CN101677492B - Manufacturing technology of printed circuit board (PCB) - Google Patents
Manufacturing technology of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN101677492B CN101677492B CN200810200181.7A CN200810200181A CN101677492B CN 101677492 B CN101677492 B CN 101677492B CN 200810200181 A CN200810200181 A CN 200810200181A CN 101677492 B CN101677492 B CN 101677492B
- Authority
- CN
- China
- Prior art keywords
- tin
- tapping
- hole
- endoporus
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a manufacturing technology of a printed circuit board (PCB). In the process for manufacturing the PCB, a bonding pad of a surface mount component and a through hole ring which needs to be prearranged with tin are perforated, and prearranged tin cream is printed. In the process for treating the PCB by reflow soldering, the prearranged tin cream forms prearranged tin. The bonding pad and/or the through hole of the through hole ring are/is provided with an inner hole; and the printing area and the printing quantity of the tin cream need to meet the condition that after the reflow soldering of the PCB is completed, the inner hole is not printed with tin, namely that no tin is soaked in the inner hole, and the inner hole can not be clogged. The invention can effectively solve the problem that the PCB is difficult to be printed with tin because of the oxidation of the bonding pad, the arrangement or structure defects of the PCB, and the like.
Description
Technical field
The present invention relates to a kind of manufacture craft of pcb board, particularly a kind of in order to solve the manufacture craft of pcb board of the difficult problem of upper tin.
Background technology
What solder once more adopted is leypewter, but because lead is heavy metal, human body is had to very large injury, and therefore, prior art has turned to the generation of lead-free process.What conventionally prior art adopted is SAC alloy and special scaling powder, but with respect to original leypewter, existing SAC alloy and special scaling powder are higher to the requirement of welding temperature.Like this, in the process of manual welding or Reflow Soldering welding, be easy to occur the problem of tin in pad difficulty, this is the oxidation that has caused pad because be subject to high temperature once or twice in pcb board Reflow Soldering welding in the early stage.This layer of oxide-film is difficult to be infiltrated by common scaling powder, therefore, just there will be afterwards tin bad, the even phenomenon of solder skip in welding.And welding is to realize the basis that circuit elements device connects, the bad rosin joint that easily causes of upper tin, causes properties of product unstable or cannot reach performance index, and the problem that solder skip causes is more obvious.
The in the situation that of manual welding, problem is more obvious.In many scientific research occasions, need to be on pcb board test of many times, adjust, be difficult to tin, cause length of side weld time, temperature sharply rises, reflow repeatedly even may cause pad directly to come off.
In addition, due to the problem such as layout or structure of pcb board, part pcb board is in the time of wave soldering, and on through hole, tin is also comparatively difficult.
Therefore, need a kind of solution for this problem of tin in difficulty.
Summary of the invention
The object of this invention is to provide a kind of for solving the manufacture craft of pcb board of the difficult problem of upper tin.
A manufacture craft for pcb board, is characterized in that: after pad and through hole finish printing, by paste solder printing on the pad and/or through hole of the preset tin of needs.
Through hole under wherein said pad and/or described through hole orifice ring has an endoporus, and the printing area of described tin cream and number to be printed should meet after pcb board Reflow Soldering, and endoporus is not gone up tin, in endoporus, does not have tin to infiltrate, and can not block endoporus.Before print solder paste, the pad to the preset tin of needs and/or vias.Described pad comprises endoporus, tapping and tapping not, and tapping is not adjacent for each tapping and two, and each not tapping is adjacent with two tappings.Described through hole orifice ring comprises tapping and tapping not, and tapping is not adjacent for each tapping and two, and each not tapping is adjacent with two tappings.Described paste solder printing is at described tapping, and each tapping and each the not size of tapping area occupied can be adjusted, but should meet after pcb board Reflow Soldering, and endoporus is not gone up tin, in endoporus, does not have tin to infiltrate, and can not block endoporus.
Beneficial effect of the present invention is: the manufacture craft of pcb board of the present invention is by after pad and through hole finish printing, by paste solder printing on the pad and/or through hole of the preset tin of needs, can effectively solve due to the problems such as pad oxidation and pcb board layout or structure, the phenomenon that is difficult to tin causing.
Brief description of the drawings
Fig. 1 is pcb board through hole schematic diagram.
Fig. 2 is pcb board through hole orifice ring perforate schematic diagram.
Embodiment
Describe the preferred embodiments of the present invention in detail below in conjunction with accompanying drawing.
Be difficult to this problem of upper tin in order to solve, the manufacture craft of pcb board provided by the present invention, in existing manufacture craft, has increased this step of preset tin cream.
In the process of making pcb board, after pad and through hole are finished printing, the through hole orifice ring perforate of the pad of effects on surface mount components and the preset tin cream of needs, then, on the through hole orifice ring of the pad of effects on surface mount components and the preset tin cream of needs, stamp preset tin cream, while pcb board being carried out to reflow soldering, tin cream is heated, and can form the preset tin of one deck.
Below taking through hole as example, for some perforate embodiment.
Embodiment mono-
Refer to Fig. 1, Figure 1 shows that the through hole (PTH) of pcb board, described through hole has orifice ring 1.
Refer to Fig. 2, Fig. 2 is pcb board through hole orifice ring perforate schematic diagram.PCB through hole comprises orifice ring 1 and endoporus 2, and in this preferred embodiment, orifice ring 1 has four tappings 11,12,13,14, four tappings 15,16,17,18 not, wherein, the diameter of endoporus 2 is than the large 0.4mm of the radius of whole through hole, to guarantee that endoporus 2 can not be printed on tin cream.In the time making pcb board, preset tin cream will be printed onto tapping, and after mount components, pcb board is crossed Reflow Soldering, and preset tin cream melts, and forms the preset tin of one deck, infiltrates whole through hole orifice ring.Tapping is not adjacent with two for each tapping, and each not tapping is adjacent with two tappings, and each tapping and each the not size of tapping area occupied can be adjusted, but should meet after pcb board Reflow Soldering, endoporus 2 is not gone up tin, in endoporus 2, does not have tin to infiltrate, and can not block endoporus 2.
Same, the pad of element pasted on surface can also be gone up preset tin cream by the way.
Embodiment bis-
The difference of the present embodiment and embodiment mono-is, two places not tapping 15,17 become tapping,, former tapping 13, former not tapping 15, former tapping 11 are merged into a new tapping, former tapping 14, former not tapping 17, former tapping 12 are merged into another new tapping, form new two tappings and two original not tappings, each new tapping is adjacent with two original not tappings, and each original not tapping is adjacent with two new tappings.Same, new tapping can be adjusted with original not tapping area occupied size, but should meet after pcb board Reflow Soldering, and endoporus 2 is not gone up tin, in endoporus 2, there is no tin infiltration, can not block endoporus 2.
Embodiment tri-
In the present embodiment, through hole orifice ring 1 has not tapping of three tappings and three, and tapping is not adjacent with two for each tapping, and each not tapping is adjacent with two tappings.
Above-mentioned various perforate mode, all should meet after pcb board Reflow Soldering, and endoporus 2 is not gone up tin, in endoporus 2, does not have tin to infiltrate, and can not block endoporus 2, and can cover whole through hole orifice ring as good taking preset tin.
The manufacture craft of pcb board provided by the invention, mainly contains two effects, and the first prevents pad and through hole oxidation, especially effects on surface processing mode itself is than the pad and the through hole that are easier to oxidation, by prefabricated tin, can make tin cover pad and through hole, stop contacting of pad and through hole and oxygen.And tin is not oxidizable, the compatibility between tin and tin is fine, just can avoid pad and through hole to be oxidized the problem that is difficult to tin causing.
It two is in order to improve solderability.Part pcb board in the time of wave soldering on pad or through hole tin more difficult, and relatively easy by tin in Reflow Soldering.Can just form alloy-layer with pad or through hole when the Reflow Soldering by prefabricated tin, because tin has good wettability, in ensuing wave soldering technique, owing to being covered by tin on pad, thereby upper tin will become easily, the upper more difficult problem of tin can avoid wave-soldering time.
Above embodiment is the unrestricted technical scheme of the present invention in order to explanation only.Do not depart from any modification or partial replacement of spirit and scope of the invention, all should be encompassed in the middle of claim scope of the present invention.
Claims (1)
1. a manufacture craft for pcb board, is characterized in that: after pad and through hole finish printing, by preset paste solder printing on the pad and/or through hole orifice ring of the preset tin cream of needs; Through hole under described pad and/or described through hole orifice ring has an endoporus, and the printing area of described tin cream and number to be printed should meet after pcb board Reflow Soldering, and endoporus is not gone up tin, in endoporus, does not have tin to infiltrate, and can not block endoporus; The diameter of described endoporus is larger than the radius of whole through hole, and the radius difference range of the diameter of described endoporus and described through hole is from 0.3mm to 0.5mm; Before print solder paste, the pad to the preset tin of needs and/or the perforate of through hole orifice ring; Described pad comprises endoporus, tapping and tapping not, and tapping is not adjacent for each tapping and two, and each not tapping is adjacent with two tappings; Described through hole orifice ring comprises tapping and tapping not, and tapping is not adjacent for each tapping and two, and each not tapping is adjacent with two tappings; Described paste solder printing is at described tapping, and each tapping and each the not size of tapping area occupied can be adjusted, but should meet after pcb board Reflow Soldering, and endoporus is not gone up tin, in endoporus, does not have tin to infiltrate, and can not block endoporus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810200181.7A CN101677492B (en) | 2008-09-19 | 2008-09-19 | Manufacturing technology of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810200181.7A CN101677492B (en) | 2008-09-19 | 2008-09-19 | Manufacturing technology of printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101677492A CN101677492A (en) | 2010-03-24 |
| CN101677492B true CN101677492B (en) | 2014-07-09 |
Family
ID=42029851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810200181.7A Active CN101677492B (en) | 2008-09-19 | 2008-09-19 | Manufacturing technology of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101677492B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300420A (en) * | 2010-10-14 | 2011-12-28 | 陈锦海 | Method for manufacturing printed circuit board (PCB) containing electric conduction hole |
| CN107251663A (en) * | 2015-02-12 | 2017-10-13 | 古河电气工业株式会社 | Flexible base board and optical module |
| CN106455321B (en) * | 2016-10-12 | 2019-02-15 | 青岛海信电器股份有限公司 | A kind of through-hole reflux device fixing pin, TV motherboard terminal and application method |
| CN106529106B (en) * | 2017-01-09 | 2019-09-06 | 郑州云海信息技术有限公司 | One kind building hole method, apparatus and a kind of PCB |
| CN109168254A (en) * | 2018-09-29 | 2019-01-08 | 珠海格力电器股份有限公司 | A kind of patch nut encapsulating structure and method |
| CN115446410A (en) * | 2022-09-21 | 2022-12-09 | 北京经纬恒润科技股份有限公司 | Welding method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295210B1 (en) * | 2000-04-07 | 2001-09-25 | Lucent Technologies, Inc. | Chassis grounding ring for a printed wiring board mounting aperture |
-
2008
- 2008-09-19 CN CN200810200181.7A patent/CN101677492B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295210B1 (en) * | 2000-04-07 | 2001-09-25 | Lucent Technologies, Inc. | Chassis grounding ring for a printed wiring board mounting aperture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101677492A (en) | 2010-03-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101677492B (en) | Manufacturing technology of printed circuit board (PCB) | |
| KR100530965B1 (en) | Printing mask, method of printing solder paste using printing mask, surface-mounted structural assembly, and method of manufacturing surface-mounted structural assembly | |
| JP4669535B2 (en) | Junction structure and electronic circuit board | |
| KR101060214B1 (en) | Printed wiring board and electronic device manufacturing method | |
| JP2017168495A (en) | Metal mask and manufacturing method of electronic component mounting board | |
| US7416106B1 (en) | Techniques for creating optimized pad geometries for soldering | |
| JP2006294949A (en) | Electrode structure, protruded electrode, and method of manufacturing these members | |
| JP2010080667A (en) | Mounting board and mounting method | |
| CN110351962A (en) | A kind of secondary via hole reflow method | |
| CN110958786A (en) | Method for soldering tin on side surface of PCBA (printed Circuit Board Assembly) of on-chip paster | |
| JPH04302193A (en) | Printed board | |
| JP2646688B2 (en) | Electronic component soldering method | |
| CN109526155B (en) | Manufacturing method of solder joint cold solder joint | |
| CN217849795U (en) | Steel mesh structure for improving through hole reflow soldering yield | |
| TWI530239B (en) | Method for depositing solders on electronic component | |
| JP2011135111A (en) | Method for forming frame ground of printed circuit board | |
| JP2002026482A (en) | Mounting structure of electronic component | |
| GB2295114A (en) | Method and means for treating the through holes of immersion gold plated printed circuit boards | |
| CN116981188A (en) | Welding method for surface-mounted device on through hole bonding pad hole | |
| JP2003133710A (en) | Electronic component packaging printed board | |
| JP2005144540A (en) | Lead free soldering method for chip part | |
| JP2009076632A (en) | Part-mounting section structure of printed-circuit board, and manufacturing method therefor | |
| JPH0621604A (en) | Circuit board device having chip electronic components mounted thereon | |
| JP2000353867A (en) | Mounting structure of part on board and structure of printing jig | |
| CN111849251A (en) | Electronic ink, conductive connection structure, multilayer circuit and corresponding manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: FLEXCOMPUTING (SUZHOU) CO., LTD. Free format text: FORMER OWNER: WEICHUANGLI ELECTRONIC TECHNOLOGY (SHANGHAI) CO., LTD. Effective date: 20131212 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201801 JIADING, SHANGHAI TO: 215224 SUZHOU, JIANGSU PROVINCE |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20131212 Address after: Suzhou Wuzhong District City, Jiangsu province 215224 Guo Xiang Jie Dao Guan Pu Road No. 1 Applicant after: Flextronics computer (Suzhou) Co. Ltd. Address before: 201801 Shanghai Jiading District Malu Town Yongsheng Road No. 77 Building 2 Applicant before: Flextronics Technology (Shanghai) Co., Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |