CN101883474A - Method of manufacturing flexible printed circuit board - Google Patents
Method of manufacturing flexible printed circuit board Download PDFInfo
- Publication number
- CN101883474A CN101883474A CN2009102243172A CN200910224317A CN101883474A CN 101883474 A CN101883474 A CN 101883474A CN 2009102243172 A CN2009102243172 A CN 2009102243172A CN 200910224317 A CN200910224317 A CN 200910224317A CN 101883474 A CN101883474 A CN 101883474A
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- Prior art keywords
- copper foil
- foil layer
- copper
- layer
- seed layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
Abstract
The present invention provides a method of manufacturing a flexible printed circuit board, including forming conducting holes on a polyimides substrate which is overlapped with a first copper foil layer on one side; processing the surface of the polyimides substrate; forming a seed layer by sputtering, and plating electrolytic copper to the surface of the polyimides substrate; plating the electrolytic copper to the surface of the seed layer to form a second copper foil layer; forming a circuit on the first and second copper foil layers; and postprocessing the surface of the circuit. The seed layer is formed by sputtering, and the first and second copper foil layers are formed by plating copper, such that the thickness of the substrate is thin, and the process of manufacturing the flexible printed circuit board is simple.
Description
The cross reference of related application
The application requires the priority of korean patent application No.10-2009-0040335 that submits on May 8th, 2009 in Korea S Department of Intellectual Property and the korean patent application No.10-2009-0074841 that submitted on August 13rd, 2009, and the whole disclosures that are incorporated herein these two korean patent applications as a reference.
Technical field
The present invention relates to a kind of method of making printed circuit board (PCB), more specifically, relate to the method that a kind of manufacturing has pliability and flexible flexible printed circuit board.
Background technology
Along with the integrated development of semiconductor integrated circuit, be used for directly installing the development of surface mounting technology of little chip assembly and the trend that makes electronics miniaturization, developed and be easy to embed flexible printed circuit board (FPCB) complicated and that the confined space is interior.
By flexible copper-clad laminated sheet (FCCL) is made this FPCB as the material of substrate.FCCL is by copper foil layer being bonded in the flexible substrates that obtains on the surface of polyimide film.In the past, usually use the 3-tier architecture of stacked in regular turn polyimide film, adhesive and copper foil layer, wherein use adhesive that polyimide film and copper foil layer are joined to one another, but in the last few years, usually use the FCCL with 2 layers of structure, wherein polyimide film and copper foil layer are connected to each other directly.
Fig. 1 is the profile of conventional FCCL 10, and Fig. 2 is the profile that is coated with the FCCL 10 of copper on the surface of the FCCL 10 of Fig. 1.With reference to Fig. 1, FCCL 10 is included in the top and the copper foil layer on the bottom 12 of polyimide film 11, and wherein via 13 is to wait by boring processing to penetrate polyimide film 11 and copper foil layer 12 forms.
As shown in Figure 2, after forming via 13, upper surface and lower surface conduction in order to make copper foil layer 12 by via 13 form copper plate 14 by electroless copper or electro-coppering etc. on the surface of copper foil layer 12.
Yet when using electroless copper or electro-coppering etc., flexible printed circuit board is because of copper plate 14 thickenings.In addition, such FCCL 10 comprises thick copper foil layer 12, therefore is difficult to form microcircuit.
In order to prevent from FCCL 10 thickenings, can use to be known as the method for hole electro-coppering (button plating), wherein need not copper-plated dry film (figure does not show) and be connected near only copper facing via 13 with the surface of copper foil layer 12.Yet in this case, the process of making FCCL 10 becomes complicated, because need expose and development treatment to dry film.
Summary of the invention
The invention provides a kind of method of making flexible printed circuit board, this method is easy to form the circuit with micro-pattern by the thickness that reduces flexible printed circuit board.
According to an aspect of the present invention, provide a kind of method of making flexible printed circuit board, described method comprises: be stacked with in a side in the polyimides substrate of first copper foil layer and form via; Surface treatment is carried out in described polyimides substrate; By using sputter to form Seed Layer, cathode copper is plated on the surface of described polyimides substrate; Cathode copper is plated to forms second copper foil layer on the surface of described Seed Layer; On described first copper foil layer and described second copper foil layer, form circuit; And the post-processing step of handling described circuit surface.
Described via can form by penetrating described first copper foil layer and described polyimides substrate, or only forms by penetrating described polyimides substrate.Described surface treatment can be by using at least a the carrying out in ion beam, plasma and the abatement processes.
The formation of described Seed Layer can be by using at least a the carrying out in induction heating method, electrical resistance heating, electronic beam method and the plasma method.Described Seed Layer can contain nickel-chromium alloy (Ni-Cr), copper (Cu) or nickel (Ni).
Described method can also comprise: before forming described via, carrier band is bonded on the end face of described first copper foil layer; And after forming described second copper foil layer, remove described carrier band.
When on described first copper foil layer and described second copper foil layer, forming circuit, can by use etching remove will be crooked the zone in described Seed Layer and described second copper foil layer.
Description of drawings
Detailed description by the reference accompanying drawing carries out exemplary embodiment can more be expressly understood above-mentioned and other feature and advantage of the present invention, in the accompanying drawings:
Fig. 1 is the profile of conventional flexible copper-clad laminated sheet (FCCL);
Fig. 2 is the profile that is coated with the FCCL of copper on the surface of the FCCL of Fig. 1;
Fig. 3 shows the flow chart of making the method for flexible printed circuit board according to embodiments of the invention;
Fig. 4～Figure 10 is each step of flexible printed circuit board is made in explanation according to embodiments of the invention a profile; And
Figure 11 is the profile that flexible printed circuit board according to another embodiment of the present invention is described.
Embodiment
Hereinafter, with reference to the accompanying drawing that shows exemplary embodiment of the present invention the present invention is described more fully.Term or word should not be construed as the lexical or textual analysis of their general or dictionary as used herein, and should be interpreted as implication and notion corresponding to aspect of the present invention based on the principle that in the present invention notion of term is provided suitable definition for the present invention is described in the best way.
Therefore, only be preferred embodiment at the embodiment and the accompanying drawing of this explanation, do not represent various technology aspect of the present invention.Like this, it is multiple multi-form to it will be understood by those skilled in the art that the present invention can be presented as.
Fig. 3 shows the flow chart of making the method for flexible printed circuit board according to embodiments of the invention, and Fig. 4～Figure 10 is each step of flexible printed circuit board is made in explanation according to embodiments of the invention a profile.
With reference to Fig. 3～Figure 10, the method comprising the steps of S11～S18.
In step S11, as shown in Figure 4, prepare the polyimides substrate 110 of stacked first copper foil layer 120 on a side, then carrier band 400 is bonded on the end face of first copper foil layer 120.The polyimides substrate 110 of stacked first copper foil layer 120 is also referred to as the single face material on a side.First copper foil layer 120 can be common electrolysis paper tinsel, especially, if flexible demand is arranged, can be to have the calendering paper tinsel of good characteristics of flexibility or special electrolysis paper tinsel etc.
Can according to circumstances need not carry out the bonding of carrier band 400, below this be had description.
In step S12, as shown in Figure 6, form the via 130 that penetrates polyimides substrate 110.
Via 130 can be by formation such as use ultraviolet (UV) laser drill.When using the UV laser drill, can be with vanadium as lasing light emitter, be of a size of 75 μ m or littler via 130 to produce the UV wavelength of 355 μ m, can form like this.By using the UV laser drill, can form small and accurate via 130.
In step S13, the surface of polyimides substrate 110 is handled.Can be by using at least a this surface of handling in ion beam, plasma and the abatement processes.
Particularly, when using plasma to come sputter below with the Seed Layer 200 described, plasma can launch on the surface of first copper foil layer 120, therefore is difficult to improve the surface roughness of polyimides substrate 110.After carrying out step S13, plasma can not launch on first copper foil layer 120, has obtained the uniform surface roughness of polyimides substrate 110 like this, and need not to consider first copper foil layer 120, thereby increased bonding force when forming Seed Layer 200.
Next, in step S14, as shown in Figure 7, form Seed Layer 200, cathode copper is plated on that surface of polyimides substrate 110 with via 130 by using sputter.Seed Layer 200 can be formed by nickel-chromium alloy (Ni-Cr), copper (Cu) or nickel (Ni).Because Seed Layer 200 is used to form second copper foil layer 300 that below will describe, therefore as shown in Figure 7, Seed Layer 200 can not be formed on first copper foil layer 120.In other words, the plasma that is used to form Seed Layer 200 produces towards polyimides substrate 110, and Seed Layer 200 forms on polyimides substrate 110 and via 130.The sputter that is used to form Seed Layer 200 in step S14 can be by using at least a the carrying out in induction heating method, electrical resistance heating, electronic beam method and the plasma method.
Sputter is by colliding metallic plate to remove metallic molecule from metallic plate with inert element, adhering to one deck then and carry out on the surface of metallic plate.Make when target being applied direct current (DC) electricity when flowing into vacuum chamber, at target with will produce plasma between the substrate of sputter such as inert gases such as argon (Ar) gas.In plasma, Ar gas is ionized into cation by high power DC ammeter.The DC ammeter makes the Ar cation to negative electrode accelerated motion, and bumps with the target surface.The atom of the target that is collided exchanges momentum because of perfectly elastic impact, therefore penetrates from the surface of target.Atom free movement in vacuum chamber of penetrating, and on the surface of target, form sputtering layer.The atom that penetrates has very high kinetic energy according to momentum, and therefore according to thermodynamics, the surface of target is stable diffusion when forming sputtering layer, and has formed the extremely thin film with microstructure.Thickness by using the Seed Layer 200 that sputter forms is 1000
Or it is thinner.Sputter needs the above high pressure of 600V, and the electric current of the sputtering rate that decision is electroplated only is 10A, so sputtering rate is not high.
As mentioned above, launch on the surface of first copper foil layer 120 by sputter, the surface of polyimides substrate 110 is handled in order to prevent plasma.In addition, carrier band 400 prevents that also plasma from launching on first copper foil layer 120.
In step S15, as shown in Figure 8, form second copper foil layer 300 on the surface of the Seed Layer 200 by cathode copper being plated to sputter.Cathode copper also is plated on the via 130, and therefore first copper foil layer 120 and second copper foil layer 300 conduct electricity.
When on the surface that cathode copper is plated to Seed Layer 200, apply electric current to the end face and the bottom surface of Seed Layer 200.At this moment, also apply little electric current to first copper foil layer 120 that does not need cathode copper.Therefore, cathode copper can also be plated on first copper foil layer 120.In this case, the thickness of first copper foil layer 120 and second copper foil layer 300 can differ from one another, and therefore, for preventing that cathode copper is plated on the end face of first copper foil layer 120, carrier band 400 is adhered on the end face of first copper foil layer 120.In addition, the polyimides substrate 110 of form membrane can become very soft and can be crooked, and this is because it is weakened when electroplating cathode copper.Therefore, carrier band 400 makes the thickness of polyimides substrate 110 keep evenly preventing the bending of polyimides substrate 110 thus.
In step S16, as shown in Figure 9, remove carrier band 400.In this embodiment of the present invention, though used the thickness of carrier band 400, the first copper foil layers 120 and second copper foil layer 300 to regulate by the electric current that adjusting is applied to first copper foil layer 120 and second copper foil layer 300, rather than use carrier band 400.In this case, can omit step S16.
In step S17, on first copper foil layer 120 and second copper foil layer 300, form circuit by using exposure technology, developing process and etching process.As shown in Figure 9, in the etching process process, remove the Seed Layer 200 and second copper foil layer 300 corresponding to regional A that will be crooked.When by copper being electroplated onto when forming second copper foil layer 300 on the Seed Layer 200 that is formed by sputter, the flexible of regional A may be low.Therefore, when forming circuit, remove the Seed Layer 200 and second copper foil layer 300 among the regional A by etching.
After step S17, as shown in figure 10, in step S 18, carry out post-processing step on the circuit surface by being adhered on the surface that photosensitive solder resist (PSR) printing ink is coated on circuit or with ray Protective film 500.
Figure 11 is the profile that flexible printed circuit board according to another embodiment of the present invention is described.With the present invention only penetrate polyimides substrate 110 form the foregoing descriptions of vias 130 different be to form by penetrating carrier band 400, first copper foil layer 120 and polyimides substrate 110 according to the via 130 of this embodiment of the invention.Here, carry out and above-mentioned the same step S12～S18, therefore here no longer to its repeat specification.
According to the method for making flexible printed circuit board, Seed Layer 200 forms by using sputter, and second copper foil layer 300 forms by electro-coppering on Seed Layer 200.Therefore, the very thin thickness of flexible printed circuit board, and be easy to form circuit with micro-pattern.In addition, for the thickness that prevents first copper foil layer 120 and second copper foil layer 300 increases, compare with the hole electro-coppering, manufacture method obtains simplifying.When using carrier band 400, in etching process, can reduce in the top of circuit pattern and the variation between the bottom, can prevent that plasma from launching on first copper foil layer 120, and can prevent that polyimides substrate 110 is wrinkling.
The method of flexible printed circuit board constructed in accordance, owing to form Seed Layer by the use sputter, and utilize copper facing on Seed Layer, to form copper foil layer, therefore reduced the thickness of flexible printed circuit board.In addition, because flexible printed circuit board is very thin, therefore be easy to form circuit with micro-pattern.In addition, for the thickness that prevents copper foil layer increases, compare with the hole electro-coppering, manufacturing process is simplified more.In addition, when using carrier band, in etching process, can reduce to prevent that in the top of circuit pattern and the variation between the bottom plasma from launching on copper foil layer, and can prevent that the polyimides substrate is wrinkling.
Although the present invention has been carried out concrete demonstration and explanation with reference to exemplary embodiment, yet it will be understood by those skilled in the art that, under the situation of the spirit and scope of the present invention that do not deviate from the appended claims qualification, can make the various variations of form and details aspect.
Claims (8)
1. method of making flexible printed circuit board, described method comprises:
Be stacked with in a side in the polyimides substrate of first copper foil layer and form via;
Surface treatment is carried out in described polyimides substrate;
By using sputter to form Seed Layer, cathode copper is plated on the surface of described polyimides substrate;
Cathode copper is plated to forms second copper foil layer on the surface of described Seed Layer;
On described first copper foil layer and described second copper foil layer, form circuit; And
Handle the post-processing step of described circuit surface.
2. the method for claim 1, wherein described via forms by penetrating described polyimides substrate.
3. the method for claim 1, wherein described via forms by penetrating described first copper foil layer and described polyimides substrate.
4. the method for claim 1, wherein described surface treatment is by using at least a the carrying out in ion beam, plasma and the abatement processes.
5. the method for claim 1, wherein the formation of described Seed Layer is by using at least a the carrying out in induction heating method, electrical resistance heating, electronic beam method and the plasma method.
6. the method for claim 1, wherein described Seed Layer contains nickel-chromium alloy (Ni-Cr), copper (Cu) or nickel (Ni).
7. the method for claim 1 also comprises:
Before forming described via, carrier band is bonded on the end face of described first copper foil layer; And
After forming described second copper foil layer, remove described carrier band.
8. as each described method in the claim 1～7, wherein, when on described first copper foil layer and described second copper foil layer, forming circuit, by use etching remove will be crooked the zone in described Seed Layer and described second copper foil layer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0040335 | 2009-05-08 | ||
| KR20090040335 | 2009-05-08 | ||
| KR1020090074841A KR100951939B1 (en) | 2009-05-08 | 2009-08-13 | Method of manufacturing flexible printed circuit board |
| KR10-2009-0074841 | 2009-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101883474A true CN101883474A (en) | 2010-11-10 |
Family
ID=42219692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102243172A Pending CN101883474A (en) | 2009-05-08 | 2009-11-17 | Method of manufacturing flexible printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100951939B1 (en) |
| CN (1) | CN101883474A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096615A (en) * | 2012-11-14 | 2013-05-08 | 南京市江宁区丁卯电子科技中心 | Flexible printed circuit board provided with light emitting diode |
| WO2015149580A1 (en) * | 2014-04-04 | 2015-10-08 | 珠海市创元电子有限公司 | Method for manufacturing flexible copper clad laminate with metalized through-hole |
| CN108990298A (en) * | 2018-07-26 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A method of fine-line is made by seed layer and resist layer of nickel |
| CN110418507A (en) * | 2019-08-19 | 2019-11-05 | 台山市精诚达电路有限公司 | High-frequency high-speed flexible electric circuit board manufacturing process |
| CN112064071A (en) * | 2020-09-09 | 2020-12-11 | 松山湖材料实验室 | Bending-resistant copper foil, preparation method thereof and FPC (flexible printed circuit) flexible circuit board |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101158208B1 (en) | 2010-09-16 | 2012-06-19 | 삼성전기주식회사 | Method for forming hole and plating of substrates using plasma |
| KR101886423B1 (en) * | 2011-11-29 | 2018-09-11 | 엘지이노텍 주식회사 | Chip package member and manufacturing method thereof |
| WO2013069947A1 (en) * | 2011-11-09 | 2013-05-16 | Lg Innotek Co., Ltd. | Tape carrier package and method of manufacturing the same |
| KR101328206B1 (en) * | 2012-01-12 | 2013-11-14 | 영풍전자 주식회사 | A method for manufacturing a printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100642741B1 (en) * | 2004-12-02 | 2006-11-10 | 엘지마이크론 주식회사 | Method for making double sides wiring substrate |
| KR100677938B1 (en) * | 2004-12-30 | 2007-02-05 | 엘지마이크론 주식회사 | Manufacturing mehtod of double-sides wiring board and double-sides wiring board |
| KR20080087622A (en) * | 2007-08-02 | 2008-10-01 | 주식회사 피앤아이 | Double sided flexible copper clad laminate without a adhesive layer, flexible printed circuit board using the flexible copper clad laminate, and fabrication methods of the flexible copper clad laminate and the flexible printed circuit board |
| KR20090025546A (en) * | 2007-09-06 | 2009-03-11 | (주)인터플렉스 | Manufacturing method of a flexible printed circuit board |
-
2009
- 2009-08-13 KR KR1020090074841A patent/KR100951939B1/en active IP Right Grant
- 2009-11-17 CN CN2009102243172A patent/CN101883474A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096615A (en) * | 2012-11-14 | 2013-05-08 | 南京市江宁区丁卯电子科技中心 | Flexible printed circuit board provided with light emitting diode |
| WO2015149580A1 (en) * | 2014-04-04 | 2015-10-08 | 珠海市创元电子有限公司 | Method for manufacturing flexible copper clad laminate with metalized through-hole |
| CN108990298A (en) * | 2018-07-26 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A method of fine-line is made by seed layer and resist layer of nickel |
| CN110418507A (en) * | 2019-08-19 | 2019-11-05 | 台山市精诚达电路有限公司 | High-frequency high-speed flexible electric circuit board manufacturing process |
| CN110418507B (en) * | 2019-08-19 | 2020-11-06 | 台山市精诚达电路有限公司 | Manufacturing process of high-frequency high-speed flexible circuit board |
| CN112064071A (en) * | 2020-09-09 | 2020-12-11 | 松山湖材料实验室 | Bending-resistant copper foil, preparation method thereof and FPC (flexible printed circuit) flexible circuit board |
| CN112064071B (en) * | 2020-09-09 | 2021-08-03 | 松山湖材料实验室 | Bending-resistant copper foil, preparation method thereof and FPC (flexible printed circuit) flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100951939B1 (en) | 2010-04-09 |
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Application publication date: 20101110 |