CN101834170B - 可抑制外界高频噪声的芯片结构 - Google Patents
可抑制外界高频噪声的芯片结构 Download PDFInfo
- Publication number
- CN101834170B CN101834170B CN 201010146898 CN201010146898A CN101834170B CN 101834170 B CN101834170 B CN 101834170B CN 201010146898 CN201010146898 CN 201010146898 CN 201010146898 A CN201010146898 A CN 201010146898A CN 101834170 B CN101834170 B CN 101834170B
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- CN
- China
- Prior art keywords
- ground
- frequency
- pad
- circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Filters And Equalizers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010146898 CN101834170B (zh) | 2010-04-15 | 2010-04-15 | 可抑制外界高频噪声的芯片结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010146898 CN101834170B (zh) | 2010-04-15 | 2010-04-15 | 可抑制外界高频噪声的芯片结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101834170A CN101834170A (zh) | 2010-09-15 |
CN101834170B true CN101834170B (zh) | 2012-07-25 |
Family
ID=42718194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201010146898 Expired - Fee Related CN101834170B (zh) | 2010-04-15 | 2010-04-15 | 可抑制外界高频噪声的芯片结构 |
Country Status (1)
Country | Link |
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CN (1) | CN101834170B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104094292B (zh) * | 2012-04-25 | 2017-03-08 | 株式会社村田制作所 | 无线ic器件及无线通信终端 |
CN102842898B (zh) * | 2012-09-10 | 2014-10-29 | 广州润芯信息技术有限公司 | 静电释放保护电路 |
CN112859983B (zh) * | 2021-01-06 | 2022-04-12 | 深圳市紫光同创电子有限公司 | 芯片的电源调节电路及方法 |
CN114496999B (zh) * | 2021-09-06 | 2023-10-24 | 上海芯圣电子股份有限公司 | 一种减小寄生电阻的芯片封装结构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1073208A2 (en) * | 1999-07-29 | 2001-01-31 | Murata Manufacturing Co., Ltd. | High frequency switching component |
CN101542924A (zh) * | 2007-05-10 | 2009-09-23 | 株式会社村田制作所 | 复合高频器件 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007214226A (ja) * | 2006-02-08 | 2007-08-23 | Oki Electric Ind Co Ltd | 静電気放電保護回路 |
-
2010
- 2010-04-15 CN CN 201010146898 patent/CN101834170B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1073208A2 (en) * | 1999-07-29 | 2001-01-31 | Murata Manufacturing Co., Ltd. | High frequency switching component |
CN101542924A (zh) * | 2007-05-10 | 2009-09-23 | 株式会社村田制作所 | 复合高频器件 |
Also Published As
Publication number | Publication date |
---|---|
CN101834170A (zh) | 2010-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KUODA ELECTRONIC (SHANGHAI) CO., LTD. Free format text: FORMER OWNER: SUZHOU KONTEL MICROELECTRONICS CO., LTD. Effective date: 20130122 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215021 SUZHOU, JIANGSU PROVINCE TO: 201803 JIADING, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130122 Address after: 201803, room 337, 301 Shahe Road, Shanghai, Jiading District Patentee after: Da Da electronic (Shanghai) Co., Ltd. Address before: Suzhou City, Jiangsu Province, Suzhou Industrial Park 215021 Xinghu Street No. 328 B9-401-1 Patentee before: Suzhou Kuoda Microelectronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20160415 |