CN101762596A - Wafer appearance detection method - Google Patents
Wafer appearance detection method Download PDFInfo
- Publication number
- CN101762596A CN101762596A CN 201010115406 CN201010115406A CN101762596A CN 101762596 A CN101762596 A CN 101762596A CN 201010115406 CN201010115406 CN 201010115406 CN 201010115406 A CN201010115406 A CN 201010115406A CN 101762596 A CN101762596 A CN 101762596A
- Authority
- CN
- China
- Prior art keywords
- wafer
- detection
- detection camera
- load plate
- driving device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a wafer appearance detection method, comprising the following steps: a transparent carrying tray of the wafer is driven to rotate by a rotation driving device, when the wafer is rotated to the position of a detection camera, the detection camera detects the wafer according to the presetting requirements and transmits detection result to an upper computer to analyze and judge whether the wafer is good product or defective product, the rotation driving device controls the start and stop and rotation according to the signal output by the upper computer; the wafer appearance detection method has the beneficial effects that: the transparent carrying tray is adopted to realize the detection of the upper and lower surfaces of the wafer without turning over the wafer, the wafer damage and pollution caused by turning over can be reduced; a unified template detection mode is adopted to reduce the inconsistence of the standards caused by manual detection; automatic detection mode is adopted; the device can realize continuous detection, improve the production efficiency and ensure the product quality.
Description
Technical field
The present invention relates to a kind of appearance detecting method, particularly relate to a kind of wafer appearance detection method.
Background technology
Along with the develop rapidly of quartz crystal industry, product type also more and more is tending towards miniaturization, and present outward appearance to quartz wafer detects to be in manually with the naked eye directly to be observed or observe with magnifier.Owing to there is subjective factor, everyone test stone can be different.And along with the miniaturization of product, artificial naked-eye observation difficulty is increasing, so manual detection can not satisfy the requirement of market and processes.
Summary of the invention
The objective of the invention is to overcome the deficiency of prior art, a kind of wafer appearance detection method that can discern automatically, detect quartz wafer in bulk is provided.
A kind of wafer appearance detection method of the present invention, it may further comprise the steps: its transparent load plate that is provided with wafer is by the rotating driving device driven rotary, when wafer rotates to the detection camera place, detection camera detects by pre-provisioning request wafer and testing result is reached the host computer analysis judges that wafer is non-defective unit or defective products, and described rotating driving device is according to its start-stop of signal controlling and the rotation of host computer output.
Beneficial effect of the present invention and advantage are: adopt transparent load plate to realize and need not can realize the upset of wafer the upper and lower surface of wafer is detected, reduced because upset causes damage and the pollution to wafer, and adopted unified template detection mode to reduce because the standard that manual detection causes is inconsistent; Adopt the robotization detection mode, and this device can realize continuous detecting, improve production efficiency, guarantee product quality.
Description of drawings
Accompanying drawing is the structural representation of checkout equipment of a kind of embodiment of wafer appearance detection method of the present invention.
Embodiment
Describe the present invention below in conjunction with the drawings and specific embodiments.
A kind of wafer appearance detection method of the present invention, it may further comprise the steps: its transparent load plate that is provided with wafer is by the rotating driving device driven rotary, when wafer rotates to the detection camera place, detection camera detects by pre-provisioning request wafer and testing result is reached the host computer analysis judges that wafer is non-defective unit or defective products, and described rotating driving device is according to its start-stop of signal controlling of host computer output.Described transparent load plate can adopt materials such as full transparent glass, plastic plate.
Shown in the drawingsly of the present inventionly a kind ofly to wafer by the embodiment that pre-provisioning request detects be: described detection camera comprises three, the top and the second detection camera 1-5 that the first detection camera 1-2 and the 3rd detection camera 1-6 are arranged on transparent load plate 1-7 are provided with thereunder, each described detection camera and charging hole to be centered close to transparent load plate 1-7 rotation center be on the same circumference in the center of circle, the detection of described first to the 3rd detection camera may further comprise the steps: (a) transparent load plate 1-7 drives by rotating driving device and is rotated, wafer is rotated under the first detection camera 1-2, the first detection camera 1-2 detects the wafer appearance size, and testing result is reached host computer; (b) transparent load plate 1-7 drives by rotating driving device and is rotated, and wafer is rotated to directly over the second detection camera 1-5, and the second detection camera 1-5 carries out the lower surface outward appearance to wafer and detects, and testing result is reached host computer; (c) transparent load plate 1-7 drives by rotating driving device and is rotated, and wafer is rotated under the positive 1-6 of the 3rd detection camera, and the 3rd detection camera 1-6 carries out the upper surface outward appearance to wafer and detects, and testing result is reached host computer; The position of perhaps described first detection camera, second detection camera, the 3rd detection camera and the sequencing of detection according to (b), (c), (a) or (c) (b) (a) adjust.
Described rotating driving device can comprise the CD-ROM drive motor that links to each other with the signal output part of host computer, and the output shaft of described CD-ROM drive motor is vertically connected on the middle shaft position of described transparent load plate 1-7.Certain described rotating driving device also can be structures such as motor-gear.
Can be respectively arranged with light source 1-3 and following light source 1-4 on the corresponding position of described first to the 3rd detection camera, be used for wafer illuminated and be convenient to camera and get phase.
Preferably in the camera testing process, it is the rotation continuously in the camera testing process of described transparent load plate that the rotation of transparent load plate employing does not stop to get the image mode detection, improves detection efficiency.
Embodiment 1
Its transparent load plate 1-7 that is provided with wafer is by the rotating driving device driven rotary, and at first wafer rotates under the first detection camera 1-2, and the first detection camera 1-2 detects the wafer appearance size, and testing result is reached host computer; Wafer rotates to directly over the second detection camera 1-5 then, and the second detection camera 1-5 carries out the lower surface outward appearance to wafer and detects, and testing result is reached host computer; Final wafer rotates under the 3rd detection camera 1-6, and the 3rd detection camera 1-6 carries out the upper surface outward appearance to wafer and detects, and testing result is reached host computer; Host computer judges that according to the input signal analysis of first to the 3rd detection camera wafer is non-defective unit or defective products, and described rotating driving device is according to its start-stop of signal controlling and the rotation of host computer output.
Adopt transparent load plate to realize and to realize the upset of wafer the upper and lower surface of wafer is detected in the method, reduced because upset causes damage and the pollution to wafer, and adopted unified template detection mode to reduce because the standard that manual detection causes is inconsistent; Adopt the robotization detection mode, and this device can realize continuous detecting, improve production efficiency, guarantee product quality.
Claims (3)
1. wafer appearance detection method, it is characterized in that it may further comprise the steps: its transparent load plate (2-7) that is provided with wafer is by the rotating driving device driven rotary, when wafer rotates to the detection camera place, detection camera detects by pre-provisioning request wafer and testing result is reached the host computer analysis judges that wafer is non-defective unit or defective products, and described rotating driving device is according to its start-stop of signal controlling and the rotation of host computer output.
2. wafer appearance detection method according to claim 1, it is characterized in that: described detection camera comprises three, top and second detection camera (2-5) that first detection camera (2-2) and the 3rd detection camera (2-6) are arranged on transparent load plate (2-7) are provided with thereunder, each described detection camera and charging hole to be centered close to transparent load plate (2-7) rotation center be that the detection of described first to the 3rd detection camera may further comprise the steps on the same circumference in the center of circle:
(a) transparent load plate 2-7 drives by rotating driving device and is rotated, and wafer is rotated under first detection camera (2-2), and first detection camera (2-2) detects the wafer appearance size, and testing result is reached host computer;
(b) transparent load plate (2-7) drives by rotating driving device and is rotated, and wafer is rotated to directly over second detection camera (2-5), and second detection camera (2-5) is carried out the lower surface outward appearance to wafer and detected, and testing result is reached host computer;
(c) transparent load plate (2-7) drives by rotating driving device and is rotated, and wafer is rotated under the 3rd detection camera (2-6), and the 3rd detection camera (2-6) is carried out the upper surface outward appearance to wafer and detected, and testing result is reached host computer;
The position of perhaps described first detection camera, second detection camera, the 3rd detection camera and the sequencing of detection according to (b), (c), (a) or (c) (b) (a) adjust.
3. wafer appearance detection method according to claim 2 is characterized in that: described transparent load plate is rotation continuously in the camera testing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010115406 CN101762596A (en) | 2010-03-01 | 2010-03-01 | Wafer appearance detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010115406 CN101762596A (en) | 2010-03-01 | 2010-03-01 | Wafer appearance detection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101762596A true CN101762596A (en) | 2010-06-30 |
Family
ID=42493887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010115406 Pending CN101762596A (en) | 2010-03-01 | 2010-03-01 | Wafer appearance detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101762596A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106153630A (en) * | 2015-04-27 | 2016-11-23 | 昆山市和博电子科技有限公司 | Chip-R detection device |
| CN106338516A (en) * | 2016-09-21 | 2017-01-18 | 侯豫 | Visual inspection equipment of commutator |
| CN107020249A (en) * | 2017-04-19 | 2017-08-08 | 苏州日和科技有限公司 | Liquid crystal panel AOI equipment with automatic identification function |
| CN112255245A (en) * | 2020-12-21 | 2021-01-22 | 惠州高视科技有限公司 | Method and device for detecting appearance defects of front and back surfaces of Mini LED wafer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1968876A (en) * | 2004-04-13 | 2007-05-23 | Tdk株式会社 | Chip part conveyance method, its device, appearance inspection method, and its device |
| TWM366668U (en) * | 2009-06-22 | 2009-10-11 | lian-heng Liao | High speed appearance inspection device for chip-type components |
-
2010
- 2010-03-01 CN CN 201010115406 patent/CN101762596A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1968876A (en) * | 2004-04-13 | 2007-05-23 | Tdk株式会社 | Chip part conveyance method, its device, appearance inspection method, and its device |
| TWM366668U (en) * | 2009-06-22 | 2009-10-11 | lian-heng Liao | High speed appearance inspection device for chip-type components |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106153630A (en) * | 2015-04-27 | 2016-11-23 | 昆山市和博电子科技有限公司 | Chip-R detection device |
| CN106338516A (en) * | 2016-09-21 | 2017-01-18 | 侯豫 | Visual inspection equipment of commutator |
| CN107020249A (en) * | 2017-04-19 | 2017-08-08 | 苏州日和科技有限公司 | Liquid crystal panel AOI equipment with automatic identification function |
| CN112255245A (en) * | 2020-12-21 | 2021-01-22 | 惠州高视科技有限公司 | Method and device for detecting appearance defects of front and back surfaces of Mini LED wafer |
| CN112255245B (en) * | 2020-12-21 | 2021-04-27 | 惠州高视科技有限公司 | Method and device for detecting appearance defects of front and back surfaces of Mini LED wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201653918U (en) | Chip appearance detection device | |
| CN202330294U (en) | Surface defect detection device based on machine vision | |
| CN204718970U (en) | Product appearance inspection device | |
| CN103090804B (en) | Automatic detection system and detection method of finished product magnet ring image | |
| CN102226688A (en) | Automatic detection system of engine piston ring | |
| CN104375293A (en) | Automatic LCD screen detecting cabinet based on machine vision | |
| CN102374996B (en) | Multicast detection device and method for full-depth tooth side face defects of bevel gear | |
| CN203203942U (en) | Wafer defect detection machine table | |
| CN101762596A (en) | Wafer appearance detection method | |
| CN103175847A (en) | Grating surface blemish detection device | |
| CN104458763A (en) | Wide-view surface defect detector | |
| CN109406526A (en) | A kind of resin lens smog defect detecting device | |
| CN103439339B (en) | Be pasted with defect detecting device and the defect inspection method of the liquid crystal panel of polaroid | |
| CN204178077U (en) | Based on the station dial point screen system of the LCD screen of machine vision | |
| CN104527193A (en) | Image system laminator | |
| CN201368855Y (en) | High precision ceramic pipe visual detector | |
| CN103913459A (en) | Lamp head tin scolding contact qualified rate detecting device and method | |
| CN204255875U (en) | Butyl rubber plug surface defects detection screening installation | |
| CN206146852U (en) | Glass limit defect detecting of portion device and system | |
| CN209215247U (en) | A kind of glass insulator quality inspection device | |
| CN203231985U (en) | Toughened glass bead defect detecting device | |
| US8610889B2 (en) | Automated optical inspection device and calibration method thereof | |
| CN204229076U (en) | A kind of testing agency of liquid crystal module screen | |
| CN204287067U (en) | Wide visual field surface defect detection apparatus | |
| CN205146709U (en) | Detection apparatus for nonconforming product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100630 |