q unit constitute, and M unit and M ViUnitary mol ratio is 6.25, M unit and M ViThe unitary mol ratio of unitary total amount and Q is 0.8.Under 120 ℃, decompression below the 10mmHg, from the gained liquid form mixt, remove toluene, obtained heavy-gravity liquid under the room temperature.
With respect to this thick liquid 100g, the silicone compounds 5g that contains epoxy group(ing) (42.5 millis rub) that mixes ethynylcyclohexanol 0.1g, tetramethyl-tetrem thiazolinyl Fourth Ring siloxanes 3g (34.8 millis rub), the catalyst A 0.30g as the reaction control agent and represent with following structural formula (12) has obtained transparent liquid form mixt.Further,, mix the silicon-dioxide B of 5 mass parts, obtained the die bonding composition with respect to these mixture 100 mass parts.Utilize said composition, with the silicon die bonding of 1mm * 1mm, thick 0.35mm on silvering.Making the condition of being heating and curing is 100 ℃, 1 hour+150 ℃, 5 hours.According to the method identical its chip shearing resistance is measured with embodiment 1.In addition, under same condition of cure, made the tabular shaping thing of thickness 2mm, measured its hardness according to the method identical with embodiment 1.Chip shearing resistance and the hardness of this moment are as shown in table 1.
＜comparative example 1 〉
With toluene solution, the viscosity of silicone resin 80g (65.6 millis rub) is that a 100mPas and an average group accepted way of doing sth are M 2D 20D Vi 20Silicone oil 20g (118.8 the milli rub D Vi/ D=1.0) and the average structure formula with M 2D H 8The hydrogenated methyl siloxanes 24g of expression (34.8 millis rub) mixes, and wherein, described silicone resin is by M unit, M ViUnit and Q unit constitute, and M unit and M ViUnitary mol ratio is 6.25, M unit and M ViThe unitary mol ratio of unitary total amount and Q is 0.8.Under 120 ℃, decompression below the 10mmHg, from the gained liquid form mixt, remove toluene, obtained heavy-gravity liquid under the room temperature.
With respect to this thick liquid 100g, the silicone compounds 5g that contains epoxy group(ing) (42.5 millis rub) that mixes ethynylcyclohexanol 0.1g, tetramethyl-tetrem thiazolinyl Fourth Ring siloxanes 3g (34.8 millis rub), the catalyst A 0.30g as the reaction control agent and represent with following structural formula (12) has obtained transparent liquid form mixt.Further,, mix the silicon-dioxide B of 5 mass parts, obtained the die bonding composition with respect to these mixture 100 mass parts.Utilize said composition, with the silicon die bonding of 1mm * 1mm, thick 0.35mm on silvering.Making the condition of being heating and curing is 100 ℃, 1 hour+150 ℃, 5 hours.According to the method identical its chip shearing resistance is measured with embodiment 1.In addition, under same condition of cure, made the tabular shaping thing of thickness 2mm, measured its hardness according to the method identical with embodiment 1.Chip shearing resistance and the hardness of this moment are as shown in table 1.
＜comparative example 2 〉
With toluene solution, the viscosity of silicone resin 80g (65.6 millis rub) is that a 60mPas and an average group accepted way of doing sth are M Vi 2D 50Silicone oil 20g (12.6 the milli rub D Vi/ D=0) and the average structure formula with M 2D H 8The hydrogenated methyl siloxanes 11g of expression (16.0 millis rub) mixes, and wherein, described silicone resin is by M unit, M ViUnit and Q unit constitute, and M unit and M ViThe unitary mol ratio of unitary total amount and Q is 0.8.Under 120 ℃, decompression below the 10mmHg, from the gained liquid form mixt, remove toluene, obtained heavy-gravity liquid under the room temperature.
With respect to this thick liquid 100g, the silicone compounds 5g that contains epoxy group(ing) (42.5 millis rub) that mixes ethynylcyclohexanol 0.1g, tetramethyl-tetrem thiazolinyl Fourth Ring siloxanes 3g (34.8 millis rub), the catalyst A 0.30g as the reaction control agent and represent with following structural formula (12) has obtained transparent liquid form mixt.Further,, mix the silicon-dioxide B of 5 mass parts, obtained the die bonding composition with respect to these mixture 100 mass parts.Utilize said composition, with the silicon die bonding of 1mm * 1mm, thick 0.35mm on silver-plated.Making the condition of being heating and curing is 100 ℃, 1 hour+150 ℃, 5 hours.According to the method identical its chip shearing resistance is measured with embodiment 1.In addition, under same condition of cure, made the tabular shaping thing of thickness 2mm, measured its hardness according to the method identical with embodiment 1.Chip shearing resistance and the hardness of this moment are as shown in table 1.
[table 1]
? Embodiment 1 Embodiment 2 Comparative example 1 Comparative example 2
Hardness (Shore D) 62? 63? - *1 53?
The chip shearing resistance 2,800? 2,600? 1,800 *2 1,900?
* 1 fracture has taken place, and therefore can't measure
* 2 on the silicon cured article after the heating, produced crackle.

Claims (5)

1. silicone resin composite for die bonding, it contains following compositions (A)～(E):
(A) the straight chain shape organopolysiloxane of a following average group accepted way of doing sth (1) expression: 40～10 mass parts,
(R 3 3SiO 1/2) 2(R 1R 2SiO) x(R 2 2SiO) y……(1)
In the formula (1), R 1Represent alkenyl independently, R 2Representative does not independently of one another contain 1 valency alkyl of aliphatics unsaturated link(age), and whole R 2In at least 80 moles of % be methyl, R 3Be R 1Or R 2, x is the integer more than 1, y is the integer more than 3, and satisfies 0.01≤x/y≤0.30;
(B) the three-dimensional netted organopolysiloxane resins of a following average group accepted way of doing sth (2) expression: 60～90 mass parts, and (A) composition is 100 mass parts with (B) total content of composition,
Should (B) composition be wax shape or solid at 23 ℃,
R 5 3SiO 1/2) k(R 4R 5 2SiO 1/2) m(R 4R 5SiO) n(R 5 2SiO) p
(R 4SiO 3/2) q(R 5SiO 3/2) r(SiO 2) s……(2)
In the formula (2), R 4Represent alkenyl independently, R 5Representative does not contain 1 valency alkyl and whole R of aliphatics unsaturated link(age) independently 5In at least 80 moles of % be methyl, satisfy 1＞k 〉=0,1＞m 〉=0,1＞n 〉=0,1＞p 〉=0,1＞q 〉=0,1＞r 〉=0,1＞s 〉=0, and m+n+q＞0, q+r+s＞0, and, k+m+n+p+q+r+s=1;
(C) the organic hydride polysiloxane of a following average group accepted way of doing sth (3) expression: content that should (C) composition make the amount that is bonded in the hydrogen atom on the Siliciumatom in (C) composition with mole count (A) composition and (B) all in the composition be bonded in 0.5～5.0 times of amount of the alkenyl on the Siliciumatom
Should have 2 hydrogen atoms that are bonded on the Siliciumatom at least in per 1 molecule of (C) composition,
R 6 aH bSiO (4-a-b)/2……(3)
In the formula (3), R 6Representative does not contain aliphatics unsaturated link(age) and replacement or unsubstituted 1 valency alkyl and whole R independently 6In at least 50 moles of % be methyl, a is for satisfying the number of 0.7≤a≤2.1, b is for satisfying the number of 0.001≤b≤1.0, and a+b is the number that satisfies 0.8≤a+b≤3.0;
(D) platinum metals class catalyzer: significant quantity; And,
(E) smoke-like silicon-dioxide:, should (E) composition be 1～20 mass parts with respect to total amount 100 mass parts of (A)～(C) composition.
2. composition according to claim 1, wherein, in (A)～(C) composition in described composition, be bonded on the Siliciumatom and all 1 valency alkyl of not fatty family unsaturated link(age) in 90 moles of % abovely be methyl.
3. composition according to claim 1 and 2, wherein, the Shore D hardness of the cured article that is got by described composition curing is more than 30.
4. composition according to claim 1, wherein, x+y is 50～50 for making the viscosity of (A) composition under 25 ℃, the scope of 000mPa.
5. composition according to claim 1, wherein, with respect to every 100g (B) composition, (B) content that is bonded in the alkenyl on the Siliciumatom in the composition is 0.01～1mol scope.
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