CN101805538A - Lower-temperature sintered conductive ink - Google Patents
Lower-temperature sintered conductive ink Download PDFInfo
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Abstract
The invention discloses a low-temperature quickly sintered conductive ink for use in ink jet printing, which comprises 1 to 70 weight percent of nano metal particles, 0.1 to 10 weight percent of dispersant, 25 to 98 weight percent of solvent and 0.01 to 36 weight percent of additive, wherein the additive is one or a mixture of two or more of a surfactant, a reducer, a defoamer, an adhesive, a preservative and a humectants. Compared with the prior art, the low-temperature sintered conductive ink can reduce sintering temperature and keep the high conductivity of a wire. For example, at a sintering temperature of 150 DEG C, the conductive ink can make the resistance of a silver wire reach 10 to 7ohm.m. Therefore, the conductive ink can enlarge the range of substrates to which the conductive ink is applied in ink jet printing and reduce energy consumption, and has a great significance for the cost control and environmental protection of manufacturers.
Description
Technical field
The present invention relates to be used for the conductive ink of spray ink Printing, particularly the low temperature sintering conductive ink.
Background technology
Inkjet technology is the printing technique of a kind of contactless, no pressure, no forme, and widespread use at present in daily life.Inkjet technology can be applied in the flexible solid substrate, for example on various films and rough base, produce electrical element etc., so for the RFID tag that is in high-speed development period at present (RFID), printed circuit board (PCB) (PCB), flexible display, industries such as flexible solar photovoltaic cell, inkjet technology receives much concern.
With regard to board production, traditional method has methods such as etching and silk screen printing.Etching method is a kind of comparatively traditional manufacturing circuit card or has the method for the electronic circuit of certain flexibility, the operation that its etching subtracts needs a large amount of water for cleaning and solvent, seriously polluted, and material use efficiency is very low, has caused waste of raw materials and cost to rise; In addition, the etching method complex procedures, energy consumption is many.Compare with etching method, the advantage of silk screen print method is that its input to production unit is lower, and material use efficiency is also higher relatively, but silk screen print method still needs pallet in advance, and can't avoid the waste of slurry; In addition, silk screen print method still belongs to contact processing, and printing quality is relevant with several factors, the often difficult control of quality product.Ink-jet printing process belongs to contactless working method, is conductive particle to be scattered in solvent form electrically conductive ink, utilizes computer control, by printing type electrically conductive ink is accurately deposited to the needed position of substrate.On technology, ink-jet printing process is particluarly suitable for making on the flexible substrates electron device; From material, it can accomplish the almost utilization ratio of zero waste of raw metal; From the angle of environmental protection, it has avoided the desired a large amount of operations of etch process, thereby reduces discharging, reduces energy consumption.So ink-jet printing process is a Perfected process of realizing that the flexible substrates electronic circuit is made.
The key of ink-jet printing process is the preparation of various functional inks, and wherein conductive dispersions is an ink-jet printing ink, i.e. the preparation of conductive ink, basis wherein especially.The essence of conductive ink is the dispersion system of conductive particle, and common conductive particle has conductive polymer material, graphite-like, pottery and metal etc.Wherein, conductive polymer material, graphite-like, the general conductivity of ceramic conductive particle are relatively poor, are not suitable for use in the conducting wire.The metallic conduction particle has gold and silver, copper etc. to be commonly used for the metal of conductor, metal and their alloys such as iron, nickel, aluminium, zinc, lead.At present, more to the research of simple substance silver particle ink, stronger because simple substance silver has unreactiveness, be difficult for oxidized characteristics, when taking all factors into consideration conductivity, production and transport cost, use cost, the cost performance of silver-colored ink is higher.In addition, the research of elemental copper particle ink is also had relevant report, still, the chemical property of copper is comparatively active, is difficult for preparation and uses, and the requirement of equipment also than higher, thereby has been increased the complexity of application cost and total system.
The performance index of conductive ink mainly are: 1) electric conductivity: the ink that contains conductive particle generally will pass through solvent evaporates and agglomerating process after depositing to substrate with inkjet printing methods, form the successive electrical conductor, owing to have unavoidable impurities and space, and bigger resistance between particle, its electric conductivity is not as good as the pure metal conductor; 2) printability: the droplet volume that ejects during spray ink Printing generally below tens of skins rise, so require conductive ink to have good flowability and continuity, with the effect that guarantees to print; The characterization parameter of printability generally has stability, viscosity, surface tension, rate of drying, granular size and solids content etc.; 3) sintering characteristic: need after conductive ink is printed to remove or to reduce the content of solvent and other non-conductive additives, to sinter the low-melting-point nano metallic particles into continuous solid body simultaneously through heat treated; Sintering temperature, heat-up time and whether to need special gas environment etc. be the index of weighing sintering characteristic.
In general, improve the electric conductivity that sintering temperature can improve remaining solid metal behind the sintering to a certain extent, because temperature is high more, decomposition such as most of additive and solvent and evaporable speed are fast more, between the metal nanoparticle because the resistance that defective produces is also more little.But qualitative change at high temperature all takes place in most of flexible base materials easily, the variation that too high sintering temperature may make base material produce shape, color, snappiness etc., thus production and use are impacted.Therefore; conductive ink sintering at a lower temperature also can obtain good electroconductibility; can improve conductive ink greatly in all kinds of suprabasil universalities, reduce energy consumption simultaneously, crucial meaning be arranged for the cost control of manufacturing enterprise and the protection of bad border.
Chinese invention patent ublic specification of application CN101010388A discloses a kind of conductive ink, and its main component is a metal complex, and sintering temperature needs 200 ℃, and is still higher; In addition, the character of complex compound has limited the speed that resolves into metal simple-substance, promptly needs long calcination time.Chinese invention patent ublic specification of application CN101448904A discloses a kind of inkjet ink composition that contains high molecular weight linear, the satellite droplet that forms in the time of can reducing spray ink Printing, but this patent does not relate to the sintering process and the sintering temperature of electrically conductive ink.Chinese invention patent ublic specification of application CN1671805A discloses a kind of electrical-conductive nanometer metal ink preparation method who needs sintering temperature and low, but, the electrical-conductive nanometer metal ink of this method preparation is applicable to the coating process complete processing, is not the conductive ink in the inkjet technology.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of low temperature sintering conductive ink at the deficiencies in the prior art.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: the low temperature sintering conductive ink by weight percentage, comprises following component:
Nano-metal particle 1%～70%;
Dispersion agent 0.1%～10%;
Solvent 25%～98%;
Additive 0.01%～36%;
Wherein, additive is the one or more kinds of combinations in tensio-active agent, reductive agent, defoamer, tackiness agent, sanitas, the wetting Agent for Printing Inks.
For optimizing technique scheme, the measure of taking also comprises:
Above-mentioned additive comprises following component:
Tensio-active agent 0.1～10%;
Reductive agent 0.01%～10%;
Defoamer 0.01%～1%;
Tackiness agent 0.01%～5%;
Sanitas 0.01%～5%;
Wetting Agent for Printing Inks 0.01%～5%;
Above-mentioned nano-metal particle is a kind of or two or more compositions in gold and silver, copper, iron, nickel, aluminium, zinc, the lead; The size of above-mentioned nano-metal particle is 1nm～200nm;
Above-mentioned dispersion agent is the composition of micromolecular compound, macromolecular compound or described micromolecular compound and described macromolecular compound; Described micromolecular compound and described macromolecular compound contain a kind of element in aerobic, nitrogen, phosphorus, the element sulphur or two or more elements;
Above-mentioned micromolecular compound is alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid or the micromolecular compound that contains ring texture; Above-mentioned macromolecular compound is polyvinyl alcohol, polyoxyethylene glycol, polyvinylpyrrolidone, polymethyl acrylic acid, polymeric amide, polyaniline, polyethers, urethane, gelatin or Sudan Gum-arabic;
Compared with prior art, low temperature sintering conductive ink of the present invention can keep the lead excellent conducting performance when reducing sintering temperature, for example can make the resistivity of silver-colored lead reach 10 under 150 ℃ sintering temperature
-7Ω m, thereby can improve the substrate scope that conductive ink in the inkjet technology is used reduces energy consumption simultaneously, for the cost control and the environment protection of manufacturing enterprise crucial meaning is arranged.Can improve conductive ink greatly exists
Description of drawings
But Fig. 1 is the present invention's low-temperature sintering conductive ink conducts electricity particulate SEM picture before sintering;
But Fig. 2 is the SEM picture of the present invention's low-temperature sintering conductive ink at 150 ℃ of sintering conductive particle after 30 minutes.
Embodiment
Embodiment describes in further detail the present invention below in conjunction with accompanying drawing.
But Fig. 1 and Fig. 2 are the effect synoptic diagram of the present invention's low-temperature sintering conductive ink before and after sintering.
By weight percentage, low temperature sintering conductive ink of the present invention comprises following component: 1%～70% nano-metal particle, 0.1%～10% dispersion agent, 25%～98% solvent additive and 0.01%～36% additive; Wherein, additive is the one or more kinds of combinations in tensio-active agent, reductive agent, defoamer, tackiness agent, sanitas, the wetting Agent for Printing Inks.
A kind of optimum combination mode of additive is: comprise 0.1～10% tensio-active agent, 0.01%～10% reductive agent, 0.01%～1% defoamer, 0.01%～5% tackiness agent, 0.01%～5% sanitas and 0.01%～5% wetting Agent for Printing Inks.
Nano-metal particle is that gold and silver, copper etc. are commonly used for metal and their alloys such as the metal of conductor and iron, nickel, aluminium, zinc, lead.Nano-metal particle can be sheet, and needle-like is spherical, and is approximate spherical, flakey, dendroid or other arbitrary shapes and their combination.Nano-metal particle can be monocrystalline, polycrystalline or amorphous.Nano-metal particle is of a size of between 1nm～200nm, is preferably 10nm～100nm.The method for preparing nano-metal particle is not specifically limited, and can be vapor phase process, and the method that liquid phase method, mechanical process and other are used to prepare nanometer powder or colloidal sol prepares nano-metal particle.Nano-metal particle can cause particle surface or inner impure by surface oxidation, sulfuration or with other form doped with non-metals elements.These also can be kept by impure can being removed by subsequent technique that non-metallic element causes, but do not influence the electric conductivity of the conductor of final formation substantially.
The effect of dispersion agent be make nano-metal particle can be in solvent stable dispersion.Dispersion agent is micromolecular compound, macromolecular compound or their combination that contains one or more elements in the elements such as aerobic, nitrogen, phosphorus, sulphur.The micromolecular compound dispersion agent can be selected for use but be not limited to alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid, contains the micromolecular compound of ring texture and their ionic compound, for example an alkali metal salt and halogenide.The macromolecular compound dispersion agent is the macromolecular compound that contains element groups such as band oxygen, sulphur, phosphorus, nitrogen, can select for use but is not limited to polyvinyl alcohol, polyoxyethylene glycol, polyvinylpyrrolidone, polymethyl acrylic acid, polymeric amide, polyaniline, polyethers, urethane, gelatin, Sudan Gum-arabic etc.The molecular weight of macromolecule dispersing agent is 3000 to 1,000 ten thousand, preferred 3000 to 1,000,000.Dispersion agent can add in the metal nanoparticle preparation process, also can add in the building-up process of conductive ink.
In order to make conductive ink Fast Sintering at low temperatures, the consumption of dispersion agent can not be too high, otherwise its degradation speed will be affected.The usage quantity of dispersion agent is by the dispersion efficiency decision of this dispersion agent to metal nanoparticle, and for different metal nanoparticles, employed dispersion agent is also different.Contain the group that has the atom of strong complex ability with metal nanoparticle in the dispersion agent used in the present invention, so the usage quantity of dispersion agent can reduce.For example, silver nano-grain uses the macromolecule dispersing agent of nitrogen-containing group, and gold nano grain uses the macromolecule dispersing agent of sulfur-containing group.
Solvent can be water and organic solvent.Organic solvent can be selected for use but be not limited to ethanol, the 1-propyl alcohol, the 1-butanols, the 1-amylalcohol, the 1-hexanol, hexalin, the 1-enanthol, R-GLYCIDOL, benzylalcohol, methyl-cyclohexanol, 2-methyl-1-butene alcohol, 3-methyl-2-butanols, 4-methyl-2-amylalcohol, Virahol, 2-ethyl butanol, 2-Ethylhexyl Alcohol, sec-n-octyl alcohol, terpinol, dihydro-terpineol, 2-methyl cellosolve, cellosolvo, the 2-n-butoxy ethanol, the 2-phenoxyethyl alcohol, Trivalin SF, ethyl carbitol, the normal-butyl Trivalin SF, diacetone alcohol, heptane, octane, nonane, decane, undecane, dodecane, tridecane, the tetradecane, pentadecane, n-Hexadecane, the pyrroles, N-Methyl pyrrolidone, chloroform, benzene, toluene, among the dimethylbenzene etc. one or more are through the mixed solvent of proportioning.
Tensio-active agent is used to reduce the surface tension of ink, can be identical with dispersion agent, and also can be other tensio-active agent.Tensio-active agent can be non-ionic type, cationic, anionic and amphoteric ion type.Tensio-active agent can be selected for use but be not limited to stearic acid, oleic acid, lauric acid, Sodium dodecylbenzene sulfonate, trolamine, sodium laurylsulfate, sodium laurylsulfonate, quaternary ammonium compound, hydroxypropylcellulose, sodiun alginate, pectic acid sodium, Walocel MT 20.000PV, carboxymethyl starch, the methacrylic acid graft starch, the poly-acid of shell, vinylpyridine copolymer, polysiloxane, polyvinyl ether, polyvinyl alcohol, polyacrylamide, polymine, maleic acid and polyoxyethylene, polymine, polyoxypropylene, the segmented copolymer of polyoxy butylene or polystyrene etc.
Reductive agent is used for protecting the nano-metal particle at production, transportation and use conductive ink not oxidized, to guarantee the electric conductivity of the finished product.Reductive agent can be selected for use but be not limited to sodium borohydride, sodium hypophosphite, xitix, S-WAT, hydrazine hydrate, formic acid, oxalic acid, methyl sodium hydrosulfite, formaldehyde, zinc powder or iron powder etc.
Defoamer is used to eliminate the bubble that conductive ink in use produces, can select for use but be not limited to polysiloxane, polyethers, silicone emulsion, higher alcohols, tributyl phosphate, the fatty acid ester compounded thing of higher alcohols, polyoxypropylene, organic silicon modified by polyether and commercialization defoamer, as BYK series etc.
Tackiness agent is used to improve the lead that forms behind the conductive ink sintering and the sticking power between substrate.Tackiness agent can be selected for use but be not limited to resol, Resins, epoxy, Vinyl Acetate Copolymer, polyvinyl acetate, polyacrylic ester, chloroprene rubber, styrene-butadiene rubber(SBR), silicon rubber, starch, shellac etc.
Sanitas is used to keep conductive ink through long-time the stable of back performance of preserving.Sanitas can be selected for use but be not limited to Sodium Benzoate, potassium sorbate, dehydroacetic acid (DHA), Sodium dehydroacetate, parabens, sodium Diacetate, calcium propionate, Sodium.alpha.-hydroxypropionate, tennecetin, hydrogen peroxide etc.
Wetting Agent for Printing Inks is used to control conductive ink rate of drying in use, to guarantee better flowability of conductive ink and continuity.Wetting Agent for Printing Inks can be selected for use but be not limited to propylene glycol, glycerine, sorbyl alcohol, glycerol, polyoxyethylene glycol, hexylene glycol, Xylitol, polypropylene glycol etc.
Below be low temperature sintering conductive ink synthetic specific embodiment of the present invention, the present invention is suitable for but is not limited to these embodiment.Umber and percentage ratio are calculated by weight among each embodiment.
Embodiment 1:
With 10 parts ball shape silver powder, particle diameter is 50～80 nanometers, is dispersed in 70 parts the Virahol, and the molecular weight that adds 10 parts then is 10000 polyoxyethylene glycol, and with ultra-sonic dispersion after 30 minutes, centrifugal 10 minutes of 3000rpm filters then with gained solution; The glycerol that adds 5 parts after filtering in solution is as wetting Agent for Printing Inks, 1 part polysiloxane is as defoamer, and 2 parts Resins, epoxy is as tackiness agent, and 2 parts potassium sorbate is as sanitas, under 200rpm, stirred 30 minutes, promptly obtain the low temperature sintering conductive ink.
The above-mentioned conductive ink that takes a morsel uses field emission scanning electron microscope (SEM) to observe in oven dry under 100 ℃ after 1 hour, as shown in Figure 1, can see that the metallic particles in this conductive ink is discrete shape distribution.
The above-mentioned conductive ink for preparing is printed as pre-fabricated patterns by ink-jet printer (for example Epson ME1 ink-jet printer) on paper, and obtain sintered product after 30 minutes at 150 ℃ of following sintering, use SEM to observe this sintered product, as shown in Figure 2, the silver-colored particle in this conductive ink has sintered conductive silver wire into as can be seen.The resistivity of using four probe method to record this silver lead is 10
-7Ω m.
Embodiment 2:
20 parts of Silver Nitrates are dissolved in 50 parts of water, add 10 parts of molecular weight and be 100000 polyoxyethylene glycol, 500rpm stirs after 60 minutes heating in water bath to 50 ℃ to be continued to stir and drip 10 part of 50% sodium borohydride as reductive agent, drip the back and continue to stir 30 minutes, 3000rpm filters after centrifugal 30 minutes then; After the filtration gained solution was carried out electrodialysis 20 minutes, the glycerol that adds 5 parts again is as wetting Agent for Printing Inks, 1 part polysiloxane is as defoamer, 1 part stearic acid is as tensio-active agent, 2 parts Resins, epoxy is as tackiness agent, 1 part potassium sorbate is as sanitas, and 200rpm stirred 30 minutes then, promptly obtained the low temperature sintering conductive ink.
But above-mentioned low-temperature sintering conductive ink is printed as pre-fabricated patterns by the self-control ink-jet apparatus on paper, and obtain sintered product after 30 minutes at 150 ℃ of following sintering, use SEM to observe this sintered product, as shown in Figure 2, the silver-colored particle in this conductive ink has sintered conductive silver wire into as can be seen.The resistivity of using four probe method to record this silver lead is 10
-7Ω m.
Embodiment 3:
25 parts of Silver Nitrates are dissolved in 50 parts of water, add 10 parts of molecular weight and be 200000 polymethyl acrylic acid, 500rpm stirs and adds 2 parts of polysiloxane after 60 minutes as defoamer, 1000rpm stirs, add 10 part of 50% hydrazine hydrate again as reductive agent, continue to stir 10 minutes, 3000rpm filters after centrifugal 30 minutes then; Filter the back and add 3 parts of glycerol as wetting Agent for Printing Inks in gained solution, 1 part of potassium sorbate is as sanitas, and 200rpm stirred after 30 minutes, promptly obtained the low temperature sintering conductive ink.
Above-mentioned low temperature sintering conductive ink is printed as pre-fabricated patterns by home-built equipment on paper, and obtain sintered product after 30 minutes at 130 ℃ of following sintering, use SEM to observe this sintered product, the result is similar shown in Figure 2, silver-colored particle in this conductive ink has sintered conductive silver wire into as can be seen, obtain the conductive silver lead, the resistivity of using four probe method to record this silver lead is 10
-6Ω m.
Embodiment 4:
30 parts of Silver Nitrates are dissolved in 50 parts of water, add 10 parts of molecular weight and be 200000 polymethyl acrylic acid, 500rpm stirs and adds 1 part of polysiloxane after 60 minutes as defoamer, 1000rpm stirs, add 7 part of 50% hydrazine hydrate again as reductive agent, continue to stir 10 minutes, 3000rpm filtered in centrifugal 30 minutes then; Filter the back and add 1 part of glycerol as wetting Agent for Printing Inks in gained solution, 1 part of potassium sorbate is as sanitas, and 200rpm stirred after 30 minutes, promptly obtained the low temperature sintering conductive ink.
Above-mentioned ink is printed as pre-fabricated patterns by ink-jet printer Epson ME1 on paper, and obtain sintered product after 30 minutes at 140 ℃ of following sintering, use SEM to observe this sintered product, the result is similar shown in Figure 2, silver-colored particle in this conductive ink has sintered conductive silver wire into as can be seen, obtain the conductive silver lead, the resistivity of using four probe method to record this silver lead is 5 * 10
-7Ω m.
Embodiment 5:
Other condition is with embodiment 1, and different is that the ball shape silver powder among the embodiment 1 is got 50 parts, is dispersed in 30 parts the Virahol, the molecular weight that adds 10 parts is 10000 polyoxyethylene glycol, use ultra-sonic dispersion after 60 minutes gained solution, centrifugal 10 minutes of 3000rpm filters then; The glycerol that adds 5 parts after filtering in solution is as wetting Agent for Printing Inks, 1 part polysiloxane is as defoamer, and 2 parts Resins, epoxy is as tackiness agent, and 2 parts potassium sorbate is as sanitas, under 200rpm, stirred 30 minutes, promptly obtain the low temperature sintering conductive ink.
The above-mentioned conductive ink that takes a morsel uses SEM to observe in oven dry under 100 ℃ after 1 hour, as shown in Figure 1, can see that the metallic particles in this conductive ink is discrete shape distribution.
The above-mentioned conductive ink for preparing is printed as pre-fabricated patterns by ink-jet printer (for example Epson ME1 ink-jet printer) on paper, and obtain sintered product after 30 minutes at 150 ℃ of following sintering, use SEM to observe this sintered product, similar shown in Figure 2, the silver-colored particle in the conductive ink has sintered conductive silver wire into.The resistivity of using four probe method to record this silver lead is 10
-7Ω m.
Most preferred embodiment of the present invention is illustrated, and various variations or the remodeling made by those of ordinary skills can not depart from the scope of the present invention.
Claims (10)
1. low temperature sintering conductive ink by weight percentage, comprises following component:
Nano-metal particle 1%～70%;
Dispersion agent 0.1%～10%;
Solvent 25%～98%;
Additive 0.01%～36%;
Described additive is the one or more kinds of combinations in tensio-active agent, reductive agent, defoamer, tackiness agent, sanitas, the wetting Agent for Printing Inks.
2. low temperature sintering conductive ink according to claim 1 is characterized in that: by weight percentage, described additive comprises following component:
Tensio-active agent 0.1～10%;
Reductive agent 0.01%～10%;
Defoamer 0.01%～1%;
Tackiness agent 0.01%～5%;
Sanitas 0.01%～5%;
Wetting Agent for Printing Inks 0.01%～5%.
3. according to claim 1 or 2 described low temperature sintering conductive inks, it is characterized in that: described nano-metal particle is a kind of or two or more compositions in gold and silver, copper, iron, nickel, aluminium, zinc, the lead; The size of described nano-metal particle is 1nm～200nm.
4. low temperature sintering conductive ink according to claim 3 is characterized in that: described dispersion agent is the composition of micromolecular compound, macromolecular compound or described micromolecular compound and described macromolecular compound; Described micromolecular compound and described macromolecular compound contain a kind of element in aerobic, nitrogen, phosphorus, the element sulphur or two or more elements.
5. low temperature sintering conductive ink according to claim 4 is characterized in that: described micromolecular compound is alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid or the micromolecular compound that contains ring texture; Described macromolecular compound is polyvinyl alcohol, polyoxyethylene glycol, polyvinylpyrrolidone, polymethyl acrylic acid, polymeric amide, polyaniline, polyethers, urethane, gelatin or Sudan Gum-arabic.
6. low temperature sintering conductive ink according to claim 3 is characterized in that: described tensio-active agent is a stearic acid, oleic acid, lauric acid, Sodium dodecylbenzene sulfonate, trolamine, sodium laurylsulfate, sodium laurylsulfonate, quaternary ammonium compound, hydroxypropylcellulose, sodiun alginate, pectic acid sodium, Walocel MT 20.000PV, carboxymethyl starch, the methacrylic acid graft starch, the poly-acid of shell, vinylpyridine copolymer, polysiloxane, polyvinyl ether, polyvinyl alcohol, polyacrylamide, polymine, maleic acid and polyoxyethylene, polymine, polyoxypropylene, the segmented copolymer of polyoxy butylene or polystyrene.
7. low temperature sintering conductive ink according to claim 3 is characterized in that: described defoamer is polysiloxane, polyethers, silicone emulsion, higher alcohols, tributyl phosphate, the fatty acid ester compounded thing of higher alcohols, polyoxypropylene or organic silicon modified by polyether.
8. low temperature sintering conductive ink according to claim 3 is characterized in that: described tackiness agent is resol, Resins, epoxy, Vinyl Acetate Copolymer, polyvinyl acetate, polyacrylic ester, chloroprene rubber, styrene-butadiene rubber(SBR), silicon rubber, starch or shellac.
9. low temperature sintering conductive ink according to claim 3 is characterized in that: described wetting Agent for Printing Inks is propylene glycol, glycerine, sorbyl alcohol, glycerol, polyoxyethylene glycol, hexylene glycol, Xylitol or polypropylene glycol.
10. low temperature sintering conductive ink according to claim 3 is characterized in that: described solvent is a water, ethanol, the 1-propyl alcohol, the 1-butanols, the 1-amylalcohol, the 1-hexanol, hexalin, the 1-enanthol, R-GLYCIDOL, benzylalcohol, methyl-cyclohexanol, 2-methyl-1-butene alcohol, 3-methyl-2-butanols, 4-methyl-2-amylalcohol, Virahol, 2-ethyl butanol, 2-Ethylhexyl Alcohol, sec-n-octyl alcohol, terpinol, dihydro-terpineol, 2-methyl cellosolve, cellosolvo, the 2-n-butoxy ethanol, the 2-phenoxyethyl alcohol, Trivalin SF, ethyl carbitol, the normal-butyl Trivalin SF, diacetone alcohol, heptane, octane, nonane, decane, undecane, dodecane, tridecane, the tetradecane, pentadecane, n-Hexadecane, the pyrroles, N-Methyl pyrrolidone, chloroform, benzene, toluene, a kind of or two or more mixed solvents in the dimethylbenzene through proportioning.
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