CN101817160A - Silicon ingot polishing method, system and polishing plate - Google Patents
Silicon ingot polishing method, system and polishing plate Download PDFInfo
- Publication number
- CN101817160A CN101817160A CN201010147264A CN201010147264A CN101817160A CN 101817160 A CN101817160 A CN 101817160A CN 201010147264 A CN201010147264 A CN 201010147264A CN 201010147264 A CN201010147264 A CN 201010147264A CN 101817160 A CN101817160 A CN 101817160A
- Authority
- CN
- China
- Prior art keywords
- polishing
- silicon ingot
- entrance hole
- plate
- guiding gutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a silicon ingot polishing method, which comprises the following steps of: providing a silicon ingot; moving a transmission rod to enable a polishing plate to contact with the upper surface of the silicon ingot, and applying preset pressure through the transmission rod, wherein the polishing plate is provided with at least a guide hole for guiding polishing liquid and at least a guide groove connected with the guide hole; guiding the polishing liquid into the guide hole of the polishing plate, wherein the polishing liquid flows into the polishing cloth of the polishing plate and the polishing interface of the silicon ingot through the guide hole and the guide groove; and horizontally moving the silicon ingot and rotating the transmission rod to polish the upper surface of the silicon ingot. As the silicon ingot is polished by a wet polishing technology, the polishing removal rate is increased, the surface damage layer of the silicon ingot is improved, the production cost is reduced, and the polishing effect is also improved.
Description
Technical field
The present invention relates to the manufacturing technology field of solar energy battery adopted silicon chip, particularly a kind of silicon ingot polishing method, system and polishing plate.
Background technology
New and renewable sources of energy is one of material technical field of tool in the 21 century development of world economy.Photovoltaic cell is a kind of important renewable energy, both can be used as separate energy source, also can realize generating electricity by way of merging two or more grid systems, and be zero disposal of pollutants.Silicon solar cell can only be used for the space at first owing to the cost reason, but along with technical development and technical maturity, uses also progressively expansion.In the face of the energy supply situation of today and serious environmental pollution day by day, silicon solar cell has obtained using widely especially.
Silicon solar cell mainly comprises with the manufacturing process of silicon chip: monocrystalline or polycrystalline ingot → butt → polishing or acid corrosion → steps such as line section → cleaning.Wherein, the effect of polishing or acid corrosion is the mechanical damage layer that reduces the square silicon ingot surface, and silicon chip edge collapses the limit when cutting into slices thereby can reduce, and improves yield rate.If adopt the mode of acid corrosion, then can produce a large amount of fluorine-containing spent acid, not only can pollute, but also be very difficult to handle environment.Therefore the method for main at present employing polishing is removed the mechanical damage layer on square silicon ingot surface.
At present, the main glossing that adopts comprises two kinds, and a kind of is to polish with the diamond brush, but the price of required equipment of this technology and diamond brush is very expensive.Therefore in order to reduce production costs, another kind of finishing method has been proposed, as shown in Figure 1, finishing method schematic diagram for prior art, square silicon ingot 100 can move by along continuous straight runs, and the drive link 200 that drives polishing plate 300 rotations is arranged above square silicon ingot 100, and drive link 200 can produce certain downward pressure, improve the polishing ability by revolving force and pressure, thereby can avoid using expensive diamond brush.Existing polishing plate 300 comprises the gripper shoe 310 on top and the polishing cloth 320 of bottom, and wherein polishing cloth 320 can be by the nylon manufacturing, so prior art can reduce production costs widely.
The shortcoming that prior art exists is that though adopt the nylon polishing cloth to reduce cost widely, polishing effect is also bad, can not satisfy polishing requirements, therefore also needs to improve.
Summary of the invention
Purpose of the present invention is intended to solve at least one of above-mentioned technological deficiency, particularly proposes a kind of silicon ingot polishing method, system and polishing plate, not only can reduce production costs, and can also improve polishing effect in addition.
For achieving the above object, one aspect of the present invention proposes a kind of silicon ingot polishing method, may further comprise the steps: silicon ingot is provided; Mobile drive link and applies default pressure by described drive link so that polishing plate contacts with the upper surface of described silicon ingot, and wherein, described polishing plate has at least one and is used for entrance hole and at least one guiding gutter that links to each other with described entrance hole that polishing fluid imports; Polishing fluid is imported in the entrance hole of described polishing plate, described polishing fluid flows into the polishing interface of the polishing cloth and the silicon ingot of described polishing plate by described entrance hole and guiding gutter; With move horizontally described silicon ingot and rotate described drive link and polish with upper surface to described silicon ingot.
The present invention has also proposed a kind of polishing system of silicon ingot on the other hand, comprising: bogey is used to carry silicon ingot, and can moves horizontally; Be used for polishing plate that described silicon ingot is polished, wherein, described polishing plate has at least one and is used for entrance hole and at least one guiding gutter that links to each other with described entrance hole that polishing fluid imports; The rotary extension device, be used for the mobile drive link that is connected with described polishing plate so that described polishing plate contacts with the upper surface of described silicon ingot, and described polishing plate is applied default pressure, and when the described silicon ingot of polishing, rotate described drive link so that the rotation of described polishing plate by described drive link; And liquid feed device, being used for polishing fluid is imported to the entrance hole of described polishing plate, described polishing fluid flows into the polishing interface of the polishing cloth and the silicon ingot of described polishing plate by described entrance hole and described guiding gutter.
The present invention adopts the wet-tumbling technology that silicon ingot is polished, can increase the polishing removal amount, improve the surface damage layer of silicon ingot, therefore the present invention not only can reduce production costs, can also improve polishing effect, the effect that the method and system that proposes by the present invention polishes is than the better effects if of polishing with the diamond brush.
Further aspect of the present invention has also proposed a kind of polishing plate, comprises gripper shoe, has at least one first entrance hole on the described gripper shoe, and drive link links to each other with the central point of described gripper shoe; And polishing cloth, described polishing cloth is connected with described gripper shoe, is used for silicon ingot is polished, and wherein, described polishing cloth has: second entrance hole, described second entrance hole is corresponding with first entrance hole of described gripper shoe; And at least one first guiding gutter, described at least one first guiding gutter is connected with described second entrance hole.The polishing plate that proposes by the embodiment of the invention can import to polishing fluid the polishing interface of polishing cloth and silicon ingot, improves polishing effect, and the polishing cloth of the embodiment of the invention can adopt nylon material, so can reduce production costs widely.
Aspect that the present invention adds and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, wherein:
Fig. 1 is the silicon ingot finishing method schematic diagram of prior art;
Fig. 2 is the silicon ingot wet-tumbling method flow diagram of the embodiment of the invention;
Fig. 3 is the silicon ingot wet-tumbling system construction drawing of the embodiment of the invention;
Fig. 4-7 is respectively stereogram, vertical view, upward view and the side view of embodiment of the invention polishing plate.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the present invention, and can not be interpreted as limitation of the present invention.
Disclosing hereinafter provides many different embodiment or example to be used for realizing different structure of the present invention.Of the present invention open in order to simplify, hereinafter parts and the setting to specific examples is described.Certainly, they only are example, and purpose does not lie in restriction the present invention.In addition, the present invention can be in different examples repeat reference numerals and/or letter.This repetition is in order to simplify and purpose clearly, itself not indicate the relation between various embodiment that discuss of institute and/or the setting.In addition, various specific technology and the examples of material that the invention provides, but those of ordinary skills can recognize the property of can be applicable to of other technologies and/or the use of other materials.In addition, first feature described below second feature it " on " structure can comprise that first and second features form the embodiment of direct contact, can comprise that also additional features is formed on the embodiment between first and second features, such first and second features may not be direct contacts.
The present invention adopts the wet-tumbling technology that silicon ingot is polished, can increase the polishing removal amount, improve the surface damage layer of silicon ingot, therefore the present invention not only can reduce production costs, can also improve polishing effect, the effect that the method and system that proposes by the present invention polishes is than the better effects if of polishing with the diamond brush.
As shown in Figure 2, the silicon ingot wet-tumbling method flow diagram for the embodiment of the invention may further comprise the steps:
Step S201 provides silicon ingot, square silicon ingot for example, and the silicon ingot of other shapes also can be applicable among the present invention certainly.
Step S202, mobile drive link and applies default pressure by drive link so that polishing plate contacts with the upper surface of silicon ingot.In embodiments of the present invention, polishing plate has at least one and is used for the entrance hole and at least one guiding gutter that links to each other with the polishing fluid entrance hole that polishing fluid imports, thereby can make the polishing interface of polishing fluid, improve polishing effect by entrance hole and guiding gutter inflow polishing cloth and silicon ingot.Wherein, polishing plate of the present invention can adopt the polishing cloth of nylon material, therefore can reduce production costs widely.
Step S203 imports to polishing fluid in the entrance hole of polishing plate.In one embodiment of the invention, polishing fluid can comprise silica (SiO
2) particle and alkaline aqueous solution, wherein, the size of silica dioxide granule can be about 70-1100nm, can improve polishing effect effectively by polishing fluid of the present invention.
Step S204 moves horizontally silicon ingot and rotates drive link and polish with the upper surface to silicon ingot.Through practice examining, effect that the finishing method that proposes by the present invention polishes and the better effects if of polishing with the diamond brush, so the present invention not only can reduce production costs, and reasonable polishing effect can also be arranged.
Step S205, polishing fluid is collected recovery, handle (for example filter etc.) afterwards circulating imports in the entrance hole of polishing plate, thereby closed cycle can be formed, further reduce production costs, recycle polishing fluid in addition and also can reduce problems such as environmental pollution.
In order to make those skilled in the art clearer understanding be arranged to said method; the invention allows for a kind of polishing system that is applicable to said method; but need to prove that those skilled in the art also can propose other polishing systems by said method according to the present invention; perhaps following polishing system of the present invention is made amendment and improve; in the scope that does not break away from the main thought of said method of the present invention, these all should be included within protection scope of the present invention.
As shown in Figure 3, be the silicon ingot wet-tumbling system construction drawing of the embodiment of the invention.This wet-tumbling system comprises the bogey that moves horizontally 410 that is used to carry silicon ingot 400, be used for polishing plate 460, rotary extension device 440 and liquid feed device 420 that silicon ingot 400 is polished.Wherein, polishing plate 460 has at least one and is used for the entrance hole and at least one guiding gutter that links to each other with entrance hole that polishing fluid imports, liquid feed device 420 imports to polishing fluid in the entrance hole of described polishing plate, makes polishing fluid flow into the polishing cloth of polishing plate 460 and the polishing interface of silicon ingot 400 by entrance hole and guiding gutter.When silicon ingot 400 is polished, rotary extension device 440 moves the drive link 450 that is connected with polishing plate 460 so that polishing plate 460 contacts with the upper surface of silicon ingot 400, and apply default pressure by 450 pairs of polishing plates 460 of drive link, and rotation drive link 450 is so that polishing plate 460 rotations.In one embodiment of the invention, polishing plate 460 comprise gripper shoe and with the polishing cloth that is fixed on the gripper shoe, therefore wherein, polishing cloth can be made of nylon material, can reduce production costs widely.In another embodiment of the present invention, polishing fluid can comprise alkaline aqueous solution and silica dioxide granule, and for example the silica dioxide granule of 70-1100nm can improve polishing effect effectively by polishing fluid of the present invention.
Preferably, in one embodiment of the invention, this wet-tumbling system also can comprise recovery EGR 430, be used for polishing fluid is collected recovery, and the polishing fluid after will handling is provided in the liquid feed device 420, thereby can form closed cycle, not only can further reduce production costs, and recycle polishing fluid and also can reduce problems such as environmental pollution.
The invention allows for a kind of polishing plate, this polishing plate comprises gripper shoe and the polishing cloth that is connected with gripper shoe, because polishing cloth can be made of nylon material, therefore can reduce production costs widely in the present invention.Wherein, have at least one first entrance hole on the gripper shoe, drive link links to each other with the central point of gripper shoe, and polishing cloth has second entrance hole corresponding with first entrance hole of gripper shoe and at least one first guiding gutter that is connected with second entrance hole.Like this, polishing fluid can flow in each first guiding gutter by second entrance hole after entering first entrance hole, thereby can improve polishing effect so that polishing fluid flows into the polishing interface of polishing cloth and silicon ingot.
Particularly, the present invention proposes a kind of instance graph of polishing plate, shown in Fig. 4-7, be respectively stereogram, vertical view, upward view and the side view of embodiment of the invention polishing plate.Need to prove; this embodiment is the preferred embodiments of the present invention mode; those skilled in the art can make modification or the replacement that is equal to according to the characteristics of the above-mentioned polishing plate of mentioning to following examples; the for example position of entrance hole and quantity; the position of guiding gutter, quantity, shape and the degree of depth etc., these modifications or replacement all should be included within protection scope of the present invention.For the ease of illustrating, polishing cloth 120 is bonded on the gripper shoe 110 in this Fig. 4, but polishing cloth 120 contacts with the upper surface of silicon ingot under gripper shoe 110 in actual polishing process.Shown in Fig. 4-7, polishing plate comprises the polishing cloth 120 of gripper shoe 110 and be connected with gripper shoe 110 (for example bonding), the center of gripper shoe 110 is connected with drive link 450, certainly those skilled in the art also can select other positions of gripper shoe 110 to be connected with drive link 450, but are preferably the center of gripper shoe 110.Wherein the center of gripper shoe 110 can be connected in possible arbitrarily mode with drive link 450, for example welding, fixed forms such as riveted joint connect, but preferably, as Fig. 4 and Fig. 5, can be provided with threaded screw 140 at the center of gripper shoe 110, one end of drive link 450 is threaded to be threaded with screw 140, polishing plate is unloaded from drive link 450 at an easy rate, thereby be convenient to clear up old polishing cloth and new polishing cloth is installed, those skilled in the art also can select other modes to make drive link 450 removably be connected with the center of gripper shoe 110 certainly.In the embodiment of Fig. 4 and Fig. 5, gripper shoe 110 is connected with screw 140 by a plurality of linking arms 150, be formed with first entrance hole 130 between each linking arm 150, those skilled in the art also can select other modes to make gripper shoe 110 be connected with screw 140 certainly.Same position corresponding with first entrance hole 130 on polishing cloth 120 also is formed with corresponding second entrance hole, because first entrance hole is in identical position with second entrance hole, therefore first entrance hole and second entrance hole all adopt same label 130.On polishing cloth 120, also comprise a plurality of first guiding gutters 160 that are connected with second entrance hole 130, this first guiding gutter 160 is with second entrance hole 130 dispersing all around for middle mind-set polishing cloth 120, preferably, each first guiding gutter 160 equidistantly distributes on polishing cloth 120, though be 6 first guiding gutters 160 in diagram, but those skilled in the art also can increase or reduce the quantity of first guiding gutter 160, polishing fluid can flow in each first guiding gutter 160 by second entrance hole 130 like this, thereby can improve polishing effect so that polishing fluid flows into the polishing interface of polishing cloth 120 and silicon ingot.In order further to improve polishing effect, on polishing cloth 120, also can comprise at least one second guiding gutter 70 along circumferential extension, to connect at least a portion of first guiding gutter 160, thereby more being evenly distributed in, polishes on the interface polishing fluid, improve polishing effect.
The present invention adopts the wet-tumbling technology that silicon ingot is polished, can increase the polishing removal amount, improve the surface damage layer of silicon ingot, therefore the present invention not only can reduce production costs, can also improve polishing effect, experimental results show that effect that the method and system that proposes by the present invention polishes is than the better effects if of polishing with the diamond brush.
Although illustrated and described embodiments of the invention, for the ordinary skill in the art, be appreciated that without departing from the principles and spirit of the present invention and can carry out multiple variation, modification, replacement and modification that scope of the present invention is by claims and be equal to and limit to these embodiment.
Claims (15)
1. a silicon ingot polishing method is characterized in that, may further comprise the steps:
Silicon ingot is provided;
Mobile drive link and applies default pressure by described drive link so that polishing plate contacts with the upper surface of described silicon ingot, and wherein, described polishing plate has at least one and is used for entrance hole and at least one guiding gutter that links to each other with described entrance hole that polishing fluid imports;
Polishing fluid is imported in the entrance hole of described polishing plate, described polishing fluid flows into the polishing interface of the polishing cloth and the silicon ingot of described polishing plate by described entrance hole and guiding gutter; With
Move horizontally described silicon ingot and rotate described drive link and polish with upper surface to described silicon ingot.
2. silicon ingot polishing method as claimed in claim 1 is characterized in that, also comprises:
Polishing fluid is collected recovery, handle the back circulation and import in the entrance hole of described polishing plate.
3. silicon ingot polishing method as claimed in claim 1 or 2 is characterized in that described polishing fluid comprises silica dioxide granule and alkaline aqueous solution.
4. as each described silicon ingot polishing method of claim 1-3, it is characterized in that described polishing cloth is made of nylon material.
5. the polishing system of a silicon ingot is characterized in that, comprising:
Bogey is used to carry silicon ingot, and can move horizontally;
Be used for polishing plate that described silicon ingot is polished, wherein, described polishing plate has at least one and is used for entrance hole and at least one guiding gutter that links to each other with described entrance hole that polishing fluid imports;
The rotary extension device, be used for the mobile drive link that is connected with described polishing plate so that described polishing plate contacts with the upper surface of described silicon ingot, and described polishing plate is applied default pressure, and when the described silicon ingot of polishing, rotate described drive link so that the rotation of described polishing plate by described drive link; With
Liquid feed device is used for polishing fluid is imported to the entrance hole of described polishing plate, and described polishing fluid flows into the polishing interface of the polishing cloth and the silicon ingot of described polishing plate by described entrance hole and described guiding gutter.
6. the polishing system of silicon ingot as claimed in claim 5 is characterized in that, also comprises:
Reclaim EGR, be used for polishing fluid is collected recovery, and the polishing fluid after will handling is provided in the described liquid feed device.
7. the polishing system of silicon ingot as claimed in claim 5 is characterized in that, described polishing fluid comprises silica dioxide granule and alkaline aqueous solution.
8. the polishing system of silicon ingot as claimed in claim 7, it is characterized in that, described polishing plate comprise gripper shoe and with the polishing cloth that is fixed on the described gripper shoe, wherein, has at least one first entrance hole on the described gripper shoe, at least one first guiding gutter that described polishing cloth has second entrance hole corresponding with first entrance hole of described gripper shoe and is connected with described second entrance hole.
9. the polishing system of silicon ingot as claimed in claim 8 is characterized in that, described first entrance hole and second entrance hole all are positioned at the center of described polishing cloth, and described first guiding gutter is dispersing all around of the described polishing cloth of middle mind-set with described second entrance hole.
10. the polishing system of silicon ingot as claimed in claim 9 is characterized in that, described polishing cloth also comprises at least one second guiding gutter along circumferential extension, to be communicated with at least a portion of described first guiding gutter.
11. the polishing system as each described silicon ingot of claim 5-10 is characterized in that, described polishing cloth is made of nylon material.
12. a polishing plate is characterized in that, comprising:
Gripper shoe has at least one first entrance hole on the described gripper shoe, drive link links to each other with the central point of described gripper shoe; With
Polishing cloth, described polishing cloth is connected with described gripper shoe, is used for silicon ingot is polished, and wherein, described polishing cloth has:
Second entrance hole, described second entrance hole is corresponding with first entrance hole of described gripper shoe; And
At least one first guiding gutter, described at least one first guiding gutter is connected with described second entrance hole.
13. polishing plate as claimed in claim 12 is characterized in that, described second entrance hole is positioned at the center of described polishing cloth, and described first guiding gutter is dispersing all around of the described polishing cloth of middle mind-set with described second entrance hole.
14. polishing plate as claimed in claim 13 is characterized in that, described polishing cloth also comprises at least one second guiding gutter along circumferential extension, to connect at least a portion of described first guiding gutter.
15., it is characterized in that described polishing cloth is made of nylon material as each described polishing plate of claim 12-14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010147264A CN101817160A (en) | 2010-04-13 | 2010-04-13 | Silicon ingot polishing method, system and polishing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010147264A CN101817160A (en) | 2010-04-13 | 2010-04-13 | Silicon ingot polishing method, system and polishing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101817160A true CN101817160A (en) | 2010-09-01 |
Family
ID=42652514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010147264A Pending CN101817160A (en) | 2010-04-13 | 2010-04-13 | Silicon ingot polishing method, system and polishing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101817160A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106808380A (en) * | 2017-03-29 | 2017-06-09 | 中国工程物理研究院激光聚变研究中心 | Numerical control polishing disk and glossing |
| CN109904094A (en) * | 2019-01-17 | 2019-06-18 | 安徽华顺半导体发展有限公司 | A kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment |
| CN114473852A (en) * | 2020-10-28 | 2022-05-13 | 中国科学院微电子研究所 | Polishing head and chemical mechanical planarization equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2242877A (en) * | 1939-03-15 | 1941-05-20 | Albertson & Co Inc | Abrasive disk and method of making the same |
| US5645469A (en) * | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
| CN1790624A (en) * | 2004-12-14 | 2006-06-21 | 罗门哈斯电子材料Cmp控股股份有限公司 | Cmp pad having an overlapping stepped groove arrangement |
| US20060154575A1 (en) * | 2000-09-28 | 2006-07-13 | Sharp Kabushiki Kaisha | Method of making solar cell |
| CN1897226A (en) * | 2005-07-11 | 2007-01-17 | 上海华虹Nec电子有限公司 | Mechamical polisher |
| CN101100048A (en) * | 2006-07-03 | 2008-01-09 | 三芳化学工业股份有限公司 | Grinding cushion with surface texture |
| CN201702666U (en) * | 2010-04-13 | 2011-01-12 | 王敬 | Silicon ingot polishing system and polishing plate |
-
2010
- 2010-04-13 CN CN201010147264A patent/CN101817160A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2242877A (en) * | 1939-03-15 | 1941-05-20 | Albertson & Co Inc | Abrasive disk and method of making the same |
| US5645469A (en) * | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
| US20060154575A1 (en) * | 2000-09-28 | 2006-07-13 | Sharp Kabushiki Kaisha | Method of making solar cell |
| CN1790624A (en) * | 2004-12-14 | 2006-06-21 | 罗门哈斯电子材料Cmp控股股份有限公司 | Cmp pad having an overlapping stepped groove arrangement |
| CN1897226A (en) * | 2005-07-11 | 2007-01-17 | 上海华虹Nec电子有限公司 | Mechamical polisher |
| CN101100048A (en) * | 2006-07-03 | 2008-01-09 | 三芳化学工业股份有限公司 | Grinding cushion with surface texture |
| CN201702666U (en) * | 2010-04-13 | 2011-01-12 | 王敬 | Silicon ingot polishing system and polishing plate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106808380A (en) * | 2017-03-29 | 2017-06-09 | 中国工程物理研究院激光聚变研究中心 | Numerical control polishing disk and glossing |
| CN106808380B (en) * | 2017-03-29 | 2023-07-28 | 中国工程物理研究院激光聚变研究中心 | Numerical control polishing disc and polishing process |
| CN109904094A (en) * | 2019-01-17 | 2019-06-18 | 安徽华顺半导体发展有限公司 | A kind of polycrystalline silicon ingot casting silicon wafer cleaning equipment |
| CN109904094B (en) * | 2019-01-17 | 2021-02-19 | 安徽华顺半导体发展有限公司 | Polycrystalline silicon ingot silicon chip cleaning equipment |
| CN114473852A (en) * | 2020-10-28 | 2022-05-13 | 中国科学院微电子研究所 | Polishing head and chemical mechanical planarization equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201702666U (en) | Silicon ingot polishing system and polishing plate | |
| CN102839824A (en) | Steel-bonded reinforcement method for steel structure | |
| CN105897146A (en) | Multifunctional device for automatically cleaning solar cell panel | |
| CN102544240B (en) | Method and device for integrating slicing and flocking of crystalline silicon wafer | |
| CN101817160A (en) | Silicon ingot polishing method, system and polishing plate | |
| CN105345645A (en) | Grinding device applied to glass surface machining | |
| CN101885161B (en) | Polishing system used for square silicon ingot for solar cell | |
| CN202480536U (en) | Screen for silk screen printing in solar battery production | |
| CN111119421A (en) | Photovoltaic building roof | |
| CN201824217U (en) | Automatic sintering furnace track grinding device | |
| CN104174616B (en) | A kind of photovoltaic battery panel rinser | |
| CN201833266U (en) | Polishing system for square silicon ingot for solar battery | |
| CN210207740U (en) | Automatic cleaning solar photovoltaic panel robot | |
| CN203456492U (en) | Portable paste recovery tool | |
| CN203579338U (en) | Surface polishing machine for polishing wheels | |
| CN206317302U (en) | Shrink belt sizer | |
| CN105436110A (en) | Cleaning device based on solar cell | |
| CN205362022U (en) | Cleaner based on solar cell | |
| CN203653677U (en) | Submerged roller device used in hot-dip galvanizing | |
| CN202336813U (en) | Diamond abrasion block | |
| CN104032366B (en) | Electrochemical polish apparatus and method | |
| CN201801776U (en) | Ceramic panel with dewatering elements | |
| CN208272910U (en) | A kind of solar panels protection framework with four seasons cleaning function | |
| CN103213380B (en) | Screen printing plate processing method | |
| CN202549902U (en) | Compensation device for electricity leakage caused by non-etching after cell test |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100901 |