CN101722468A - Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device - Google Patents
Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device Download PDFInfo
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- CN101722468A CN101722468A CN200810201826A CN200810201826A CN101722468A CN 101722468 A CN101722468 A CN 101722468A CN 200810201826 A CN200810201826 A CN 200810201826A CN 200810201826 A CN200810201826 A CN 200810201826A CN 101722468 A CN101722468 A CN 101722468A
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- lapping liquid
- grinding pad
- grinding
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Abstract
The invention provides a chemical mechanical polishing method, a grinding fluid nozzle and a chemical mechanical polishing device with the view to improving polishing effect.In the polishing method, a rotary polishing pad is applied to polish wafers, comprising the following steps: spraying polishing fluid into more than two positions on the polishing pad, wherein the more than two positions are located at different circles of the polishing pad; then polishing wafers under the action of the polishing fluid.The nozzle is used in the chemical mechanical polishing process in which rotary polishing pad is used for polishing the wafers. The nozzle is provided with more than two spouts, polishing fluid of each spout is located at more than two positions of the polishing pad, the more than two positions is located at different circles.
Description
Technical field
The present invention relates to semiconductor applications, relate in particular to chemical and mechanical grinding method, lapping liquid nozzle and chemical-mechanical grinding device.
Background technology
For making chip surface smooth and smooth, in ic manufacturing process, need grind chip usually.Generally be to use cmp (CMP) method to realize process of lapping at present, its principle is to grind by chemical reaction and mechanism to divest the unnecessary film that is deposited on chip surface, makes the chip surface smooth planar.
Fig. 1 is the physical equipment schematic diagram of existing CMP, and number in the figure 10 is represented the lapping liquid nozzle, and label 11 is represented lapping liquid, and label 12 representatives are positioned at the grinding pad on the turntable, the chip that label 13 representatives need be ground, and label 14 is the groove of grinding pad.The process of CMP is: lapping liquid nozzle 10 is to grinding pad 12 ejection lapping liquids 11, and lapping liquid 11 is again to the periphery diffusion, and each groove 14 generally all has lapping liquid to distribute; When grinding pad 12 rotations, grinding pad 12 grinds chip 13 by lapping liquid 11 effects.
But grind by said method, have following problems:
The one, grinding pad 12 is using after a period of time, because lapping liquid 11 sprays into the shown position on grinding pad 12 all the time, because grinding pad 12 rotations, so this position is to there being a circumference, circumference is interpreted as possessing the circumference of certain live width herein, and described live width is about the diameter that grinds drop 11.On this circumference, because lapping liquid 11 sprays into for a long time, will have a lot of lapping liquid 11 residual lapping liquid particulates that are condensed into, this with the surface of possibility defective chip 13, causes the chip 13 of grinding place that problems such as cut are arranged when grinding.
The 2nd, because lapping liquid 11 is these circumferential periphery diffusions that spray into from described, therefore in other different circumference places, the distribution difference of lapping liquid 11, the closer to this circumference, lapping liquid distributes many more, more away from this circumference, lapping liquid distributes few more, and this will influence the smoothness of the chip surface after grinding.
Above-mentioned two problems has all reduced grinding effect.
Summary of the invention
The invention provides chemical and mechanical grinding method, lapping liquid nozzle and milling apparatus, to improve grinding effect.
The present invention proposes chemical and mechanical grinding method, adopt the grinding pad grinding chip of rotation, this method comprises: two above positions spray into lapping liquid on grinding pad, and described two above positions are in the different circumference of grinding pad; Grinding chip under the effect of lapping liquid.
The invention allows for the lapping liquid nozzle, use is in chemical mechanical planarization process, described chemical mechanical planarization process adopts the grinding pad grinding chip of rotation, described nozzle possesses two above spouts, the lapping liquid of each spout ejection is sprayed on two above positions of grinding pad, and described two above positions are in the different circumference of grinding pad.
The invention allows for chemical-mechanical grinding device, comprise the lapping liquid nozzle, in chemical mechanical planarization process, described lapping liquid nozzle possesses two above spouts, the lapping liquid of each spout ejection is sprayed on two above positions of grinding pad, and described two above positions are in the different circumference of grinding pad.
The invention allows for the lapping liquid nozzle, use is in chemical mechanical planarization process, described chemical mechanical planarization process adopts the grinding pad grinding chip of rotation, described nozzle possesses the slit-type spout, be sprayed on two above positions of grinding pad by the lapping liquid of described slit-type spout ejection, described two above positions are positioned at the different circumference of grinding pad.
The invention allows for chemical-mechanical grinding device, comprise the lapping liquid nozzle, in chemical mechanical planarization process, described lapping liquid nozzle possesses the slit-type spout, be sprayed on two above positions of grinding pad by the lapping liquid of described slit-type spout ejection, described two above positions are positioned at the different circumference of grinding pad.
The present invention sprays into lapping liquid by two above positions to grinding pad, and under the effect of lapping liquid, grinding chip, make on the one hand compared with prior art, spray under the situation of lapping liquid of equal number, make the lapping liquid particulate that condenses on the grinding pad reduce, make the lapping liquid on the grinding pad distribute comparatively even on the other hand, so solved the more and lapping liquid skewness of above-mentioned lapping liquid particulate in the prior art, cause the relatively poor problem of grinding effect, improved grinding effect.
Description of drawings
Fig. 1 is the physical equipment schematic diagram of existing CMP;
Fig. 2 is the flow chart of the CMP method of embodiment of the invention proposition;
Fig. 3 is first kind of schematic diagram that sprays into direction of lapping liquid in the embodiment of the invention;
Fig. 4 A～4C is several schematic diagrames that spray into direction of lapping liquid in the embodiment of the invention;
Fig. 5 is first kind of structure of nozzle schematic diagram in the embodiment of the invention;
Fig. 6 is second kind of structure of nozzle schematic diagram in the embodiment of the invention.
The specific embodiment
In the existing CMP process, because lapping liquid nozzle 10 is when spraying into lapping liquid 11, be that lapping liquid 11 is sprayed on some circumference of grinding pad 12, therefore after grinding a period of time, on this circumference cohesion there are more lapping liquid 11 particulates, make problems such as in follow-up process of lapping, will on chip, producing cut, reduce grinding effect, in addition, because only from this circumferential circumference on every side diffusion, therefore in zones of different, the distributional difference of lapping liquid is bigger for lapping liquid 11, this makes that the flatness of grinding the back chip is not good, and above-mentioned two problems has all reduced grinding effect.According to above-mentioned analysis, the embodiment of the invention proposes in the CMP process, lapping liquid 11 can be sprayed into a plurality of positions of grinding pad 12, like this can be under the effect of grinding pad 12 rotations, lapping liquid 11 is injected to a plurality of circumference, thereby under the situation of the lapping liquid 11 that sprays into equal number, the residual lapping liquid 11 that condenses on each circumference will reduce, and lapping liquid 11 can diffuse on grinding pad 12 other circumference from described a plurality of circumference, make on the grinding pad 12 lapping liquid 11 everywhere distribute more even, can improve grinding effect, also prolong the service life of grinding pad, improve the utilization rate of grinding pad.
According to above-mentioned idea, the embodiment of the invention has proposed following CMP method, to improve grinding effect.
Fig. 2 is the flow chart of the CMP method of embodiment of the invention proposition, and in conjunction with this figure as can be known, the CMP method that the embodiment of the invention proposes comprises:
Step 1, a plurality of positions spray into lapping liquid on grinding pad, and described a plurality of positions are in the different circumference of grinding pad;
Described a plurality of position can be continuous, also can disperse, and will propose respective nozzles in view of the above below, herein schematic illustration only.The direction that sprays into lapping liquid to grinding pad can have multiple in addition, no matter lapping liquid is sprayed into described a plurality of position from which angle, compared with prior art, can both reduce the lapping liquid that condenses on each circumference of each position correspondence on the grinding pad and improve the distribution consistency degree of lapping liquid on grinding pad, thereby improve grinding effect.Certainly spray into grinding pad at some specific direction, can make that grinding effect is better, follow-up will elaborating.
Step 2, under the effect of lapping liquid, grinding chip.
Following basis sprays into the difference of direction, provides a plurality of embodiment of such scheme.
Embodiment one, a plurality of positions on the grinding pad are sprayed into lapping liquid from direction perpendicular to grinding pad.
Fig. 3 is first kind of schematic diagram that sprays into direction of lapping liquid in the embodiment of the invention, and this figure is for the direction that sprays into of lapping liquid is described, for other details, and the position number that for example sprays into, spraying into height and lapping liquid structure of nozzle etc. can not be by this figure restriction.In fact, the position number that sprays into, spraying into highly can be in implementation process, according to the actual conditions adjustment; For the lapping liquid structure of nozzle, the embodiment of the invention will provide several examples follow-up, no longer set forth herein.
When lapping liquid sprays into grinding pad 12 via direction as shown, because lapping liquid is directly vertically to spray into more than 12 position of grinding pad, therefore except possessing above-mentioned technique effect, also the lapping liquid particulate that condenses on the circumference to each position correspondence has bigger percussion, especially under the situation of grinding pad 12 rotations, further reduced the lapping liquid particulate of cohesion, improved grinding effect, in addition owing to be that lapping liquid is sprayed into more than 12 position of grinding pad, therefore the lapping liquid distribution will be much at one on the grinding pad 12, so from this two aspect, follow-up grinding effect will improve greatly.
Embodiment two, from the direction that favours grinding pad a plurality of positions on the grinding pad sprayed into lapping liquid.
According to the incline direction difference, embodiment two has multiple situation, and the grinding effect under the various situations is also had any different.Fig. 4 A～4C is several schematic diagrames that spray into direction of lapping liquid in the embodiment of the invention.
Direction shown in Fig. 4 A favours surface, grinding pad 12 place, and described incline direction is identical with the direction of grinding pad 12 rotations in this surperficial projection.Therefore reaching the situation that improve grinding effect under because lapping liquid sprays into from described incline direction, and lapping liquid 41 will seldom can spill grinding pad 12 this moment, can improve the service efficiency of lapping liquid.
Direction shown in Fig. 4 B favours surface, grinding pad 12 place, and described incline direction is opposite with the direction of grinding pad 12 rotations in this surperficial projection; This moment, grinding pad 12 had bigger percussion with lapping liquid, helps significantly reducing the residual cohesion of lapping liquid, improves grinding effect greatly because lapping liquid sprays into from described incline direction.
Direction shown in Fig. 4 C favours grinding pad 12 surfaces, and described incline direction is vertical with the direction of grinding pad 12 rotations in this surperficial projection.In this case, because lapping liquid sprays into from described incline direction, deflection grinding pad 12 radially, therefore for the residual lapping liquid in trench bottom surfaces on the grinding pad 12 and the sidewall intersecting area better removal effect can be arranged, can prevent more that also lapping liquid from condensing upon on the grinding pad 12, helps significantly improving grinding effect.
Except above-mentioned direction, all the other incline directions also can be implemented, and for for simplicity, repeat no more herein.In addition, the angle of above-mentioned incline direction can have multiple, is 45 degree etc. with described surperficial angle for example, and described angle can be adjusted according to actual performance when implementing.
Above-mentioned is that basis sprays into the embodiment that direction provides, and reality can also be adjusted as required and spray into direction in the CMP process, sprays into the beneficial effect that direction is brought to make full use of each, further improves grinding effect.Certainly, this set-up procedure is that optionally if do not adjust, compared with prior art, its grinding effect also will significantly improve.
The embodiment of the invention also proposes new lapping liquid nozzle, and this nozzle can spray into lapping liquid in a plurality of positions on grinding pad, and described a plurality of positions are in the different circumference of grinding pad, therefore uses this nozzle in the CMP process, can improve grinding effect.Spray into the direction difference of lapping liquid to grinding pad according to this nozzle; provide a plurality of structure of nozzle below the embodiment of the invention; but this does not limit the embodiment of the invention and proposes nozzle arrangements, in fact, can spray into the nozzle of lapping liquid all in protection scope of the present invention to a plurality of positions of grinding pad.
Embodiment one, this nozzle possess a plurality of spouts, and be preferable, and described spout is arranged in parallel.Fig. 5 is first kind of structure of nozzle schematic diagram in the embodiment of the invention, and in conjunction with this figure as can be known, by the parallel spout 51 of a row, nozzle 50 can directly spray into lapping liquid to grinding pad, has solved prior art problems.In addition, described spout 51 is arranged in parallel, and makes that the lapping liquid distribution on the grinding pad is very even, so further improved grinding effect.Spout 51 can be determined when implementing with the angle on surface, grinding pad place among the figure, and it is 45 degree with reference to angle that present embodiment provides one.
The incline direction of spout 51 can be opposite with the grinding pad direction of rotation among this embodiment, in fact, as described in above-mentioned method embodiment, its direction has multiple choices, this spout also can be perpendicular to grinding pad in addition, spout among this embodiment 51 can be set to change the spout of direction in addition, spray into direction so that in implementation process, adjust lapping liquid.
Embodiment two, and this nozzle possesses a spout, and this spout is a slit-shaped, also can spray into lapping liquid in a plurality of positions on grinding pad, and this moment, these a plurality of positions can be understood as continuous.Fig. 6 is second kind of structure of nozzle schematic diagram in the embodiment of the invention, and in conjunction with this figure as can be known, by spout 61 being set to the shape of slit, this nozzle 60 can spray into lapping liquid to a plurality of positions equally, solves prior art problems.Equally, similar to the aforementioned embodiment according to the difference of this spout direction 61, it possesses corresponding different-effect, no longer elaborates here.
The embodiment of the invention has also proposed CMP equipment, this equipment adopts the nozzle in the foregoing description, can on grinding pad, spray into lapping liquid in a plurality of positions, described a plurality of position is in the different circumference of grinding pad, under the situation that sprays into the equal number lapping liquid, make the lapping liquid particulate of residual cohesion on each place, position circumference reduce, and can improve the distribution consistency degree of lapping liquid on grinding pad, therefore compare with existing CMP equipment, can improve grinding effect greatly, and according to the different structure of nozzle, this CMP equipment also has corresponding effects.
For example this CMP equipment is in the CMP process, can spray into lapping liquid to a plurality of positions of grinding pad by direction perpendicular to grinding pad, a plurality of positions that also can be grinding pad from the direction that favours grinding pad spray into lapping liquid, and for example from miter angle direction etc., this all will improve grinding effect.
In this external CMP process, this CMP equipment can also be adjusted the direction that sprays into of lapping liquid, to make full use of the beneficial effect that sprays into the lapping liquid correspondence from all directions, solves the prior art problem, improves grinding effect as far as possible.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (16)
1. a chemical and mechanical grinding method adopts the grinding pad grinding chip that rotates; It is characterized in that, comprising:
Two above positions spray into lapping liquid on grinding pad, and described two above positions are in the different circumference of grinding pad;
Under the effect of lapping liquid, grinding chip.
2. the method for claim 1 is characterized in that, sprays into lapping liquid along the direction perpendicular to grinding pad.
3. the method for claim 1 is characterized in that, sprays into lapping liquid along the direction that favours grinding pad.
4. method as claimed in claim 3 is characterized in that, described incline direction is in the projection of grinding pad, and is opposite with the grinding pad direction of rotation.
5. method as claimed in claim 3 is characterized in that, described incline direction is in the projection of grinding pad, and is identical with the grinding pad direction of rotation.
6. method as claimed in claim 3 is characterized in that, described incline direction is in the projection of grinding pad, and is vertical with the grinding pad direction of rotation.
7. the method for claim 1 is characterized in that, also comprises adjusting the step that lapping liquid sprays into direction.
8. lapping liquid nozzle, use is in chemical mechanical planarization process, described chemical mechanical planarization process adopts the grinding pad grinding chip of rotation, it is characterized in that, described nozzle possesses two above spouts, the lapping liquid of each spout ejection is sprayed on two above positions of grinding pad, and described two above positions are in the different circumference of grinding pad.
9. nozzle as claimed in claim 8 is characterized in that, described two above spouts are arranged in parallel, and favour the grinding pad miter angle.
10. nozzle as claimed in claim 8 is characterized in that, described two above spouts are arranged in parallel, and perpendicular to grinding pad.
11. chemical-mechanical grinding device, comprise the lapping liquid nozzle, it is characterized in that, in chemical mechanical planarization process, described lapping liquid nozzle possesses two above spouts, the lapping liquid of each spout ejection is sprayed on two above positions of grinding pad, and described two above positions are in the different circumference of grinding pad.
12. equipment as claimed in claim 11 is characterized in that, described two above spouts are arranged in parallel, and favour the grinding pad miter angle.
13. lapping liquid nozzle, use is in chemical mechanical planarization process, described chemical mechanical planarization process adopts the grinding pad grinding chip of rotation, it is characterized in that, described nozzle possesses the slit-type spout, be sprayed on two above positions of grinding pad by the lapping liquid of described slit-type spout ejection, described two above positions are positioned at the different circumference of grinding pad.
14. nozzle as claimed in claim 13 is characterized in that, described nozzle can be adjusted the direction that sprays into of lapping liquid.
15. chemical-mechanical grinding device, comprise the lapping liquid nozzle, it is characterized in that, in chemical mechanical planarization process, described lapping liquid nozzle possesses the slit-type spout, be sprayed on two above positions of grinding pad by the lapping liquid of described slit-type spout ejection, described two above positions are positioned at the different circumference of grinding pad.
16. equipment as claimed in claim 15 is characterized in that, described nozzle can be adjusted the direction that sprays into of lapping liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810201826A CN101722468A (en) | 2008-10-27 | 2008-10-27 | Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN200810201826A CN101722468A (en) | 2008-10-27 | 2008-10-27 | Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device |
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| CN101722468A true CN101722468A (en) | 2010-06-09 |
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| CN200810201826A Pending CN101722468A (en) | 2008-10-27 | 2008-10-27 | Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887865A (en) * | 2019-03-07 | 2019-06-14 | 上海华力微电子有限公司 | A kind of wafer cleaning drying device, method and work-table of chemicomechanical grinding mill |
| CN113798998A (en) * | 2021-08-04 | 2021-12-17 | 山西光兴光电科技有限公司 | Cleaning device for grinding workbench and grinding system |
| CN114227527A (en) * | 2020-09-09 | 2022-03-25 | 中国科学院微电子研究所 | Grinding reagent and preparation method thereof, and chemical mechanical grinding method and device thereof |
| CN115890456A (en) * | 2022-12-29 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Polishing liquid supply device, polishing equipment and polishing method |
-
2008
- 2008-10-27 CN CN200810201826A patent/CN101722468A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887865A (en) * | 2019-03-07 | 2019-06-14 | 上海华力微电子有限公司 | A kind of wafer cleaning drying device, method and work-table of chemicomechanical grinding mill |
| CN114227527A (en) * | 2020-09-09 | 2022-03-25 | 中国科学院微电子研究所 | Grinding reagent and preparation method thereof, and chemical mechanical grinding method and device thereof |
| CN113798998A (en) * | 2021-08-04 | 2021-12-17 | 山西光兴光电科技有限公司 | Cleaning device for grinding workbench and grinding system |
| CN115890456A (en) * | 2022-12-29 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Polishing liquid supply device, polishing equipment and polishing method |
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Application publication date: 20100609 |