CN101666771B - Light addressable potential sensor slide holder of sandwich structure - Google Patents
Light addressable potential sensor slide holder of sandwich structure Download PDFInfo
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- CN101666771B CN101666771B CN2009100706038A CN200910070603A CN101666771B CN 101666771 B CN101666771 B CN 101666771B CN 2009100706038 A CN2009100706038 A CN 2009100706038A CN 200910070603 A CN200910070603 A CN 200910070603A CN 101666771 B CN101666771 B CN 101666771B
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Abstract
The invention relates to a light addressable potential sensor slide holder of a sandwich structure, belonging to the field of electronic packaging in semiconductor biochemical sensors. The invention adopts the modern technique of semiconductor device packing and printed circuit board and a sandwich structure to satisfy the requirement of liquid testing environment of a sensor chip and the translucency requirement of the light addressable potential sensor and simultaneously realize electrical connection. The lower surface of the light addressable potential sensor chip is bonded with a bottom plate which is provided with a transmission window corresponding to a sensing unit on the light addressable potential sensor; the upper surface of the sensor chip is bonded with a cover plate which is provided with a contact window, a bonding area, a wiring layer and a welding spot, wherein the contact window is sleeved with the sensing unit on the sensor chip. By adopting a method of assembling bare chips, the invention solves the problem that the traditional electronic device packing method is not suitable for the light addressable potential sensor, has simple technological process and low cost, can satisfy the requirement of scientific research of light addressable potential sensor chips at the present as well as the requirement of low cost at the producibility stage in the future.
Description
[technical field] the invention belongs to the electronics assembling field of semiconductor biochemical sensor.
[background technology] theory and technology of the present invention basis be LAPS (Light AddressablePotensiometric Sensor, LAPS) and electronics assembling.
1, LAPS brief introduction
(Light Addressable Potensiometric Sensor LAPS) is a kind of semiconductor devices that liquid biochemical quantity detects that is used for to LAPS
[1], have simple in structure, highly sensitive, advantages such as response is fast, multiparameter detection, so LAPS is in immunoassays
[2,3], cellular metabolism
[4,5,6]And living cells detects
[7]Etc. the applied research of aspect received very big concern.Along with the development of microelectronic technique, various integrated, microminiaturized, portable LAPS
[8,9,10], and many sensing units LAPS has obtained research
[11], this solid state, integrated, polyfunctional characteristics make LAPS detect for biomolecule that realizes no fluorescent marker even living cells born of the same parents, and even realize lab-on-a-chipization, all have good development prospect.
Fig. 1 is the cross-section structure and the test macro synoptic diagram thereof of typical LAPS sensing unit, the sensing unit of device
[12]Being made up of detected solution 3, sensitive membrane 4 (silicon nitride layer) and insulation course 5, is the core of whole sensor sensitive mechanism.The sensitive membrane of device is the variation of surface of insulating layer electromotive force with the change transitions of information measured; Insulation course 5 and substrate 6 are converted into surface potential variation the variation of the space surface electric field intensity of substrate 6; When excitation source 8 under the control of its driving and frequency modulation circuit 9; When periodically being radiated at lower surface or the upper surface of sensing unit; To produce photo-generated carrier, when these photo-generated carriers are diffused into the space charge region, will be by electric field separates wherein; Become photocurrent, and the space electric field that the changes photocurrent that will change; This photocurrent is converted into photovoltage through lock-in amplifier 10, carries out data acquisition and processing through computing machine 11.
LAPS is similar with the MOS device, and its space charge layer is by effective grid voltage V
gV among the LAPS
gWith bias voltage V
b, sensitive membrane surface potential V
FilmRelation be:
V
g＝V
b+V
film <1>
When sensitive membrane and measured matter reaction, will cause V
FilmVariation, thereby to V
gModulate.Space charge region institute can charge stored amount Q
sWith V
gRelevant, under spent condition, V
gQ more greatly then
sBig more, the photovoltage V that is then detected by lock-in amplifier (10) is big more, thereby has realized the detection to measured matter.
2, electronics assembling brief introduction
[13]
In general, modern electronic product is core with the silicon base chip, and silicon base chip (abbreviation chip) is to be substrate with the monocrystalline silicon piece, through peroxidating, photoetching, chemical vapour deposition, evaporation, sputter, etc. technological process, circuit or element manufacturing is formed above that.The electronics assembling comprises encapsulation, printed circuit board (Printed Circuit Board, PCB) processes such as preparation, components and parts/chips welding of chip., be not commonly referred to nude film through the chip of electronics assembling.
The present invention mainly belongs to electronics assembling field, therefore here only to electronics assembling carrying out brief account.
1) encapsulation of chip: according to the difference of using, material, the structure of Chip Packaging also have nothing in common with each other, but its basic function is nothing more than two aspects: for chip provides mechanical support, realizes being electrically connected of chip and other circuit elements device.The typical chip encapsulating structure is as shown in Figure 2; At first IC nude film 13 is bonded on the base plate for packaging 14; Realize being electrically connected between IC nude film 13 and the lead frame 17 through bonding wire 15; Encapsulating material 16 covers on IC nude film 13, bonding wire 15 and the lead frame 17, and IC nude film 13 and bonding wire 15 are played a protective role.Pin 18 is the conducting metal material, and inner in encapsulation, pin 18 links to each other with lead frame 17; In package outside, pin 18 is connected with other components and parts.
2) basic role of PCB:PCB is the instead of manual line, on the material of insulation, prints out the connection lead of each components and parts in the circuit.According to the arrangement mode of components and parts on PCB, can be divided into polytypes such as single face PCB, two-sided PCB and multi-layer PCB.Wherein, the structure of single face PCB is the simplest, and the structure of pupil unit is as shown in Figure 3, and preparation has through hole 20 on the PCB substrate 19 of insulation, is used for various components and parts such as plug-in mounting resistance, electric capacity, transistor, chip; Behind the plug-in mounting,, the pin of components and parts is welded on the PCB substrate 19 through solder joint 21; Be welded on the element on the PCB, be connected with other components and parts through the copper conductor 22 that is printed on the PCB.
3) welding in the electronics assembling
It is soldering paste or welding powder that PCB welds normally used scolder, for preventing that the copper conductor on the scolder and PCB 22 forms circuit pathways in the welding process, before welding, also will on copper conductor 22, make solder mask 23.
3, proposition of the present invention
Deepen continuously along with what the semiconductor biochemical sensor was studied, it is one of inexorable trend of microelectronics scientific development that this direction has become, and wherein LAPS is because of advantages such as its preparation technology is simple, with low cost, high fluxs; In scientific research field, receive much attention; But realize the commercialization of LAPS, the encapsulation of LAPS is a difficult point, wherein has two aspect problems to solve: 1. LAPS is mainly used in the biological chemistry amount detection in the liquid environment; Therefore sensitive membrane 4 must contact with test solution in the sensing unit; And must be moistureproof as semiconductor devices LAPS, this has just produced contradiction, particularly when being integrated with circuit on the LAPS chip; This contradiction is more outstanding, therefore must in encapsulation process, solve; 2. the light addressing function of LAPS is one of its characteristic, also is the key that realizes high throughput testing, must guarantee the photosensitive area printing opacity of LAPS sensing unit for this reason.About the encapsulation of LAPS, all carried out correlative study both at home and abroad, for example:
1) pen type LAPS
[11,14,15], light source and control circuit thereof, LAPS chip all are sealed in the pen type plastic chamber, and the LAPS sensing unit are exposed in the test environment, during use pen type LAPS is immersed in the test solution, and cooperate contrast electrode, to electrode, constitute three electrode detection systems.This method is not considered the liquid storage problem in the device package process, technological operation is simple; But when changing the LAPS chip, need the pen type cavity be taken apart, new LAPS chip and light source and control circuit thereof partly re-assemblied, and reseal cavity.
2) unicellular action sensor
[16], the electrode of chip is arranged at silicon chip back, make to be electrically connected the upper and lower surface that separates from chip with tested liquid environment; Adopt front lighting according to mode, thereby need not to be provided with light hole.But there be absorption and light the refraction problems in solution of solution to light in front lighting according in the mode; Simultaneously, electrode is arranged at chip back, also is inappropriate for the development of following integrated LAPS chip.
3) LAPS plastic cards
[17], in this method, adopted back side illumination mode; Therefore but the electrode of chip still is arranged at the silicon chip back side, still has the problem that is inappropriate for integrated LAPS development, and encapsulating material is plastic cards, can not be compatible with the electronics packaging technology of modern electronic product.
[summary of the invention]
The objective of the invention is: based on the PCB process for manufacturing circuit board, provide a kind of technology simple, compatible good, LAPS package design cheaply, make LAPS can work in liquid environment normally, make the electron device operate as normal again simultaneously.
Sandwich structure light addressing semiconductor transducer slide holder; Comprise rigid plastic base plate, LAPS nude film, PCB cover plate successively; The rigid plastic base plate is provided with optical transmission window; The PCB cover plate is made up of PCB substrate, solder joint, copper conductor, solder mask, and is provided with contact window, and the LAPS nude film is by p type Si substrate, p
+-Si ohmic contact regions, silicon dioxide, silicon nitride and LAPS electrode constitute; It is characterized in that, last each sensing unit of LAPS and optical transmission window, contact window fit, promptly the center of the center of LAPS sensing unit and optical transmission window, contact window is on same straight line; On the physical dimension, optical transmission window is less than contact window, and contact window is less than sensing unit; On the electric connecting mode, the PCB cover plate is provided with solder joint, and the solder joint of LAPS electrode is the convex structure, and corresponding one by one with solder joint on the PCB cover plate, adopts the method for flip-chip, with the convex solder joint of LAPS electrode and the solder joint of PCB cover plate, firm welding; Fill the space that forms between base plate and the cover plate with insulating resin, and sealing contact window and optical transmission window.Because LAPS is mainly used in the liquid environment test, during actual the use, must be used with liquid storage container, on slide holder, also be provided with bolt hole for this reason, be used for the two connection and fixing.
Advantage of the present invention and good effect:
The advantage and the good effect of " sandwich structure light addressing semiconductor transducer slide holder " proposed by the invention are:
1) adopt PCB as cover plate, and the LAPS chip is fixed thereon, and this helps realizing being electrically connected of LAPS and peripheral testing circuit, and the manufacture craft of PCB cover plate is very simple, with low cost.
2) realize back side light addressing function, avoided front lighting, the problem that the absorption and the refraction of light is produced because of detected solution according in the addressing method
3) connected mode of slide holder and liquid storage container adopts bolt to connect and fixing mode, and chip is changed flexibly, and easy and simple to handle, with low cost.
[description of drawings]:
Fig. 1 is LAPS sensing unit and detection system synoptic diagram thereof.
Fig. 2 is the chip-packaging structure sectional view.
Fig. 3 is the PCB structural representation.
Fig. 4 is a sandwich structure light addressing semiconductor transducer slide holder section of structure.
Fig. 5 is a LAPS upper surface vertical view.
Fig. 6 is a PCB cover plate vertical view.
Fig. 7 is the liquid storage container sectional view.
Wherein 1: contrast electrode; 2: to electrode; 3: detected solution; 4: silicon nitride; 5: silicon dioxide; 6:p type Si substrate; 7:p
+-Si ohmic contact regions; 8: light source; 9: control circuit for light source; 10: lock-in amplifier; 11: computing machine; 12: ground electrode; The 13:IC nude film; 14: base plate for packaging; 15: bonding wire; 16: encapsulating material; 17: lead frame; 18: pin; The 19:PCB substrate; 20: through hole; 21: solder joint; 22: copper conductor; 23: solder mask; 24: the rigid plastic base plate; 25: optical transmission window; 26: contact window; The 27:LAPS electrode; 28: bolt hole; 29: liquid storage tank; 30: the liquid storage container lid.
[embodiment]
Embodiment 1
Like Fig. 4, shown in 7; The sectional view of light addressable potential sensor slide holder of sandwich structure provided by the invention, vertical view; Comprise rigid plastic base plate 24, LAPS nude film, PCB cover plate successively, the rigid plastic base plate is provided with optical transmission window 25, and the PCB cover plate is made up of PCB substrate 19, solder joint 21, copper conductor 22, solder mask 23; And being provided with contact window 26, the LAPS nude film is by p type Si substrate 6, p
+-Si ohmic contact regions 7, silicon dioxide 5, silicon nitride 4 and LAPS electrode 27 constitute; It is characterized in that, last each sensing unit of LAPS and optical transmission window 25, contact window 26 fits, promptly the center of the center of LAPS sensing unit and optical transmission window, contact window is on same straight line; On the physical dimension, optical transmission window is less than contact window, and contact window is less than sensing unit; On the electric connecting mode, the PCB cover plate is provided with solder joint 21, and the solder joint of LAPS electrode 27 is the convex structure; And it is corresponding one by one with the solder joint 21 on the PCB cover plate; Adopt the method for flip-chip, with the convex solder joint of LAPS electrode 27 and the solder joint 21 of PCB cover plate, firm welding; Fill the space that forms between base plate and the cover plate with insulating resin, and sealing contact window 26 and optical transmission window 25.Because LAPS is mainly used in the liquid environment test, during actual the use, must be used with liquid storage container (Fig. 7), also be provided with bolt hole 28 for this reason, be used for the two connection and fixing.
Typical process flow
1) requires processing rigid plastic bottom board 24 according to Fig. 4.
2) require the processing PCB cover plate according to Fig. 4 and Fig. 6.
3) solder joint of LAPS electrode 27 is aimed at the solder joint 21 of PCB cover plate, and firm welding, and fills not welding region with epoxy resin.
4) with 1) and 3) bonding, and with around the epoxy sealing contact window.
5) Fig. 6 is aimed at the bolt hole 27 of Fig. 7, and be connected firmly,, between slide holder and liquid storage container, be lined with elastic seal ring for preventing leakage with bolt.
List of references
[1]D.G.Hafeman，J.W.Parce，H.M.Mcconnell.Light?addressable?potentionmetric?sensorfor?biochemical?systems[J].Science，1988，240：1182
[2]Gu?Libo，Han?Jinghong，CuiDafi，Zhang?Hong，The?Research?of?Light?AddressablePotentiometric?Sensor?on?Detection?of?AlphaFeto-protein，Chinese?Journal?of?AnalyticalChemistry，2005，33(1)：17
[3]William?E.Lee，H.Gail?Thompson，John?G.Hall?1，Douglas?E.Bader，Rapid?detectionand?identification?of?biological?and?chemical?agents?by?immunoassay，gene?probe?assayand?enzyme?inhibition?using?a?silicon-based?biosensor[J]，Biosensors?&Bioelectronics，2000，14：795
[4]Fanigliulo，P.Accossato，et.al.，Comparison?between?a?LAPS?and?An?FET-based?sensorfor?cell-metabolism?detection[J]，Sensors?and?Actuators，1996，B32：41
[5]Frank?Hafner，Cytosensor
Microphysiometer：technology?and?recent?applications[J]，Biosensors?&?Bioelectronics，2000，15：149
[6]B.Stein，M.George，H.E.Gaub，W.J.Parak，Extracellular?measurements?of?averagedionic?currents?with?the?light-addressable?potentiometric?sensor(LAPS)[J]，Sensors?andActuators?B，2004，B98：299
[7]Jia?Yunfang，Niu?Wencheng，etc.The?Cell?Detection?Using?EIS?Sensor?and?PhageDisplay，2006?8th?International?Conference?on?Solid-State?and?Integrated?CircuitTechnology，551-553
[8]Yoshinobu，T.；
，M.J.；Otto，R.；Furuichi，K.；Mourzina，Yu.；Ermolenko，Yu.；Iwasaki，H.，Portable?light-addressable?potentiometric?sensor(LAPS)for?multisensorapplications[J]，Sensors?and?Actuators，2003，B95：(1-3)：352
[9]M.J.
，T.Wagner，C.Wang，R.Otto，T.Yoshinobu，Development?of?a?handheld16?channel?pen-type?for?electrochemical?sensing，Sensors?and?Actuators?B，2005，108，Issues?1-2：808
[10]Torsten?Wagner，Tatsuo?Yoshinobu，Chanwen?Rao，Ralph?Otto，Michael?J.
“All-in-one”solid-state?device?based?on?a?light-addressable?potentiometric?sensorplatform，Sensors?and?Actuators?B，In?Press，Corrected?Proof，Available?online?20February?2006
[11]T.Yoshinobu，M.J.Schoning，R.Otto，K.Furuichi，Yu.Mourzina，Yu.Ermolenko?andH.Iwasaki.Portable?light-addressable?potentiometric?sensor(LAPS)for?multisensorapplications[J].Sensors?and?Actuators，2003，B95：352
[12] Jia Yunfang, Niu Wencheng, Zhang Fuhai, Liu Guohua, Yu Mei, the theoretical modeling of EIS N-type semiconductor N biochemical sensor EI interfacial potential, semiconductor journal, 2005,26 (11): 2196
[13] C.A. Harper chief editor, Jia Songliang, Cai Jian, Wang Yuming etc. translate, electronics assembly, Science Press, in February, 2005
[14]M.J.Sch¨oning，T.Wagner，C.Wang，R.Otto，T.Yoshinobu，Development?of?ahandheld?16?channel?pen-type?LAPS?for?electrochemical?sensing，Sensors?and?Actuators，2005，B108：808-814
[15]Torsten?Wagner，Tatsuo?Yoshinobu，Chanwen?Rao，Ralph?Otto，Michael?J.
，“All-in-one”solid-state?device?based?on?a?light-addressable?potentiometricsensor?platform，Sensors?and?Actuators，2006，B117：472
[16] Wang Ping, Xu Gaixia, Qin Lifeng, Xu Ying is used for single-cell sensor of extracellular action potential measurement and preparation method thereof, the patent No.: ZL200310122949.0
[17]T.Wagner，C.Rao，J.P.Kloock，“LAPS?Card”-A?novel?chip?card-basedlight-addressable?potentiometric?sensor，Sensors?and?Actuators?B118(2006)33
Claims (1)
1. sandwich structure light addressing semiconductor transducer slide holder based on printed-board technology; Comprise rigid plastic base plate, LAPS nude film, PCB cover plate successively; The rigid plastic base plate is provided with optical transmission window; The PCB cover plate is made up of PCB substrate, solder joint, copper conductor, solder mask, and is provided with contact window, and the LAPS nude film is by p type Si substrate, p
+-Si ohmic contact regions, silicon dioxide, silicon nitride and LAPS electrode constitute; It is characterized in that, each sensing unit and optical transmission window, contact window fit on the LAPS, promptly the center of the center of LAPS sensing unit and optical transmission window, contact window is on same straight line; On the physical dimension, optical transmission window is less than contact window, and contact window is less than sensing unit; Electric connecting mode, the PCB cover plate is provided with solder joint, and the solder joint of LAPS electrode is the convex structure; And it is corresponding one by one with the solder joint on the PCB cover plate; Adopt the method for flip-chip, with the convex solder joint of LAPS electrode and the solder joint of PCB cover plate, pressure welding is firm; Space in the sandwich structure adopts insulating resin to fill.
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| CN2009100706038A CN101666771B (en) | 2009-09-27 | 2009-09-27 | Light addressable potential sensor slide holder of sandwich structure |
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| CN101666771B true CN101666771B (en) | 2012-07-25 |
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| CN101975805B (en) * | 2010-08-09 | 2014-11-19 | 南开大学 | Packaging probe of photoelectric biochemical quantity semiconductor sensor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750195A1 (en) * | 1995-06-20 | 1996-12-27 | Matsushita Electric Industrial Co., Ltd | Two-dimensional sensor using laps for measuring cell activity |
| CN1168975A (en) * | 1997-03-26 | 1997-12-31 | 中国科学院电子学研究所 | Three-D micro-structure optical addressing potential sensor |
| CN1553176A (en) * | 2003-06-02 | 2004-12-08 | 中国科学院电子学研究所 | Plastic light addressing biochemical sensor chip |
| CN101325205A (en) * | 2007-06-14 | 2008-12-17 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation structure of image sensing chip |
-
2009
- 2009-09-27 CN CN2009100706038A patent/CN101666771B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750195A1 (en) * | 1995-06-20 | 1996-12-27 | Matsushita Electric Industrial Co., Ltd | Two-dimensional sensor using laps for measuring cell activity |
| CN1168975A (en) * | 1997-03-26 | 1997-12-31 | 中国科学院电子学研究所 | Three-D micro-structure optical addressing potential sensor |
| CN1553176A (en) * | 2003-06-02 | 2004-12-08 | 中国科学院电子学研究所 | Plastic light addressing biochemical sensor chip |
| CN101325205A (en) * | 2007-06-14 | 2008-12-17 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation structure of image sensing chip |
Non-Patent Citations (2)
| Title |
|---|
| 戴春祥.光寻址电位传感器新结构的研究.《浙江大学硕士学位论文》.2008,全文. * |
| 贾芸芳 等.半导体传感器在生物分析科学中的应用.《微纳电子技术》.2006,(第1期),第28-36页. * |
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