CN101872826B - 基于液态金属散热的螺纹连接结构的大功率led光源 - Google Patents
基于液态金属散热的螺纹连接结构的大功率led光源 Download PDFInfo
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- CN101872826B CN101872826B CN 201010185749 CN201010185749A CN101872826B CN 101872826 B CN101872826 B CN 101872826B CN 201010185749 CN201010185749 CN 201010185749 CN 201010185749 A CN201010185749 A CN 201010185749A CN 101872826 B CN101872826 B CN 101872826B
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- liquid metal
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 55
- 230000005855 radiation Effects 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 238000004806 packaging method and process Methods 0.000 claims description 62
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000000565 sealant Substances 0.000 claims description 10
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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Abstract
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Application Number | Priority Date | Filing Date | Title |
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CN 201010185749 CN101872826B (zh) | 2010-05-28 | 2010-05-28 | 基于液态金属散热的螺纹连接结构的大功率led光源 |
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CN 201010185749 CN101872826B (zh) | 2010-05-28 | 2010-05-28 | 基于液态金属散热的螺纹连接结构的大功率led光源 |
Publications (2)
Publication Number | Publication Date |
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CN101872826A CN101872826A (zh) | 2010-10-27 |
CN101872826B true CN101872826B (zh) | 2013-03-13 |
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CN 201010185749 Expired - Fee Related CN101872826B (zh) | 2010-05-28 | 2010-05-28 | 基于液态金属散热的螺纹连接结构的大功率led光源 |
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CN (1) | CN101872826B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019041294A1 (zh) * | 2017-09-01 | 2019-03-07 | 深圳前海小有技术有限公司 | 半导体元件的封装结构及其封装方法 |
CN111637428B (zh) * | 2020-04-21 | 2021-10-15 | 江西吉丰工业技术有限公司 | 一种集成大功率led热电分离支架 |
CN111968919B (zh) * | 2020-08-24 | 2022-02-25 | 浙江集迈科微电子有限公司 | 一种射频模组散热工艺 |
CN112351641B (zh) * | 2020-10-19 | 2022-01-28 | 珠海格力电器股份有限公司 | 一种改善散热模块散热不良的电器盒和灌封方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1649136A (zh) * | 2004-01-20 | 2005-08-03 | 那勒库乐斯股份有限公司 | 散热装置及其热分散器 |
CN2758974Y (zh) * | 2004-09-24 | 2006-02-15 | 中国科学院理化技术研究所 | 一种风扇-搅拌型液态金属芯片散热器 |
EP2056320A2 (en) * | 2007-11-02 | 2009-05-06 | Yokogawa Electric Corporation | Liquid metal relay |
CN201715304U (zh) * | 2010-05-28 | 2011-01-19 | 符建 | 一种基于液态金属散热的螺纹连接结构的大功率led光源 |
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2010
- 2010-05-28 CN CN 201010185749 patent/CN101872826B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1649136A (zh) * | 2004-01-20 | 2005-08-03 | 那勒库乐斯股份有限公司 | 散热装置及其热分散器 |
CN2758974Y (zh) * | 2004-09-24 | 2006-02-15 | 中国科学院理化技术研究所 | 一种风扇-搅拌型液态金属芯片散热器 |
EP2056320A2 (en) * | 2007-11-02 | 2009-05-06 | Yokogawa Electric Corporation | Liquid metal relay |
CN201715304U (zh) * | 2010-05-28 | 2011-01-19 | 符建 | 一种基于液态金属散热的螺纹连接结构的大功率led光源 |
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CN101872826A (zh) | 2010-10-27 |
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Owner name: HANGZHOU GUANGZHUI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FU JIAN Effective date: 20130912 |
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Effective date of registration: 20130912 Address after: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee after: HANGZHOU LIGHT-CONE TECHNOLOGY CO.,LTD. Address before: Hangzhou City, Zhejiang Province, Xihu District Zijin building 24-701 310012 Patentee before: Fu Jian |
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Address after: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee after: Zhejiang guangcone Technology Co.,Ltd. Address before: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee before: HANGZHOU LIGHT-CONE TECHNOLOGY Co.,Ltd. |
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