CN101880493A - Method for preparing nano copper conductive ink - Google Patents
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Abstract
The invention discloses a method for preparing nano copper conductive ink, which can be applied in the field of printing electronic technology, in particular ink jet printing technology. The preparation method comprises the following steps of: dissolving copper salt and protective agent into a solvent, heating and stirring the solution, adding a small amount of alkali solution to adjust the pH of the solution to between 7 and 10, dripping a reducing agent into the solution, continuously stirring the solution to react for 30 to 60 minutes, and then cooling the reaction solution to room temperature to obtain nano copper dispersion; performing centrifuging, washing and vacuum drying at room temperature on the nano copper dispersion to obtain nano copper granules; and dispersing the nano copper granules into an organic solvent, and ultrasonically treating the solution to obtain the nano copper conductive ink. The method solves the problems of complex preparation process and long preparation period in the prior art, has the advantages of simple and convenient operation, low production cost, short flow and no harmful waste generation, and realizes the goals of environmental protection and economy; and the prepared nano copper conductive ink has good dispersion property and high stability.
Description
Technical field
The present invention relates to the conductive ink technical field in the printed electronics technology, especially relate to a kind of preparing nano copper conductive.
Background technology
Ground such as America and Europe, Japan, Korea S and China Taiwan are rising a novel manufacturing technology-printed electronics or printed electronics circuit engineering at present, are also referred to as additive process.This revolutionary new technology adopts various printing technologies on insulating substrate functional ink directly to be printed to circuit or device, is the manufacturing technology of a kind of versatile and flexible, rapid and convenient, environmental protection and energy saving.Now this Study on Technology is mainly concentrated on printing technology and the material that is used to print, the i.e. research of functional ink.
Spray ink Printing is a kind of extremely wide, more sophisticated printing technology of development of using in daily life.At present, the printed electronics technology becomes a kind of type material processing means from the initial imaging technique development differentiation of writings and image being transferred on the stock from computer, and spray ink Printing is the core process technology of present printed electronics technology.Than traditional materials processing technology, spray ink Printing has rapid shaping, saves time, cost is low, pollution-free, technology flexibly, adapt to advantages such as various kinds of substrates and flow process be short, make it all have very wide application prospect and huge marketable value at aspects such as electronics, communication, plane demonstration, the energy and medical treatment.For example adopt inkjet technology, directly print electronic components such as lead, electric capacity, resistance, inductance, diode, triode and be used to produce all-inkjet printed circuit card (PCB); By directly on flexibility or rigidity matrix, printing electronic circuits such as coupling element, antenna, passive and active component is made passive and active wireless radio frequency identification electronic tag (RFID), Organic Light Emitting Diode (OLED), flexible solar battery and medical material etc.
The functional ink that is used for spray ink Printing can be scolder and resin, photosensitive polymer (light-cured resin class), nano metal powder (solution), transparent conductor, semi-conductor and isolator, ferrite, reagent, optical absorption agent (being used for organic materials or solar cell etc.), biomaterial (protein molecule, DNA or cell etc.).Wherein the nano metal ink is the main raw material of printed circuit board (PCB)/radio frequency identification electronic label.
It is reported, Korea S inkTec company, Finland VTT research centre, mechanisms such as Japanese NRI research centre have prepared the nano metal ink of comparative maturity, wherein major part all is based on the jet conductive ink of nanometer silver, and the achievement in research of other conducting metal ink discloses also fewer.But silver is as electro-conductive material, under higher relatively temperature and moist environment ion migration takes place easily, and selling at exorbitant prices, and these problems have limited the application of silver in circuit such as PCB and device mass production.Compare with silver, copper is metal the most frequently used in the electronic industry, and its electric conductivity and silver are more or less the same, but its low price only is 1/10th of a silver.So people wish the surrogate of copper as silver, become the main product in the nano metal conductive ink always.
Chinese invention patent ublic specification of application CN200810201967.0 discloses the preparing nano copper conductive that a kind of spray ink Printing is used, it is mantoquita that this method is selected high-purity copper sulfate for use, sodium hypophosphite is a reductive agent, add the organic phase solvent glycol ether (DE gram) of tensio-active agent LD and polyethylene of dispersing agent pyrrolidone (PVP), be heated to 120～160 ℃ and obtain nano copper colloid solution, concentrate by electrodialysis removal of impurities and underpressure distillation again and obtain nano-copper conductive ink.This method Heating temperature height needs electrodialysis and underpressure distillation operation, thereby complicated process of preparation, and preparation cycle is long.Chinese invention patent ublic specification of application CN20910054884.8 discloses a kind of preparing nano copper conductive, though this method reaction conditions is relatively gentleer: temperature of reaction is 30～100 ℃, has adopted electrodialysis and underpressure distillation operation equally.
Summary of the invention
The technical problem to be solved in the present invention is at the deficiencies in the prior art, and a kind of preparing nano copper conductive is provided, and the processing unit of this method is simple, easy to operate, can prepare good dispersity, stable high nano-copper conductive ink.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: a kind of preparing nano copper conductive comprises the steps:
Step 1: mantoquita and protective material are dissolved in the solvent, are warming up to 30～80 ℃, stir, adding an amount of basic solution adjusting pH value is 7～10, splashes into reductive agent then, continues stirring reaction after 30～60 minutes, is cooled to room temperature, obtains nanometer copper dispersion liquid;
Step 2: the nanometer copper dispersion liquid that step 1 is obtained carries out centrifugal, carrying out washing treatment, and vacuum-drying at room temperature obtains nano copper particle then;
Step 3: the nano copper particle that step 2 is obtained is distributed in the organic solvent, and supersound process obtains nano-copper conductive ink.
Wherein, a kind of preferred implementation of above-mentioned steps 2 is: the nanometer copper dispersion liquid that step 1 is obtained is in centrifugal treating under 8000～10000 rev/mins the rotating speed after 10～30 minutes, with deionized water and absolute ethanol washing, vacuum-drying at room temperature is 1～3 hour then, obtains nano copper particle.
In a kind of preparing nano copper conductive of the present invention, organic solvent can be one or more the mixture in butoxy ethyl ester, propylene glycol monomethyl ether acetate, diethylene glycol ether acetic ester, butyl glycol ether, ethylene glycol ether, diethylene glycol monobutyl ether, dibutyl ethylene glycol ether, diethylene glycol diethyl ether, triglyme, triglycol monobutyl ether, triglycol list ether, pimelinketone, hexalin, Terpineol 350, isobutyl ester and the gamma-butyrolactone.
Mantoquita can be at least a in copper sulfate, cupric nitrate, neutralized verdigris, cupric chloride, lauric acid copper and the succsinic acid copper.
Reductive agent can be at least a in sodium hypophosphite, sodium borohydride, xitix, formaldehyde, glucose and the hydrazine hydrate.
Protective material can be small molecules protective material or macromolecule dispersant.Wherein, the small molecules protective material can be at least a in alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid, linear alkyl ether, the micromolecular compound that contains ring texture and their ionic compound; Macromolecule dispersant can be at least a in polyvinyl alcohol, polyoxyethylene glycol, polyvinylpyrrolidone, polyacrylic acid, polymeric amide, polyaniline, Polythiophene, polyethers, urethane, Zelan 338, gelatin, the Sudan Gum-arabic.
Solvent can be one or more the combination in deionized water, ethanol, ethylene glycol, Virahol, glycol ether, the glycerol.
The above-mentioned former dose of mol ratio with mantoquita is 1: 1～5: 1; The mol ratio of protective material and mantoquita is 0.1: 1～10: 1.
Regulate in a kind of preparing nano copper conductive of the present invention and obtain the nano-copper conductive ink that nano copper particle and organic dissolved content can obtain different concns, in actual use, the weight percent content of preferred nanometer copper particle is 10%～50%.
The particle diameter that utilizes the nano copper particle in the nano-copper conductive ink that a kind of preparing nano copper conductive of the present invention obtains is at 20～70nm, and particles dispersed is good, does not have tangible agglomeration; In addition, the characteristic peak of nano copper particle is obvious, does not have the characteristic peak of other cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; This nano-copper conductive ink placed in air coagulation did not take place in one month.
Adopt the preparation technology of electrodialysis and underpressure distillation operation preparation nano-copper conductive ink to compare nanometer copper dispersion liquid with existing, a kind of preparing nano copper conductive of the present invention has been abandoned conventional electrodialysis and underpressure distillation operating procedure, employing is carried out centrifugal, carrying out washing treatment to nanometer copper dispersion liquid and is obtained nano copper particle, is distributed to the preparation technology in the organic solvent after being dried again.It is unexpected that this preparation technology changes the person skilled in the art of the present invention, because for the person skilled in the art of the present invention, though electrodialysis and underpressure distillation operating procedure complex process, but the first-selected technology of the nano-copper conductive ink that it is the preparation good dispersity, stability is high, and adopt other technologies to can not get good dispersity, stable high nano-copper conductive ink.The inventor explores the preparation method that the preparation technology described in the present invention is simple, cost is low just on a large amount of experiment basis, utilize this preparation method can obtain good dispersity, stable high nano-copper conductive ink.
Therefore, a kind of preparing nano copper conductive of the present invention has overcome complicated process of preparation, the long problem of preparation cycle that exists among the existing preparation method, has advantage easy and simple to handle, that production cost is low, flow process is short, no bazardous waste produces, environmental protection and economic target have been realized, the good product dispersibility of the nano-copper conductive ink for preparing, stability height, be applicable to the printed electronics technology, especially the inkjet technology field.
Description of drawings
Fig. 1 is the TEM figure of nano copper particle in the nano-copper conductive ink of embodiment 1;
Fig. 2 is the SEM figure of nano copper particle in the nano-copper conductive ink of embodiment 1;
Fig. 3 is the XRD figure of nano copper particle in the nano-copper conductive ink of embodiment 1.
Embodiment
Embodiment describes in further detail the present invention below in conjunction with accompanying drawing.
Embodiment 1:
With 10 mmole CuCl
2.2H
2O and 2.6 gram polyvinylpyrrolidones (PVP) are dissolved in respectively in 50 ml deionized water, mix and stir, and are warming up to 80 ℃, and it is 10 that the adding proper ammonia is regulated its pH value; Slowly the hydrazine hydrate solution of Dropwise 5 milliliter 50% continues to stir 60 minutes, is cooled to room temperature, obtains nanometer copper dispersion liquid; With the copper dispersion liquid that obtains under 8000 rev/mins rotating speed centrifugal 15 minutes, use deionized water and absolute ethanol washing twice respectively, vacuum-drying at room temperature is 2 hours then, obtains nano copper particle; Take by weighing 0.4 gram nano copper particle, be dissolved in the 0.6 gram diethylene glycol monobutyl ether, obtain solids content after ultrasonic 15 minutes and be 40% nano-copper conductive ink.
With the above-mentioned nano-copper conductive ink sampling that obtains, use transmission electron microscope (TEM) and field emission scanning electron microscope (SEM) are observed the copper particle in this nano-copper conductive ink, use x-ray diffractometer (XRD) that this nano-copper conductive ink is carried out thing phase atlas analysis, judge to have or not the second phase impurity, obtain Fig. 1, Fig. 2 and Fig. 3.From Fig. 1 and Fig. 2 as can be seen, the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, and particles dispersed is good, does not have tangible agglomeration; Can significantly find out the characteristic peak of copper this nano-copper conductive ink from Fig. 3, wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 2:
With 10 mmole CuSO
45H
2O and 1.62 gram polyacrylamides are dissolved in respectively in 50 milliliters of ethylene glycol and 50 ml deionized water, mix and stir, and are warming up to 80 ℃, and it is 9 that the adding proper ammonia is regulated its pH value; Slowly the hydrazine hydrate solution of Dropwise 5 milliliter 50% continues to stir 30 minutes, is cooled to room temperature, obtains nanometer copper dispersion liquid; With the copper dispersion liquid that obtains under 8000 rev/mins rotating speed centrifugal 15 minutes, use deionized water and absolute ethanol washing twice respectively, vacuum-drying at room temperature is 2 hours then, obtains nano copper particle; Take by weighing 0.2 gram nano copper particle, be dissolved in the 0.8 gram butyl glycol ether, obtain solids content after ultrasonic 15 minutes and be 20% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 3:
With 10 mmole CuCl
2.2H
2O and 2.6 gram polyvinylpyrrolidones (PVP) are dissolved in respectively in 50 milliliters of glycol ethers, mix and stir, and are warming up to 30 ℃, and it is 7 that the adding proper ammonia is regulated its pH value; Slowly the hydrazine hydrate solution of Dropwise 5 milliliter 50% continues to stir 60 minutes, is cooled to room temperature, obtains nanometer copper dispersion liquid; With the copper dispersion liquid that obtains under 8000 rev/mins rotating speed centrifugal 20 minutes, use deionized water and absolute ethanol washing twice respectively, vacuum-drying at room temperature is 3 hours then, obtains nano copper particle; Take by weighing 0.3 gram nano copper particle and be dissolved in the 0.7 gram diethylene glycol monobutyl ether, obtain solids content after ultrasonic 15 minutes and be 30% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 4:
With 10 mmole CuSO
4.5H
2O and 0.54 gram polyacrylamide are dissolved in respectively in 50 ml deionized water, mix and stir, and are warming up to 50 ℃, and it is 8 that the adding proper ammonia is regulated its pH value; Slowly drip 3 milliliter 50% hydrazine hydrate solution, continue to stir 30 minutes, be cooled to room temperature, obtain nanometer copper dispersion liquid; With the copper dispersion liquid that obtains under 8000 rev/mins rotating speed centrifugal 15 minutes, use deionized water and absolute ethanol washing twice respectively, vacuum-drying at room temperature is 2 hours then, obtains nano copper particle; Take by weighing 0.2 gram nano copper particle and be dissolved in the 1.8 gram butyl glycol ethers, obtain solids content after ultrasonic 15 minutes and be 10% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 5:
With 10 mmole Cu (NO
3)
2Be dissolved in respectively in 50 ml deionized water and the 50 milliliters of Virahols with 8 milliliters of sulfur alcohols, mix and stir, be warming up to 70 ℃, adding proper ammonia, to regulate its pH value be 10.Slowly the hydrazine hydrate solution of Dropwise 5 milliliter 50% continues to stir 60 minutes, is cooled to room temperature, obtains nanometer copper dispersion liquid; With the copper dispersion liquid that obtains under 10000 rev/mins rotating speed centrifugal 15 minutes, use deionized water and absolute ethanol washing twice respectively, vacuum-drying at room temperature is 2 hours then, obtains nano copper particle; Take by weighing 0.3 gram nano copper particle, be dissolved in the 0.7 gram diethylene glycol monobutyl ether, obtain solids content after ultrasonic 15 minutes and be 30% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 6:
With 10 mmole Cu (NO
3)
2Be dissolved in respectively in 50 ml deionized water and the 50ml ethylene glycol with 10 milliliters of sulfur alcohols, mix and stir, be warming up to 60 ℃, it is 10 that the adding proper ammonia is regulated its pH value.Slowly the hydrazine hydrate solution of Dropwise 5 milliliter 50% continues to stir 60 minutes, is cooled to room temperature, obtains nanometer copper dispersion liquid; With the copper dispersion liquid that obtains under 8000 rev/mins rotating speed centrifugal 30 minutes, use deionized water and absolute ethanol washing twice respectively, vacuum-drying at room temperature is 2 hours then, obtains nano copper particle; Take by weighing 0.4 gram nano copper particle and be dissolved in the 0.6 gram dibutyl ethylene glycol ether, obtain solids content after ultrasonic 15 minutes and be 40% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 7:
Substantially the same manner as Example 1, different is after obtaining nano copper particle, takes by weighing 0.4 gram nano copper particle, is dissolved in the 0.6 gram diethylene glycol diethyl ether, obtains solids content after ultrasonic 15 minutes and be 40% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 8:
Substantially the same manner as Example 2, different is after obtaining nano copper particle, takes by weighing 0.2 gram nano copper particle, is dissolved in the 0.8 gram ethylene glycol ether, obtains solids content after ultrasonic 15 minutes and be 20% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Embodiment 9:
Substantially the same manner as Example 3, different is after obtaining nano copper particle, takes by weighing 0.3 gram nano copper particle, is dissolved in the 0.7 gram triglyme, obtains solids content after ultrasonic 15 minutes and be 30% nano-copper conductive ink.
Fig. 1, Fig. 2 and Fig. 3 in the TEM figure of this nano-copper conductive ink, SEM figure and the XRD figure similar embodiment 1.Show that the nano copper particle particle diameter is at 20～70nm in this nano-copper conductive ink, particles dispersed is good, does not have tangible agglomeration; The characteristic peak of copper in this nano-copper conductive ink is wherein without any the characteristic peak of cupric oxide or Red copper oxide grade in an imperial examination two-phase impurity; The above-mentioned nano-copper conductive ink that obtains placed in air coagulation did not take place in one month.
Above-mentioned specific embodiment just is used to content of the present invention is described and does not limit the present invention.Should be appreciated that under the situation that does not deviate from scope of the present invention those skilled in the art is after having read content of the present invention, variation or modification that these specific embodiments are carried out all drop in protection scope of the present invention.
Claims (10)
1. a preparing nano copper conductive is characterized in that: comprise the steps:
Step 1: mantoquita and protective material are dissolved in the solvent, are warming up to 30～80 ℃, stir, adding an amount of basic solution adjusting pH value is 7～10, splashes into reductive agent then, continues stirring reaction after 30～60 minutes, is cooled to room temperature, obtains nanometer copper dispersion liquid;
Step 2: the nanometer copper dispersion liquid that step 1 is obtained carries out centrifugal, carrying out washing treatment, and vacuum-drying at room temperature obtains nano copper particle then;
Step 3: the nano copper particle that step 2 is obtained is distributed in the organic solvent, and supersound process obtains nano-copper conductive ink.
2. a kind of preparing nano copper conductive according to claim 1, it is characterized in that: in the described step 2, nanometer copper dispersion liquid is in centrifugal treating under 8000～10000 rev/mins the rotating speed after 10～30 minutes, with deionized water and absolute ethanol washing, vacuum-drying at room temperature is 1～3 hour then, obtains nano copper particle.
3. a kind of preparing nano copper conductive according to claim 1 and 2 is characterized in that: described organic solvent is one or more the mixture in butoxy ethyl ester, propylene glycol monomethyl ether acetate, diethylene glycol ether acetic ester, butyl glycol ether, ethylene glycol ether, diethylene glycol monobutyl ether, dibutyl ethylene glycol ether, diethylene glycol diethyl ether, triglyme, triglycol monobutyl ether, triglycol list ether, pimelinketone, hexalin, Terpineol 350, isobutyl ester, the gamma-butyrolactone.
4. a kind of preparing nano copper conductive according to claim 3 is characterized in that: described mantoquita is at least a in copper sulfate, cupric nitrate, neutralized verdigris, cupric chloride, lauric acid copper and the succsinic acid copper.
5. a kind of preparing nano copper conductive according to claim 3 is characterized in that: described reductive agent is at least a in sodium hypophosphite, sodium borohydride, xitix, formaldehyde, glucose and the hydrazine hydrate.
6. a kind of preparing nano copper conductive according to claim 3 is characterized in that: described protective material is small molecules protective material or macromolecule dispersant; Described small molecules protective material is at least a in alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid, linear alkyl ether, the micromolecular compound that contains ring texture and their ionic compound; Described macromolecule dispersant is at least a in polyvinyl alcohol, polyoxyethylene glycol, polyvinylpyrrolidone, polyacrylic acid, polymeric amide, polyaniline, Polythiophene, polyethers, urethane, Zelan 338, gelatin, the Sudan Gum-arabic.
7. a kind of preparing nano copper conductive according to claim 3 is characterized in that: described solvent is one or more the combination in deionized water, ethanol, ethylene glycol, Virahol, glycol ether, the glycerol.
8. a kind of preparing nano copper conductive according to claim 3 is characterized in that: the mol ratio of described reductive agent and mantoquita is 1: 1～5: 1; The mol ratio of described protective material and mantoquita is 0.1: 1～10: 1.
9. a kind of preparing nano copper conductive according to claim 3 is characterized in that: the weight percent content of copper particle is 10%～50% in the described nano-copper conductive ink.
10. a kind of preparing nano copper conductive according to claim 1 and 2 is characterized in that: the particle diameter of described nano copper particle is 20～70nm.
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