CN101675137A - Adhesive resin composition and dicing die bonding film using the same - Google Patents
Adhesive resin composition and dicing die bonding film using the same Download PDFInfo
- Publication number
- CN101675137A CN101675137A CN200880014326A CN200880014326A CN101675137A CN 101675137 A CN101675137 A CN 101675137A CN 200880014326 A CN200880014326 A CN 200880014326A CN 200880014326 A CN200880014326 A CN 200880014326A CN 101675137 A CN101675137 A CN 101675137A
- Authority
- CN
- China
- Prior art keywords
- film
- resin composition
- adhesive resin
- composition according
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3209—Epoxy compounds containing three or more epoxy groups obtained by polymerisation of unsaturated mono-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Abstract
The present invention relates to an adhesive resin composition applied to prepare a semiconductor package, an adhesive film and its preparation process, a dicing die bonding film, and a semiconductordevice, using the same. The adhesive resin composition according to the present invention is characterized by comprising a) a multi-functional epoxy resin; b) a phenol resin, of which the moisture absorptivity is 2.0 % by weight or less, as treated in a condition of the temperature of 121 DEG C, 2 atms and 100% RH for 48 hours; and c) a thermoplastic resin. It has excellent bond strength with a wafer and filling property in a semi-curing state, so that the process fraction defective may be reduced. It has excellent heat resistance, hygroscopic resistance or reflow crack resistance, and the like in the cured state, so that semiconductor devices having excellent reliability may be prepared.
Description
Technical field
The present invention relates to a kind ofly be used to prepare the adhesive resin composition of semiconductor packages and bonding film, dicing die adhesive film (dicing die bonding film) and the semiconducter device that adopts the said composition preparation, and the preparation method of bonding film.According to adhesive resin composition of the present invention, it is characterized in that, comprise a) polyfunctional epoxy resin; B) resol, its rate of moisture absorption of 48 hours under the condition of 121 ℃, 2 normal atmosphere and 100%RH is 2.0wt% or lower; And c) thermoplastic resin.
Background technology
At present, along with the high integration and the multifunction of semiconductor memory, begin flash memory pack into mobile phone or mobile termination, the method for MCP (encapsulation of multicore sheet) is used in a large number, wherein a plurality of semi-conductor chips is laminated on the semiconductor substrate.In the MCP method, traditional liquid phase epoxidation glue (open Nos.H03-192178 of Japanese unexamined patent and H04-234472 etc.) bonding semiconductor chips and semiconductor substrate have been replaced with film sample tackiness agent.
Simultaneously, use the method for described film sample tackiness agent that membrane portions Method for bonding and chip back surface Method for bonding are arranged.
The membrane portions Method for bonding is that a kind of cutting or punching press film sample tackiness agent of comprising is to make it to become the part that adapts to chip, it is bonded to semiconductor substrate, takes off chip and the method for the matrix that bonds thereon from wafer, and the step by postorder, obtain semiconducter device as bonding wire and sealing step (the open No.H09-17810 of Japanese unexamined patent).
In the chip back surface Method for bonding, by film sample adhesives is arrived chip back surface, the dicing tape that further will have pressure sensitive adhesive layer again is bonded to not and chip back surface agglutinating opposite, cut described wafer to be separated into one chip, taking off chip and its matrix is bonded to semiconductor substrate, is bonding wire and sealing step then.Yet, in described chip back surface Method for bonding, have such as be difficult to transmit LED reverse mounting type, technology increase, be difficult to adapt to different thickness and size chip, be difficult to make the film attenuation and be used for problem such as high function semiconductor device reliability difference.
In order to solve described problem, a kind of method has been proposed, it comprises that the film that will have tackiness agent and pressure sensitive adhesive is adhered to chip back surface (Japanese unexamined patent open Nos.H02-32181, H08-53655 and H10-8001) as one deck.Described method is not carried out twice laminating technology, and can once carry out, and can not throw into question when the transportation wafer, because be equipped with the wafer ring of supporting wafers.In addition, ultraviolet hardening pressure sensitive adhesive and heat-curing type adhesive be blended in the dicing die bonding film that constitutes by pressure sensitive adhesive of one-described tackiness agent comprises the composition and the substrate of above-mentioned patent disclosure.Therefore, described pressure sensitive adhesive is used at the cutting process supporting wafers, and after the ultraviolet curing step its bond strength of forfeiture, so chip is easy to from the wafer removed.Simultaneously, described tackiness agent solidifies in the matrix adhesion step, and may make chip and semiconductor substrate bonding securely.Yet, react to each other use the problem that the dicing die adhesive film of described one exists substrate and chip can not peel off well in the process of taking off semi-conductor chip after the cutting by pressure sensitive adhesive layer and the pressure sensitive adhesive layer in the film from preparation.
Proposed the independent dicing die bonding film that a kind of pressure sensitive adhesive and tackiness agent separate, can be used as dicing tape in cutting step and the tackiness agent in the matrix adhesion step by dissolving it, to solve the problems referred to above of one film.In described independent dicing die adhesive film, pressure sensitive adhesive and tackiness agent pass through it is solidified with regard to separate easily with ultraviolet ray or heating behind cutting step, therefore it takes off in the step at semi-conductor chip and can not go wrong, and is that the thickness that reduces film in the matrix adhesion step is provided convenience.Yet, binder layer being pressed onto in the step of back surface of semiconductor wafer, heating steps is different with adding in the traditional method, and pressure sensitive adhesive at room temperature bonds, and has also caused considerable space.In addition, existing problems when heating, wafer is because high temperature is bent, and subsequent step is not easy to carry out, and the cohesive strength a little less than the slicing step chips is owing to tackiness agent comes off.Therefore, the reliability of semiconductor packages existing problems.Therefore, press for and develop a kind of semi-conductive adhesive resin composition that is used for, it has excellent cohesive strength or filling properties when under semi-cured state adhesive resin composition being coated on semiconductor packages, thereby can reduce the disqualification rate of processing, and after being prepared into solid-state commodity, it has excellent reliability such as thermotolerance, resistance to water soak and anti-backflow cracking behavior.
Summary of the invention
The invention is intended to satisfy the demand, one of purpose of the present invention provides a kind of semi-conductive adhesive resin composition that is used for, said composition has excellent cohesive strength or filling properties when semicure is coated on the adhesive resin composition of semiconductor packages, and said composition has excellent reliability such as thermotolerance, resistance to water soak and anti-backflow cracking behavior when it is solidified.
Another object of the present invention provides a kind of bonding film and preparation process thereof that comprises as the described adhesive resin composition of binder layer.
Another object of the present invention provides a kind of dicing die adhesive film, and it comprises described bonding film and dicing tape.
Another object of the present invention provides a kind of semiconductor wafer that uses described dicing die adhesive film.
Other purposes of the present invention provide a kind of semiconducter device that uses described bonding film.
Description of drawings
Fig. 1 is the cross-sectional view of bonding film according to an embodiment of the invention.
Fig. 2 is the cross-sectional view of dicing die adhesive film according to an embodiment of the invention.
Fig. 3 is the cross-sectional view of semiconducter device according to an embodiment of the invention.
Embodiment
To specifically illustrate according to adhesive resin composition of the present invention, bonding film, dicing die adhesive film, semiconductor wafer and semiconducter device successively.
Adhesive resin composition
According to adhesive resin composition of the present invention, it comprises
A) polyfunctional epoxy resin;
B) resol, its 121 ℃,, the following 48 hours rate of moisture absorption of condition of 2 normal atmosphere and 100%RH is 2.0wt% or lower; With
C) thermoplastic resin.
Hereinafter sets forth in detail the various components of this resin combination.
Used a) the polyfunctional epoxy resin of the present invention has no particular limits, as long as it solidifies to have bond property.The example of a) polyfunctional epoxy resin that the present invention uses can comprise the Resins, epoxy that contains 3 above functional groups, preferably, have 180～1, the Resins, epoxy of 000 average epoxy equivalent (weight), more preferably, independent cresols novolac epoxy resin, the bisphenol A-type novolac epoxy, phenol type novolac epoxy, 4 officials energy Resins, epoxy, biphenyl type epoxy resin, triphenol methane type Resins, epoxy, alkyl-modified triphenol methane type Resins, epoxy, naphthalene type Resins, epoxy, dicyclopentadiene-type epoxy resin or Dicyclopentadiene (DCPD) modified phenol type Resins, epoxy, or the mixture of above-mentioned two or more resins.If polyfunctional epoxy resin described herein average epoxy equivalent (weight) a) is lower than 180, be understandable that then it solidifies quick raising of back cross-linking density and has hardening.In addition, if described average epoxy equivalent (weight) has surpassed 1,000, be understandable that then its second-order transition temperature (Tg) can reduce.
Moistureproofness aspect at high temperature, the present invention uses b) resol, by pressure cooker test (Pressure Cooker Test) (PCT) when handling, be specially under the condition of 121 ℃, 2 normal atmosphere and 100%TH 48 hours, its rate of moisture absorption (moisture absorptivity) is below the 2.0wt%.In addition, when using described b) when resol prepared film, preferably, the rate of moisture absorption of film was below the 1.5wt%.
In addition, when measuring b as herein described by thermogravimetric analysis (TGA)) during resol, preferably, when under nitrogen atmosphere with the speed of 10 ℃/min when 50 ℃ are heated to 260 ℃, its weight loss is less than 10wt%.If the weight loss of resol is in above-mentioned scope, the amount of volatile constituent is slight in the course of processing, and therefore, reliability such as thermotolerance or moisture resistance can improve.
Aspect mobile, at the b as herein described of 150 ℃ of measurements) viscosity of resol is preferably below the 200cps.If use resol, then can in the course of processing, keep mobile preferably and have the filling properties of improvement with above-mentioned scope viscosity.In addition, because it at high temperature has excellent moistureproofness, the reliability of semiconductor packages can improve.The lower limit of described viscosity has no particular limits, but is preferably 80cps.
Aspect thermotolerance, multifunctional resol contains the phenolic hydroxyl functional group more than 3, and the present invention preferably adopts the resol with average hydroxyl equivalent of 100～500 as described b) resol.If described average hydroxyl equivalent is lower than 100, be understandable that the hardness of stiffening agent reduces and cohesive strength reduces.If described equivalent surpasses 500, be understandable that second-order transition temperature (Tg) reduces and the thermotolerance deterioration.
The preferred example of the resol that the present invention uses can comprise the resin by 1 expression of following general formula.
[general formula 1]
(wherein, n is 0～50 integer).
Preferred example by the resol of above-mentioned general formula 1 representative can comprise Dicyclopentadiene (DCPD) phenol type resol (to call " DPP " in the following text), and, in these, preferably be selected among DPP-6085, DPP-6095 and the DPP-6115 one or more.
Preferably, with respect to Resins, epoxy, based on equivalence ratio, in adhesive resin composition of the present invention, the amount of described resol is about 0.5～1.2 equivalent.Based on weight ratio, preferably, with respect to the described Resins, epoxy of 100 weight parts, the resol that comprises is 60～150 weight parts.If the amount of described resol is less than 60 weight parts, the epoxy group(ing) of remained unreacted and second-order transition temperature (Tg) reduce.Then,, be understandable that the reliability of semiconductor packages reduces because residual epoxy group(ing) is volatilized in the process of test high temperature reliability.In addition,, be understandable that because unreacted hydroxyl (OH) group, though cross-linking density increases, its rate of moisture absorption increases or the stability in storage deterioration if the amount of described resol surpasses 150 weight parts.
Thermoplastic resin used herein, aspect cohesive strength and thermotolerance, preferably, its second-order transition temperature (Tg) is that-60～30 ℃ and weight-average molecular weight are 100,000～1,000,000.By containing this kind thermoplastic resin, control flowability that can be when casting film, and can reduce Young's modulus to guarantee the snappiness of finished film.If described second-order transition temperature (Tg) is understandable that less than-60 ℃ because cohesive strength improves fast, processing characteristics and operability greatly reduce.If it surpasses 30 ℃, be understandable that cohesive strength reduces under the low temperature.If the weight-average molecular weight of thermoplastic resin used herein is understandable that less than 100,000, because the snappiness of bonding film or intensity reduces, the processing characteristics deterioration, and owing to flow during filling semiconductor substrate circuit and increase, mobile uncontrollable.In addition, if described weight-average molecular weight surpasses 1,000,000, be understandable that, because the mobile effect of control increases when diaphragm bonds, therefore, when there was unevenness in substrate surface, filling properties reduced, and the reliability of bonding film and circuit filling properties reduce.
Thermoplastic resin used herein can suitably be selected by any those skilled in the art in the invention.There is not concrete restriction, it is preferably and is selected from polyimide, polyetherimide, polyester-imide, polymeric amide, polyethersulfone, polyetherketone, polyolefine, polyvinyl chloride, phenoxy group (phenoxy), reactive acrylonitrile-butadiene copolymer rubber and the acrylic resin one or more, and more preferably, acrylic resin.
Preferably, described acrylic resin is the acrylic copolymer that comprises vinylformic acid and derivative thereof.The example of described vinylformic acid and derivative thereof can comprise vinylformic acid; Methacrylic acid; Alkyl acrylate with 1～12 carbon atom is as methyl acrylate or ethyl propenoate; Alkyl methacrylate with 1～12 carbon atom is as methyl methacrylate or Jia Jibingxisuanyizhi; Monomer such as vinyl cyanide or acrylamide and other copolymerisable monomers.In addition, preferably, described acrylic copolymer comprises one or more functional groups that are selected from glycidyl, hydroxyl, carboxyl and the itrile group.Monomeric preferred example with this functional group can comprise: (methyl) glycidyl acrylate, as situation with glycidyl; (methyl) crylic acid hydroxy ester or (methyl) Hydroxyethyl acrylate are as the situation with hydroxyl; Or (methyl) vinylformic acid carboxyl ester, as situation with carboxyl etc.
The amount of functional group is not particularly limited in the described acrylic copolymer, but preferably, with respect to 100 parts by weight of acrylic resins, is 0.5～10 weight part.If the amount of described functional group less than 0.5 weight fraction, then is difficult to prove conclusively cohesive strength.Equally, if it surpasses 10 weight parts, its bonding strength is too big so that reduced its processing characteristics, and therefore, this is the shortcoming that colloidization can't overcome.
With respect to 100 parts by weight of epoxy resin, the content of the thermoplastic resin that comprises in according to adhesive resin composition of the present invention is preferably 100～400 weight parts.If the amount of described thermoplastic resin is less than 100 weight fraction, to such an extent as to Young's modulus too high in preparation process resin combination be not easy to pour into a mould film forming shape, and flow during cast and be tending towards increasing.If it surpasses 400 weight parts, reduce to such an extent as to suppress the too high filling properties of mobile effect, and working ability at high temperature is tending towards deterioration.
The preparation method's process that is used for described thermoplastic resin can suitably be selected by those skilled in the art in the invention.Be not specifically limited, for example can use method as solution polymerization, letex polymerization or suspension polymerization.
In adhesive resin composition according to the present invention, can further comprise coupling agent.All resin Compositions with respect to 100 weight parts can contain 0.01～10 weight part, the described coupling agent of preferred 0.1～10 weight part.The sealing bonding at the semiconductor wafer of this paper or silica filler and interface can be by comprising described coupling agents to improve.In addition, the organo-functional group when cohesiveness and sealing bonding can be by curing reactions in the coupling agent improves with the reaction of resin composition, and does not influence the thermotolerance of stiffening agent, therefore, has also improved protection against the tide-thermotolerance.If the content of described coupling agent is less than 0.01 weight part, the sealing cohesive action deficiency of bonding film.If content surpasses 10 weight parts, be understandable that, because unreacted coupling agent can cause the space or reduce thermotolerance.
This paper available coupling agent is not particularly limited, as long as it shows above-mentioned effect, but the combination of preferred silane coupling agent, titanate coupling agent, aluminate coupling agent or above-mentioned two or more coupling agents, and silane coupling agent more preferably, because of its cost performance height.The preferred example of described silane coupling agent is for being selected from aminosilane, epoxy silane, hydrosulphonyl silane, urea groups silane, 2-methacryloxy silane, vinyl silanes, glycidoxy silane and the sulphur bridge silane (sulfido silane) one or more.
The preferred example of described aminosilane can include but not limited to, N-β-(aminoethyl)-γ-An Bingjisanjiayangjiguiwan, N-β-(aminoethyl)-γ-aminopropyl methyl dimethoxysilane, γ-An Bingjisanyiyangjiguiwan, 3-aminopropyl methyldiethoxysilane, 3-aminopropyl trimethoxysilane, 3-aminopropyl three (2-methoxyl group-oxyethyl group-oxyethyl group) silane, N-methyl-3-aminopropyl trimethoxysilane, three aminopropyls-Trimethoxy silane or N-phenyl-γ-An Bingjisanjiayangjiguiwan; The preferred example of described epoxy radicals silicone hydride includes, but not limited to β-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane; The preferred example of described hydrosulphonyl silane includes, but not limited to γ sulfydryl propyl trimethoxy silicane, 3-sulfydryl propyl group-methyl dimethoxysilane or γ sulfydryl propyl-triethoxysilicane; The preferred example of described urea groups silane includes, but not limited to 3-urea groups propyl-triethoxysilicane or 3-urea groups propyl trimethoxy silicane; The preferred example of described methacryloxy silane includes, but not limited to γ methacryloxypropyl trimethoxy silane, 3-methacryloxypropyl-Trimethoxy silane or γ methacryloxypropyl methyl dimethoxysilane; The preferred example of described vinyl silanes includes, but not limited to vinyl methyl dimethoxysilane, vinyl trichloro silane, vinyl three (β methoxy ethoxy) silane, vinyltriethoxysilane or vinyltrimethoxy silane etc.; The preferred example of described glycidoxy silane includes, but not limited to γ glycidoxypropyltrime,hoxysilane, γ glycidoxy propyl group methyl dimethoxysilane or γ glycidoxy propyl group methyldiethoxysilane.
With respect to 100 weight part Resins, epoxy, can further comprise 0.1～10 weight part according to adhesive resin composition of the present invention, the hardening accelerator of preferred 0.5～5 weight part, and the sclerous reaction of resin combination can be quickened by comprising described hardening accelerator.If the amount of described hardening accelerator is less than 0.1 weight part, the crosslinked deficiency of Resins, epoxy is so that thermotolerance is tending towards decline.If it surpasses 10 weight parts, be understandable that sclerous reaction is finished rapidly, therefore, stability in storage reduces.
This paper available hardening accelerator is not particularly limited, as long as it is that the field is commonly used under the present invention, is selected from imidazolium compounds, triphenylphosphine (TTP) and the tertiary amine one or more but can use.The preferred imidazolium compounds that uses.The preferred example of described imidazolium compounds can comprise, but be not limited to, be selected from glyoxal ethyline (2MZ), 2-ethyl-4-methylimidazole (2E4MZ), 2-phenylimidazole (2PZ), 1-cyanoethyl-2-phenylimidazole (2PZ-CN), 2-undecyl imidazole (C11Z), 2-heptadecyl imidazoles (C17Z) and the 1-cyanoethyl-2-phenylimidazole trimellitate (2PZ-CNS) one or more.
Aspect improving working ability and thermotolerance and controlling melt viscosity, with respect to the solid resin of 100 weight parts, this resin combination can further comprise the filler of 5～100 weight parts.If the amount of described filler is understandable that less than 5 weight parts, improve the effect deficiency of thermotolerance and working ability by the interpolation filler.If it surpasses 100 weight parts, be understandable that, improve the close-burning effect reduction of working ability and sealing.
The kind of described filler can comprise organic filler or mineral filler, preferred mineral filler with regard to characteristic.Described mineral filler can comprise and is selected from silicon-dioxide, talcum, aluminium hydroxide, lime carbonate, magnesium hydroxide, aluminum oxide and the aluminium nitride one or more.The preferred preparing spherical SiO 2 of root is because of it has good dispersiveness and uniform cohesive strength in film in resin combination.
The median size of described filler has no particular limits, but is preferably 10～1,000nm.If described footpath be understandable that less than 10nm, filler is easily attached on the bonding film and cause macroscopic irregularity.If it surpasses 1,000nm is understandable that, the filler in the bonding film can be projected into the film surface, and when being hot-pressed onto film on the wafer, meeting defective chip or reduction improve the effect of adhesiveproperties.
Bonding film
The invention still further relates to a kind of bonding film, it comprises
Basilar membrane; With
Binder layer, it forms on described basilar membrane, and comprises according to adhesive resin of the present invention.This bonding film comprises according to adhesive resin composition of the present invention, wherein said composition comprises b) resol, described like this bonding film has excellent cohesive strength and filling properties in semi-cured state, and described bonding film uses c) thermoplastic resin and filler, make it have excellent thermotolerance, anti-water absorbability and anti-backflow cracking behavior etc. like this.
With reference to Fig. 1, illustrate according to bonding film of the present invention.
Basilar membrane (10) as according to bonding film of the present invention can use plastic film such as polyethylene terephthalate film, poly tetrafluoroethylene, polyethylene film, polypropylene screen, polybutene film, polyhutadiene film, vinyl chloride copolymer film or polyimide film.In addition, preferably at the surface-coated anti-stick coating of described basilar membrane.The release agent that is used for the surface anti sticking coating can comprise the release agent based on alkyd, siloxanes, fluorochemical, unsaturated ester, polyolefine or wax, and because of its thermotolerance most preferably based on the release agent of alkyd, siloxanes or fluorine.
The thickness of basilar membrane is preferably 10～500 μ m, and 20～200 μ m more preferably.If described thickness is less than 10 μ m, coat film and can cause excessive elongation when solidifying on substrate.If it surpasses 500 μ m, then it is uneconomic.
The binder layer of described bonding film (20) comprises according to adhesive resin composition of the present invention, and when described bonding film is bonded to semiconductor wafer at low temperatures, the formation of hole is minimized thus, and the high bond strength of maintenance and wafer is scattered to prevent the cutting process chips.
The thickness of described binder layer is not particularly limited, but the thickness of heat curable adhesive layer is preferably 5～200 μ m, more preferably 10～100 μ m.If thickness is less than 5 μ m, the effect that discharges stress under the high temperature is impaired.If it surpasses 200 μ m, then it is uneconomic.
In addition, described binder layer (20) can form on a surface of basilar membrane (10), with the bilayer structure of formation basilar membrane/binder layer or the three-decker of binder layer/basilar membrane/binder layer or basilar membrane/binder layer/basilar membrane.
The invention still further relates to the preparation method of bonding film of the present invention.
The preparation method of described bonding film is characterised in that it comprises
First step prepares resinous varnish by dissolving or dispersing binder resin combination in solvent;
Second step is coated on basilar membrane with described resinous varnish; And
Third step, the basilar membrane that is coated with described resinous varnish by heating comes except that desolvating.
The first step according to the method for the invention is to adopt adhesive resin composition according to the present invention to prepare the step of resinous varnish.
For the solvent of described varnish, can use the combination of methylethylketone (MEK), acetone, toluene, dimethyl formamide (DMF), methyl Cellosolve (MCS), tetrahydrofuran (THF) (THF), N-Methyl pyrrolidone (NMP) or above-mentioned two or more solvents etc. usually.Consider the thermotolerance of basilar membrane, the preferred use has lower boiling solvent.But,, also can use to have high boiling solvent in order to improve the performance of film.
In addition, in order to shorten process period or the good dispersion of acquisition in bonding film, filler also can be used in the described first step.When using filler, described first step can comprise
(a) step of mixed solvent, filler and coupling agent;
(b) Resins, epoxy and resol are joined in the mixture of described step (a) and its blended step; And
(c) with the mixture blended step of thermoplastic resin and hardening accelerator and described step (b).
The example of described filler can comprise independent ball milling, pearl mill (Bead Mill), three rollers or high speed dispersion agent or aforementioned two or more combination.Ball or pearl are to be made by glass, aluminum oxide or zirconium etc.With regard to particulate is dispersed, the preferred ball or the pearl of making by zirconium.
According to second step among the preparation method of bonding film of the present invention for described resinous varnish being coated on step on the basilar membrane.
The method of coated with resins varnish has no particular limits on described basilar membrane.Can use method commonly used in the technical field of the present invention.For example can use scraper coating method, rolling method, spraying method, gravure coating method, curtain coating, comma coating method (comma coat method) or flange coating method (lip coat method) etc.
In the step that removes solvent according to the third step among the preparation method of bonding film of the present invention for the basilar membrane that is coated with described resinous varnish by heating.At this moment, preferably under 70～250 ℃, heated 5～20 minutes.The thickness of heat curable adhesive layer is preferably 5～200 μ m behind varnish coating, more preferably 10～100 μ m.
The dicing die adhesive film
The invention still further relates to a kind of dicing die adhesive film, it comprises
Dicing tape; With
Be laminated to the bonding film according to the present invention on the described dicing tape.
Illustrate according to dicing die adhesive film of the present invention with reference to Fig. 2.
Preferably, described dicing tape comprises
Basilar membrane (40); And
Pressure sensitive adhesive layer (30), it is formed on the described basilar membrane.
As the basilar membrane (40) of dicing tape, can use polyethylene film, polypropylene screen, poly tetrafluoroethylene, polyethylene terephthalate film, polyurethane film, ethylene vinyl acetate film (ethylene vinylacetone film), ethylene-propylene copolymer film, ethylene-ethyl acrylate copolymer film (ethylene-acrylic acid ethyl copolymer) or ethylene-methyl acrylate copolymer film (ethylene-acrylic acid methyl copolymer film) etc.If necessary, preferably carry out the surface treatment handled as priming paint coating, corona treatment, etch processes or UV.When pressure sensitive adhesive is that it also can be selected from the material with good optical transparency when shining curing with UV.
The thickness of the basilar membrane of described dicing tape has no particular limits.But, consider working ability or packaging process, be preferably 60～160 μ m, more preferably 80～120 μ m.
Pressure sensitive adhesive layer (30) as dicing tape can use ultraviolet-cured pressure-sensitive adhesive agent commonly used or thermofixation pressure sensitive adhesive.When being the ultraviolet-cured pressure-sensitive adhesive agent, improving in it poly-gravitation with ultraviolet ray and reduce bonding strength by it being shone from basilar membrane one side.When for the thermofixation pressure sensitive adhesive, reduce bonding strength by heating.
Can comprise the method for lamination dicing tape and bonding film and to its laminated method etc. according to the preparation method of dicing die adhesive film of the present invention.From the angle of quantity-produced ability and efficient, cast coating is preferred.In addition, be 0.1～10Kgf/cm preferably at pressure
2, temperature is to carry out hot-roll lamination under 10～100 ℃ the condition.
When will dicing die adhesive film according to the present invention being bonded in when cutting on the semiconductor wafer, it has excellent cohesive strength, to prevent that chip is scattered, and bonding film strips off easily picking up step (pick-up), therefore in that it has excellent filling properties to semiconductor substrate the time with chip attach.Therefore, can provide semiconductor packages with excellent package reliability.
Semiconductor wafer
The invention still further relates to semiconductor wafer, wherein, will be bonded in the one side of wafer, and the dicing tape of described dicing die adhesive film is fixed on the wafer annular frame according to the bonding film of dicing die adhesive film of the present invention.
By with the back side of the bonding film of dicing die adhesive film and semiconductor wafer as the condition of 0～180 ℃ laminating temperature under bond, and the dicing tape of described dicing die adhesive film is fixed on the wafer annular frame, can prepare such semiconductor wafer.
Semiconducter device
In addition, the present invention relates to a kind of semiconducter device, it comprises
Circuit board (50);
Bonding coat (20), it comprises that according to binder composition of the present invention this bonding coat is glued to the one side that described circuit board loads chip; And
Be installed to the semi-conductor chip (1) on the described bonding coat.
The preparation method of described semiconducter device illustrates as follows.
Adopt cutting unit, the semiconductor wafer that aforementioned dicing die adhesive film is adhered to cuts fully to be divided into independently chip.
Then, when dicing tape is the ultraviolet-cured pressure-sensitive adhesive agent, by solidifying from basilar membrane one side irradiation ultraviolet ray.When for the thermofixation pressure sensitive adhesive, solidify by heating up.Coming in the solidified pressure sensitive adhesive with ultraviolet ray or heating as mentioned above, the sealing cohesive strength of tackiness agent reduces, thereby picking up of operation chips afterwards is easy to carry out.At this moment, if necessary, the dicing die adhesive film can extend.If carry out such extension step, interval between the chip enlarges, make to pick up easily and carry out, thereby and the creep of bonding coat and pressure sensitive adhesive layer produce and improve pickup capacity.
Then, carry out chip pickup.Then, can be from the binder layer stripping semiconductor wafer of dicing die adhesive film and the pressure sensitive adhesive layer of dicing die adhesive film, to obtain the chip that only is stained with binder layer.With the bonding that obtains the chip attach of described binder layer to semiconductor substrate.The sticking temperature of chip is generally 100～180 ℃, and tack time is 0.5～3 second, and cohesive pressure is 0.5～2Kgf/cm
2
Carry out according to described method, obtain semiconducter device by line weldering (bonding) and sealing (molding) step.
The preparation method of semiconducter device is not limited only to above-mentioned steps, also can comprise any step and change the order of step.For example, also can cut by ultraviolet curing-extension step or cutting extension-ultraviolet curing step carry out.According to the chip attach step, can further include heating or refrigerative step.
Embodiment
Below, will be by according to embodiments of the invention with do not illustrate the present invention in more detail according to comparative example of the present invention.Yet scope of the present invention is not limited to the scope of the following examples representative.
The preparation of acrylic resin
With 150g butyl acrylate, 200g ethyl propenoate, 140g vinyl cyanide, 16g glycidyl methacrylate and 1, the 500g deionized-distilled water join have agitator, in the 4-neck 3L reactor of nitrogen replaceable equipment and thermometer.As suspension agent, and add the 0.3g lauryl mercaptan to the water diluent that wherein adds 4g 4% polyvinyl alcohol (trade(brand)name: NH-17, by Nippon Ghosei produce), with the preparation mixture as molecular weight regulator.In mixture, carried out nitrogen replacement about 1 hour, and elevated temperature to 55 ℃.When arriving design temperature, add 4g peroxide heavy carbonic ethylhexyl by being diluted to 2% at vinyl acetic monomer (trade(brand)name: Trigonox EHP, produce) and come initiated polymerization as initiator by Akzo Nobel.Cause after 4 hours and should reaction finish.Reactant cleans for several times with deionized-distilled water, uses whizzer and vacuum drying oven drying to obtain polymer beads then.Yield is 90%, records molecular weight (M by gel permeation chromatography
w) be 700,000, molecular weight distribution is 3.0 and to record second-order transition temperature (Tg) with DSC (dsc) be 5 ℃.Be dissolved in the resulting polymers particle in the methylethylketone and be used for applying.
The preparation of adhesive resin composition, bonding film and dicing die adhesive film
The cresol-novolac epoxy resin of adding 100 weight parts in methylethylketone (EOCN-1020-55, by Nippon Kayaku Co., Ltd. produces; Epoxy equivalent (weight): 199, softening temperature: 55 ℃) as Resins, epoxy, the DPP-6115 of 90 weight parts is (by Kolong Industries, Inc. produce, hydroxyl equivalent: 180, softening temperature: 115 ℃, at 121 ℃, the following 48 hours rate of moisture absorption of condition of 2 normal atmosphere and 100%RH: 1.0wt%) as resol, the thermoplastic resin by method for preparing of 150 weight parts, 0.5 the 2-of weight part phenyl-4-methyl-5-hydroxymethyl-imidazole (2P4MHZ, produce by Shikoku ChemicalsCorporation) as hardening accelerator, γ-the glycidoxypropyltrime,hoxysilane of 2 weight parts (KBM-403 is produced by Shin-Etsu Chemical) is as UFP-80 (DENKA, the preparing spherical SiO 2 of coupling agent and 30 weight parts, median size: 75nm) as filler, stirring also mixes with preparation varnish.
Described varnish is coated on the basilar membrane that thickness is 38 μ m (release polyester film, RS-21G are produced by SKC), and was the bonding film of 20 μ m with the preparation thickness in 3 minutes 160 ℃ of dryings.Then, use laminating machine (making) by Fujishoko, with described bonding film at 5Kgf/cm
2, 30 ℃ of lower floors are pressed onto dicing tape (SLIONTEC6360-50) and go up to obtain the dicing die adhesive film.
Embodiment 2
Except the Dicyclopentadiene (DCPD) modified epoxy that uses 100 weight parts (XD-1000L, by NipponKayaku Co., Ltd. produces; Epoxy equivalent (weight): 253, softening temperature: 74 ℃) as the DPP-6115 of Resins, epoxy and 70 weight parts as outside the resol, prepare film in the mode identical with embodiment 1.
Embodiment 3
Except the naphthol type novolac epoxy that uses 100 weight parts (NC-7300L, by NipponKayaku Co., Ltd. produces; Epoxy equivalent (weight): 215, softening temperature: 62 ℃) as the DPP-6115 of Resins, epoxy and 85 weight parts as outside the resol, prepare film in the mode identical with embodiment 1.
Embodiment 4
(by Kolong Industries, Inc. produces except the DPP-6085 that uses 85 weight parts; Hydroxyl equivalent: 168, softening temperature: 87 ℃, the rate of moisture absorption of handling under 121 ℃, 2 normal atmosphere and 100%RH condition 48 hours is 1.5wt%) as resol outside, prepare film in the mode identical with embodiment 1.
The comparative example 1
Except the bisphenol A epoxide resin that uses 100 weight parts (YD-128, by Kukdo ChemicalCo., Ltd. produces; Epoxy equivalent (weight): 187) as the DPP-6115 of Resins, epoxy and 100 weight parts as outside the resol, prepare film in the mode identical with embodiment 1.
The comparative example 2
Except the phenol type resol that uses 50 weight parts (KPH-F2001, by Kolong Industries, Inc. produces; Hydroxyl equivalent: 106, softening temperature: 84 ℃, the rate of moisture absorption of handling under the condition of 121 ℃, 2 normal atmosphere and 100%RH 48 hours is 4.5wt%) as resol outside, prepare film in the mode identical with embodiment 1.
The comparative example 3
Except the bisphenol A-type resol that uses 60 weight parts (Phenolite VH-4170, by Kangnam Chemical Co., Ltd. produces; Hydroxyl equivalent: 118, softening temperature: 105 ℃, the rate of moisture absorption of handling under 121 ℃, 2 normal atmosphere and 100%RH condition 48 hours is 5.2wt%) as resol outside, prepare film in the mode identical with embodiment 1.
The comparative example 4
Except the Xylok resin that uses 90 weight parts (KPH-F3075, by Kolong Industries, Inc. produces; Hydroxyl equivalent: 175, softening temperature: 75 ℃, the rate of moisture absorption of handling under 121 ℃, 2 normal atmosphere and 100%RH condition 48 hours is 3.2wt%) as resol outside, prepare film in the mode identical with embodiment 1.
The rate of moisture absorption of described embodiment and comparative example's the composition and the resol of above-mentioned use and weight loss are presented at respectively in following table 1 and 2.
Table 1
(Ex.: embodiment; C.Ex.: the comparative example)
Table 2
* rate of moisture absorption is to handle to record in 48 hours under 121 ℃, 2 normal atmosphere and 100%RH condition
* weight loss is that the speed with 10 ℃/mi n records when 50 ℃ are heated to 260 ℃ under nitrogen atmosphere
About embodiment 1～4 and comparative example 1～4, its physical properties is measured according to following method, and it the results are shown in Table 3.
[film evaluation method]
(1) cohesive strength
In being set to 60 ℃ adhesive tape fitting machine (tape mounter) (Hugle Electronics Inc.) with 8 inches silicon wafers and matrix adhesive film lamination 10 seconds.Use TA.XT Plus structural analysis instrument (StableMicro Systems Ltd.),, measure the cohesive strength of above-mentioned matrix adhesive film being that 5mm/s and peel angle are under 180 ° the condition as peeling rate.
(2) filling properties
The PCB that will have 10 μ m difference of altitude is as substrate.(20 μ m) is cut to 25mm * 25mm with the matrix adhesive film, and descends and the chip laminations at 60 ℃ in adhesive tape fitting machine (Hugle Electronics Inc.).The chip of bondd PCB and matrix adhesive film was pushed 1 second under the pressure of 130 ℃ of 1.5Kg.Film flows out and the amount that is filled into PCB pattern space calculates filling ratio by calculating.The method of estimating filling properties is as follows.
◎: filling ratio: surpass 60%
Zero: filling ratio: 30～60%
*: filling ratio: less than 30%
(3) rate of moisture absorption of film
The weight (A) of 2 hours film is solidified in measurement in 190 ℃ of baking ovens, use PCT equipment (Hirayama Manufacturing Corporation) after handling 48 hours under the 121 ℃/100%RH/2 normal atmosphere and removing its surperficial moisture, measure its weight (B).Bring above-mentioned observed value in the following equation (1) calculating rate of moisture absorption.
Equation (1)--rate of moisture absorption (wt%)=([B-A] * 100)/A
(4) moistureproofness
Use PCT equipment will with the film of wafer bonding after handling 72 hours under 121 ℃, 100%RH and 2 normal atmosphere, observe whether to cause and peel off.The mode of estimating is as follows.
Zero: do not cause and peel off
*: cause and peel off
(5) IR reflux test
Chip and PCB are bonded on the matrix adhesive film, and it is solidified 2 hours down with preparation semiconductor packages sample at 180 ℃.Use heat towards tester (DIMOS TECH Co., Ltd.), with this sample place-65 ℃ following 15 minutes, under 150 ℃ of atmosphere 15 minutes then, and repeat this step 5 time.Then, it was put in 85 ℃ and 85% the humidity cabinet 72 hours, by IR backflow instrument the maximum surface temperature of sample is set in 260 ℃ and continues 30 seconds, place under the room temperature and cooling, repeat this and handle 3 times.Then, with the crack in the above-mentioned sample of ultrasonic microscope (SAT) observation.The mode of estimating is as follows.
Zero: do not cause and peel off or crack etc.
*: cause and peel off or crack etc.
Table 3
Shown in the table 2, can confirm as above, compare that the bonding film of embodiment 1～4 prepared in accordance with the present invention has excellent physicals in semi-cured state and solid state with comparative example 1～4 bonding film.
In addition, slightly variant according to the kind cohesive strength and the filling properties of Resins, epoxy in use comprises film according to the resol of general formula 1 of the present invention, but it has demonstrated the level that does not cause any problem man-hour adding.Therefore, because low rate of moisture absorption can be guaranteed its excellent results in moistureproofness and anti-backflow.On the other hand, when being when using the comparative example 1 of bifunctional epoxy resin rather than polyfunctional epoxy resin, has guaranteed cohesive strength and filling properties to a certain degree, but can confirm, aspect reliability, have problems owing to low heat resistant.Also can confirm to have existing problems among the comparative example 2 and 3 of resol of high hydroscopicity in use.When use has low weight loss but during the comparative example 4 of the resol of high hydroscopicity, it has anti-preferably backflow, but aspect moistureproofness existing problems.
[industrial practicality]
The bonding film of semiconductor according to the present invention semi-cured state have excellent wafer bonding intensity and Fill performance, thereby can reduce the disqualification rate of processing. After solid state prepares semiconductor packages, It has excellent heat resistance, anti-hygroscopicity or anti-backflow cracking behavior etc., has excellence thereby can prepare The semiconductor devices of reliability.
Claims (38)
1, a kind of adhesive resin composition, it comprises:
A) polyfunctional epoxy resin;
B) resol, its rate of moisture absorption of handling 48 hours under the condition of 121 ℃, 2 normal atmosphere and 100%RH is 2.0wt% or lower; With
C) thermoplastic resin.
2, adhesive resin composition according to claim 1,
Wherein, the average epoxy equivalent (weight) of described polyfunctional epoxy resin is 180～1,000.
3, adhesive resin composition according to claim 1,
Wherein, described polyfunctional epoxy resin be selected from cresols novolac epoxy resin, bisphenol A-type novolac epoxy, phenol type novolac epoxy, 4-official can Resins, epoxy, in biphenyl type epoxy resin, triphenol methane type Resins, epoxy, alkyl-modified triphenol methane type Resins, epoxy, naphthalene type Resins, epoxy, dicyclopentadiene-type epoxy resin and the Dicyclopentadiene (DCPD) modified phenol type Resins, epoxy one or more.
4, adhesive resin composition according to claim 1,
Wherein, described resol under nitrogen atmosphere with the speed of 10 ℃/min when 50 ℃ are heated to 260 ℃ weight loss less than 10%.
5, adhesive resin composition according to claim 1,
Wherein, described resol has the viscosity below the 200cps under 150 ℃ temperature.
6, adhesive resin composition according to claim 1,
Wherein, described resol has 100～500 average hydroxyl equivalent.
7, adhesive resin composition according to claim 1,
Wherein, described resol is represented by general formula 1:
[general formula 1]
Wherein, n is 0～50 integer.
8, adhesive resin composition according to claim 7,
Wherein, described resol is Dicyclopentadiene (DCPD) phenol type resol.
9, adhesive resin composition according to claim 1,
Wherein, with respect to the described Resins, epoxy of 100 weight parts, contain the described resol of 60～150 weight parts.
10, adhesive resin composition according to claim 1,
Wherein, described thermoplastic resin has-60～30 ℃ second-order transition temperature and 100,000～1,000,000 weight-average molecular weight.
11, adhesive resin composition according to claim 10,
Wherein, described thermoplastic resin is to be selected from polyimide, polyetherimide, polyester-imide, polymeric amide, polyethersulfone, polyetherketone, polyolefine, polyvinyl chloride, phenoxy group, reactive acrylonitrile-butadiene copolymer rubber and the acrylic resin one or more.
12, adhesive resin composition according to claim 11,
Wherein, described acrylic resin is to comprise one or more monomeric acrylic copolymer that are selected from vinylformic acid, methacrylic acid, acrylate, methacrylic ester, vinyl cyanide and the acrylamide.
13, adhesive resin composition according to claim 12,
Wherein, described acrylic copolymer comprises one or more functional groups that are selected from glycidyl, hydroxyl, carboxyl and the itrile group.
14, adhesive resin composition according to claim 13,
Wherein, with respect to the described acrylic resin of 100 weight parts, the amount of functional group described in the described acrylic copolymer is 0.5～10 weight part.
15, adhesive resin composition according to claim 1,
Wherein, with respect to the described Resins, epoxy of 100 weight parts, the content of described thermoplastic resin is 100～400 weight parts.
16, adhesive resin composition according to claim 1, with respect to all resins component of 100 weight parts, described composition further comprises the coupling agent of 0.01～10 weight part.
17, adhesive resin composition according to claim 16,
Wherein, described coupling agent is to be selected from silane coupling agent, titanate coupling agent and the aluminate coupling agent one or more.
18, adhesive resin composition according to claim 17,
Wherein, described silane coupling agent is to be selected from aminosilane, epoxy silane, hydrosulphonyl silane, urea groups silane, methacryloxy silane, vinyl silanes, glycidoxy silane and the sulphur bridge silane one or more.
19, adhesive resin composition according to claim 1, with respect to the described Resins, epoxy of 100 weight parts, described composition further comprises the hardening accelerator of 0.1～10 weight part.
20, adhesive resin composition according to claim 19,
Wherein, described hardening accelerator is for being selected from imidazolium compounds, triphenylphosphine (TTP) and the tertiary amine one or more.
21, adhesive resin composition according to claim 20,
Wherein, described imidazolium compounds is to be selected from glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazoles and the 1-cyanoethyl-2-phenylimidazole trimellitate one or more.
22, adhesive resin composition according to claim 1,
Wherein, with respect to the solid resin of 100 weight parts, described composition further comprises the filler of 5～100 weight parts.
23, adhesive resin composition according to claim 22,
Wherein, described filler is to be selected from silicon-dioxide, talcum, aluminium hydroxide, lime carbonate, magnesium hydroxide, aluminum oxide and the aluminium nitride one or more.
24, adhesive resin composition according to claim 22,
Wherein, described filler has 10～1, the median size of 000nm.
25, a kind of bonding film, it comprises:
Basilar membrane; With
Binder layer, it forms on described basilar membrane and comprises according to any described adhesive resin composition in the claim 1～24.
26, bonding film according to claim 25,
Wherein, described basilar membrane is polyethylene terephthalate film, poly tetrafluoroethylene, polyethylene film, polypropylene screen, polybutene film, polyhutadiene film, vinyl chloride copolymer film or polyimide film.
27, bonding film according to claim 25,
Wherein, handle by being selected from based on one or more release agents in the release agent of alkyd, siloxanes, fluorochemical, unsaturated ester, polyolefine or wax on the surface of described basilar membrane.
28, bonding film according to claim 25,
Wherein, described basilar membrane has the thickness of 10～500 μ m.
29, bonding film according to claim 25,
Wherein, described binder layer has the thickness of 5～200 μ m.
30, a kind of method for preparing bonding film, it comprises:
First step prepares resinous varnish by dissolving in solvent or dispersion according to each described adhesive resin composition in the claim 1～24;
Second step is coated on described resinous varnish on the basilar membrane; And
Third step, the basilar membrane that is coated with described resinous varnish by heating comes except that desolvating.
31, the method for preparing bonding film according to claim 30,
Wherein, described first step comprises:
(a) step of mixed solvent, filler and coupling agent;
(b) Resins, epoxy and resol are joined in the mixture of described step (a) and they blended steps; And
(c) with the mixture blended step of thermoplastic resin and hardening accelerator and described step (b).
32, a kind of dicing die adhesive film, it comprises:
Dicing tape; With
Be laminated to the bonding film according to claim 25 on the described dicing tape.
33, dicing die adhesive film according to claim 32,
Wherein, described dicing tape comprises:
Basilar membrane; With
Be formed at the pressure sensitive adhesive layer on the described basilar membrane.
34, dicing die adhesive film according to claim 33,
Wherein, described basilar membrane is polyethylene film, polypropylene screen, poly tetrafluoroethylene, polyethylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ethylene-propylene copolymer film, ethylene-ethyl acrylate copolymer film or ethylene-methyl acrylate copolymer film.
35, dicing die adhesive film according to claim 33,
Wherein, by one or more methods that are selected from priming paint coating, corona treatment, etch processes and the UV processing surface treatment is carried out on the surface of described basilar membrane.
36, dicing die adhesive film according to claim 33,
Wherein, described pressure sensitive adhesive layer is ultraviolet-cured pressure-sensitive adhesive agent or thermofixation pressure sensitive adhesive.
37, a kind of semiconductor wafer wherein, is bonded in the one side of wafer with the bonding film of dicing die adhesive film according to claim 32, and the dicing tape of described dicing die adhesive film is fixed on the wafer annular frame.
38, a kind of semiconducter device, it comprises:
Circuit board;
Bonding film according to claim 25, it is glued to the one side that described circuit board loads chip; And
Be installed to the semi-conductor chip on the described bonding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510091685.XA CN104745131A (en) | 2007-04-30 | 2008-04-29 | Adhesive Resin Composition And Dicing Die Bonding Film Using The Same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070042017 | 2007-04-30 | ||
| KR1020070042017A KR101082448B1 (en) | 2007-04-30 | 2007-04-30 | Adheisive resin composition and dicing die bonding film using the same |
| PCT/KR2008/002429 WO2008133472A1 (en) | 2007-04-30 | 2008-04-29 | Adhesive resin composition and dicing die bonding film using the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510091685.XA Division CN104745131A (en) | 2007-04-30 | 2008-04-29 | Adhesive Resin Composition And Dicing Die Bonding Film Using The Same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101675137A true CN101675137A (en) | 2010-03-17 |
Family
ID=39925868
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510091685.XA Pending CN104745131A (en) | 2007-04-30 | 2008-04-29 | Adhesive Resin Composition And Dicing Die Bonding Film Using The Same |
| CN200880014326A Pending CN101675137A (en) | 2007-04-30 | 2008-04-29 | Adhesive resin composition and dicing die bonding film using the same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510091685.XA Pending CN104745131A (en) | 2007-04-30 | 2008-04-29 | Adhesive Resin Composition And Dicing Die Bonding Film Using The Same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101082448B1 (en) |
| CN (2) | CN104745131A (en) |
| WO (1) | WO2008133472A1 (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103827162A (en) * | 2011-09-29 | 2014-05-28 | 日立化成株式会社 | Epoxy resin composition and electronic component device |
| CN103987799A (en) * | 2011-10-25 | 2014-08-13 | 3M创新有限公司 | Corrosion, chip and fuel resistant coating composition |
| CN105264033A (en) * | 2014-01-03 | 2016-01-20 | 株式会社Lg化学 | Dicing film and dicing die bonding film |
| CN105255110A (en) * | 2015-10-21 | 2016-01-20 | 安徽亚南电缆厂 | High-temperature-resistant and anti-ageing insulating base layer used for cables |
| CN105315940A (en) * | 2015-10-26 | 2016-02-10 | 益阳桃花江竹业发展有限公司 | Adhesive for bonding between bamboo plate and glass fiber reinforced plastics |
| CN105733484A (en) * | 2016-03-29 | 2016-07-06 | 苏州蔻美新材料有限公司 | Toughening-modified epoxy resin adhesive and preparation method thereof |
| CN105829478A (en) * | 2014-11-17 | 2016-08-03 | 株式会社Lg化学 | Resin composition for semiconductor adhesion, and adhesive film for semiconductor |
| WO2016145661A1 (en) * | 2015-03-19 | 2016-09-22 | Ablestik (Shanghai) Ltd. | Epoxy molding compound, its manufacturing process and use, and transistor outline package product containing molded product thereof |
| CN106414641A (en) * | 2014-12-24 | 2017-02-15 | 株式会社Lg化学 | Adhesive resin composition for semiconductor, adhesive film, dicing die bonding film, and semiconductor device |
| CN106715631A (en) * | 2015-07-10 | 2017-05-24 | 株式会社Lg化学 | Resin composition for semiconductor adhesion and dicing die bonding film |
| CN107674161A (en) * | 2017-10-17 | 2018-02-09 | 江苏宝安电缆有限公司 | A kind of epoxide resin material for strengthening metal adhesion and preparation method thereof |
| CN109111867A (en) * | 2017-06-22 | 2019-01-01 | 日东电工株式会社 | Cut die bonding film |
| CN110041836A (en) * | 2013-09-30 | 2019-07-23 | 琳得科株式会社 | Composite sheet is used in resin film formation |
| CN112513217A (en) * | 2018-08-03 | 2021-03-16 | 昭和电工材料株式会社 | Adhesive composition, film-like adhesive, adhesive sheet, and method for manufacturing semiconductor device |
| CN113388334A (en) * | 2021-08-17 | 2021-09-14 | 常州嘉容电子有限公司 | Double-sided PET film-coated plate and preparation method thereof |
| CN114514300A (en) * | 2019-11-29 | 2022-05-17 | 东洋纺株式会社 | Adhesive composition, adhesive sheet, laminate, and printed wiring board |
| CN114702923A (en) * | 2021-12-24 | 2022-07-05 | 广东东溢新材料科技有限公司 | Adhesive and preparation method and application thereof |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5174092B2 (en) * | 2009-08-31 | 2013-04-03 | 日東電工株式会社 | Adhesive film with dicing sheet and method for producing the same |
| JP6136268B2 (en) * | 2009-10-16 | 2017-05-31 | エルジー・ケム・リミテッド | Die attach film |
| WO2012081842A2 (en) * | 2010-12-17 | 2012-06-21 | 제일모직 주식회사 | Adhesive composition for semiconductors, adhesive film using same, and uses thereof |
| KR101188170B1 (en) | 2011-01-21 | 2012-10-05 | 도레이첨단소재 주식회사 | Adhesive Composition for Carrier Film for Flexible Printed Circuit Board and Carrier Film for Using the Same |
| KR101291603B1 (en) * | 2011-06-14 | 2013-08-01 | 주식회사 케이씨씨 | Adhesive composition with low moisture absorption for semiconductor |
| KR101635259B1 (en) * | 2014-02-14 | 2016-06-30 | 이원정 | Method for manufacturing functional thin film and functional thin film manufactured by the same |
| CN104046312A (en) * | 2014-06-30 | 2014-09-17 | 无锡市崇安区科技创业服务中心 | Flexible plastic composite packaging material adhesive and preparation method thereof |
| CN104231989A (en) * | 2014-07-28 | 2014-12-24 | 黄能威 | Single-component high-strength waterproof epoxy adhesive |
| CN104327771B (en) * | 2014-11-05 | 2016-07-13 | 京东方科技集团股份有限公司 | A kind of adhesive resin dielectric layer material |
| CN104788795A (en) * | 2015-03-31 | 2015-07-22 | 苏州市鼎立包装有限公司 | Corrosion-resistant film material and preparation method thereof |
| CN104726048B (en) * | 2015-04-10 | 2017-11-07 | 大连理工大学 | The bisphenol A epoxide resin anchoring adhesive and preparation method of a kind of compounding toughness reinforcing of hot environment cementability by force |
| CN107325489B (en) * | 2017-08-14 | 2019-07-16 | 通威太阳能（安徽）有限公司 | A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique |
| KR102449899B1 (en) | 2018-02-02 | 2022-09-30 | 삼성전자주식회사 | Semiconductor package module |
| CN108471702B (en) * | 2018-05-15 | 2021-01-01 | 苏州盛达飞智能科技股份有限公司 | Heat-conducting and electric-conducting foam adhesive tape and manufacturing method thereof |
| WO2020183581A1 (en) * | 2019-03-11 | 2020-09-17 | 日立化成株式会社 | Adhesive agent composition, film-like adhesive agent, adhesive sheet, and semiconductor device manufacturing method |
| JPWO2023171023A1 (en) * | 2022-03-08 | 2023-09-14 | ||
| TWI828469B (en) * | 2022-12-09 | 2024-01-01 | 南亞塑膠工業股份有限公司 | Adhesive composition and copper clad laminate manufactured using the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001060938A1 (en) * | 2000-02-15 | 2001-08-23 | Hitachi Chemical Co., Ltd. | Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| US7070670B2 (en) * | 2000-03-31 | 2006-07-04 | Hitachi Chemical Co., Ltd. | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
| JP4380127B2 (en) * | 2002-03-28 | 2009-12-09 | 住友化学株式会社 | Thermosetting resin composition and adhesive film |
| JP4244777B2 (en) * | 2002-10-18 | 2009-03-25 | 日立化成工業株式会社 | Curing accelerator for curable resin, curable resin composition, electronic component device, and method for producing phosphine derivative |
| EP1493766B1 (en) * | 2003-06-30 | 2006-06-07 | Mitsubishi Gas Chemical Company, Inc. | Heat-curable resin composition and use thereof |
| US7709085B2 (en) * | 2003-12-08 | 2010-05-04 | Sekisui Chemical Co., Ltd. | Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
| US20080118633A1 (en) * | 2006-11-21 | 2008-05-22 | Cheng-Chung Chen | Methods for creating electronic circuitry comprising phenolic epoxy binder compositions |
-
2007
- 2007-04-30 KR KR1020070042017A patent/KR101082448B1/en active IP Right Grant
-
2008
- 2008-04-29 WO PCT/KR2008/002429 patent/WO2008133472A1/en active Application Filing
- 2008-04-29 CN CN201510091685.XA patent/CN104745131A/en active Pending
- 2008-04-29 CN CN200880014326A patent/CN101675137A/en active Pending
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103827162B (en) * | 2011-09-29 | 2016-06-15 | 日立化成株式会社 | Composition epoxy resin and electronic part apparatus |
| CN103827162A (en) * | 2011-09-29 | 2014-05-28 | 日立化成株式会社 | Epoxy resin composition and electronic component device |
| CN103987799A (en) * | 2011-10-25 | 2014-08-13 | 3M创新有限公司 | Corrosion, chip and fuel resistant coating composition |
| CN110041836A (en) * | 2013-09-30 | 2019-07-23 | 琳得科株式会社 | Composite sheet is used in resin film formation |
| CN105264033A (en) * | 2014-01-03 | 2016-01-20 | 株式会社Lg化学 | Dicing film and dicing die bonding film |
| CN105264033B (en) * | 2014-01-03 | 2018-05-18 | 株式会社Lg化学 | Cutting film and cut crystal bonding film |
| US9761476B2 (en) | 2014-01-03 | 2017-09-12 | Lg Chem, Ltd. | Dicing film and dicing die-bonding film |
| CN105829478B (en) * | 2014-11-17 | 2018-05-25 | 株式会社Lg化学 | Adhesive resin composition for bonding semiconductor and the binder film for semiconductor |
| CN105829478A (en) * | 2014-11-17 | 2016-08-03 | 株式会社Lg化学 | Resin composition for semiconductor adhesion, and adhesive film for semiconductor |
| CN106414641B (en) * | 2014-12-24 | 2018-11-23 | 株式会社Lg化学 | For engaging adhesive resin composition, bonding film, cut crystal junction film and the semiconductor device of semiconductor |
| CN106414641A (en) * | 2014-12-24 | 2017-02-15 | 株式会社Lg化学 | Adhesive resin composition for semiconductor, adhesive film, dicing die bonding film, and semiconductor device |
| WO2016145661A1 (en) * | 2015-03-19 | 2016-09-22 | Ablestik (Shanghai) Ltd. | Epoxy molding compound, its manufacturing process and use, and transistor outline package product containing molded product thereof |
| CN108350251A (en) * | 2015-03-19 | 2018-07-31 | 衡所华威电子有限公司 | Epoxy molding compounds, preparation method and use and the transistor outline package product comprising its layered product |
| CN106715631B (en) * | 2015-07-10 | 2019-07-30 | 株式会社Lg化学 | Semiconductor adhesive composition and dicing die adhesive film |
| CN106715631A (en) * | 2015-07-10 | 2017-05-24 | 株式会社Lg化学 | Resin composition for semiconductor adhesion and dicing die bonding film |
| CN105255110A (en) * | 2015-10-21 | 2016-01-20 | 安徽亚南电缆厂 | High-temperature-resistant and anti-ageing insulating base layer used for cables |
| CN105315940A (en) * | 2015-10-26 | 2016-02-10 | 益阳桃花江竹业发展有限公司 | Adhesive for bonding between bamboo plate and glass fiber reinforced plastics |
| CN105733484A (en) * | 2016-03-29 | 2016-07-06 | 苏州蔻美新材料有限公司 | Toughening-modified epoxy resin adhesive and preparation method thereof |
| CN109111867A (en) * | 2017-06-22 | 2019-01-01 | 日东电工株式会社 | Cut die bonding film |
| CN107674161A (en) * | 2017-10-17 | 2018-02-09 | 江苏宝安电缆有限公司 | A kind of epoxide resin material for strengthening metal adhesion and preparation method thereof |
| CN112513217A (en) * | 2018-08-03 | 2021-03-16 | 昭和电工材料株式会社 | Adhesive composition, film-like adhesive, adhesive sheet, and method for manufacturing semiconductor device |
| CN114514300A (en) * | 2019-11-29 | 2022-05-17 | 东洋纺株式会社 | Adhesive composition, adhesive sheet, laminate, and printed wiring board |
| CN114514300B (en) * | 2019-11-29 | 2023-11-14 | 东洋纺Mc株式会社 | Adhesive composition, adhesive sheet, laminate, and printed wiring board |
| CN113388334A (en) * | 2021-08-17 | 2021-09-14 | 常州嘉容电子有限公司 | Double-sided PET film-coated plate and preparation method thereof |
| CN114702923A (en) * | 2021-12-24 | 2022-07-05 | 广东东溢新材料科技有限公司 | Adhesive and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080096991A (en) | 2008-11-04 |
| WO2008133472A1 (en) | 2008-11-06 |
| CN104745131A (en) | 2015-07-01 |
| KR101082448B1 (en) | 2011-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101675137A (en) | Adhesive resin composition and dicing die bonding film using the same | |
| KR101688677B1 (en) | Adhesive for flip chip mounting, adhesive film for flip chip mounting, method for mounting semiconductor chip, and semiconductor device | |
| KR101492629B1 (en) | Adhesive composition, adhesive sheet and production process for semiconductor device | |
| CN101848974B (en) | Dicing die bonding film having excellent burr property and reliability and semiconductor device using same | |
| JP6136268B2 (en) | Die attach film | |
| JP5089560B2 (en) | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | |
| CN107004590B (en) | Dicing die bonding sheet | |
| KR20100037045A (en) | Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these | |
| JP5364991B2 (en) | Adhesive composition for semiconductor, adhesive sheet for semiconductor, and semiconductor device | |
| JP5153597B2 (en) | Protective film forming sheet for chip and semiconductor chip with protective film | |
| US20100266842A1 (en) | Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor | |
| CN106471077B (en) | Adhesive film and semiconductor package using the same | |
| KR101023841B1 (en) | Adheisive composition and dicing die bonding film using the same | |
| KR102346224B1 (en) | Adhesive composition, adhesive sheet, and method for producing semiconductor device | |
| US8247503B2 (en) | Adhesive composition and adhesive sheet | |
| JP2002285109A (en) | Adhesive sheet, semiconductor device and method producing the device | |
| KR101248008B1 (en) | Adhesive film composition for semiconductor package | |
| KR101056688B1 (en) | Adhesive composition, adhesive film and dicing die-bonding film using the same | |
| JP5237647B2 (en) | Adhesive composition, adhesive sheet and method for producing semiconductor device | |
| JP2009209345A (en) | Pressure-sensitive adhesive sheet | |
| JP2009124096A (en) | Pressure-sensitive adhesive sheet | |
| JP5414256B2 (en) | Adhesive composition, adhesive sheet, and method for manufacturing semiconductor device | |
| JP2005154687A (en) | Adhesive composition, adhesive member, supporting member for semiconductor mounting and semiconductor device | |
| JP2003147299A (en) | Adhesive sheet, semiconductor device and method for producing the semiconductor device | |
| JPWO2019150446A1 (en) | Methods for Manufacturing Adhesive Compositions, Film Adhesives, Adhesive Sheets, and Semiconductor Devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100317 |