CN111849251A - Electronic ink, conductive connection structure, multilayer circuit and corresponding manufacturing method - Google Patents
Electronic ink, conductive connection structure, multilayer circuit and corresponding manufacturing method Download PDFInfo
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- CN111849251A CN111849251A CN201910366212.4A CN201910366212A CN111849251A CN 111849251 A CN111849251 A CN 111849251A CN 201910366212 A CN201910366212 A CN 201910366212A CN 111849251 A CN111849251 A CN 111849251A
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- liquid metal
- oleoresin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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Abstract
The invention provides electronic ink, a conductive connection structure, a multilayer circuit and a corresponding manufacturing method, and relates to the technical field of electronic materials. The electronic ink provided by the invention is composed of liquid metal and oleoresin with fluidity, which are uniformly mixed, wherein the oleoresin wraps liquid drops formed by the liquid metal; in the electronic ink, the weight ratio of the liquid metal to the oleoresin is as follows: 0.2: 1 to 50: 1. The technical scheme of the invention can simplify the manufacturing process of the electronic circuit.
Description
Technical Field
The invention relates to the technical field of electronic materials, in particular to electronic ink, a conductive connection structure, a multilayer circuit and a corresponding manufacturing method.
Background
With the rapid development of microelectronic technology, there is an increasing demand for rapid manufacturing of electronic products. The traditional electronic circuit is integrated on the PCB, the process of manufacturing the PCB is complex, and complicated manufacturing procedures such as cutting, drilling, copper deposition, appearance circuit, pattern electroplating, etching, center testing, resistance welding and the like are required.
Disclosure of Invention
The invention provides electronic ink, a conductive connection structure, a multilayer circuit and a corresponding manufacturing method, which can simplify the manufacturing process of the electronic circuit.
In a first aspect, the present invention provides an electronic ink, which adopts the following technical scheme:
the electronic ink is composed of liquid metal and oleoresin with fluidity, which are uniformly mixed, wherein the oleoresin wraps liquid drops formed by the liquid metal; in the electronic ink, the weight ratio of the liquid metal to the oleoresin is as follows: 0.2: 1 to 50: 1.
Optionally, the liquid metal is a simple metal or an alloy with a melting point below 300 ℃.
The liquid metal includes: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin copper alloy, tin zinc copper alloy, tin silver copper alloy, bismuth lead tin alloy.
Optionally, the liquid metal forms droplets having a diameter of 0.05 μm to 2 μm.
Optionally, the oleoresin comprises a resin matrix and an auxiliary agent, the auxiliary agent at least being used to adjust the flowability of the oleoresin.
In a second aspect, the present invention provides a conductive connection structure, which adopts the following technical scheme:
the conductive connection structure is located on a first substrate, the conductive connection structure is formed by manufacturing the electronic ink, and the conductive connection structure comprises a first resin layer in contact with the first substrate, a first liquid metal layer located on the first resin layer, and a second resin layer located on the first liquid metal layer.
Optionally, the thickness of the electrically conductive connection structure is greater than or equal to 30 μm.
In a third aspect, the present invention provides a method for manufacturing a conductive connection structure, which is used for manufacturing any one of the conductive connection structures, and adopts the following technical scheme:
the manufacturing method of the conductive connection structure comprises the following steps:
step S1, forming a circuit on the first substrate by the electronic ink;
step S2, activating the circuit at a first temperature T1 to enable liquid metal in the circuit to be gathered and layered;
Step S3, drying the circuit at a second temperature T2 to obtain the conductive connection structure;
wherein the first temperature T1 is higher than the melting point of the liquid metal and lower than the curing temperature of the oleoresin, and the second temperature T2 is higher than or equal to the curing temperature of the oleoresin.
Optionally, the first temperature T1 is related to the second temperature T2
In a fourth aspect, the present invention provides a conductive connection structure, which adopts the following technical scheme:
the conductive connection structure is positioned on the first substrate and is made of the electronic ink, and in the width direction of the conductive connection structure, the conductive connection structure comprises a liquid metal conductive part positioned in the center, two oleoresin parts positioned on two sides of the liquid metal conductive part, and a mixing part positioned on one side, away from the liquid metal conductive part, of each oleoresin part, wherein a hole is formed in each oleoresin part, and each mixing part is composed of oleoresin and liquid drops formed by the liquid metal wrapped by the oleoresin.
In a fifth aspect, the present invention provides a method for manufacturing a conductive connection structure, which is used for manufacturing any one of the conductive connection structures described above, and adopts the following technical scheme:
The manufacturing method of the conductive connection structure comprises the following steps:
step S11, forming a circuit on the first substrate by the electronic ink;
step S12, drying the circuit at a second temperature to solidify the circuit;
and step S13, cutting the solidified circuit from the middle along the extending direction of the circuit to obtain the conductive connection structure.
In a sixth aspect, the present invention provides a multilayer circuit, which adopts the following technical solutions:
the multilayer circuit includes a second substrate, a first wiring and a second wiring on the second substrate, the second wiring having a portion overlapping the first wiring;
the first circuit comprises a third resin layer, a second liquid metal layer positioned on the third resin layer, and a fourth resin layer positioned on the second liquid metal layer along the direction far away from the second substrate;
the second circuit includes a fifth resin layer, a third liquid metal layer on the fifth resin layer, and a sixth resin layer on the third liquid metal layer in a direction away from the second substrate.
In a seventh aspect, the present invention provides a method for manufacturing a multilayer circuit, which adopts the following technical scheme:
The manufacturing method of the multilayer circuit comprises the following steps:
providing a second substrate;
forming a first circuit pattern on the second substrate by the electronic ink of any one of the above;
performing an activation treatment on the first line pattern at a first temperature T1 to cause liquid metal in the first line pattern to aggregate and stratify;
drying the first circuit pattern at a second temperature T2 to obtain a first circuit;
forming a second line pattern on the second substrate by the electronic ink of any one of the above, the second line pattern having a portion overlapping the first line;
performing an activation process on the second line pattern at a first temperature T1 to cause liquid metal in the second line pattern to aggregate and stratify;
drying the second line pattern at a second temperature T2 to obtain a second line;
wherein the first temperature T1 is higher than the melting point of the liquid metal and lower than the curing temperature of the oleoresin, and the second temperature T2 is higher than or equal to the curing temperature of the oleoresin.
The invention provides electronic ink, a conductive connection structure, a multilayer circuit and a corresponding manufacturing method, wherein the electronic ink is composed of liquid metal and oleoresin with fluidity which are uniformly mixed, and the oleoresin wraps liquid drops formed by the liquid metal; in the electronic ink, the weight ratio of the liquid metal to the oleoresin is as follows: 0.2: 1-50: 1, the electronic ink has good fluidity, and a circuit can be formed on the substrate through simple processes such as screen printing, spraying, printing, dispensing, steel mesh printing and the like, the circuit is simply processed, so that a conductive circuit can be obtained, and the manufacturing process of the electronic circuit can be simplified.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an electronic ink provided in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an electronic ink provided in an embodiment of the present invention after curing;
FIG. 3 is a graph showing the relationship between the curing temperature and the curing rate of an oleoresin according to an example of the present invention;
fig. 4 is a schematic structural diagram of a circuit provided in the embodiment of the present invention after being scratched;
fig. 5 is a top view of a conductive connection structure according to an embodiment of the invention;
FIG. 6 is a first cross-sectional view along AA' of FIG. 5 according to an embodiment of the present invention;
FIG. 7 is a second cross-sectional view along AA' of FIG. 5 according to an embodiment of the present invention;
fig. 8 is a schematic diagram illustrating a result of the conductive connection structure connecting the conductive terminals according to the embodiment of the invention;
FIG. 9 is a top view of a multilayer circuit provided by an embodiment of the present invention;
FIG. 10 is a schematic cross-sectional view along AA' of FIG. 9 according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The embodiment of the invention provides an electronic ink, and specifically, as shown in fig. 1, fig. 1 is a schematic structural diagram of the electronic ink provided by the embodiment of the invention, the electronic ink is composed of a liquid metal 1 and an oleoresin 2 with fluidity, which are uniformly mixed, and the oleoresin 2 wraps liquid drops formed by the liquid metal 1; in the electronic ink, the weight ratio of the liquid metal 1 to the oleoresin 2 is as follows: 0.2: 1 to 50: 1.
The oleoresin 2 having fluidity means that the oleoresin 2 has fluidity during the process for preparing the electronic ink, and the oleoresin 2 having fluidity in the prepared electronic ink, preferably fluidity at room temperature, so that the process for preparing the electronic ink is simple.
The oleoresin 2 has fluidity, and the liquid metal 1 in the liquid state also has good fluidity, so that the electronic ink has good fluidity, and a circuit can be formed on a substrate by simple processes such as screen printing, spraying, printing, dispensing, steel mesh printing and the like, and the circuit is simply processed to obtain a conductive circuit, so that the manufacturing process of the electronic circuit can be simplified.
Optionally, in the electronic ink, the weight ratio of the liquid metal 1 to the oleoresin 2 is: 0.2: 1, 0.5: 1, 0.8: 1, 1: 1, 4: 1, 8: 1, 12: 1, 13: 1, 14: 1, 15: 1, 16: 1, 17: 1, 18: 1, 19: 1, 20: 1, 21: 1, 22: 1, 23: 1, 24: 1, 25: 1, 26: 1, 27: 1, 28: 1, 29: 1, 30: 1, 31: 1, 32: 1, 33: 1, 34: 1, 35: 1, 36: 1, 37: 1, 38: 1, 39: 1, 40: 1, 45: 1, or 50: 1.
Illustratively, the preparation process of the above electronic ink may include: weighing liquid metal 1 and oleoresin 2 in proportion; putting the liquid metal 1 and the oleoresin 2 which are in a liquid state into a tin paste tank of a tin paste stirring machine, and sealing the tin paste tank (the sealing effect is better after vacuumizing), wherein if the melting point of the liquid metal 1 is lower than the room temperature, the liquid metal 1 can be directly used, and if the melting point of the liquid metal 1 is higher than the room temperature, the liquid metal 1 is heated firstly to be melted into a liquid state and then used; placing the tin paste cans in a tin paste stirrer in an inclined way at an angle of 45 degrees, and ensuring that the symmetrically placed tin paste cans are consistent in weight; starting a solder paste stirrer, stirring at a rotating speed of 1200 r/min-2000 r/min (such as 1600r/min) for 5-20 minutes, and rotating a solder paste tank in the process; and stopping the solder paste stirrer, opening the solder paste tank, and taking out the prepared electronic ink.
The purpose of sealing the tin paste tank is to effectively prevent the conductivity of the liquid metal 1 from being reduced and the viscosity of the liquid metal from being increased due to oxidation in the stirring process, and prevent the fluidity of the oleoresin 2 from being reduced due to rapid volatilization of an auxiliary agent in the oleoresin 2. In addition, if the stirring is insufficient, the liquid metal 1 and the oleoresin 2 can be layered, and the selection of the stirring speed and the stirring time can effectively ensure that the liquid metal 1 and the oleoresin 2 are fully mixed.
In addition, the inventor also tried other ways to prepare the electronic ink described above, such as ordinary stirring, but the preparation efficiency and the quality of the prepared electronic ink are lower than the above-mentioned methods.
The liquid metal 1 in the embodiment of the present invention is a simple metal or an alloy having a melting point of 300 ℃. The liquid metal may include one or more of gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper, sodium, potassium, magnesium, aluminum, iron, nickel, cobalt, manganese, titanium, vanadium, boron, carbon, silicon, and the like. Preferably, the specific selection ranges of the liquid metal include: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin copper alloy, tin zinc copper alloy, tin silver copper alloy, bismuth lead tin alloy.
The inventors found that, in this range, if the melting point of the liquid metal 1 is high, the liquid metal needs to be heated to be melted and then mixed with the oleoresin 2, the components in the oleoresin 2 are easily volatilized during the mixing process, and the viscosity of the electronic ink gradually increases with the decrease of the temperature during the formation of the wiring, which makes the process difficult, and based on this, it is preferable that the melting point of the liquid metal 1 is below 60 ℃. Alternatively, the liquid metal 1 is a gallium simple substance (melting point of 29.8 ℃), a gallium-indium eutectic alloy (melting point of 15.5 ℃), a gallium-indium-tin eutectic alloy (melting point of 11 ℃), a bismuth-indium-tin eutectic alloy (melting point of 58 ℃), or a gallium-indium-tin-zinc eutectic alloy (melting point of 9 ℃). Of course, the liquid metal 1 may also contain other components such as refractory metal particles, non-metallic particles, etc. as appropriate without significantly affecting the properties (such as fluidity and surface tension) of the liquid metal 1.
If the diameter of the liquid drop formed by the liquid metal 1 in the electronic ink is too large, the liquid drop is easy to polymerize, the performance stability of the electronic ink is poor, the mesh number of the screen capable of passing through the electronic ink is low, and if the diameter of the liquid drop formed by the liquid metal 1 in the electronic ink is too small, the liquid metal 1 is too dispersed, the conductive path is not favorably formed, and the efficiency of preparing the electronic ink is low, therefore, the diameter of the liquid drop formed by the liquid metal 1 is selected to be 0.05-2 μm, so that the electronic ink has better comprehensive performance.
Compared with water-based resin, the liquid drops formed by the liquid metal 1 can exist in the oleoresin 2 more stably, the electronic ink has better performance stability and can still be normally used after being stored, and when the diameter of the liquid drops formed by the liquid metal 1 is up to 5 mu m, the electronic ink can still keep the performance stability within a certain time.
Alternatively, oleoresin 2 in the present embodiment includes a resin matrix and an auxiliary agent for at least adjusting the fluidity of oleoresin 2. The auxiliary agent may be a diluent and/or a dispersant, and the specific material and concentration of the diluent and/or the dispersant may be selected according to the selected resin matrix so that the oleoresin 2 has appropriate fluidity. All or most of the auxiliary agents are volatilized in the process of drying and curing the electronic ink.
Further, the resin base may be an epoxy resin system, an acrylic system, a polyurethane system, or the like.
It should be noted that a person skilled in the art may configure the desired oleoresin 2 with the resin matrix and the auxiliary agent by himself or may directly purchase the ready-made oleoresin 2 that meets the needs.
In addition, the inventors found that, after the electronic ink in the embodiment of the present invention is used to fabricate the circuit on the substrate, in the process of drying and curing the circuit (in which the oleoresin 2 is cured, but the liquid metal 1 is not limited to be in a liquid state or a solid state), the performance of the obtained circuit is greatly different according to the different drying modes, and the embodiment of the present invention is described in detail in two different drying modes.
In a first drying manner, firstly, the circuit is activated at a first temperature T1, during the activation, the oleoresin 2 in the circuit, which is in direct contact with the substrate, adheres to the substrate to form a layered structure, droplets formed by the liquid metal 1 are precipitated and gathered downwards to form a layered structure, and other oleoresin 2 is extruded upwards to form a layered structure, and then the upper and lower layers of oleoresin 2 are cured at a second temperature T2, as shown in fig. 2, fig. 2 is a schematic structural diagram of the electronic ink provided by the embodiment of the present invention after being cured, and the layered structure formed by the liquid metal 1 is wrapped by the upper and lower layers of oleoresin 2 after being cured, so that a self-packaging effect can be achieved.
The first temperature T1 is higher than the melting point of the liquid metal 1 and lower than the curing temperature of the oleoresin 2, and the second temperature T2 is higher than or equal to the curing temperature of the oleoresin 2.
Specifically, as shown in fig. 3, fig. 3 is a graph of a relationship between a curing temperature and a curing rate of oleoresin provided in an embodiment of the present invention, at a lower temperature, an auxiliary in oleoresin 2 volatilizes slowly, the curing rate of oleoresin 2 is slow, the volatilization rate of the auxiliary increases with the increase of temperature, the curing rate gradually increases, after the highest value is reached, the upper oleoresin 2 is rapidly cured with the increase of temperature, the volatilization of the auxiliary in the lower oleoresin is prevented, the curing rate is gradually reduced, and in addition, if the curing temperature is too high, oleoresin 2 may be denatured. Based on this, in the embodiment of the present invention, it is preferable that second temperature T2 is a temperature corresponding to the maximum curing rate in the curing curve of oleoresin 2, and a specific value of this temperature may be determined according to the auxiliary in oleoresin 2. Optionally, at the second temperature T2, the time for curing the oleoresin 2 is 20-60 min, which may be specifically determined according to the volatilization rate of the auxiliary agent in the oleoresin 2.
Preferably, the first temperature T1 and the second temperature T2 satisfy:
so that the first temperature T1 can ensure that the liquid metal 1 has good activity and the oleoresin 2 does not solidify. At the first temperature T1, if the time for activating the circuit is too long, the efficiency will be reduced, and if the time is too short, the layering effect will be poor, and based on this, in the embodiment of the present invention, the time for activating the circuit at the first temperature T1 is selected to be 20-60 min.
When the circuit with the structure is applied to an electronic circuit, the circuit does not need to be additionally packaged, so that the manufacturing process of the electronic circuit can be further simplified, and the circuit can be combined with the base material more firmly and is not easy to separate under the action of the bottom layer oleoresin 2. In the using process of the circuit, the upper layer oleoresin 2 at the position where the circuit needs to be connected with other circuits or electronic elements can be scratched to expose the liquid metal 1, and then pins of the other circuits or electronic elements are contacted with the liquid metal 1. In addition, the circuit or the electronic element to be connected can be connected or pasted before the circuit is dried, and then the circuit or the electronic element is dried without adding any process.
For this drying method, if the weight ratio of the liquid metal 1 to the oleoresin 2 in the electronic ink is less than 1: 1, the content of the oleoresin 2 in the electronic ink is too high, the liquid metal 1 is too dispersed therein, and an effective conductive circuit cannot be formed when the drying process is performed on the circuit formed by the liquid metal 1, and if the weight ratio of the liquid metal 1 to the oleoresin 2 in the electronic ink is greater than 29: 1, the content of the oleoresin 2 is too low, and the liquid metal 1 cannot be effectively encapsulated.
In one example, in the electronic ink, the viscosity of the oleoresin 2 at 25 ℃ is 3400-6500 cps, the liquid metal 1 is gallium-indium eutectic alloy (the melting point is 15.5 ℃), the lines made of the electronic ink are firstly kept at room temperature for 40min for activation treatment, and after the lines are layered, the lines are placed in an oven at 50 ℃ for drying for 40 min.
In another example, in the electronic ink, the viscosity of the oleoresin 2 at 25 ℃ is 4000-6000 cps, the liquid metal 1 is gallium-indium eutectic alloy (the melting point is 15.5 ℃), the circuit made of the electronic ink is placed in a 40 ℃ oven for 20min for activation treatment, after the circuit is layered, the temperature of the oven is raised to 65 ℃, and the circuit is dried for 30 min.
In another example, in the electronic ink, the viscosity of the oleoresin 2 at 25 ℃ is 6000-12000 cps, the liquid metal 1 is gallium-indium eutectic alloy (the melting point is 15.5 ℃), the circuit made of the electronic ink is firstly placed in a 70 ℃ oven to be kept for 60min for activation treatment, after the circuit is layered, the temperature of the oven is raised to 105 ℃, and the circuit is dried for 50 min.
In the process of activating the line, the time and temperature required for the droplets of the liquid metal 1 to move more easily as the viscosity of the oleoresin 2 is reduced.
In the second drying mode, the line is directly dried at the second temperature T2 to solidify the line (i.e. solidify the oleoresin 2 in the line), during which the hardness and viscosity of the oleoresin 2 both rapidly rise, and the liquid drops formed by the liquid metal 1 cannot sufficiently move and cannot be aggregated to form a layered structure, so that the line is not layered, but is composed of the liquid metal 1 and the solidified oleoresin 2 which are uniformly mixed, the oleoresin 2 wraps the liquid drops formed by the liquid metal 1, and the structural schematic diagram of the electronic ink after solidification can still refer to fig. 1, except that the oleoresin 2 is solid.
The circuit needs to be scratched so that the liquid metal 1 in the circuit flows out and converges to form a continuous path before the circuit is conductive. As shown in fig. 4, fig. 4 is a schematic structural diagram of a scribed line according to an embodiment of the present invention, in a width direction of the scribed line, the scribed line includes a liquid metal 1 located at the center, an oleoresin 2 located at both sides of the liquid metal 1, and a mixture of the liquid metal 1 and the oleoresin 2 located at a side of the oleoresin 2 away from the liquid metal, the oleoresin 2 located at both sides of the liquid metal 1 has a hole 21 inside, the hole 21 is occupied by a droplet formed by the liquid metal 1 before scribing, the liquid metal 1 flows out after scribing, and the oleoresin 2 wraps the droplet formed by the liquid metal 1 in the mixture of the liquid metal 1 and the oleoresin 2.
The electrical connection between the adjacent electronic components or circuits can be easily controlled by the circuit having such characteristics, for example, the above-described circuit is formed between the adjacent electronic components or circuits, and then when the two are required to be connected, the circuit is cut by an object, so that the two can be electrically connected.
For the drying method, if the weight ratio of the liquid metal 1 to the oleoresin 2 in the electronic ink is less than 1: 1, the content of the oleoresin 2 in the electronic ink is too high, the liquid metal 1 is too dispersed in the oleoresin, and after the lines formed by the liquid metal 1 are dried and scratched, the liquid metal 1 which can flow out is too little, so that effective conductive lines cannot be formed.
In addition, an embodiment of the present invention further provides a conductive connection structure, specifically, as shown in fig. 5, fig. 6 and fig. 7, fig. 5 is a top view of the conductive connection structure provided in the embodiment of the present invention, fig. 6 is a first schematic cross-sectional view along AA 'of fig. 5 provided in the embodiment of the present invention, fig. 7 is a second schematic cross-sectional view along AA' of fig. 5 provided in the embodiment of the present invention, the conductive connection structure 4 is located on the first substrate 3, and the conductive connection structure 4 is made of any one of the electronic inks described above.
Specifically, in the structure shown in fig. 6, the conductive connection structure 4 includes a first resin layer 41 in contact with the first substrate 3, a first liquid metal layer 42 on the first resin layer 41, and a second resin layer 43 on the first liquid metal layer 42.
Here, the first resin layer 41 is a layered structure formed by curing the oleoresin 2 directly contacting the substrate during the drying of the electronic ink (in the first drying manner described above), the first liquid metal layer 42 is a layered structure formed by gathering the liquid metals 2 during the drying of the electronic ink, and the second resin layer 43 is a layered structure formed by curing the other oleoresin 2 during the drying of the electronic ink. The first liquid metal layer 42 is in a solid state or a liquid state, and is determined by the melting point of the liquid metal 1 in the electronic ink.
Because the adjacent layers are automatically formed in the process of drying and curing the electronic ink, rather than an upper layer structure formed on the basis of a structure formed by a lower layer, the interface between the adjacent layers is irregular, for example, the adjacent layers can be uneven curved surfaces.
Optionally, the thickness of the conductive connection structure is greater than or equal to 30 μm, so that the layering effect is more obvious in the process of drying the electronic ink, the conductive connection structure further has a more distinct three-layer structure, and the first resin layer 41 and the second resin layer 43 have a better packaging effect on the first liquid metal layer 42.
In addition, an embodiment of the present invention further provides a manufacturing method of a conductive connection structure, which is used for manufacturing the conductive connection structure shown in fig. 6, and specifically, the manufacturing method of the conductive connection structure includes:
step S1, forming a circuit on the first substrate by the electronic ink.
Specifically, the circuit can be formed on the substrate by screen printing, spraying, printing, dispensing, screen printing, or the like.
And step S2, activating the line at a first temperature T1 to enable the liquid metal in the line to be aggregated and layered.
Wherein the first temperature T1 is higher than the melting point of the liquid metal and lower than the curing temperature of the oleoresin.
During the activation treatment, the oleoresin 2 in direct contact with the substrate in the circuit adheres to the substrate to form a layered structure, droplets formed by the liquid metal 1 precipitate and aggregate downwards to form a layered structure, and other oleoresin 2 is extruded upwards to form a layered structure.
Step S3, drying the circuit at a second temperature T2 to obtain a conductive connection structure;
wherein the second temperature T2 is greater than or equal to the curing temperature of the oleoresin.
The specific selection of the first temperature T1 and the second temperature T2 can be referred to the above description, and will not be described herein.
Specifically, in the structure shown in fig. 7, in the width direction thereof, the conductive connection structure 4 includes a liquid metal conductive portion 4a located at the center, two oleoresin portions 4b located on both sides of the liquid metal conductive portion 4a, and a mixed portion 4c located on a side of each oleoresin portion 4b away from the liquid metal conductive portion 4a, the oleoresin portions 4b have holes 4d inside, and the mixed portion 4c is composed of droplets formed by an oleoresin 2 and a liquid metal 1 wrapped with the oleoresin 2.
In addition, an embodiment of the present invention further provides a manufacturing method of a conductive connection structure, which is used for manufacturing the conductive connection structure shown in fig. 7, and specifically, the manufacturing method of the conductive connection structure includes:
Step S11, forming a circuit on the first substrate by the electronic ink.
Specifically, the circuit can be formed on the substrate by screen printing, spraying, printing, dispensing, flexography, screen printing, transfer printing, pad printing, and the like.
And step S12, drying the line at a second temperature T2 to solidify the line.
The second temperature T2 is greater than or equal to the curing temperature of the oleoresin, and the specific selection of the second temperature may be determined according to the foregoing content, which is not described herein again.
And step S13, cutting the solidified circuit from the middle along the extending direction of the circuit to obtain the conductive connection structure.
In the scribing process, the liquid metal near the scribing position flows out of the oleoresin, and is gathered to form a conductive path, so that the oleoresin on two sides of the conductive path is free of the liquid metal, and the liquid metal in the oleoresin at a position far away from the scribing position still remains and is wrapped by the oleoresin in the form of liquid drops. If the circuit is not divided, the circuit has poor conductivity or even is not conductive, and when the circuit has poor conductivity, namely, high resistance, the circuit can be used as a heating wire.
In the embodiment of the present invention, the conductive connection structure 4 shown in fig. 5, fig. 6 and fig. 7 is more suitable for electrical connection between conductive terminals with pins or probes, as shown in fig. 8, fig. 8 is a schematic diagram illustrating a result of the conductive connection structure provided in the embodiment of the present invention for connecting conductive terminals, and since no insulating substance is coated on the pins or probes of the conductive terminals 5, the conductive connection structure 4 is directly manufactured on the substrate 3 between two pins or probes by printing, etc., so that the electrical connection between two adjacent conductive terminals 5 can be realized.
The first substrate 3 may be provided with one or more conductive connection structures, which are not limited herein, and the specific shape of the conductive connection structure 4 may also be designed according to the components to be connected.
Optionally, the first substrate on which the conductive connection structure is located is a flexible substrate, such as PVC, PET, PU, PI, and the like, so that the conductive connection structure may be applied to a flexible circuit board (FPC) and other structures.
In addition, an embodiment of the present invention further provides a multilayer circuit, specifically, as shown in fig. 9 and fig. 10, fig. 9 is a top view of the multilayer circuit provided in the embodiment of the present invention, fig. 10 is a schematic cross-sectional view of fig. 9 along the AA' direction provided in the embodiment of the present invention, the multilayer circuit includes a second substrate 6, a first wire 7 and a second wire 8 located on the second substrate 6, the second wire 8 has a portion overlapping the first wire 7;
in the direction away from the second substrate 6, the first wiring 7 includes a third resin layer 71, a second liquid metal layer 72 on the third resin layer 71, and a fourth resin layer 73 on the second liquid metal layer 72:
the second wiring 8 includes a fifth resin layer 81, a third liquid metal layer 82 on the fifth resin layer 81, and a sixth resin layer 83 on the third liquid metal layer 82 in a direction away from the second substrate 6.
Due to the existence of the fourth resin layer 73 in the first circuit 7 and the existence of the fifth resin layer 81 in the second circuit 8, the multilayer circuit in the embodiment of the invention does not need to arrange an insulating layer between two layers of circuits, thereby simplifying the manufacturing process of the multilayer circuit, reducing the thickness and the cost of the multilayer circuit and being beneficial to expanding the application range of the multilayer circuit.
Of course, it is possible to determine whether electrical connection is required at the position where the first wire 7 and the second wire 8 overlap according to actual needs, and this is not limited herein.
In addition, an embodiment of the present invention further provides a method for manufacturing a multilayer circuit, and specifically, the method for manufacturing a multilayer circuit includes:
in step S10, a second substrate is provided.
Step S20, forming a first circuit pattern on a second substrate by the electronic ink as described in any one of the above.
Step S30, performing an activation process on the first line pattern at a first temperature T1 to cause the liquid metal in the first line pattern to aggregate and stratify.
And step S40, drying the first line pattern at a second temperature T2 to obtain a first line.
Step S50, forming a second circuit pattern on the second substrate by the electronic ink, the second circuit pattern having a portion overlapping the first circuit.
Step S60, performing an activation process on the second line pattern at a first temperature T1 to cause the liquid metal in the second line pattern to aggregate and stratify.
And step S70, drying the second line pattern at a second temperature T2 to obtain a second line.
The first temperature T1 is higher than the melting point of the liquid metal and lower than the curing temperature of the oleoresin, and the second temperature T2 is higher than or equal to the curing temperature of the oleoresin.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The electronic ink is characterized by consisting of liquid metal and oleoresin with fluidity, wherein the liquid metal is uniformly mixed with the oleoresin, and the oleoresin wraps liquid drops formed by the liquid metal; in the electronic ink, the weight ratio of the liquid metal to the oleoresin is as follows: 0.2: 1 to 50: 1.
2. The electronic ink of claim 1, wherein the liquid metal forms droplets having a diameter of 0.05 μm to 2 μm.
3. The electronic ink according to claim 1, wherein the oleoresin comprises a resin matrix and an auxiliary agent, the auxiliary agent at least for adjusting the fluidity of the oleoresin.
4. An electrically conductive connection structure on a first substrate, wherein the electrically conductive connection structure is made of the electronic ink according to any one of claims 1 to 3, and the electrically conductive connection structure comprises a first resin layer in contact with the first substrate, a first liquid metal layer on the first resin layer, and a second resin layer on the first liquid metal layer.
5. A method for manufacturing a conductive connection structure according to claim 4, wherein the method for manufacturing the conductive connection structure comprises:
step S1, forming a circuit on the first substrate by the electronic ink according to any one of claims 1 to 3;
step S2, activating the circuit at a first temperature T1 to enable liquid metal in the circuit to be gathered and layered;
Step S3, drying the circuit at a second temperature T2 to obtain the conductive connection structure;
wherein the first temperature T1 is higher than the melting point of the liquid metal and lower than the curing temperature of the oleoresin, and the second temperature T2 is higher than or equal to the curing temperature of the oleoresin.
6. The method as claimed in claim 5, wherein the first temperature T1 is related to the second temperature T2
7. A conductive connection structure, which is located on a first substrate, and is formed by manufacturing the electronic ink according to any one of claims 1 to 3, and in a width direction of the conductive connection structure, the conductive connection structure includes a liquid metal conductive part located in a center, two oleoresin parts located on two sides of the liquid metal conductive part, and a mixed part located on one side of each oleoresin part away from the liquid metal conductive part, the oleoresin parts have holes inside, and the mixed part is composed of droplets formed by the oleoresin and the liquid metal wrapped by the oleoresin.
8. A method for manufacturing the conductive connection structure according to claim 7, wherein the method for manufacturing the conductive connection structure comprises:
Step S11, forming a circuit on the first substrate by the electronic ink according to any one of claims 1 to 3;
step S12, drying the circuit at a second temperature to solidify the circuit;
and step S13, cutting the solidified circuit from the middle along the extending direction of the circuit to obtain the conductive connection structure.
9. A multilayer circuit comprising a second substrate, a first wiring and a second wiring on the second substrate, the second wiring having a portion overlapping the first wiring;
the first circuit comprises a third resin layer, a second liquid metal layer positioned on the third resin layer, and a fourth resin layer positioned on the second liquid metal layer along the direction far away from the second substrate;
the second circuit includes a fifth resin layer, a third liquid metal layer on the fifth resin layer, and a sixth resin layer on the third liquid metal layer in a direction away from the second substrate.
10. A method of making a multilayer circuit for making a multilayer circuit according to claim 9, the method comprising:
Providing a second substrate;
forming a first circuit pattern on the second substrate by the electronic ink as claimed in any one of claims 1 to 3;
performing an activation treatment on the first line pattern at a first temperature T1 to cause liquid metal in the first line pattern to aggregate and stratify;
drying the first circuit pattern at a second temperature T2 to obtain a first circuit;
forming a second wiring pattern on the second substrate by the electronic ink as claimed in any one of claims 1 to 3, the second wiring pattern having a portion overlapping the first wiring;
performing an activation process on the second line pattern at a first temperature T1 to cause liquid metal in the second line pattern to aggregate and stratify;
drying the second line pattern at a second temperature T2 to obtain a second line;
wherein the first temperature T1 is higher than the melting point of the liquid metal and lower than the curing temperature of the oleoresin, and the second temperature T2 is higher than or equal to the curing temperature of the oleoresin.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106467652A (en) * | 2015-08-21 | 2017-03-01 | 中国科学院理化技术研究所 | Conductive composite packaging material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106467652A (en) * | 2015-08-21 | 2017-03-01 | 中国科学院理化技术研究所 | Conductive composite packaging material and preparation method thereof |
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