CN101662881B - 电路板及其制作方法 - Google Patents
电路板及其制作方法 Download PDFInfo
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- CN101662881B CN101662881B CN2008103042373A CN200810304237A CN101662881B CN 101662881 B CN101662881 B CN 101662881B CN 2008103042373 A CN2008103042373 A CN 2008103042373A CN 200810304237 A CN200810304237 A CN 200810304237A CN 101662881 B CN101662881 B CN 101662881B
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- layer
- conducting wire
- insulating barrier
- circuit board
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Abstract
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Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2008103042373A CN101662881B (zh) | 2008-08-27 | 2008-08-27 | 电路板及其制作方法 |
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CN2008103042373A CN101662881B (zh) | 2008-08-27 | 2008-08-27 | 电路板及其制作方法 |
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CN101662881A CN101662881A (zh) | 2010-03-03 |
CN101662881B true CN101662881B (zh) | 2011-12-07 |
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CN2008103042373A Active CN101662881B (zh) | 2008-08-27 | 2008-08-27 | 电路板及其制作方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103582321B (zh) * | 2012-07-19 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | 多层线路板及其制作方法 |
CN110430664B (zh) * | 2019-07-29 | 2020-12-01 | 厦门大学 | 一种可拉伸可降解的柔性电路板及其制备方法与应用 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1337145A (zh) * | 1999-12-14 | 2002-02-20 | 松下电器产业株式会社 | 多层印刷电路板及其制造方法 |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1337145A (zh) * | 1999-12-14 | 2002-02-20 | 松下电器产业株式会社 | 多层印刷电路板及其制造方法 |
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CN101662881A (zh) | 2010-03-03 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170303 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
CP03 | Change of name, title or address |