CN101852564A - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN101852564A
CN101852564A CN200910301218A CN200910301218A CN101852564A CN 101852564 A CN101852564 A CN 101852564A CN 200910301218 A CN200910301218 A CN 200910301218A CN 200910301218 A CN200910301218 A CN 200910301218A CN 101852564 A CN101852564 A CN 101852564A
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heat
plate shaped
heat transfer
heat pipe
radiating fin
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刘鹏
周世文
陈俊吉
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CN200910301218A priority Critical patent/CN101852564A/zh
Priority to US12/504,683 priority patent/US20100243207A1/en
Publication of CN101852564A publication Critical patent/CN101852564A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，包括一板型热管、若干散热鳍片及若干传热柱，该板型热管用于与热源接触，所述板型热管内形成一中空密闭腔室且容纳有工作介质，所述传热柱的一端固定在所述板型热管上，所述传热柱的另一端穿设在所述散热鳍片上。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别涉及一种适用于电子元件散热的散热装置。
背景技术
随着信息产业的迅速发展，发热电子元件如中央处理器追求高速度化，多功能化及小型化所衍生的散热问题越来越严重，因此，必须将热量及时有效地散发出去，否则会极大地影响电子元件的工作性能，同时还会缩减电子元件的使用寿命，因此必须对电子元件进行散热。
目前的散热装置大多采用金属吸热底板配合圆型热管与散热鳍片的组合，其中，热管的两端分别与该吸热底板和散热鳍片相连，从而将吸热底板吸收的热量传导至散热鳍片上。然而，由于热管的成本较高，为控制成本，散热装置一般采用的热管的数量较少，从而热管与散热鳍片间的接触面积也少，限制了传热速度，同时，散热鳍片上靠近热管的区域温度偏高而远离热管的区域温度较低，温度分布不均大大降低了散热鳍片的利用率，从而限制了散热装置的散热性能。
发明内容
有鉴于此，有必要提供一种可提高散热鳍片的利用率从而提高散热性能的散热装置。
一种散热装置，包括一板型热管、若干散热鳍片及若干传热柱，该板型热管用于与热源接触，所述板型热管内形成一中空密闭腔室且容纳有工作介质，所述传热柱的一端固定在所述板型热管上，所述传热柱的另一端穿设在所述散热鳍片上。
上述散热装置中，该板型热管可迅速地吸收热源的热量并将热量传导至传热柱，由于传热柱的数量多，增大了传热柱与板型热管及散热鳍片的接触面积，大大提高了传热效率。同时，热量可通过众多传热柱以均匀扩散的方式传递给散热鳍片，使每一散热鳍片各部分均匀受热，消除了传统散热装置中散热鳍片上的温度分布不均的现象，大大提高了散热鳍片的利用率，提升散热装置的散热效率。
附图说明
图1为本发明散热装置较佳实施例的立体组合图。
图2为图1的立体分解图。
图3为图1所示散热装置的另一视角的示意图。
图4为图1所示散热装置沿Ⅳ-Ⅳ线的剖面示意图。
具体实施方式
请参阅图1至图4，该散热装置10包括一板型热管12、一散热鳍片组14及若干传热柱16。
该板型热管12呈平板状，包括一壳体120及设于壳体120内的毛细结构121，该毛细结构121可以为沟槽、丝网、纤维或烧结粉末等。该壳体120由导热性能良好的材料制成。该壳体120围成一中空密闭腔室125，该腔室125内容纳有工作介质(图未示)比如水、酒精等。该板型热管12具有一顶面122及与之相对的一底面124，该底面124用于与发热电子元件接触以吸收发热电子元件产生的热量。该底面124向外凸出形成一凸起部126，该凸起部126用于与发热电子元件紧密接触。当同时有多个高度不同的发热电子元件需要散热时，可在板型热管12的底面124设置多个高度不同的凸起部126，分别对各个发热电子元件散热。
该若干传热柱16均匀间隔分布于板型热管12的顶面122上。这些传热柱16由传热性能良好的材料制成，比如铜、铝。每一传热柱16呈实心圆柱状，每一传热柱16的底端与板型热管12的顶面122连接，并自该底端向上延伸形成一自由端。
该散热鳍片组14位于板型热管12的上方并与板型热管12平行，该散热鳍片组14由若干相互平行的散热鳍片140堆叠而成，这些散热鳍片140与板型热管12平行并沿垂直于该板型热管12的顶面122方向相互堆叠。这些散热鳍片140可由铝、铜等传热性能良好的金属制成。每一散热鳍片140上对应传热柱16的位置处形成若干通孔142。各散热鳍片140上的通孔142自上而下相互对准，从而于散热鳍片组14内形成贯穿孔以供传热柱16穿设。每一通孔142的***向上形成一环缘144，该环缘144有利于增大传热柱16与散热鳍片140的接触面积。
组装该散热装置10时，将这些传热柱16的自由端垂直穿过各散热鳍片140上的通孔142，并可利用过盈配合或焊接的方式将这些传热柱16与散热鳍片组14连接固定。这些传热柱16的底端则通过焊接与板型热管12的顶面122连接。
散热装置10工作时，该板型热管12通过凸起部126从发热电子元件吸收热量，接着该凸起部126通过底面124将热量传递给该板型热管12内部的工作介质，然后工作介质通过相变化将热量迅速均匀地传递至顶面122，及与顶面122相连接的传热柱16，进而通过传热柱16将热量传递至散热鳍片组14。
由于传热柱16数量众多，增大了传热柱16与该板型热管12及散热鳍片组14的接触面积，且散热鳍片140上的若干环缘144进一步增加了散热鳍片140与传热柱16的接触面积，从而大大提高了热量从传热柱16到散热鳍片140的传递速度，提高了传热效率。同时，由于该若干传热柱16均匀地分布于该板型热管12的顶面122及散热鳍片组14内，该板形热管12的热量可通过传热柱16以均匀扩散的方式传递给散热鳍片组14，使每一散热鳍片140各部分均匀受热，消除了传统散热装置中散热鳍片上的温度分布不均的现象，大大提高了散热鳍片140的利用率，提升散热装置10的散热效率。

Claims (10)

1.一种散热装置，其特征在于：包括一板型热管、若干散热鳍片及若干传热柱，该板型热管用于与热源接触，所述板型热管内形成一中空密闭腔室且容纳有工作介质，所述传热柱的一端固定在所述板型热管上，所述传热柱的另一端穿设在所述散热鳍片上。
2.如权利要求1所述的散热装置，其特征在于：所述散热鳍片与板型热管平行并沿垂直于该板型热管的方向相互堆叠，每一散热鳍片上设有若干通孔，这些散热鳍片上的通孔的位置相互对准，从而共同形成可供所述传热柱穿过的贯穿孔，所述传热柱经贯穿孔穿设于这些散热鳍片内。
3.如权利要求2所述的散热装置，其特征在于：所述传热柱呈实心圆柱状。
4.如权利要求3所述的散热装置，其特征在于：所述传热柱由铜或铝制成。
5.如权利要求2所述的散热装置，其特征在于：所述传热柱均匀、分散地分布于所述板型热管上及散热鳍片内。
6.如权利要求2所述的散热装置，其特征在于：所述传热柱通过过盈配合或焊接的方式与散热鳍片相连。
7.如权利要求2所述的散热装置，其特征在于：每一通孔的***设有一环缘。
8.如权利要求2所述的散热装置，其特征在于：所述板型热管的底面用于与热源接触，所述传热柱的底端通过焊接的方式固定于所述板型热管的顶面上。
9.如权利要求8所述的散热装置，其特征在于：该板型热管的底面上向外凸出形成至少一用于与热源接触的凸起部。
10.如权利要求9所述的散热装置，其特征在于：所述热源为多个高度不同的发热电子元件，该板型热管包括多个高度不同的凸起部，分别对各个发热电子元件散热。
CN200910301218A 2009-03-30 2009-03-30 散热装置 Pending CN101852564A (zh)

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US12/504,683 US20100243207A1 (en) 2009-03-30 2009-07-17 Thermal module

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CN110690184A (zh) * 2019-09-12 2020-01-14 无锡江南计算技术研究所 一种多质复合三维流道双面强化换热冷板

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CN105813433B (zh) * 2015-01-20 2019-06-18 富士通株式会社 散热装置和散热方法
CN110690184A (zh) * 2019-09-12 2020-01-14 无锡江南计算技术研究所 一种多质复合三维流道双面强化换热冷板

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Application publication date: 20101006