CN101864585A - Copper plating solution for producing multilayer circuit board - Google Patents
Copper plating solution for producing multilayer circuit board Download PDFInfo
- Publication number
- CN101864585A CN101864585A CN200910030625A CN200910030625A CN101864585A CN 101864585 A CN101864585 A CN 101864585A CN 200910030625 A CN200910030625 A CN 200910030625A CN 200910030625 A CN200910030625 A CN 200910030625A CN 101864585 A CN101864585 A CN 101864585A
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- CN
- China
- Prior art keywords
- copper plating
- plating solution
- circuit board
- multilayer circuit
- producing multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a copper plating solution for producing a multilayer circuit board. A micro-etching solution comprises the following components: 39.27 to 51.05 g/L of CuSO4.5H2O, 10.00 to 13.00g/L of CuSO4, 190.00 to 220.00g/L of H2SO4, 0.040 to 0.060g/L of HCl, and 50.8g/L to 60.0g/L of electroplating brighteners. The solvent of the copper plating solution is deionized water. The copper plating solution has a high acid and copper proportion. The ratio of H2SO4 to Cu<2+> in the prepared copper plating solution is from (17-20) to 1. The copper plating solution has good exchange capacity, solution dispersibility and deep plating performance.
Description
Technical field
The present invention relates to field of electroplating, particularly a kind of copper plating bath.
Background technology
High-grade multi-ply wood refers to big plate face, aperture warp (aperture≤φ 0.3mm), thickness of slab and aperture ratio 〉=6: 1, the 14-20 layer of high-density thin wire and above multilayer board.This class multilayer board, what have is applied to aerospace field, and what have is used on the giant-powered computer.This class plate, extremely strict and harsh to specification of quality, for example the hole failure rate must＜1 * 10
-10, promptly thousands of up to ten thousand holes do not allow a hole and lost efficacy.Hole wall copper facing thickness is necessary 〉=25um, coating ductility is necessary 〉=15%, it is big that bonding force is wanted, carry out 288 ℃ 10 seconds 6 the round-robin thermal shock test, coating should not occur rupturing or produce the phenomenon of tiny crack.These harsh requirements, general copper plating bath prescription is difficult to satisfy above-mentioned requirements.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of copper plating solution for producing multilayer circuit board, this copper plating bath can effectively reduce the phenomenon that coating fracture occurs or produces tiny crack.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of copper plating solution for producing multilayer circuit board, by densitometer: include following composition in the micro-etching solution:
CuSO
4·5H
2O：39.27～51.05g/L；
CuSO
4：10.00～13.00g/L；
H
2SO
4：190.00～220.00g/L；
HCl：0.040～0.060g/L；
Brightening agent: 50.8g/L～60.0g/L;
The solvent of described copper plating bath is a deionized water.
Described brightening agent comprises following four kinds of reagent, counts by concentration:
S-(3-propionic acid amide)-sulfuration propanesulfonic acid sodium: 0.1g/L;
PEG(6000)：10.0g/L；
Acrylic acid amides: 34.0g/L;
Glycerol: 6.7g/L.
The working temperature of described copper plating bath is 22～27 ℃.
The working temperature of described copper plating bath is 25 ℃.
Copper plating bath of the present invention can be used for high-grade multiple-plate copper-plating technique, and used brightening agent is shadd-Cu1 (this is dedicated version term in the industry, and this example no longer describes in detail).
The invention has the beneficial effects as follows: the acid of copper plating bath of the present invention, copper compare big, H in the copper plating bath after the preparation
2SO
4: Cu
2+=(17～20): 1, have good exchange capacity and solution dispersive ability, and it is good to plate performance deeply.
Embodiment
Embodiment: a kind of copper plating solution for producing multilayer circuit board, by densitometer: include following composition in the micro-etching solution:
CuSO
4·5H
2O：39.27～51.05g/L；
CuSO
4：10.00～13.00g/L；
H
2SO
4：190.00～220.00g/L；
HCl：0.040～0.060g/L；
Brightening agent: 50.8g/L～60.0g/L;
The solvent of described copper plating bath is a deionized water.
Described brightening agent comprises following four kinds of reagent, counts by concentration:
S-(3-propionic acid amide)-sulfuration propanesulfonic acid sodium: 0.1g/L;
PEG(6000)：10.0g/L；
Acrylic acid amides: 34.0g/L;
Glycerol: 6.7g/L.
The working temperature of described copper plating bath is 22～27 ℃.
The working temperature of described copper plating bath is 25 ℃.
Copper plating bath of the present invention can be used for high-grade multiple-plate copper-plating technique, and used brightening agent is shadd-Cu1 (this is dedicated version term in the industry, and this example no longer describes in detail).
The prescription of the specific embodiment of the invention is referring to table 1:
Table 1:(unit: concentration g/L)
Using copper plating bath of the present invention carries out copper facing and can have exchange capacity in the good hole, solution dispersive ability and dark plating performance are good, add and use little cathode current density, long electroplating time, cooperate negative electrode to move, vibrate and technological measure such as symmetrical link plate up and down, can make high-grade multiple-plate hole plating can obtain electrolytic coating uniformly, the thickest and the thinnest extreme difference＜15um of the hole wall copper layer of this electrolytic coating, bonding force is strong, ductility＞15%, distributed force (throwing power) reaches 80%.The invention enables the batch process of high-grade multi-ply wood production to become possibility, promoted the state of the art of PCB Production, improved the competitive capacity in market.
Claims (4)
1. copper plating solution for producing multilayer circuit board is characterized in that: by densitometer: include following composition in the micro-etching solution:
CuSO
4·5H
2O：39.27～51.05g/L；
CuSO
4：10.00～13.00g/L；
H
2SO
4：190.00～220.00g/L；
HCl：0.040～0.060g/L；
Brightening agent: 50.8g/L～60.0g/L;
The solvent of described copper plating bath is a deionized water.
2. copper plating solution for producing multilayer circuit board according to claim 1 is characterized in that: described brightening agent comprises following four kinds of reagent, counts by concentration:
S-(3-propionic acid amide)-sulfuration propanesulfonic acid sodium: 0.1g/L;
PEG(6000)：10.0g/L；
Acrylic acid amides: 34.0g/L;
Glycerol: 6.7g/L.
3. copper plating solution for producing multilayer circuit board according to claim 1 is characterized in that: the working temperature of described copper plating bath is 22～27 ℃.
4. copper plating solution for producing multilayer circuit board according to claim 3 is characterized in that: the working temperature of described copper plating bath is 25 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910030625A CN101864585A (en) | 2009-04-17 | 2009-04-17 | Copper plating solution for producing multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910030625A CN101864585A (en) | 2009-04-17 | 2009-04-17 | Copper plating solution for producing multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101864585A true CN101864585A (en) | 2010-10-20 |
Family
ID=42956503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910030625A Pending CN101864585A (en) | 2009-04-17 | 2009-04-17 | Copper plating solution for producing multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101864585A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104451237A (en) * | 2014-11-14 | 2015-03-25 | 北京科技大学 | Method for preparing three-dimensional continuous network Cr3C2-Cu composites by utilizing infiltration process |
-
2009
- 2009-04-17 CN CN200910030625A patent/CN101864585A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104451237A (en) * | 2014-11-14 | 2015-03-25 | 北京科技大学 | Method for preparing three-dimensional continuous network Cr3C2-Cu composites by utilizing infiltration process |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20101020 |