CN101831612B - 精准定位溅镀装置及其定位方法 - Google Patents
精准定位溅镀装置及其定位方法 Download PDFInfo
- Publication number
- CN101831612B CN101831612B CN 201010107510 CN201010107510A CN101831612B CN 101831612 B CN101831612 B CN 101831612B CN 201010107510 CN201010107510 CN 201010107510 CN 201010107510 A CN201010107510 A CN 201010107510A CN 101831612 B CN101831612 B CN 101831612B
- Authority
- CN
- China
- Prior art keywords
- sputter
- rotating disk
- shack
- main body
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000004807 localization Effects 0.000 claims description 7
- 230000000295 complement effect Effects 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 210000001364 upper extremity Anatomy 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000003860 storage Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 229910000737 Duralumin Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 244000188472 Ilex paraguariensis Species 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/266—Sputtering or spin-coating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010107510 CN101831612B (zh) | 2010-01-29 | 2010-01-29 | 精准定位溅镀装置及其定位方法 |
PCT/CN2010/074936 WO2011091651A1 (zh) | 2010-01-29 | 2010-07-02 | 精准定位溅镀装置及其定位方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010107510 CN101831612B (zh) | 2010-01-29 | 2010-01-29 | 精准定位溅镀装置及其定位方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101831612A CN101831612A (zh) | 2010-09-15 |
CN101831612B true CN101831612B (zh) | 2012-05-02 |
Family
ID=42715831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201010107510 Expired - Fee Related CN101831612B (zh) | 2010-01-29 | 2010-01-29 | 精准定位溅镀装置及其定位方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101831612B (zh) |
WO (1) | WO2011091651A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112397099B (zh) * | 2020-12-01 | 2022-04-15 | 北京中科开迪软件有限公司 | 一种用于光盘生产线的精准定位设备 |
CN113564542A (zh) * | 2021-07-06 | 2021-10-29 | 赫得纳米科技(昆山)有限公司 | 一种便于定位的溅镀机用定位装置及定位方法 |
CN113684451A (zh) * | 2021-08-16 | 2021-11-23 | 上海济物光电技术有限公司 | 一种碳化硅光学镜片的增材面形修正装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6149368A (en) * | 1998-06-12 | 2000-11-21 | Advanced Micro Devices, Inc. | Wafer disk pad having one or more wafer loading points to facilitate vacuum wand wafer loading and unloading |
JP2000149253A (ja) * | 1998-11-04 | 2000-05-30 | Fuji Electric Co Ltd | 成膜用のディスク基板ホルダ |
US6582572B2 (en) * | 2000-06-01 | 2003-06-24 | Seagate Technology Llc | Target fabrication method for cylindrical cathodes |
JP4653418B2 (ja) * | 2004-05-17 | 2011-03-16 | 芝浦メカトロニクス株式会社 | 真空処理装置および光ディスクの製造方法 |
CN1279209C (zh) * | 2004-10-19 | 2006-10-11 | 中国科学院上海光学精密机械研究所 | 磁控溅射镀膜夹具及其使用方法 |
-
2010
- 2010-01-29 CN CN 201010107510 patent/CN101831612B/zh not_active Expired - Fee Related
- 2010-07-02 WO PCT/CN2010/074936 patent/WO2011091651A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2011091651A1 (zh) | 2011-08-04 |
CN101831612A (zh) | 2010-09-15 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HE'NAN KERRY DIGITAL CO., LTD. Free format text: FORMER OWNER: DONGGUAN HONGWEI DIGITAL MACHINERY CO., LTD. Effective date: 20130703 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 523018 DONGGUAN, GUANGDONG PROVINCE TO: 455000 ANYANG, HENAN PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20130703 Address after: 455000 east section of Haihe Road, Anyang hi tech Industrial Development Zone, Henan Patentee after: Henan Kerry Digital Co., Ltd. Address before: 523018, Dongguan Guangdong Nancheng ambitious High-tech Development Zone Patentee before: Dongguan Hongwei Digital Machinery Co., Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Precise positioning sputtering device and positioning method thereof Effective date of registration: 20130918 Granted publication date: 20120502 Pledgee: Beijing AVIC Information Technology Co., Ltd. Pledgor: Henan Kerry Digital Co., Ltd. Registration number: 2013990000685 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PP01 | Preservation of patent right |
Effective date of registration: 20131205 Granted publication date: 20120502 |
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PD01 | Discharge of preservation of patent |
Date of cancellation: 20140905 Granted publication date: 20120502 |
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Effective date of registration: 20140905 Granted publication date: 20120502 |
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PD01 | Discharge of preservation of patent |
Date of cancellation: 20150905 Granted publication date: 20120502 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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