CN101692446B - Organic electro-stimulation luminous element encapsulation and encapsulating method thereof - Google Patents
Organic electro-stimulation luminous element encapsulation and encapsulating method thereof Download PDFInfo
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- CN101692446B CN101692446B CN2009101797960A CN200910179796A CN101692446B CN 101692446 B CN101692446 B CN 101692446B CN 2009101797960 A CN2009101797960 A CN 2009101797960A CN 200910179796 A CN200910179796 A CN 200910179796A CN 101692446 B CN101692446 B CN 101692446B
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Abstract
The invention provides an organic electro-stimulation luminous element encapsulation, which comprises a substrate, a plurality of organic electro-stimulation luminous elements, a transparent cover plate, a plurality of frame rubbers and a plurality of optical filling rubber matrixes. The organic electro-stimulation luminous elements are arranged on the substrate. The transparent cover plate is deployed on the substrate to cover the organic electro-stimulation luminous elements, wherein the transparent cover is provided with a plurality of grooves positioned above the organic electro-stimulation luminous elements for accommodating the organic electro-stimulation luminous elements respectively. The frame rubbers are deployed between the substrate and the transparent cover plate, and each frame rubber encircles one of the organic electro-stimulation luminous elements. Each optical filling rubber matrix is filled in one of the grooves and a space encircled by the corresponding frame rubber respectively, and wraps one of the organic electro-stimulation luminous elements. Moreover, the invention also provides an encapsulating method for the organic electro-stimulation luminous elements.
Description
Technical field
The present invention relates to a kind of organic electroluminescent element (organic electro-luminescent device) encapsulation and method for packing thereof, and be particularly related to a kind of organic electroluminescent element encapsulation and method for packing thereof that is easy to produce in batches.
Background technology
Along with the demand of the flourish and portable electronic product of electronic product increases day by day, the performance of the display of electronic product on reaction speed, resolution, image quality comes into one's own gradually.Except need possessed multiple function, in light weight, volume is little also to be one of emphasis of electronic product research and development.Because organic electro-luminescent display is the display of self-luminous kenel, do not need backlight module, so organic electro-luminescent display extremely meets the requirement of electronic product at aspects such as in light weight and volume are little.
General organic electro-luminescent display can be divided into bottom-emission type (bottomemission) organic electro-luminescent display and top emission type (top emission) organic electro-luminescent display haply.Common bottom-emission type organic electro-luminescent display uses ultraviolet colloid and drier to intercept aqueous vapor mostly and enters in the packaging body of organic electro-luminescent display, but, because the light emission direction of top emission type organic electro-luminescent display is different from the light emission direction of bottom-emission type organic electro-luminescent display, therefore, the drier of meeting shield lights can't use in the encapsulation process of top emission type organic electro-luminescent display.Common top emission type organic electro-luminescent display adopts laser package technology (laser frit) and cofferdam filling technique (dam and fill) more at present.Yet above-mentioned two kinds of technical costss that are used to encapsulate the top emission type organic electro-luminescent display are higher, and need higher processing precise degree.
Summary of the invention
The invention provides a kind of organic electroluminescent element encapsulation and method for packing thereof, effectively to cut down finished cost and the processing difficulties degree.
The invention provides a kind of organic electroluminescent element encapsulation, it comprises a substrate, a plurality of organic electroluminescent element, a transparent cover plate, a plurality of frame glue and a plurality of optical filling colloid (optical fill).Organic electroluminescent element is disposed on the substrate.Transparent cover plate is disposed on the substrate to cover organic electroluminescent element, wherein have a plurality of grooves that are positioned at the organic electroluminescent element top in the transparent cover plate, to hold organic electroluminescent element respectively, described groove is to remove or dig transparent mother metal partly by the transparent mother metal that will have same thickness on its ad-hoc location to form, so that described transparent cover plate presents different-thickness in zones of different, wherein the position of thinner thickness is described groove, and the position that thickness is thicker then constitutes the sidewall of described groove.Frame glue is disposed between substrate and the transparent cover plate, and each frame glue lay respectively at described groove sidewall the top and around one of them organic electroluminescent element.Each optical filling colloid be filled in respectively one of them groove and corresponding frame rubber around the space in, and coat one of them organic electroluminescent element.
In one embodiment of this invention, each organic electroluminescent element comprises one first electrode layer, an organic electric-excitation luminescent layer and a second electrode lay.First electrode layer is disposed on the substrate, and the organic electric-excitation luminescent layer is disposed on first electrode layer, and the second electrode lay is disposed on the organic electric-excitation luminescent layer.
In one embodiment of this invention, first electrode layer is a reflection electrode layer, and the second electrode lay is a through electrode layer.In other words, organic electroluminescent element is a top emission type organic electroluminescent element.In one embodiment of this invention, the thickness of each organic electroluminescent element is T1, and the thickness of each frame glue is T2, and the degree of depth of each described groove is D, and T1＜T2+D, further, and T1＜T2.
The present invention also provides a kind of method for packing of organic electroluminescent element.At first, one transparent cover plate is provided, wherein have a plurality of grooves in the transparent cover plate, described groove is to remove or dig transparent mother metal partly by the transparent mother metal that will have same thickness on its ad-hoc location to form, make described transparent cover plate present different-thickness in zones of different, wherein the position of thinner thickness is described groove, and the position that thickness is thicker then constitutes the sidewall of described groove.Then, in each groove, insert an optical filling colloid respectively, and on transparent cover plate, form a plurality of frame glue, wherein each frame glue lay respectively at described groove sidewall the top and around one of them groove.Afterwards, a substrate that has been formed with a plurality of organic electroluminescent elements is engaged, so that organic electroluminescent element is immersed in the liquid optical filling colloid with aforementioned transparent cover plate by frame glue.Afterwards, frame glue and liquid optical filling colloid are solidified.
In one embodiment of this invention, the optical filling colloid is inserted in the groove by the mode of blade coating (blade coating) mode or silk screen printing (screen printing).
In one embodiment of this invention, the curing of frame glue and liquid optical filling colloid comprises ultraviolet curing (UV curing) or be heating and curing (thermal curing).
Based on foregoing, because the present invention inserts the optical filling colloid simultaneously a plurality of organic electroluminescent elements being encapsulated in the groove of transparent cover plate, so the present invention extremely helps the batch process of organic electroluminescent element encapsulation.
For above-mentioned feature and advantage of the present invention can be become apparent, hereinafter exemplify embodiment especially, and cooperate appended accompanying drawing to be described in detail below.
Description of drawings
Figure 1A to Fig. 1 D is the generalized section of method for packing of the organic electroluminescent element of one embodiment of the invention.
Fig. 2 A to Fig. 2 D is the schematic top plan view of method for packing of the organic electroluminescent element of one embodiment of the invention.
Wherein, description of reference numerals is as follows:
100: transparent cover plate 102: groove
110: optical filling colloid 120: frame glue
130: 132: the first electrode layers of organic electroluminescent element
134: organic electric-excitation luminescent layer 136; The second electrode lay
140: substrate T1, T2: thickness
D: the degree of depth
Embodiment
Figure 1A to Fig. 1 D is the generalized section of method for packing of the organic electroluminescent element of one embodiment of the invention, and Fig. 2 A to Fig. 2 D is the schematic top plan view of method for packing of the organic electroluminescent element of one embodiment of the invention.At first, please refer to Figure 1A and Fig. 2 A, a transparent cover plate 100 is provided, wherein transparent cover plate 100 has a plurality of grooves 102.In the present embodiment, transparent cover plate 100 for example is the substrate of glass substrate, plastic base or other materials.The formation method of groove 102 for example is to form by modes such as etching, hot pressing, grindings.In detail, the transparent mother metal (not shown) that present embodiment can utilize methods such as etching, hot pressing, grinding will have same thickness earlier removes or digs the transparent mother metal of part on its ad-hoc location, make transparent mother metal present different-thickness in zones of different, wherein the position of thinner thickness is a groove 102, and the position that thickness is thicker then constitutes the sidewall of groove 102.The shape of groove 102 is relevant with the shape and the thickness of the degree of depth and organic electroluminescent element, and this field those of ordinary skill should be able to be adjusted the degree of depth and the shape of groove 102 according to the specification of organic electroluminescent element.
From Figure 1B as can be known, the groove 102 in the present embodiment for example is a rectangular recess, and these rectangular recess are arranged on one of them surface of transparent cover plate 100 with array way.In other embodiments, groove 102 can be rhombus, hexagon, circle or other suitable shape with the shape of groove, and the arrangement mode of groove can be mosaic arrangement, rounded projections arranged, is staggered or arrangement mode that other is suitable.
Then please refer to Figure 1B and Fig. 2 B, in each groove 102, insert a liquid optical filling colloid 110 respectively.In the present embodiment, can utilize the mode of blade coating method or silk screen printing or nozzle coating (nozzledispensing) that liquid optical filling colloid 110 is inserted in the corresponding groove 102.In addition, liquid optical filling colloid 110 for example has ultraviolet curing or the characteristic that is heating and curing, and liquid optical filling colloid 110 is preferably and has good light penetration rate.
Then please refer to Fig. 1 C and Fig. 2 C, form a plurality of frame glue 120 on transparent cover plate 100, wherein each frame glue 120 is respectively around one of them groove 102.In the present embodiment, frame glue 120 for example has ultraviolet curing or the characteristic that is heating and curing.
Please refer to Fig. 1 D and Fig. 2 D afterwards, one substrate 140 that has been formed with a plurality of organic electroluminescent elements 130 is provided, and substrate 140 is engaged with transparent cover plate 100 by frame glue 120, so that organic electroluminescent element 130 is immersed in the liquid optical filling colloid 110, in the present embodiment, the aforesaid substrate 140 that has been formed with a plurality of organic electroluminescent elements 130 for example is that an active-matrix type organic electric-excitation luminescent displaying panel (AMOLED panel) or is by active-matrix type organic electric-excitation luminescent displaying panel (PMOLED panel).
In the present embodiment, the amount that liquid optical filling colloid 110 is inserted can be passed through calculated in advance so that liquid optical filling colloid 110 can fill up 120 of groove 102 and corresponding frame rubber around the space.
With after transparent cover plate 100 engages, then make frame glue 120 and liquid optical filling colloid 110 solidify at substrate 140.In the present embodiment, the curing of the curing of frame glue 120 and liquid optical filling colloid 110 can be carried out or carry out respectively in the lump.In detail, present embodiment can make liquid optical filling colloid 110 be cured simultaneously with frame glue 120 by the heating or the mode of irradiating ultraviolet light, certainly, present embodiment also can solidify liquid optical filling colloid 110 earlier, solidify frame glue 120 again, or solidify frame glue 120 earlier, solidify liquid optical filling colloid 110 again.
By Fig. 1 D and Fig. 2 D as can be known, the encapsulation of the organic electroluminescent element of present embodiment comprises a substrate 140, a plurality of organic electroluminescent element 130, a transparent cover plate 100, a plurality of frame glue 120 and a plurality of optical filling colloid 110.Organic electroluminescent element 130 is disposed on the substrate 140.Transparent cover plate 100 is disposed on the substrate 140 to cover organic electroluminescent element 130, wherein has a plurality of and organic electroluminescent element 130 corresponding groove 102 in the transparent cover plate 100, to hold organic electroluminescent element 130 respectively.Frame glue 120 is disposed between substrate 140 and the transparent cover plate 100, and each frame glue 120 is respectively around one of them organic electroluminescent element 130.Each optical filling colloid 110 be filled in respectively 120 of a groove 102 wherein and corresponding frame rubber around the space in, and coat one of them organic electroluminescent element 130.
In the present embodiment, each organic electroluminescent element 130 comprises one first electrode layer 132, an organic electric-excitation luminescent layer 134 and a second electrode lay 136, wherein first electrode layer 132 is disposed on the substrate 140, and organic electric-excitation luminescent layer 134 is disposed on first electrode layer 132, and the second electrode lay 136 is disposed on the organic electric-excitation luminescent layer 134.In a preferred embodiment of the present invention, first electrode layer 132 is a reflection electrode layer, and the second electrode lay 136 is a through electrode layer.In other words, organic electroluminescent element 130 is a top emission type organic electroluminescent element.Certainly, if organic electroluminescent element 130 is a bottom-emission type organic electroluminescent element, then first electrode layer 132 is a through electrode layer, and the second electrode lay 136 is a reflection electrode layer.
By Fig. 1 D as can be known, the thickness of each organic electroluminescent element 130 is T1, and the thickness of each frame glue 120 is T2, and the degree of depth of each groove 102 is D, generally speaking, and T1＜T2; But the situation of also not getting rid of T1＞T2 is as long as satisfy T1＜T2+D this moment.In sum, the present invention inserts the optical filling colloid simultaneously a plurality of organic electroluminescent elements being encapsulated in the groove of transparent cover plate, so the present invention extremely helps the batch process of organic electroluminescent element encapsulation.
Claims (8)
1. organic electroluminescent element encapsulation comprises:
One substrate;
A plurality of organic electroluminescent elements are disposed on this substrate;
One transparent cover plate, be disposed on this substrate, to cover described a plurality of organic electroluminescent element, wherein have a plurality of grooves that are positioned at described a plurality of organic electroluminescent elements top in this transparent cover plate, to hold described a plurality of organic electroluminescent element respectively, described groove is to remove or dig transparent mother metal partly by the transparent mother metal that will have same thickness on its ad-hoc location to form, so that described transparent cover plate presents different-thickness in zones of different, wherein the position of thinner thickness is described groove, and the position that thickness is thicker then constitutes the sidewall of described groove;
A plurality of frame glue are disposed between this substrate and this transparent cover plate, wherein each described frame glue lay respectively at described groove sidewall the top and around one of them organic electroluminescent elements of described a plurality of organic electroluminescent elements; And
A plurality of optical filling colloids, wherein said optical filling colloid be filled in respectively one of them grooves of described a plurality of grooves and corresponding frame rubber around the space in, and coat one of them organic electroluminescent element.
2. organic electroluminescent element encapsulation as claimed in claim 1, wherein each described organic electroluminescent element comprises:
One first electrode layer is disposed on this substrate;
One organic electric-excitation luminescent layer is disposed on this first electrode layer; And
One the second electrode lay is disposed on this organic electric-excitation luminescent layer.
3. organic electroluminescent element encapsulation as claimed in claim 2, wherein this first electrode layer is a reflection electrode layer, and this second electrode lay is a through electrode layer.
4. organic electroluminescent element encapsulation as claimed in claim 1, wherein the thickness of each described organic electroluminescent element is T1, and the thickness of each described frame glue is T2, and the degree of depth of each described groove is D, and T1＜T2+D.
5. organic electroluminescent element encapsulation as claimed in claim 4, wherein T1＜T2.
6. the method for packing of an organic electroluminescent element comprises:
One transparent cover plate is provided, wherein have a plurality of grooves in this transparent cover plate, described groove is to remove or dig transparent mother metal partly by the transparent mother metal that will have same thickness on its ad-hoc location to form, make described transparent cover plate present different-thickness in zones of different, wherein the position of thinner thickness is described groove, and the position that thickness is thicker then constitutes the sidewall of described groove;
In each described groove, insert an optical filling colloid respectively;
On this transparent cover plate, form a plurality of frame glue, wherein each described frame glue lay respectively at described groove sidewall the top and around one of them groove of described groove;
One substrate that has been formed with a plurality of organic electroluminescent elements is engaged, so that described a plurality of organic electroluminescent element is immersed in the liquid described optical filling colloid with this transparent cover plate by described a plurality of frame glue; And
Described a plurality of frame glue and liquid described optical filling colloid are solidified.
7. the method for packing of organic electroluminescent element as claimed in claim 6, wherein this optical filling colloid is inserted in the described groove by blade coating method or screen printing mode.
8. the method for packing of organic electroluminescent element as claimed in claim 6, wherein the method that described a plurality of frame glue and liquid described optical filling colloid are solidified comprises ultraviolet curing or is heating and curing.
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| CN2009101797960A CN101692446B (en) | 2009-10-19 | 2009-10-19 | Organic electro-stimulation luminous element encapsulation and encapsulating method thereof |
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| CN2009101797960A CN101692446B (en) | 2009-10-19 | 2009-10-19 | Organic electro-stimulation luminous element encapsulation and encapsulating method thereof |
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| CN101692446B true CN101692446B (en) | 2011-09-07 |
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| CN104393187B (en) * | 2014-11-17 | 2018-09-11 | 合肥鑫晟光电科技有限公司 | A kind of package substrate and preparation method thereof, OLED display |
| CN107104202B (en) | 2017-06-02 | 2019-09-17 | 京东方科技集团股份有限公司 | The encapsulating structure of OLED display device, packaging method, display device |
| CN109309174B (en) * | 2018-12-07 | 2021-11-05 | 合肥鑫晟光电科技有限公司 | Display panel and packaging method thereof |
| CN110112314B (en) * | 2019-05-22 | 2021-08-27 | 合肥京东方卓印科技有限公司 | Packaging structure, packaging method and display device |
| CN113013352B (en) * | 2021-01-29 | 2023-07-21 | 固安翌光科技有限公司 | Film packaging structure and organic photoelectric device |
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