CN101850537A - Circular substrate polishing and cleaning device and method - Google Patents
Circular substrate polishing and cleaning device and method Download PDFInfo
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- CN101850537A CN101850537A CN200910103476A CN200910103476A CN101850537A CN 101850537 A CN101850537 A CN 101850537A CN 200910103476 A CN200910103476 A CN 200910103476A CN 200910103476 A CN200910103476 A CN 200910103476A CN 101850537 A CN101850537 A CN 101850537A
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Abstract
The invention relates to a circular substrate polishing and cleaning device and a circular substrate polishing and cleaning method. The device comprises a polishing and cleaning component, a substrate guiding component and a substrate driving component. A substrate is conveyed through the substrate guiding component by a substrate conveyance component, and is guided into the polishing and cleaning component under the rotation of the polishing and cleaning component; the substrate driving component drives the substrate to rotate; a liquid injection component supplies chemical polishing liquid and cleaning liquid to polish and clean the substrate; and after the substrate is polished and cleaned, the rotation direction of the polishing and cleaning component is changed, and the substrate is guided out of the polishing and cleaning component and then is guided into the substrate conveyance component by the substrate guiding component. The device of the invention can be operated and run as an independent mechanism, and also can be used as a module of a large-scale substrate polishing and cleaning system; and single-substrate single-station polishing and cleaning units can be combined into a multi-substrate multi-station system to polish and clean the substrates in batches.
Description
Technical field
The present invention relates to polishing, cleaning device and the method for substrate, be particularly related to circular substrate, comprise the circular silicon chip that is used to produce semiconductor wafer, the glass, pottery and the aluminium matter circular substrate that are used for scheduler magnetic recording memory (HDD) medium, be used to produce optical recording memory CD (CD), digital versatile disc (DVD) plastics circular substrate, and be used to produce polishing, cleaning device and the method for the glass circular substrate of optics.
Background technology
Circular silicon chip, glass, pottery, plastics and aluminium matter circular substrate are widely used in semiconductor, computer, information industry, reach in the product for civilian use.
In the manufacture process of semiconductor wafer (Wafer), must mill repeatedly to substrate, chemically mechanical polishing (CMP, Chemical mechanical polishing), by using the wet clean process of deionized water (DIW) or chemicals, removal remains in chemical substance, granule and other impurity on surface, reduce the surface roughness of substrate, improve any surface finish of substrate, thereby improve the yield rate of product.
Scheduler, information industry, and the process of civilian product in, before glass, pottery and aluminium matter substrate are carried out magnetic material, optical material or magneto-optic material spraying coating process, need mill repeatedly to substrate equally, etching, polishing and clean, to improve any surface finish of substrate.
Along with the continuous development of semi-conductor industry, the design of integrated circuit and production technology become more complicated and precise treatment, and sandwich construction and high integration have proposed strict more requirement to any surface finish and the cleannes of substrate.In the production of disk, recording of information density improves constantly, and suspension between magnetic recording media and magnetic head distance is more and more littler, and for recorded information on CD more to high-density, all requires constantly to improve any surface finish and the cleannes of substrate.Defective, impurity, pollution in the milling of substrate, etching, polishing and cleaning process will reduce the yield rate of product significantly, increase production time and production cost.
In existing substrate polishing, cleaning device and method, the polished and cleaned of substrate is normally finished on a table apparatus.In glossing, substrate is horizontal positioned usually, on substrate or below burnishing device rotate substrate polished.In the cleaning of substrate, substrate or level or vertical the placement are placed, are done the opposite cleaning element that rotatablely moves of direction substrate is cleaned by a pair of horizontal parallel.Because in the production process of substrate, substrate often will be milled repeatedly, etching, polishing and clean, to obtain the substrate of high any surface finish and cleannes, therefore substrate will be sent to another station from a station repeatedly, or be sent to another device from a device, increase the time that substrate transmits thus, reduced production efficiency.May cause cross pollution owing in the transport process simultaneously, thereby reduce the cleannes of substrate, thereby be difficult to satisfy substrate complicated and accurate day by day design and manufacturing technique requirent.
Summary of the invention
In order to overcome the deficiencies in the prior art, technical scheme of the present invention has been proposed.The substrate that is used for polishing, cleaning device and the method for circular substrate disclosed in this invention can be circular silicon chip, magnetic recording medium substrate, and other circular discoid substrates with similar shape structure.
A feature of the present invention provides a kind of polishing, cleaning device and method of circular substrate, and the surface cleanness with the polishing, cleaning performance and the substrate that improve substrate satisfies the requirement to clean substrate of design and production technology.Processing be polished, cleans, be washed to apparatus and method disclosed in this invention can to substrate on same equipment or same station, eliminated the cross pollution that substrate causes in transport process; Also a tables of equipment station can be combined into same equipment multistation,, substrate be polished, cleans, washes processing by arranging by the order of ' dirty ' to ' only '; Thereby the cleannes of substrate have been improved.
Another feature of the present invention provides a kind of polishing, cleaning device and method of circular substrate, with polishing, the cleaning production efficiency that improves substrate.Apparatus and method utilization disclosed in this invention changes the direction of rotation of polished and cleaned assembly, under the guiding of substrate guidance set, realizes the conveying and the transmission of substrate, has improved the substrate transfer rate.Apparatus and method disclosed in this invention can be carried out polishing, cleaning, the flushing processing of same equipment multistation to substrate, have eliminated the delivery time of substrate between distinct device or station.Thereby improved substrate polishing, clean production efficiency.
Another feature of the present invention provides a kind of polishing, cleaning device and method of circular substrate, with polishing, the cleaning production output that improves substrate.The disclosed apparatus and method of the present invention can independent agency the operation operation, also can be used as the module of a large-scale substrate polished and cleaned system and use.The polished and cleaned unit combination of the single station of monocrepid can be become many substrates multistation system that substrate is carried out polished and cleaned processing in batch, improve production output.
In order to realize above-mentioned feature, the invention provides a kind of polishing, cleaning device of circular substrate.As described below is several embodiment of device disclosed in this invention.
In one embodiment, disclosed device is installed on the support frame and is constituted by polished and cleaned assembly, substrate guidance set, and the polished and cleaned that forms the substrate upright position is handled.The substrate driven unit drives the substrate rotation, and substrate,, is carried out polished and cleaned among the importing polished and cleaned assembly and handles under the rotation of polished and cleaned assembly through the substrate guidance set by the substrate transfer assembly.After polished and cleaned, rotate the substrate guidance set, and change the direction of rotation of polished and cleaned assembly, substrate is imported in the substrate transfer assembly through the substrate guidance set.
In another embodiment, disclosed device is installed on the support frame and is constituted by polished and cleaned assembly, substrate guidance set, and the polished and cleaned that forms the substrate upright position is handled.The substrate driven unit drives the substrate rotation.Substrate,, is imported among the polished and cleaned assembly under the rotation of polished and cleaned assembly through the substrate guidance set by the substrate transfer assembly.The substrate driven unit is done toward complex line and is moved, and the polished and cleaned assembly carries out polished and cleaned to substrate to be handled.After polished and cleaned is handled, change the direction of rotation of polished and cleaned assembly, substrate is imported in the substrate transfer assembly through the substrate guidance set.
In another embodiment, disclosed device is installed on the support frame and is constituted by several polished and cleaned assemblies, several substrate guidance sets, substrate is carried out the polished and cleaned of multistation and handles.Substrate is through the substrate transfer assembly, and the substrate guidance set under the rotation of polished and cleaned assembly, imports the first polished and cleaned station.After polished and cleaned, rotate the substrate guidance set, and change the direction of rotation of polished and cleaned assembly, substrate is imported into next polished and cleaned station through the substrate guidance set, realizes the substrate stepping.So repeatedly, finishing the polished and cleaned of substrate on all stations handles.
In another embodiment again, disclosed device is installed on the support frame and is constituted by cylindrical polished and cleaned assembly, the substrate guidance set of arranged crosswise at a certain angle, and the polished and cleaned that forms the substrate upright position is handled.Substrate, imports between the cylindrical polished and cleaned assembly under the rotation of cylindrical polished and cleaned assembly through the substrate guidance set.The substrate driven unit drives the substrate rotation, and can do toward complex line and move, and cylindrical polished and cleaned assembly carries out polished and cleaned to substrate to be handled.In the polished and cleaned post processing, change the direction of rotation of cylindrical polished and cleaned assembly, substrate is imported in the substrate transfer assembly through the substrate guidance set.
In another embodiment, disclosed device is installed on the support frame and is constituted by several many substrates polished and cleaned assemblies, several many substrates guidance sets, substrate is carried out the polished and cleaned of many substrates multistation and handles.Several substrates are through many substrates transfer assembly, and many substrates guidance set under the rotation of many substrates polished and cleaned assembly, imports the first polished and cleaned station.After polished and cleaned is handled, rotate many substrates guidance set, and change the direction of rotation of many substrates polished and cleaned assembly, several substrates are imported into next polished and cleaned station through many substrates guidance set, realize the substrate stepping.So repeatedly, finishing the polished and cleaned of substrate on all stations handles.
In order to realize above-mentioned feature, the invention provides a kind of polishing, cleaning method of circular substrate, in the substrate rotation of polished cleaning, rotation polished and cleaned assembly, providing chemical polishing liquid and cleaning liquid carry out polished and cleaned to described substrate and handle.Described substrate through the substrate guidance set, under the rotation of polished and cleaned assembly, imports the polished and cleaned assembly by the substrate transfer assembly.The substrate driven unit drives described substrate rotation, and polished and cleaned liquid fill assembly providing chemical polishing liquid and cleaning liquid carry out polished and cleaned to described substrate and handle.After finishing the polished and cleaned processing, change the direction of rotation of polished and cleaned assembly, substrate is derived from the polished and cleaned assembly, is imported into the substrate transfer assembly through the substrate guidance set.
The substrate driven unit can be done toward complex line and move in rotation, and the polished and cleaned that described substrate is rotated and moves back and forth is handled.
Description of drawings
Figure 1A is depicted as the structural representation according to an embodiment of the polishing of circular substrate of the present invention, cleaning device.
Figure 1B and Fig. 1 C are depicted as the principle schematic of the device among Figure 1A, and substrate transmits schematic flow sheet.
Fig. 2 A is depicted as another schematic diagram of the substrate transmission flow process of the device among Figure 1A.
Fig. 2 B is depicted as another schematic diagram of the substrate transmission flow process of the device among Figure 1A.
Fig. 2 C is depicted as another schematic diagram of the substrate transmission flow process of the device among Figure 1A.
The substrate that Fig. 3 A to Fig. 3 C is depicted as the device among Figure 1A imports the schematic diagram that this installs flow process.
Fig. 4 A to Fig. 4 C is depicted as the substrate of the device among Figure 1A and derives the schematic diagram that this installs flow process.
Figure 5 shows that the cutaway view of the polished and cleaned assembly of the device among Figure 1A.
Figure 6 shows that the layout schematic diagram of the polished and cleaned liquid fill assembly of the device among Figure 1A.
Fig. 7 A is depicted as the structural representation that is arranged vertically according to the embodiment of polished and cleaned assembly more than of the polishing of circular substrate of the present invention, cleaning device.
Fig. 7 B and Fig. 7 C are depicted as the principle schematic of the device among Fig. 7 A, and substrate transmits schematic flow sheet.
Fig. 8 A is depicted as the structural representation according to another embodiment of the polishing of circular substrate of the present invention, cleaning device.
Fig. 8 B to Fig. 8 F is depicted as the principle schematic of the device among Fig. 8 A, and substrate transmits schematic flow sheet.
Fig. 9 A and Fig. 9 B are depicted as the principle schematic according to another many polished and cleaned assembly embodiment of the polishing of circular substrate of the present invention, cleaning device, and substrate transmits schematic flow sheet.
Figure 10 shows that the structural representation that is arranged vertically according to another many many polished and cleaned of substrate assembly embodiment of the polishing of circular substrate of the present invention, cleaning device.
Figure 11 A is depicted as the structural representation according to another embodiment of the polishing of circular substrate of the present invention, cleaning device.
Figure 11 B to Figure 11 D is depicted as the principle schematic of the device among Figure 11 A, and substrate transmits schematic flow sheet.
Figure 12 A and Figure 12 B are depicted as the principle schematic according to another many polished and cleaned assembly embodiment of the polishing of circular substrate of the present invention, cleaning device, and substrate transmits schematic flow sheet.
Figure 13 shows that the structural representation that is arranged vertically according to another many many polished and cleaned of substrate assembly multiple row embodiment of the polishing of circular substrate of the present invention, cleaning device.
The specific embodiment
The present invention is described with reference to the accompanying drawings more fully, and these accompanying drawings have shown the preferred embodiments of the present invention.But the present invention can implement in a different manner, and it should be interpreted as and limited by illustrated embodiment.The opposite embodiment that provides is in order to allow content detailed complete disclosed by the invention.
The present invention can be used for the polished and cleaned of substrate, circular substrate particularly, comprise the circular silicon chip that is used to produce semiconductor wafer, the glass, pottery and the aluminium matter circular substrate that are used for scheduler magnetic recording storage medium, be used to produce the plastics circular substrate of optical recording memory CD, digital versatile disc, and be used to produce the glass circular substrate of optics.For convenience of description, mentioned " substrate " is the above-mentioned various substrates of expression among the embodiment below, represents with 101.And in accompanying drawing, similar parts are represented with similar Reference numeral.
Figure 1A is depicted as the structural representation according to an embodiment 100 of the polishing of circular substrate of the present invention, cleaning device.。Present embodiment is made of polished and cleaned assembly 102a, 102b, substrate guidance set 103a, 103b, 103c and support frame 108.Polished and cleaned assembly 102a, 102b, substrate guidance set 103a, 103b, 103c are installed in the polished and cleaned that forms substrate 101 upright positions on the support frame 108 and handle.The polishing of circular substrate, cleaning device 100 both can move in the independent agency operation, also can be used as the module of a large-scale substrate polished and cleaned system and use, both can carry out polished and cleaned and handle, also can carry out polished and cleaned processing in batch many substrates to monocrepid.For further setting forth explanation, embodiments of the invention are not limited to a specific substrate 101, and are construed as above-mentioned various substrates, and other the similar substrates with similar shape structure.
Shown in Figure 1A, substrate 101 is through substrate transfer assembly 104a, substrate guide pad 111, and substrate guidance set 103a under the rotatablely moving of polished and cleaned assembly 102a, imports among polished and cleaned assembly 102a, the 102b.Polished and cleaned assembly 102a, 102b carry out polished and cleaned according to the technological requirement of substrate to substrate 101 to be handled, the chemical liquid of polishing or the deionized water of cleaning can be through polished and cleaned assembly mandrels, provide by supporting component 106, or provide (shown in Fig. 6) by fluid injector 125.After polished and cleaned is handled, rotate substrate guidance set 103a, 103b, 103c, change the direction of rotation of polished and cleaned assembly 102a, 102b, substrate 101 is through substrate guidance set 103b, 103c, and substrate guide pad 115,116 is imported among the substrate transfer assembly 104b.Polished and cleaned assembly 102a, 102b can be driven by motor 105a, also can be driven by sprocket wheel 105b, gear 105c or belt pulley.Polished and cleaned assembly 102a, 102b both can also can rotate with different speed with identical speed rotation, as the embodiment elaboration of back when being driven by motor 105a.
Figure 1B and Fig. 1 C are depicted as the principle schematic of the device 100 among Figure 1A, and substrate transmits schematic flow sheet.Shown in Figure 1B, substrate guidance set 103a, 103c 143a in the counterclockwise direction rotate, and substrate guidance set 103b 144a along clockwise direction rotates.Substrate 101 is sent to substrate transfer assembly 104a by the substrate transferring structure, is sent to polished and cleaned assembly 102a through substrate lifting subassembly 110 and substrate guide pad 111 (shown in Fig. 3 A).Polished and cleaned assembly 102a does clockwise direction 141a rotation, polished and cleaned assembly 102b does 142a rotation counterclockwise, substrate 101 is through substrate guide pad 111, substrate guidance set 103a, 103b, under the rotation of polished and cleaned assembly 102a, 102b, handle along the polished and cleaned of carrying out substrate among direction 140 imports polished and cleaned assembly 102a, 102b.In polished and cleaned assembly 102a, the inside extruding force of 102b, and by under the balanced frictional force effect downwards that is rotated in the generation of substrate 101 both sides, substrate 101 is pressed on the substrate driven unit 107.Substrate driven unit 107 is at motor, or sprocket wheel, gear, belt pulley drive and drive substrate 101 rotations down.Can regulate the rotary speed of substrate driven unit 107, thereby change the velocity of rotation of substrate 101.
After the polished and cleaned processing of finishing substrate 101, substrate guidance set 103a, 103c 143b along clockwise direction rotate, and substrate guidance set 103b 144b in the counterclockwise direction rotates, shown in Fig. 1 C.Change the direction of rotation of drive motor 105a, polished and cleaned assembly 102a does 141b rotation counterclockwise, polished and cleaned assembly 102b does clockwise direction 142b rotation, substrate 101 moves up under the frictional force effect that polished and cleaned assembly 102a, 102b relative motion are produced, through substrate guidance set 103b, 103c, substrate guide pad 115,116 (shown in Fig. 4 A) imports substrate transfer assembly 104b along direction 140.Take out the substrate of polished and cleaned by the substrate transferring structure again, finish the transmission to substrate, polished and cleaned is handled, the process of taking-up.
Fig. 2 A is depicted as another schematic diagram of the substrate transmission flow process of the device 100 among Figure 1A.Shown in Fig. 2 A, in the process that imports substrate 101, under motor 105a drove, polished and cleaned assembly 102a can be with higher speed 145a rotation, and polished and cleaned assembly 102b is then with lower speed 146a rotation.The different rotating speeds of polished and cleaned assembly produces unequal frictional force on substrate 101 surfaces, helps substrate 101 and successfully imports in polished and cleaned assembly 102a, 102b along direction 140.
Fig. 2 B is depicted as another schematic diagram of the substrate transmission flow process of the device 100 among Figure 1A.Shown in Fig. 2 B, in the process that derives substrate 101, the polished and cleaned assembly is under motor 105a drives, and polished and cleaned assembly 102a can be with lower speed 145b rotation, and polished and cleaned assembly 102b is then with higher speed 146b rotation.The different rotating speeds of polished and cleaned assembly is in the substrate 101 surface unequal frictional force that produce, help substrate 101 to withdraw from from polished and cleaned assembly 102a, through substrate guidance set 103b, 103c, under the rotation of polished and cleaned assembly 102b, import substrate transfer assembly 104b with direction 140.
Fig. 2 C is depicted as another schematic diagram of the substrate transmission flow process of the device 100 among Figure 1A.Shown in Fig. 2 C, in the process that derives substrate 101, substrate lifting subassembly 109 promotes substrate 101 and moves up, and helps substrate 101 to withdraw from from polished and cleaned assembly 102a.Polished and cleaned assembly 102a does 141b rotation counterclockwise, and polished and cleaned assembly 102b does clockwise direction 142b rotation, under the guiding of substrate guidance set 103a, 103c, imports substrate transfer assembly 104b with direction 140.Substrate lifting subassembly 109 can be made by stainless steel, plastic or other material, low dust is installed on it is generated the made slide block of material.Polished and cleaned element 109a is installed on the slide block of substrate lifting subassembly 109, then can carries out polished and cleaned and handle substrate 101 neighborings.Polished and cleaned element 109a can be a porous polymeric materials, as polyvinyl alcohol (PVA) polymer, or other any suitable materials.
The substrate that Fig. 3 A is depicted as the device 100 among Figure 1A imports the schematic diagram that this installs flow process.As shown in Figure 3A, substrate lifting subassembly 110, substrate transfer assembly 104a and substrate guide pad 111 are vertically mounted on the support frame 108.The substrate 101 that substrate lifting subassembly 110 promotes among the substrate transfer assembly 104a moves up, and is sent among the polished and cleaned assembly 102a by substrate guide pad 111 guiding substrates 101.Polished and cleaned assembly 102a does clockwise direction 141a rotation, and polished and cleaned assembly 102b does 142a rotation counterclockwise, and substrate 101 is through substrate guidance set 103a, 103b, among direction 140 importing polished and cleaned assembly 102a, 102b.
The substrate that Fig. 3 B is depicted as the device 100 among Figure 1A imports another schematic diagram that this installs flow process.Shown in Fig. 3 B, substrate boost assemblies 112, substrate transfer assembly 104a and substrate guide pad 113 levels are installed on the support frame 108.Substrate boost assemblies 112 promotes to move horizontally along substrate guide pad 113 at the substrate 101 of substrate transfer assembly 104a, sends among the polished and cleaned assembly 102a.Polished and cleaned assembly 102a does clockwise direction 141a rotation, and polished and cleaned assembly 102b does 142a rotation counterclockwise, and substrate 101 is through substrate guidance set 103a, 103b, among direction 140 importing polished and cleaned assembly 102a, 102b.
The substrate that Fig. 3 C is depicted as the device 100 among Figure 1A imports another schematic diagram that this installs flow process.Shown in Fig. 3 C, the transmission of substrate 101 is to pick and place assembly 114 by substrate to finish.Substrate picks and places assembly 114 and clamps from substrate transfer assembly 104a and take out substrate 101, with horizontal direction (or certain angle) substrate 101 is sent among the polished and cleaned assembly 102a, and substrate picks and places assembly 114 and unclamps and return, and finishes picking and placeing of substrate 101.Polished and cleaned assembly 102a does clockwise direction 141a rotation, and polished and cleaned assembly 102b does 142a rotation counterclockwise, and substrate 101 is through substrate guidance set 103a, 103b, among direction 140 importing polished and cleaned assembly 102a, 102b.To pick and place the substrate clamping contact point of assembly 114 are 4 points to substrate among the figure, but according to the size of sizes of substrate, clamp contact point and can be 3 or more than 4 points.The clamping of substrate with loosen also and can realize by vacuum in the surface or the neighboring of substrate.
Fig. 4 A is depicted as the substrate of the device 100 among Figure 1A and derives the schematic diagram that this installs flow process.Shown in Fig. 4 A, substrate guide pad 115,116 and substrate transfer assembly 104b are vertically mounted on the support frame 108.Polished and cleaned assembly 102a does 141b rotation counterclockwise, polished and cleaned assembly 102b does clockwise direction 142b rotation, the frictional force that relative motion produced of polished and cleaned assembly 102a, 102b drives substrate 101 and moves up, through substrate guidance set 103b, 103c, import substrate guide pad 115,116 along direction 140, help substrate 101 to withdraw from from polished and cleaned assembly 102b, according to the own wt of substrate 101, substrate 101 is imported among the substrate transfer assembly 104b.
Fig. 4 B is depicted as the substrate of the device 100 among Figure 1A and derives another schematic diagram that this installs flow process.Shown in Fig. 4 B, substrate guide pad 117,118 and substrate transfer assembly 104b level (or certain angle) are installed on the support frame 108.Polished and cleaned assembly 102a does 141b rotation counterclockwise, polished and cleaned assembly 102b does clockwise direction 142b rotation, the frictional force that the relative motion of polished and cleaned assembly 102a, 102b is produced drives substrate 101 and moves up, through substrate guidance set 103b, 103c, import in the substrate guide pad 117,118 along direction 140, utilize the rotation of polished and cleaned assembly 102b and the guide effect of substrate guide pad 117, help substrate 101 from polished and cleaned assembly 102b, to withdraw from, be imported among the substrate transfer assembly 104b.
Fig. 4 C is depicted as the substrate of the device 100 among Figure 1A and derives another schematic diagram that this installs flow process.Shown in Fig. 4 C, the derivation of substrate 101 is to pick and place assembly 119 by substrate to finish.Finish polished and cleaned when substrate 101 and handle, substrate 101 is derived through substrate guidance set 103b, 103c, and is rested on certain position owing to the relative motion of polished and cleaned assembly 102a, 102b.Substrate picks and places the stop place that assembly 119 moves to substrate 101, clamps from polished and cleaned assembly 102b and takes out substrate 101, with horizontal direction (or certain angle) substrate 101 is sent among the substrate transfer assembly 104b, unclamps and returns.To pick and place the substrate clamping contact point of assembly 119 are 4 points to substrate among the figure, but according to the size of sizes of substrate, clamp contact point and can be 3 or more than 4 points.The clamping of substrate with loosen also and can realize by vacuum in the surface or the neighboring of substrate.
Figure 5 shows that the cutaway view of the polished and cleaned assembly of the device 100 among Figure 1A.As shown in Figure 5, cleaning assembly is by mandrel 120, polished and cleaned element 121, and polished and cleaned member supports 122, side gripper shoe 123, and locking nut 124 constitutes.Substrate 101 imports between the polished and cleaned element 121 through the substrate guidance set.In mandrel 120, process slotted hole, and processing many group pores along diametric(al), polishing chemical liquid, deionized water or other liquid can be under certain supply pressures, along direction 150,151 offer polished and cleaned element 121, handle to be used for that substrate 101 is carried out polished and cleaned.The liquid that is provided can also wash polished and cleaned element 121, remains in impurity on the polished and cleaned element 121 with removing, prolongs the service life of cleaning element 121 simultaneously.Polished and cleaned element 121 can be selected from porous polymeric materials, as polyvinyl alcohol polymer (PVA), polyoxyethylene polymer, acrylate copolymer, polyether polymer, polystyrene acid polymer etc., or flexible sponge plastics, as fluorubber, silicon rubber, phosphonitrile rubber, polyurethane rubber etc., or other any suitable materials, by the mode of mold, be cast on the polished and cleaned member supports 122.Can be by changing the different polished and cleaned element 121 of gauge, or by reaching the distance that locking nut 124 is regulated 121 of polished and cleaned elements, change the pressure of cleaning element 121 on substrate 101, thereby regulate substrate polished and cleaned dynamics, to satisfy different technological requirements.
Figure 6 shows that the layout schematic diagram of the polished and cleaned liquid fill assembly of the device 100 among Figure 1A.As above-mentioned details discussion explanation, substrate 101 imports along direction 140 between the polished and cleaned element 121 of polished and cleaned assembly 102a, 102b through substrate guidance set 103a, 103b.The inside extruding force of polished and cleaned assembly 102a, 102b, and relative motion is pressed on the substrate driven unit 107 substrate 101 downwards in the frictional force that substrate 101 surfaces produce.Fluid injector 125 is placed on both sides, substrate 101 top, or is placed on both sides, substrate 101 below, according to the technological requirement of polished and cleaned, to supply with required polishing chemical liquid, deionized water or other liquid.Fluid injector 125 can also be arranged in the above and below of each station of polishing, the cleaning device 160 (shown in Fig. 7 A) of many polished and cleaned assembly in groups, supply with polishing required polishing chemical liquid, deionized water, realize polishing and cleaning at different station; Or supply with to clean required cleaning liquid, deionized water, realize the chemical liquid cleaning, washed with de-ionized water, deionized water rinsing by dirty to clean multistation cleaning process.
Fig. 7 A is depicted as the structural representation that is arranged vertically according to the embodiment of polished and cleaned assembly more than 160 of the polishing of circular substrate of the present invention, cleaning device.Shown in Fig. 7 A, polished and cleaned assembly 102a, 102b, 102c, 102d, 102e are arranged to the polished and cleaned device of four stations, substrate guidance set 103a, 103b, 103c, 103d, 103e, 103f are arranged in the top of polished and cleaned assembly, polished and cleaned assembly and substrate guidance set all are installed in the polished and cleaned treatment box 126, and the polished and cleaned that forms substrate 101 upright positions is handled.Substrate 101 is through substrate transfer assembly 104a, substrate guide pad 111, and substrate guidance set 103a under the rotatablely moving of polished and cleaned assembly 102a, imports the first polished and cleaned station (shown in Figure 1B).After the polished and cleaned assembly carries out the polished and cleaned processing to substrate 101, change the direction of rotation of polished and cleaned assembly 102a, 102b, 102c, 102d, 102e, reach the rotation direction of substrate guidance set 103a, 103b, 103c, 103d, 103e, 103f, substrate 101 is imported into next polished and cleaned station through the substrate guidance set, realizes substrate 101 steppings.So repeatedly, finishing the polished and cleaned of substrate on all stations handles.The polished and cleaned device of multistation can reduce the passing time of substrate 101, enhances productivity, and reduces production costs effectively.
Obviously, polished and cleaned assembly 102a, 102b, 102c, 102d, 102e and substrate guidance set 103a, 103b, 103c, 103d, 103e, 103f can be installed in the polished and cleaned treatment box 126, constitute the multistation polished and cleaned device of substrate 101 horizontal levels, to satisfy certain polished and cleaned technological requirement.This polished and cleaned device also can be installed in the polished and cleaned treatment box 126 with certain angle, so that finish the polishing chemical liquid that has polluted, deionized water or other liquid that polished and cleaned is handled, because the weight of itself, from top to bottom flow out, get rid of on the substrate and particulate and pollutant on the polished and cleaned element.
Fig. 7 B and Fig. 7 C are depicted as the principle schematic of the device 160 among Fig. 7 A, and substrate transmits schematic flow sheet.Shown in Fig. 7 B, the polished and cleaned of substrate 101 is handled and is carried out in polished and cleaned treatment box 126.Fluid injector 125 jet polishing chemical liquids, deionized water are to keep the moistening of substrate 101.Or in polished and cleaned treatment box 126, inject polishing chemical liquid, cleaning chemical liquid or deionized water, in liquid soaks, finish the polished and cleaned of substrate 101 and handle.
Meanwhile, the substrate 101 that is positioned at last polished and cleaned station is under the upwards frictional force effect that polished and cleaned assembly 102d, 102e rotation produces, through substrate guidance set 103e, 103f, import in the substrate guide pad 115,116 along direction 140, then be directed at (shown in Fig. 4 A) among the substrate transfer assembly 104b.Substrate transfer assembly 104b sends substrate 101, so that the substrate transferring structure takes out substrate 101 from polished and cleaned treatment box 126.
Shown in Fig. 7 C, after the polished and cleaned processing of finishing substrate 101, substrate guidance set 103a, 103c, 103e 149 rotate along clockwise direction, and substrate guidance set 103b, 103d, 103f 148 rotate in the counterclockwise direction.Simultaneously, change the direction of rotation of polished and cleaned assembly, polished and cleaned assembly 102a, 102c, 102e do 147 rotations counterclockwise, and polished and cleaned assembly 102b, 102d do clockwise direction 146 rotations.Substrate 101 moves up under the frictional force effect that the relative motion of polished and cleaned assembly is produced, through substrate guidance set 103a, 103b, 103c, 103d, 103e, 103f, among the next polished and cleaned station of direction 140 importings, substrate 101 is carried out the polished and cleaned of next station and handle, so repeatedly.Also be that substrate 101 steps to next station along direction 145 at every turn, finish polished and cleaned flow process from first station to a last station.
Fig. 8 A is depicted as the structural representation according to another embodiment 200 of the polishing of circular substrate of the present invention, cleaning device.Shown in Fig. 8 A, present embodiment by polished and cleaned assembly 102a, 102b, substrate guidance set 201a, 201b, and support frame 108 constitute.Substrate 101 is through substrate transfer assembly 104a, substrate guide pad 111, and substrate guidance set 201a under the rotation of polished and cleaned assembly 102a, imports among polished and cleaned assembly 102a, the 102b.Substrate driven unit 202a does toward complex line and moves, and polished and cleaned assembly 102a, 102b carry out the polished and cleaned processing to substrate 101 simultaneously.After polished and cleaned is handled, change the direction of rotation of polished and cleaned assembly 102a, 102b, substrate 101 is through substrate guidance set 201b, and substrate guide pad 115,116 is imported among the substrate transfer assembly 104b.
Fig. 8 B to Fig. 8 F is depicted as the principle schematic of the device 200 among Fig. 8 A, and substrate transmits schematic flow sheet.Shown in Fig. 8 B, substrate 101 is sent among the polished and cleaned assembly 102a by substrate lifting subassembly 110 and substrate guide pad 111 (shown in Fig. 3 A).Polished and cleaned assembly 102a does clockwise direction 141a rotation, and polished and cleaned assembly 102b does 142a rotation counterclockwise, and substrate 101 is through substrate guide pad 111, and substrate guidance set 201a is among direction 140 importing polished and cleaned assembly 102a, 102b.Substrate driven unit 202a moves to leftward position, and under the downward frictional force effect that polished and cleaned assembly 102a, 102b rotation produces, substrate 101 moves down, and is pressed on the substrate driven unit 202a.In the present embodiment, substrate guidance set 201a, 201b can fix and not rotate.
Shown in Fig. 8 C, substrate driven unit 202a drives substrate 101 rotations, and substrate driven unit 202a does and moves 210 pairs of substrates 101 toward complex line and carry out polished and cleaned and handle simultaneously.The rotating speed of polished and cleaned assembly 102a, 102b, and rotating speed and the translational speed of substrate driven unit 202a all can be regulated according to the technological requirement of polished and cleaned.
After the polished and cleaned processing of finishing substrate 101, substrate driven unit 202a and substrate 101 move to right positions, shown in Fig. 8 D.Change the direction of rotation of polished and cleaned assembly, polished and cleaned assembly 102a does 141b rotation counterclockwise, polished and cleaned assembly 102b does clockwise direction 142b rotation, and substrate 101 moves up under the frictional force effect that the relative motion of polished and cleaned assembly 102a, 102b is produced.Because the position of substrate 101 is offset to polished and cleaned assembly 102b, unbalanced frictional force is gone up on substrate 101 surfaces, cause substrate 101 to withdraw from from polished and cleaned assembly 102a earlier, again through substrate guidance set 201b, substrate guide pad 115,116 (shown in Fig. 4 A) imports among the substrate transfer assembly 104b along direction 140.
Be the importing or the derivation polished and cleaned assembly that help substrate 101, substrate guidance set 201a, 201b can do toward complex line and move 214, shown in Fig. 8 E.When substrate 101 imports, substrate guidance set 201a moves to the left, when substrate 101 is sent to polished and cleaned assembly 102a by substrate lifting subassembly 110 and substrate guide pad 111, substrate guidance set 201a moves to the right, helps substrate to import among the polished and cleaned assembly 102a.When substrate 101 is derived, substrate guidance set 201b moves to the left, change the direction of rotation of polished and cleaned assembly, substrate 101 moves up under the frictional force effect that the relative motion of polished and cleaned assembly 102a, 102b is produced, when substrate moves to substrate guidance set 201b, substrate guidance set 201b moves to the right, helps substrate to withdraw from polished and cleaned assembly 102b.Shown in Fig. 8 F, substrate guidance set 201a, 201b also can do reciprocal rotation 215, help substrate 101 to import or derive the polished and cleaned assembly.
Fig. 9 A and Fig. 9 B are depicted as the principle schematic according to another many polished and cleaned assembly embodiment 220 of the polishing of circular substrate of the present invention, cleaning device, and substrate transmits schematic flow sheet.Shown in Fig. 9 A, polished and cleaned assembly 102a, 102b, 102c, 102d, 102e are arranged vertically into the polished and cleaned device of four stations, substrate guidance set 201a, 201b, 201c, 201d, 201e are arranged in the top of polished and cleaned assembly, and polished and cleaned assembly and substrate guidance set all are installed in the polished and cleaned treatment box 128.Substrate 101 is sent to the substrate transfer assembly 104a that is arranged in polished and cleaned treatment box 128 by the substrate transferring structure, and substrate transfer assembly 104a delivers to substrate lifting subassembly 110 with substrate 101.Substrate lifting subassembly 110 is sent to the substrate 101 among the substrate transfer assembly 104a among the polished and cleaned assembly 102a along substrate guide pad 111 (shown in Fig. 3 A).Polished and cleaned assembly 102a, 102c, 102e do clockwise direction 211 rotations, and polished and cleaned assembly 102b, 102d do 212 rotations counterclockwise, and substrate 101 is through substrate guidance set 201a, among the direction 140 importings first polished and cleaned station.Substrate driven unit 202a moves to leftward position, and under the downward frictional force effect that polished and cleaned assembly 102a, 102b rotation produces, substrate 101 is pressed on the substrate driven unit 202a.Substrate driven unit 202a drives substrate 101 rotations, and substrate driven unit 202a does and moves 210 pairs of substrates 101 toward complex line and carry out polished and cleaned and handle simultaneously.
Meanwhile, substrate driven unit 202d moves to right positions, the substrate 101 that is positioned at last polished and cleaned station is under the upwards frictional force effect that polished and cleaned assembly 102d, 102e rotation produces, through substrate guidance set 201e, import in the substrate guide pad 115,116 along direction 140, then be directed at (shown in Fig. 4 A) among the substrate transfer assembly 104b.Substrate transfer assembly 104b sends substrate 101, so that the substrate transferring structure takes out substrate 101 from polished and cleaned treatment box 128.
After the polished and cleaned of finishing substrate 101, substrate driven unit 202a, 202b, 202c, 202d and substrate 101 move to right positions, shown in Fig. 9 B.Change the direction of rotation of polished and cleaned assembly, polished and cleaned assembly 102a, 102c, 102e do 212 rotations counterclockwise, polished and cleaned assembly 102b, 102d do clockwise direction 211 rotations, substrate 101 moves up under the frictional force effect that the relative motion of polished and cleaned assembly is produced, through substrate guidance set 201a, 201b, 201c, 201d, 201e, among the next polished and cleaned station of direction 140 importings, substrate driven unit 202a, 202b, 202c, 202d then move to leftward position, with the substrate of accepting to transmit 101.Also be that substrate 101 steps to next station along direction 213, carry out the polished and cleaned of next station and handle.So repeatedly, finish polished and cleaned flow process from first station to a last station.
Figure 10 shows that the structural representation that is arranged vertically according to another many many polished and cleaned of substrate assembly embodiment 300 of the polishing of circular substrate of the present invention, cleaning device.As shown in figure 10, many substrates polished and cleaned assembly 301a, 301b, 301c, 301d, 301e are arranged vertically into the polished and cleaned device of four stations, many substrates guidance set 302a, 302b, 302c, 302d, 302e, 302f are arranged in the top of polished and cleaned assembly, and many substrates polished and cleaned assembly and many substrates guidance set all are installed in the support frame 129 (shown in the figure five substrates 101 of polished and cleaned) simultaneously.
The polished and cleaned device embodiment 160 that shown in Figure 10 is the circular substrate of foundation polished and cleaned assembly more than sets forth the polishing of the circular substrate of many many polished and cleaned of substrate assemblies, the structure of cleaning device embodiment 300.But be understood that present embodiment 300 also can be made of the polished and cleaned device embodiment 220 (shown in Fig. 9 A) of the circular substrate of many polished and cleaned assembly.
Figure 11 A is depicted as the structural representation according to another embodiment 400 of the polishing of circular substrate of the present invention, cleaning device.Shown in Figure 11 A, present embodiment is by cylindrical polished and cleaned assembly 401a, the 401b of arranged crosswise at a certain angle, substrate driven unit 402a, and substrate guidance set 403a, and support frame 406 constitutes.Substrate 101 is through substrate transfer assembly 104a, substrate guide pad 405a, and substrate directive wheel 404a under the rotation of cylindrical polished and cleaned assembly 401a, 401b, imports between the cylindrical polished and cleaned assembly.Substrate driven unit 402a drives substrate 101 rotations, and does toward complex line and move, and substrate 101 is carried out polished and cleaned handle.After polished and cleaned is handled, change the direction of rotation of cylindrical polished and cleaned assembly 401a, 401b, substrate 101 is through substrate guidance set 403a, substrate directive wheel 404b, substrate guide pad 405b is imported among the substrate transfer assembly 104b.Cylindrical polished and cleaned assembly 401a, 401b can be driven by motor 105a, also can be driven by sprocket wheel, gear or belt pulley.
Figure 11 A illustrated embodiment is for carrying out the polished and cleaned device that the vertical direction polished and cleaned is handled to substrate 101.Obviously, for satisfying certain polished and cleaned technological requirement, this polished and cleaned device also can be with horizontal level, or is installed in the support frame 406 with certain angle.
Figure 11 B to Figure 11 D is depicted as the principle schematic of the device 400 among Figure 11 A, and substrate transmits schematic flow sheet.Shown in Figure 11 B, substrate guidance set 403a rotates along direction 414a, and substrate 101 picks and places assembly by substrate, and through substrate transfer assembly 104a, substrate guide pad 405a, substrate directive wheel 404a are sent to cylindrical polished and cleaned assembly 401a, 401b.Cylindrical polished and cleaned assembly 401a is direction 412a and rotatablely moves, and produces the frictional force of direction 413a on substrate 101 surfaces; Cylindrical polished and cleaned assembly 401b is direction 410b and rotatablely moves, and produces the frictional force of direction 411b on substrate 101 surfaces.The suffered frictional force drives substrate 101 in substrate 101 surfaces moves forward, and imports between cylindrical polished and cleaned assembly 401a, the 401b.Under the guide effect that is subjected to substrate guidance set 403a, substrate 101 moves to substrate driven unit 402a place.
Shown in Figure 11 C, change the direction of rotation of cylindrical polished and cleaned assembly.Cylindrical polished and cleaned assembly 401b is direction 410a and rotatablely moves, and produces the frictional force of direction 411a on substrate 101 surfaces, and cylindrical polished and cleaned assembly 401a produces the frictional force of direction 413a on substrate 101 surfaces simultaneously.The suffered frictional force drives substrate 101 of substrate surface moves along direction 415, and substrate 101 is pressed on the substrate driven unit 402a.Substrate driven unit 402a drives substrate 101 rotations, and substrate driven unit 402a can do toward complex line and move 416 simultaneously, substrate 101 is carried out polished and cleaned handle.The rotating speed of cylindrical polished and cleaned assembly 401a, 401b, and rotating speed and the translational speed of substrate driven unit 402a all can be regulated according to the technological requirement of polished and cleaned.
Shown in Figure 11 D, after the polished and cleaned processing of finishing substrate 101, substrate guidance set 403a rotates along direction 414b.Change the direction of rotation of cylindrical polished and cleaned assembly, cylindrical polished and cleaned assembly 401b is direction 410b and rotatablely moves, produce the frictional force of direction 411b on substrate 101 surfaces, cylindrical polished and cleaned assembly 401a produces the frictional force of direction 413a on substrate 101 surfaces simultaneously.The suffered frictional force drives substrate of substrate surface drives substrate 101 and moves forward, and under the guiding of substrate guidance set 403a, substrate 101 is derived between cylindrical polished and cleaned assembly 401a, 401b.Substrate 101 is through substrate directive wheel 404b, and substrate guide pad 405b picks and places assembly by substrate and is sent to substrate transfer assembly 104b.
In Figure 11 D, also can be in the rotation direction that changes substrate guidance set 403a, after direction 414b rotation, change earlier the direction of rotation of cylindrical polished and cleaned assembly 401a, 401b simultaneously, the frictional force drives substrate 101 that cylindrical polished and cleaned assembly is produced on substrate 101 leaves substrate driven unit 402a, shifts to substrate guidance set 403a.Then change the direction of rotation of cylindrical polished and cleaned assembly 401a again, be direction 412a and rotatablely move, finish the derivation of substrate 101.
Figure 12 A and Figure 12 B are depicted as the principle schematic according to another many polished and cleaned assembly embodiment 420 of the polishing of circular substrate of the present invention, cleaning device, and substrate transmits schematic flow sheet.Shown in Figure 12 A, cylindrical polished and cleaned assembly 401a, 401b, 401c, 401d, 401e, 401f, 401g, 401h are arranged vertically into the polished and cleaned device of four stations in polished and cleaned treatment box 408, driven by transmission device 407.Substrate driven unit 402a, 402b, 402c, 402d are arranged in the below of cylindrical polished and cleaned assembly, substrate guidance set 403a, 403b, 403c, 403d arranges the top that is arranged in cylindrical polished and cleaned assembly.Substrate 101 is sent to the substrate transfer assembly 104a that is arranged in polished and cleaned treatment box 408 by the substrate transferring structure, and fluid injector 125 jet polishing chemical liquids, deionized water are to keep the moistening of substrate 101.Substrate guidance set 403a, 403b, 403c, 403d rotates along direction 414a, and substrate 101 picks and places assembly by substrate, and through substrate transfer assembly 104a, substrate guide pad 405a, substrate directive wheel 404a are sent to cylindrical polished and cleaned assembly 401a, 401b.Cylindrical polished and cleaned assembly 401a is direction 412a and rotatablely moves, and cylindrical polished and cleaned assembly 401b is direction 410b and rotatablely moves, and the frictional force that produces direction on substrate 101 surfaces is with among the substrate 101 importings first polished and cleaned station.Meanwhile, then step to next station, carry out the polished and cleaned of next station and handle along direction 417 at the substrate of the second and the 3rd station.
Station in the end, cylindrical polished and cleaned assembly 401g is direction 412a and rotatablely moves, and cylindrical polished and cleaned assembly 401h is direction 410b and rotatablely moves, and the frictional force that produce directions on substrate 101 surfaces derive substrate 101 from last polished and cleaned station.Substrate 101 is through substrate directive wheel 404b, and substrate guide pad 405b pick and place assembly by substrate and be sent to substrate transfer assembly 104b, and the substrate transferring structure takes out substrate 101 from polished and cleaned treatment box 408.
Shown in Figure 12 B, change cylindrical polished and cleaned assembly 401b, 401d, 401f, 401g, the direction of rotation of 401h is direction 410a and is rotatablely moved, produce the frictional force of direction 411a on substrate 101 surfaces, cylindrical polished and cleaned assembly 401a of while, 401c, 401e, 401g is direction 412a and rotatablely moves, and produces the frictional force of direction 413a on substrate 101 surfaces.The suffered frictional force drives substrate 101 of substrate surface moves to the substrate driven unit, and substrate 101 is pressed on the substrate driven unit.Substrate driven unit 402a, 402b, 402c, 402d drive substrate 101 rotations, but the substrate driven unit can be done toward complex line and moves 416 simultaneously, substrate 101 is carried out polished and cleaned handle.
Figure 13 shows that the structural representation that is arranged vertically according to another many many polished and cleaned of substrate assembly multiple row embodiment 500 of the polishing of circular substrate of the present invention, cleaning device.As shown in figure 13, many many polished and cleaned of substrate assembly polished and cleaned device 300 (shown in Figure 10) can be used as a module, form polishing, the purging system of two row or multiple row, effectively utilize the production capacity of equipment, to enhance productivity further, reduce production costs.Obviously, present embodiment 500 also can be made of the disclosed embodiments 200 (shown in Fig. 8 A) or embodiment 400 (shown in Figure 11 A).
Though the present invention is described with reference to some embodiment; but the present invention can the form with other variations and change implement under the prerequisite that does not break away from its protection domain; therefore need to prove; embodiment involved in the present invention is used for the description of this invention rather than qualification, protection scope of the present invention be limit by claims rather than limited by the specification of front.
Claims (19)
1. one kind is used to handle the polishing of circular substrate, the device of cleaning, comprising:
The polished and cleaned assembly is used for that substrate is carried out polished and cleaned and handles;
The substrate guidance set is used for the transmission of guiding substrate at device; And
The substrate driven unit is used for supporting substrate and drives the substrate rotation;
Wherein, the adjacent arrangement of polished and cleaned assembly, the substrate guidance set is arranged in a side of polished and cleaned assembly, cooperates the transmission of guiding substrate in device with the polished and cleaned assembly, and the substrate driven unit is arranged in the opposite side of polished and cleaned assembly.
2. device as claimed in claim 1 is characterized in that, described polished and cleaned assembly is done opposite the rotatablely moving of direction, and direction of rotation can change.
3. one kind is used to handle the polishing of circular substrate, the device of cleaning, comprising:
Cylindrical polished and cleaned assembly is used for that substrate is carried out polished and cleaned and handles;
The substrate guidance set is used for the transmission of guiding substrate at device; And
The substrate driven unit is used for supporting substrate and drives the substrate rotation;
Wherein, the cross arrangement at a certain angle of cylindrical polished and cleaned assembly, the substrate guidance set is arranged in a side of cylindrical polished and cleaned assembly, cooperates the transmission of guiding substrate in device with cylindrical polished and cleaned assembly, and the substrate driven unit is arranged in the opposite side of cylindrical polished and cleaned assembly.
4. device as claimed in claim 3 is characterized in that, described cylindrical polished and cleaned assembly rotates, and direction of rotation can control respectively, or changes simultaneously.
5. as claim 1 and the described device of claim 3, it is characterized in that described substrate guidance set can be done reciprocal rotation; Maybe can do toward complex line and move, maybe can maintain static.
6. as claim 1 and the described device of claim 3, it is characterized in that described substrate driven unit can maintain static; Maybe can do toward complex line and move.
7. as claim 1 and the described device of claim 3, it is characterized in that, in the mandrel of described polished and cleaned assembly, process slotted hole, and process many group pores, supply with polished and cleaned element polished and cleaned liquid along diametric(al).
8. device as claimed in claim 7, it is characterized in that, the material of described polished and cleaned element is selected from porous polymeric materials: comprise polyvinyl alcohol polymer (PVA), polyoxyethylene polymer, acrylate copolymer, polyether polymer, polystyrene acid polymer, or flexible sponge plastics: comprise fluorubber, silicon rubber, phosphonitrile rubber, polyurethane rubber.
9. as claim 1 and the described device of claim 3, also comprise:
Substrate imports assembly, is used for importing substrate to the polished and cleaned assembly from the substrate transfer assembly;
Substrate is derived assembly, and being used for derives substrate to the substrate transfer assembly from the polished and cleaned assembly;
Polished and cleaned liquid fill assembly is used to supply with polished and cleaned assembly and substrate polishing liquid and cleaning liquid;
The substrate lifting subassembly is used to promote substrate and moves up, and withdraws from from the polished and cleaned assembly;
Wherein, polished and cleaned liquid fill assembly with inclination substrate certain angle be arranged in substrate above or below both sides; The substrate lifting subassembly is arranged between the substrate driven unit.
10. device as claimed in claim 9 is characterized in that, described substrate imports assembly and is made of the substrate guide pad and the substrate boost assemblies that import the guiding substrate of direction layout along substrate;
Or pick and place assembly by substrate and constitute, substrate picks and places assembly and moves to the polished and cleaned assembly along straight line, and the clamping that picks and places assembly by substrate imports substrate with loosening.
11. device as claimed in claim 9 is characterized in that, described substrate is derived assembly and is made of the substrate guide pad of deriving the guiding substrate of direction layout along substrate;
Or pick and place assembly by substrate and constitute, substrate picks and places assembly and moves to the polished and cleaned assembly along straight line, and the clamping that picks and places assembly by substrate is taken out substrate with loosening.
12. device as claimed in claim 9 is characterized in that, the polished and cleaned element is installed on described substrate lifting subassembly, can carry out polished and cleaned to substrate peripheral edge and handle.
13. one kind is used to handle the polishing of many many polished and cleaned of substrate assembly multiple rows of circular substrate, the device of cleaning, comprises:
Several many substrates polished and cleaned assemblies are used for that substrate is carried out polished and cleaned and handle;
Several many substrates guidance sets are used for the transmission of guiding substrate at device; And
Several many substrates driven units are used for supporting substrate and drive the substrate rotation,
Wherein, many substrates polished and cleaned assembly is arranged in order, many substrates guidance set is arranged in a side of polished and cleaned assembly, cooperates the transmission of guiding substrate in device with many substrates polished and cleaned assembly, and many substrates driven unit is arranged in the opposite side of polished and cleaned assembly.
14. device as claimed in claim 13 is characterized in that, adjacent many substrates polished and cleaned assembly make direction opposite rotatablely move and direction of rotation can change.
15. device as claimed in claim 13 is characterized in that, described many substrates polished and cleaned assembly is made of the adjacent arrangement on the mandrel of polished and cleaned assembly of a plurality of polished and cleaned elements.
16. device as claimed in claim 13 also comprises:
One group of several polished and cleaned liquid fill assembly, be arranged in many substrates polished and cleaned assembly one side above or below;
Another organizes several polished and cleaned liquid fill assemblies, be arranged in many substrates polished and cleaned assembly opposite side above or below;
Wherein, polished and cleaned liquid fill assembly is arranged with many substrates polished and cleaned assembly certain angle that tilts, is supplied with polished and cleaned assembly and substrate polishing liquid and cleaning liquid.
17. one kind is used to handle the polishing of circular substrate, the method for cleaning, in the substrate rotation of polished cleaning, and rotation polished and cleaned assembly, providing chemical polishing liquid and cleaning liquid carry out polished and cleaned to described substrate and handle.Said method comprising the steps of:
The polished and cleaned assembly rotates, and substrate is directed in polished and cleaned assembly and the substrate driven unit;
The substrate driven unit drives the substrate rotation, substrate is carried out polished and cleaned handle; Polished and cleaned liquid fill assembly providing chemical polishing liquid and cleaning liquid; Simultaneously, can carry out polished and cleaned to substrate peripheral edge handles;
After finishing the polished and cleaned processing, change the direction of rotation of polished and cleaned assembly, substrate is derived from the polished and cleaned assembly;
18. method as claimed in claim 17 is characterized in that, the rotary speed of described polished and cleaned assembly and substrate driven unit can be regulated; And the substrate driven unit can be done the past complex line that speed can regulate and move.
19. method as claimed in claim 17 is characterized in that, described polishing rotation cleaning assembly is when importing or derive substrate, and the polished and cleaned assembly is made rotatablely moving of direction change, and the polished and cleaned assembly can be with speed rotation identical or inequality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910103476A CN101850537A (en) | 2009-03-30 | 2009-03-30 | Circular substrate polishing and cleaning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910103476A CN101850537A (en) | 2009-03-30 | 2009-03-30 | Circular substrate polishing and cleaning device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101850537A true CN101850537A (en) | 2010-10-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910103476A Pending CN101850537A (en) | 2009-03-30 | 2009-03-30 | Circular substrate polishing and cleaning device and method |
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| CN (1) | CN101850537A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104385109A (en) * | 2014-09-25 | 2015-03-04 | 湖北大禹汉光真空电器有限公司 | Acid-free surface treatment technology of electrical pure iron and stainless steel parts for electrical vacuum device |
| CN111326473A (en) * | 2020-04-08 | 2020-06-23 | 西安奕斯伟硅片技术有限公司 | Silicon wafer bearing device and edge polishing equipment |
-
2009
- 2009-03-30 CN CN200910103476A patent/CN101850537A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104385109A (en) * | 2014-09-25 | 2015-03-04 | 湖北大禹汉光真空电器有限公司 | Acid-free surface treatment technology of electrical pure iron and stainless steel parts for electrical vacuum device |
| CN111326473A (en) * | 2020-04-08 | 2020-06-23 | 西安奕斯伟硅片技术有限公司 | Silicon wafer bearing device and edge polishing equipment |
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Application publication date: 20101006 |