CN101883479A - 电子装置壳体 - Google Patents

电子装置壳体 Download PDF

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Publication number
CN101883479A
CN101883479A CN2009103021244A CN200910302124A CN101883479A CN 101883479 A CN101883479 A CN 101883479A CN 2009103021244 A CN2009103021244 A CN 2009103021244A CN 200910302124 A CN200910302124 A CN 200910302124A CN 101883479 A CN101883479 A CN 101883479A
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China
Prior art keywords
electronic device
side plate
case
groove
towards
Prior art date
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Pending
Application number
CN2009103021244A
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English (en)
Inventor
孙正衡
马小峰
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2009103021244A priority Critical patent/CN101883479A/zh
Priority to US12/606,107 priority patent/US20100284148A1/en
Publication of CN101883479A publication Critical patent/CN101883479A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种电子装置壳体，包括一设有一通风区域的侧板，所述侧板包括相对的一第一侧面与一第二侧面，所述通风区域设有至少一通槽，所述侧板的第二侧面对于每一通槽设有若干跨接所述通槽的两相对侧缘的弯折片，每两相邻的弯折片之间形成一通风孔，斜吹过所述通槽与弯折片之间的空气气流可从邻近的对应通风孔穿过该侧板，从而可以促进气流流过该侧板。

Description

电子装置壳体
技术领域
本发明是关于一种电子装置壳体，特别是关于一种具有通风孔的电子装置壳体。
背景技术
电子装置，如电脑或服务器等，为达到散热的目的，通常在壳体上设有若干通风孔，以让外界的冷空气流入或让***内的热空气流出。然而，现有的技术通常是在壳体的一呈平板状的侧板上开设若干圆形或方形的通风孔，冷空气或热空气的气流遇该壳体将被挡住，其只能通过通风孔穿过该侧板，气流流通率较低。
发明内容
鉴于以上，有必要提供一种能够促进气流流通的电子装置壳体。
一种电子装置壳体，包括一设有一通风区域的侧板，所述侧板包括相对的一第一侧面与一第二侧面，所述通风区域设有至少一通槽，所述侧板的第二侧面对于每一通槽设有若干跨接所述通槽的两相对侧缘的弯折片，每两相邻的弯折片之间形成一通风孔。
相较现有技术，上述电子装置壳体通过在侧板设置通槽及弯折片，使弯折片之间形成的通风孔开口变大、深度变深，斜吹过通槽与弯折片之间的空气气流也能从邻近的对应通风孔穿过该侧板，从而可以促进气流流过该侧板。
附图说明
图1是本发明电子装置壳体的立体透视图。
具体实施方式
请参照图1，为本发明电子装置壳体10的较佳实施方式。该电子装置壳体10包括一呈平板状的侧板12。该侧板12包括一朝向该电子装置壳体10外侧的第一侧面121与一朝向该电子装置壳体10内侧的第二侧面122。该侧板12上设有一通风区域124，用于让外部的冷空气进入该电子装置壳体10内。该通风区域124设有若干长形的通槽125，该侧板12的第二侧面122，对于每一通槽125，都设有若干间隔的跨接该通槽125两相对侧缘的弯折片126，从而每两相邻的弯折片126之间形成一通风孔127。这些弯折片126均是朝向该电子装置壳体10内弯折的。在本实施方式中，这些弯折片126是呈钝角弯折的，在其他实施方式中，这些弯折片126还可以是呈直角、锐角弯折或弧形弯折。
当外部的冷空气要进入该电子装置壳体10时，冷空气从不同角度吹向该侧板12(如图中箭头所示)。由于该通风区域124的这些弯折片126向该电子装置壳体10内弯折，这些通风孔127分别与相对应的通槽125相连通，从而使得这些通风孔127相对于直接在平板状侧板上开设的通风孔，开口变大、深度变深，斜吹过通槽125与弯折片126之间的冷空气也能从邻近的对应通风孔127吹入该电子装置壳体10内，从而可以让更多的冷空气通过这些通风孔127进入该电子装置壳体10。
在其他实施方式中，可以将该侧板12内外侧翻转地装设于该电子装置壳体10，即使该侧板12的第一侧面121朝向该电子装置壳体10内侧，该第二侧面122朝向该电子装置壳体10外侧，从而该通风区域124的弯折片126朝向该电子装置壳体10外弯折，该装置可以使电子装置壳体10内的更多的热空气通过这些通风孔127排出该电子装置壳体10。

Claims (3)

1.一种电子装置壳体，包括一设有一通风区域的侧板，所述侧板包括相对的一第一侧面与一第二侧面，其特征在于：所述通风区域设有至少一通槽，所述侧板的第二侧面对于每一通槽设有若干跨接所述通槽的两相对侧缘的弯折片，每两相邻的弯折片之间形成一通风孔。
2.如权利要求1所述的电子装置壳体，其特征在于：所述侧板的第一侧面朝向所述电子装置壳体的外侧，所述侧板的第二侧面朝向所述电子装置壳体的内侧，所述若干弯折片朝向所述电子装置壳体的内侧弯折。
3.如权利要求1所述的电子装置壳体，其特征在于：所述侧板的第一侧面朝向所述电子装置壳体的内侧，所述侧板的第二侧面朝向所述电子装置壳体的外侧，所述若干弯折片朝向所述电子装置壳体的外侧弯折。
CN2009103021244A 2009-05-06 2009-05-06 电子装置壳体 Pending CN101883479A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009103021244A CN101883479A (zh) 2009-05-06 2009-05-06 电子装置壳体
US12/606,107 US20100284148A1 (en) 2009-05-06 2009-10-26 Electronic device enclosure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103021244A CN101883479A (zh) 2009-05-06 2009-05-06 电子装置壳体

Publications (1)

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CN101883479A true CN101883479A (zh) 2010-11-10

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US (1) US20100284148A1 (zh)
CN (1) CN101883479A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110381690A (zh) * 2019-08-02 2019-10-25 北京智芯微电子科技有限公司 高环境适应性的车内设备外壳

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6932443B1 (en) * 2000-10-19 2005-08-23 Multipower, Inc. Outdoor cabinet for electrical components
DE10155810B4 (de) * 2001-11-14 2004-02-12 Minebea Co. Ltd., a Japanese Corporation, Nagano Gehäusekomponente für eine zu belüftende Einrichtung
US6814659B2 (en) * 2002-10-31 2004-11-09 Illinois Tool Works Inc. Louver configuration for welding apparatus
TWM241965U (en) * 2003-05-23 2004-08-21 Hon Hai Prec Ind Co Ltd EMI-Attenuating air ventilation panel
US7173822B2 (en) * 2004-10-28 2007-02-06 Cisco Technology, Inc. Techniques for providing ventilation and EMI shielding to electronic circuitry using a panel member with brimmed holes
US20060148398A1 (en) * 2004-12-20 2006-07-06 Mark Ruch Air vent and method
US7529087B2 (en) * 2006-02-24 2009-05-05 Cisco Technology, Inc. Method and apparatus for ventilating a computerized device
CN101207995B (zh) * 2006-12-20 2010-12-29 富准精密工业(深圳)有限公司 散热模组及采用该散热模组的电子装置
US7606044B2 (en) * 2007-06-06 2009-10-20 Dell Products L.P. Multi-purpose structural support I/O member for a server
US7675749B2 (en) * 2007-12-12 2010-03-09 Zippy Technology Corp. Heat dissipating structure of 1U power supply
CN101483992B (zh) * 2009-02-05 2011-05-18 旭丽电子(广州)有限公司 可防水的电子装置散热结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110381690A (zh) * 2019-08-02 2019-10-25 北京智芯微电子科技有限公司 高环境适应性的车内设备外壳

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Application publication date: 20101110