CN101911261A - 循环成核法 - Google Patents
循环成核法 Download PDFInfo
- Publication number
- CN101911261A CN101911261A CN2008801223550A CN200880122355A CN101911261A CN 101911261 A CN101911261 A CN 101911261A CN 2008801223550 A CN2008801223550 A CN 2008801223550A CN 200880122355 A CN200880122355 A CN 200880122355A CN 101911261 A CN101911261 A CN 101911261A
- Authority
- CN
- China
- Prior art keywords
- bubble
- liquid
- described object
- help
- chemism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (40)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US98315807P | 2007-10-27 | 2007-10-27 | |
US60/983,158 | 2007-10-27 | ||
PCT/US2008/081397 WO2009055834A2 (en) | 2007-10-27 | 2008-10-27 | Cyclic nucleation process |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101911261A true CN101911261A (zh) | 2010-12-08 |
CN101911261B CN101911261B (zh) | 2012-05-30 |
Family
ID=40580453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008801223550A Active CN101911261B (zh) | 2007-10-27 | 2008-10-27 | 循环成核法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100192978A1 (zh) |
EP (1) | EP2212906B1 (zh) |
KR (1) | KR20100106321A (zh) |
CN (1) | CN101911261B (zh) |
WO (1) | WO2009055834A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102618933A (zh) * | 2011-01-30 | 2012-08-01 | 上海思恩电子技术有限公司 | 硅材料的压差湿处理装置及其处理方法 |
CN109301032A (zh) * | 2018-09-28 | 2019-02-01 | 横店集团东磁股份有限公司 | 单晶硅表面制绒方法 |
CN114364467A (zh) * | 2019-09-20 | 2022-04-15 | 卡本有限公司 | 通过真空循环成核而增材制造的物体的清洁 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101911261B (zh) | 2007-10-27 | 2012-05-30 | 亥普弗罗有限责任公司 | 循环成核法 |
JP5254308B2 (ja) * | 2010-12-27 | 2013-08-07 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体 |
KR20140142227A (ko) * | 2012-01-02 | 2014-12-11 | 에드벤스트 웨트 테크놀로지스 게엠베하 | 순환식 핵화 이송용 세척 방법 및 시스템 |
WO2013158802A1 (en) * | 2012-04-18 | 2013-10-24 | Advanced Wet Technogogies Gmbh | Dynamic chamber for cycle nucleation technology |
EP2866954A1 (en) * | 2012-05-06 | 2015-05-06 | Advanced Wet Technologies GmbH | Hyperbaric methods and systems for surface treatment, cleaning, and drying |
WO2014052508A1 (en) * | 2012-09-25 | 2014-04-03 | Advanced Wet Technogogies Gmbh | Gas expansion displacement cnx concept, methods and apparatus. |
US10022189B2 (en) | 2013-12-16 | 2018-07-17 | Stryker Sustainability Solutions, Inc. | Apparatus and method for cleaning an instrument |
DE102015104147B4 (de) | 2015-03-19 | 2019-09-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Ablösung eines Aufwachssubstrats von einer Schichtenfolge |
JP6639657B2 (ja) * | 2015-10-04 | 2020-02-05 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 熱質量が小さい加圧チャンバ |
DE102019108094A1 (de) | 2018-03-28 | 2019-10-02 | Lpw Reinigungssysteme Gmbh | Verfahren und Vorrichtung zur Bereitstellung eines Mediums mittels zyklischer Nukleation |
DE102023111577A1 (de) | 2022-12-14 | 2024-06-20 | Ecoclean Gmbh | Verfahren zur Behandlung eines Werkstücks und Vorrichtung zum Behandeln von Werkstücken |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4294805A (en) | 1978-08-09 | 1981-10-13 | United Kingdom Atomic Energy Authority | Method of leaching the contents of a can |
DE4138400C1 (zh) | 1991-11-22 | 1993-02-18 | Aichelin Gmbh, 7015 Korntal-Muenchingen, De | |
JP2777498B2 (ja) * | 1991-12-06 | 1998-07-16 | 三菱電機株式会社 | 基板の洗浄方法 |
US5301701A (en) * | 1992-07-30 | 1994-04-12 | Nafziger Charles P | Single-chamber cleaning, rinsing and drying apparatus and method therefor |
JPH06252115A (ja) * | 1993-02-23 | 1994-09-09 | Tamotsu Mesaki | 被洗浄物の洗浄方法 |
US5868898A (en) * | 1996-11-21 | 1999-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fluid dispensing device for wet chemical process tank and method of using |
US6253775B1 (en) * | 1998-06-04 | 2001-07-03 | Tokyo Electron Limited | Cleaning apparatus |
JP2001246337A (ja) * | 2000-03-09 | 2001-09-11 | Mitsubishi Electric Corp | 微細孔を有する部品の湿式表面処理方法 |
US6418942B1 (en) | 2000-03-10 | 2002-07-16 | Donald Gray | Solvent and aqueous decompression processing system |
US6743300B2 (en) * | 2002-01-15 | 2004-06-01 | Donald Gray | Multistep single chamber parts proceeding method |
US6783601B2 (en) * | 2002-06-06 | 2004-08-31 | Donald Gray | Method for removing particles and non-volatile residue from an object |
US7270130B2 (en) * | 2003-10-15 | 2007-09-18 | Infineon Technologies Ag | Semiconductor device cleaning employing heterogeneous nucleation for controlled cavitation |
US6802137B1 (en) * | 2003-11-25 | 2004-10-12 | Donald Gray | Solvent drying method |
JP2005166906A (ja) * | 2003-12-02 | 2005-06-23 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置および基板洗浄方法 |
WO2005071138A1 (ja) * | 2004-01-23 | 2005-08-04 | Ebara Corporation | 基板処理方法及び触媒処理液及び基板処理装置 |
DE502004011649D1 (de) * | 2004-03-22 | 2010-10-21 | Rena Sondermaschinen Gmbh | Verfahren zur behandlung von substratoberflächen |
US20070107748A1 (en) * | 2005-11-16 | 2007-05-17 | Donald Gray | Vacuum cavitational streaming |
US7444761B2 (en) * | 2006-03-06 | 2008-11-04 | Gray Donald J | Intrinsically safe flammable solvent processing method and system |
CN101911261B (zh) | 2007-10-27 | 2012-05-30 | 亥普弗罗有限责任公司 | 循环成核法 |
-
2008
- 2008-10-27 CN CN2008801223550A patent/CN101911261B/zh active Active
- 2008-10-27 WO PCT/US2008/081397 patent/WO2009055834A2/en active Application Filing
- 2008-10-27 EP EP08842674.7A patent/EP2212906B1/en active Active
- 2008-10-27 KR KR1020107011653A patent/KR20100106321A/ko not_active Application Discontinuation
- 2008-10-27 US US12/259,294 patent/US20100192978A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102618933A (zh) * | 2011-01-30 | 2012-08-01 | 上海思恩电子技术有限公司 | 硅材料的压差湿处理装置及其处理方法 |
CN109301032A (zh) * | 2018-09-28 | 2019-02-01 | 横店集团东磁股份有限公司 | 单晶硅表面制绒方法 |
CN114364467A (zh) * | 2019-09-20 | 2022-04-15 | 卡本有限公司 | 通过真空循环成核而增材制造的物体的清洁 |
Also Published As
Publication number | Publication date |
---|---|
WO2009055834A3 (en) | 2009-06-11 |
CN101911261B (zh) | 2012-05-30 |
EP2212906A4 (en) | 2014-09-17 |
WO2009055834A2 (en) | 2009-04-30 |
US20100192978A1 (en) | 2010-08-05 |
EP2212906A2 (en) | 2010-08-04 |
EP2212906B1 (en) | 2022-02-16 |
KR20100106321A (ko) | 2010-10-01 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ADVANCED WET TECHNOLOGIES GMBH Free format text: FORMER OWNER: HYPERFLO LLC Effective date: 20130624 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130624 Address after: German Xu Fengen Patentee after: Advanced wet technologies Address before: Arizona, USA Patentee before: Hyperflo LLC |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151201 Address after: German - Bella Xu at Patentee after: LPW high purity company Address before: German Xu Fengen Patentee before: Advanced wet technologies |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160108 Address after: German Reid Rishi Patentee after: LPW Purification Systems Ltd Address before: German - Bella Xu at Patentee before: LPW high purity company |