CN101661134B - Photoelectric composite flexible wiring board and manufacturing method thereof - Google Patents
Photoelectric composite flexible wiring board and manufacturing method thereof Download PDFInfo
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- CN101661134B CN101661134B CN 200910151605 CN200910151605A CN101661134B CN 101661134 B CN101661134 B CN 101661134B CN 200910151605 CN200910151605 CN 200910151605 CN 200910151605 A CN200910151605 A CN 200910151605A CN 101661134 B CN101661134 B CN 101661134B
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Abstract
The present invention provides an optical waveguide mixing flexible wiring board which has the advantages of being thin and good bending resistance and can install a semiconductor containing a photo-electric conversion element and a manufacturing method thereof. The optical waveguide mixing flexible wiring board comprises: a first optical waveguide covering (2); a conductive wiring pattern (3) and an optical waveguide core layer pattern (5) which are arranged on the first optical waveguide covering; and a second optical waveguide covering (6) which is formed together with the first optical waveguide covering to surround the optical waveguide core layer pattern and the conductive wiring pattern. The present invention provides a manufacturing method of the optical waveguide mixing flexible wiring board.
Description
Technical field
The present invention relates to promptly thin and bending resistance excellent photoelectric composite flexible wiring board and manufacturing approach thereof.
Background technology
For typical mobile electronic device such as portable phone, digital camera or notebook computer, especially earnestly need compactization.Therefore, for compactization of mobile electronic device and be easy to use, often adopt frameworks designs such as collapsible or slidingtype.
Realize the design of this excellence, need pass composite move type hinge (hinge) inside of realizing foldable structure or slide construction and transmit electric signal.The inner electric signal of composite move type hinge transmits; But even the flexible distributing board that adopts under the dynamic bending state also signal to transmit; For employed flexible distributing board in hinge, require in the alternating bending action of 100,000 degree, to guarantee the mechanical/electrical characteristic.
Itself require compactization for mobile electronic devices such as portable phone or digital cameras, increase rapidly, also require the high speed of information processing rate in addition yet the data size that electronic equipment must be handled comprises the still image/animation data of high image quality.Therefore,, not only require compactization of substrate itself, and require to deal with the transmission of high speed signal more for employed flexible distributing board in electronic equipment.
In the past; In the flexible distributing board; Utilize copper to connect up to transmit electric signal, but, also attempt in flexible distributing board, also transmitting simultaneously light signal for the demand of tackling now and from now on high capacity/high speed signal is handled; To in flexible distributing board, transmit light signal, need optical waveguide and conducting wiring is compound.
In sum, in present and future, flexible distributing board need satisfy 3 following conditions.
(a) compound optical waveguide and the conducting wiring that is used for the light transmission.
(b) above-mentioned wiring plate has the bending resistance of mechanical/electrical/optics in the lump.
(c) above-mentioned wiring plate itself can compactization.
But; Traditional structure as the flexible distributing board that optical waveguide and conducting wiring is compound; Shown in patent documentation 1 (No. the 3193500th, japanese), adopting flexible distributing board and light waveguide-layer is the structure of different layers, so the thickness of flexible distributing board increase and be difficult to bending.
In addition; Not only be difficult to bending; And be on the structure of different layers at optical waveguide core layer and conductive metal layer, because the center of the bending stress that takes place during crooked whole base plate is from the off-centring of optical waveguide core layer and conductive metal layer, the bending stress that is applied to each layer also becomes bigger.Therefore, the counter-bending life-span of optical waveguide core layer and conductive metal layer can become shorter.
Summary of the invention
The present invention considers that the design of above-mentioned problem forms, its purpose be to provide promptly thin and bending resistance excellent, and semi-conductive photoelectric composite flexible wiring board and the manufacturing approach thereof that comprises photo-electric conversion element can be installed.
In order to reach above-mentioned purpose, the application provides the invention of the thing described in the claim 1 to 3, and the invention that is recorded in the manufacturing approach of claim 4 to 6.
That is, the photoelectric composite flexible wiring board of record on packaging material basement membrane (basefilm) surface, is provided with optical waveguide core pattern and conducting metal pattern in the claim 1, it is characterized in that:
At least at grade, in optical waveguide core pattern described in the crooked flexible portion and said conducting metal pattern arrangement
The face xsect in addition that joins with said packaging material basement membrane with packaging material overlayer (coverlay) of lining optical waveguide core pattern and conducting metal pattern.
The photoelectric composite flexible wiring board of record in the claim 2 is characterized in that: in the described photoelectric composite flexible wiring board of claim 1,
The thickness of said optical waveguide core pattern is thicker than the thickness of said conducting metal pattern, and the thickness of the said packaging material basement membrane of the part of joining with said optical waveguide core pattern is thinner than the thickness of the part of joining with said conducting metal pattern.
The photoelectric composite flexible wiring board of record in the claim 3 is characterized in that: in the described photoelectric composite flexible wiring board of claim 1,
Be provided with the middle layer between said conducting metal pattern and the said packaging material basement membrane.
The manufacturing approach of the photoelectric composite flexible wiring board of record is the manufacturing approach that is provided with the photoelectric composite flexible wiring board of optical waveguide core pattern and conducting metal pattern on the surface of packaging material basement membrane in the claim 4, it is characterized in that:
(a) preparation has the duplexer of metal level at least on a face of packaging material basement membrane,
(b) form the conducting metal pattern through the part that do not need of removing metal level,
(c) the face laminated core layer that exists at the conducting metal pattern,
(d) form optical waveguide core pattern through the part that do not need of removing the core layer,
(e) lining packaging material overlayer is to cover optical waveguide core pattern.
The manufacturing approach of the photoelectric composite flexible wiring board of record in the claim 5 is characterized in that: in the manufacturing approach of the described photoelectric composite flexible wiring board of claim 4,
(a) preparation has the duplexer of metal level at least one face of said packaging material basement membrane,
(b) do not need part through what remove said metal level, form the conducting metal pattern,
(c) said metal level be removed and the part of the said packaging material membrane surface exposed be processed into thinner,
(d) the face laminated core layer that exists at said conducting metal pattern,
(e) come in crooked at least flexible portion, to implement to form optical waveguide core pattern on the said packaging material basement membrane of thinning processing through the part that do not need of removing said core layer,
(f) lining packaging material overlayer is to cover said optical waveguide core pattern.
The manufacturing approach of the photoelectric composite flexible wiring board of record in claim 6 is characterized in that: in the manufacturing approach of the described photoelectric composite flexible wiring board of claim 4,
(a) preparation has the duplexer of middle layer and metal level at least one face of said packaging material basement membrane,
(b) form the conducting metal pattern through the part that do not need of removing said metal level,
(c) remove removing of said metal level and a part of middle layer that will expose, and the said packaging material basement membrane that exposes carried out thinning processing,
(d) at certain one side laminated core resin bed of said conducting metal pattern,
(e) do not need part through what remove said core resin bed, in crooked flexible portion, implement at least to form optical waveguide core pattern on the said packaging material basement membrane of thinning processing,
(f) lining packaging material overlayer is to cover said optical waveguide core pattern.
Description of drawings
Fig. 1 is the planimetric map of photoelectricity composite module of the present invention.
Fig. 2 is the sectional structure chart of the structure of expression first embodiment of the invention.
Fig. 3 is the process chart of the manufacturing approach of expression first embodiment of the invention.
Fig. 4 is the sectional structure chart of the structure of expression second embodiment of the invention.
Fig. 5 is the process chart of the manufacturing approach of expression second embodiment of the invention.
Fig. 6 is the sectional structure chart of the structure of expression third embodiment of the invention.
Fig. 7 is the process chart of the manufacturing approach of expression third embodiment of the invention.
(symbol description)
1 packaging material basement membrane; The 2a core; 2 core patterns; The 3a metal forming; 3 conducting metal patterns; 4 packaging material overlayers; 5 dig deep processing portion; 6 middle layers.
Embodiment
Below, according to Fig. 1 to Fig. 7, describe with regard to embodiment of the present invention.
Fig. 1 is the planimetric map that expression applicable object example of the present invention is the photoelectric composite flexible wiring board module.In this Fig. 1, possess: the cable portion that optical waveguide core pattern 2 and conducting metal pattern 3 is compound; Be configured in photo detector, amplifier IC, conversion of signals IC and the conducting metal pattern connector installation portion in the diagram left side of cable (cable) portion; And the light-emitting component, drive IC and the conducting metal pattern that are configured in the diagram right side of cable portion insert connector portion.
This photoelectric composite flexible wiring board module is connector body or end plate (header) parts of the electric connector installation portion that forms with conducting metal pattern 3 in the surface combination of basic materials such as packaging material basement membrane, installation etc. and forming.
The VCSEL light-emitting components such as (surface-emitting lasers) that the electric signal that transmits from the insertion connector portion passes through to be installed converts light signal into and propagates in optical waveguide.The light signal of in optical waveguide, propagating to convert into electric signal through the photo detectors such as photodiode that are similarly installing component again; And then by amplifications such as amplifier IC; On the basis of carrying out necessary signal conversion processes, via with conductive pattern connection portions installation portion transmitting signal again.
First embodiment
Fig. 2 representes to have first embodiment of the most basic structure of the present invention.In this first embodiment; Be provided with in the photoelectric composite flexible wiring board of optical waveguide core pattern 2 and conducting metal pattern 3 on optical waveguide packaging material basement membrane 1 surface; At least in crooked flexible portion; Optical waveguide core pattern 2 disposes at grade with conducting metal pattern 3, and has the packaging material overlayer 4 of optical waveguide core pattern 2 with 3 linings of conducting wiring pattern.Here the material of packaging material and core for example is resins such as polyimide, epoxies, propylene class.
The forming method of conducting metal pattern can adopt to electroplate to form half of wiring in Seed Layer (seed layer) and add (semi-additive) method, or metallic particles be dispersed in the print process of carrying out screen painting, ink jet printing etc. behind the resin adhesive (binder); From considering, more preferably deduct (subtractive) method with metal forming is etched for the high patience aspect of alternating bending.
Fig. 3 illustrates the manufacturing approach of a routine photoelectric composite flexible wiring board of the present invention.Section A-A with Fig. 1 is an object, and the method for making of basic structure shown in Figure 2 is described.This method for making comprises following operation (a) to (e).
Operation (a): the duplexer of preparing on a face of packaging material basement membrane, to have at least metal level.It is level and smooth that the surface state of metal forming 3a is preferably made every effort to.Its reason is: be the occasion that adopts Copper Foil at metal forming 3a; The concavo-convex of copper foil surface is transferred on the packaging material basement membrane 1; The surface of the core pattern 2 that makes the surface of packaging material basement membrane 1 and on the surface of packaging material basement membrane 1, form becomes convex-concave, can increase the transmission loss of optical waveguide.
Operation (b): on metal forming 3a, through dry film form corrosion-inhibiting coating (etching resist) (not shown) such as exposure/development treatment, through the etch processes of metal forming 3a, that removes metal forming 3a does not need part, the conducting wiring pattern 3 of formations needs.
Operation (c): form the photonasty core 2a of optical waveguide, to imbed between the conducting wiring pattern 3 that forms in the operation (b).The formation method of photonasty core 2a can be used the method that the substrate that forms with the photonasty core 2a of filmization with in operation (b) forms with lamination (laminate press) or vacuum lamination, perhaps the core 2a of glassy surface (varnish) shape is used such as screen painting or spraying (spray) printing to apply/the dry and method of formation.
Operation (d):, form the core pattern 2 of optical waveguide with the photonasty core 2a exposure/development that forms in the operation (b).
Operation (e): the mode with the core pattern 2 of the optical waveguide of formation in the lining operation (d), form packaging material overlayer 4, form parts the peristome on the required conductive bond pads (pad) is installed.
Then, on conductive bond pads, carry out again, also can carry out parts and install such as the surface treatment of electroplating.
Through these characteristics, the present invention has following effect.
Through the present invention, conducting metal pattern that electric signal is used and optical waveguide pattern are formed on in the one side, use basement membrane and overlayer as flexible distributing board through the packaging material with optical waveguide, gross thickness that can the attenuate photoelectric composite flexible wiring board.
Through the present invention, gross thickness that can the attenuate photoelectric composite flexible wiring board, this is favourable to compactization that electronic equipment requires, and because attenuation realizes the raising of substrate flexibility and the raising of bending resistance.
Second embodiment
In optical waveguide, the surface of the core pattern that on the surface of packaging material basement membrane and packaging material basement membrane, forms just has the transmission loss as optical waveguide to become big shortcoming in case coarse with the convex-concave shape.Therefore, in structure shown in first embodiment and manufacturing approach, it is level and smooth that the surface of employed metal forming need be made every effort to.
On the other hand, the surface of metal forming is level and smooth more, and firm (anchor) effect of physics is just few more, therefore and the closing force between its range upon range of resin material descend.In second embodiment, use and implemented to obtain the metal forming of the necessary roughening treatment of sufficient driving fit characteristic in the practical application, and guarantee transmission loss, and method for making and the structure that improves flexural property is shown as optical waveguide.
Fig. 4 is the structure with following characteristic; Promptly; In photoelectric composite flexible wiring board illustrated in fig. 2; The thickness of optical waveguide core pattern is thicker than the thickness of conducting metal pattern, and the thickness of the packaging material basement membrane of the part of joining with optical waveguide core pattern is thinner than the structure of the thickness of the part of joining with the conducting metal pattern.
Fig. 5 is the section process chart of the method for making of expression photoelectric composite flexible wiring board shown in Figure 4, comprises following operation (a) to (f).
Operation (a): the duplexer of preparing on a face of packaging material basement membrane 1, to have at least metal level 3a.With the surface of the metal forming 3a of a side of packaging material basement membrane 1 driving fit, implemented roughening treatment, with obtain and packaging material basement membrane 1 between required sufficient closing force.
Operation (b): on metal forming 3a, the exposure/processing such as development through dry film form corrosion-inhibiting coating (not shown), and through the etch processes of metal forming 3a, that removes metal forming 3a does not need part, forms necessary conducting metal pattern 3.
Operation (c): remove metal forming 3a and the part surface of the covering basic material 1 that exposes pruned, be processed into thinner.Be processed into thin method can adopt in the dicer (dicer) dig deep processing, or by abrasion (abrasion) processing of laser instrument, plasma etching, active-ion-etch (reactive ion etching), by the chemical etching of soup etc.
Particularly by the digging in the deep processing of dicer,, thereby can make level and smooth surface with mechanically easy gimmick packaging material 1 surface concavo-convex of the back side form generation through transfer printing metal forming 3a of can pruning.
Operation (d): form the photonasty core 2a of optical waveguide, to imbed between the conducting metal pattern 3 that forms in the operation (c).Among the figure, not only form and imbed conducting metal pattern 3, and cover the top.
The formation method of photonasty core 2 can be the method that the substrate lamination that forms in the core 2a of filmization and the operation (c) or vacuum lamination are formed, and perhaps the core 2a of glassy surface shape is used such as screen painting or spraying printing to apply/the dry and method that forms.
Operation (e): the photonasty core 2a to forming in the operation (d) makes public/develops, and forms the core pattern 2 of optical waveguide.
Operation (f): the mode with the core pattern 2 of the optical waveguide of formation in the lining operation (e), form packaging material overlayer 4, form the peristome on the required conductive bond pads of installing component.
Through comprising the method for making of above-mentioned operation (a) to (f), can adopt the metal forming of having carried out being used to improving the roughening treatment of closing force, and remove the concavo-convex transfer printing that the roughening treatment of the metal surface through being transferred to packaging material forms, obtain the smooth surface of packaging material 1.This result can form the core pattern 2 with smooth surface above that, and the light that therefore can suppress the optical waveguide part transmits the increase of loss.
And, through digging dark packaging material 1, alignd with the flexural center of whole base plate in the flexural center of core 2, can reduce to be applied to the bending stress of core 2, the result can prolong the flex life of optical waveguide.Obviously, with the also attenuation of all thickness after packaging material basement membrane 1 and 4 additions of packaging material overlayer, therefore soft more and be easy to bending.
The 3rd embodiment
Fig. 6 representes the structure of third embodiment of the invention.And the difference of second embodiment shown in Figure 4 is to insert between metal forming 3 and the packaging material 1 the thin middle layer 6 of number μ m.
Fig. 7 is the section process chart of the method for making of expression the 3rd embodiment shown in Figure 6, comprises following operation (a) to (f).
Operation (a): the duplexer of preparing on a face of covering basic material 1, to have at least middle layer 6 and metal level 3a.The material in middle layer 6 for example is resins such as polyimide, epoxies, propylene class.The surface state of metal forming 6 is preferably made every effort to smoothly, but for obtain and packaging material basement membrane 1 between required sufficient closing force, can be to implementing roughening treatment with the metal forming 3a surface of the face of packaging material basement membrane 1 driving fit.
Operation (b): on metal forming 3a, through dry film form corrosion-inhibiting coating (not shown) such as exposure/development, through the etch processes of metal forming 3a, that removes metal forming 3a does not need part, and forms necessary conducting metal pattern 3.
Operation (c): a side in the middle layer 6 of exposing from removing metal forming 3a, dig dark middle layer 6 and packaging material basement membrane 1, be processed into thinner.As being processed into thin method, the deep processing of digging that can use dicer, perhaps by the abrasion processing of laser instrument, plasma etching, active-ion-etch, by the chemical etching of soup etc.Particularly by the digging in the deep processing of dicer, can be with gimmick easy on the mechanical property concavo-convex that back side shape because of transfer printing metal forming 3a produces on covering material 1 surface of pruning, and can make level and smooth surface.
Operation (d): form the photonasty core 2 of optical waveguide, to imbed between the conducting metal pattern 3 that forms in the operation (c).The formation method of photonasty core 3; Can be the method that the substrate that forms in the core 3a of filmization and the operation (c) is formed with lamination or vacuum lamination, perhaps the core 3a of glassy surface shape is used such as screen painting or spraying printing to apply/the dry and method that forms.
Operation (e): the photonasty core 3a to forming in the above-mentioned operation makes public/develops, and forms optical waveguide core pattern 3.
Operation (f): the mode with the core pattern 2 of the optical waveguide of formation in the lining operation (e), form packaging material overlayer 4, form the peristome on the required conductive bond pads of installing component.Then, on conductive bond pads, carry out again, can carry out parts and install such as the surface treatment of electroplating.
In the 3rd embodiment, between metal forming 3a and packaging material 1, insert the thin middle layer 6 of number μ m.Through the characteristic in this middle layer 6, can produce the photoelectric composite flexible wiring board of further raising function.
For example, the high bonding agent of adaptation between middle layer 6 employings and metal forming 3a and the packaging material 1, thus also can use on high adaptation ground in the metal forming on the very level and smooth surface of not carrying out the surface coarsening processing.
Thereby; Can form the also conducting wiring pattern 3 of straight (straight) of the level and smooth more and pattern edge in surface/back side; And can reduce the transmission loss when transmitting high frequency electrical signal thus, in photoelectric composite flexible wiring board, also can transmit the electric signal of high frequency more.
Through the deep processing of digging of packaging material basement membrane 1, with second embodiment likewise, alignd with the flexural center of whole base plate in the flexural center of core 2a, can reduce to be applied to the bending stress of core 2a.This result can prolong the flex life of optical waveguide.Therefore obviously, packaging material basement membrane 1 adds the also attenuation of all thickness of packaging material overlayer 4, can be soft more and be easy to bending.
Claims (6)
1. a photoelectric composite flexible wiring board is provided with optical waveguide core pattern and conducting metal pattern in the packaging material membrane surface, it is characterized in that:
At least at grade, in optical waveguide core pattern described in the crooked flexible portion and said conducting metal pattern arrangement
The face xsect in addition that joins with said packaging material basement membrane of packaging material overlayer lining optical waveguide core pattern and conducting metal pattern.
2. photoelectric composite flexible wiring board as claimed in claim 1 is characterized in that:
The thickness of said optical waveguide core pattern is thicker than the thickness of said conducting metal pattern, and the thickness of the said packaging material basement membrane of the part of joining with said optical waveguide core pattern is thinner than the thickness of the part of joining with said conducting metal pattern.
3. photoelectric composite flexible wiring board as claimed in claim 1 is characterized in that:
Be provided with the middle layer between said conducting metal pattern and the said packaging material basement membrane.
4. the manufacturing approach of a photoelectric composite flexible wiring board, said photoelectric composite flexible wiring board is provided with optical waveguide core pattern and conducting metal pattern on the surface of packaging material basement membrane, it is characterized in that:
(a) preparation has the duplexer of metal level at least one face of said packaging material basement membrane,
(b) form the conducting metal pattern through the part that do not need of removing said metal level,
(c) the face laminated core layer that exists at the said conducting metal pattern of said duplexer,
(d) form optical waveguide core pattern through the part that do not need of removing said core layer,
(e) lining packaging material overlayer is to cover said optical waveguide core pattern.
5. the manufacturing approach of a photoelectric composite flexible wiring board, said photoelectric composite flexible wiring board is provided with optical waveguide core pattern and conducting metal pattern on the surface of packaging material basement membrane, it is characterized in that:
(a) preparation has the duplexer of metal level at least one face of said packaging material basement membrane,
(b) do not need part through what remove said metal level, form the conducting metal pattern,
(c) said metal level be removed and the part of the said packaging material membrane surface exposed be processed into thinner,
(d) the face laminated core layer that exists at said conducting metal pattern,
(e) come in crooked at least flexible portion, to implement to form optical waveguide core pattern on the said packaging material basement membrane of thinning processing through the part that do not need of removing said core layer,
(f) lining packaging material overlayer is to cover said optical waveguide core pattern.
6. the manufacturing approach of a photoelectric composite flexible wiring board, said photoelectric composite flexible wiring board is provided with optical waveguide core pattern and conducting metal pattern on the surface of packaging material basement membrane, it is characterized in that:
(a) preparation has the duplexer of middle layer and metal level at least one face of said packaging material basement membrane,
(b) form the conducting metal pattern through the part that do not need of removing said metal level,
(c) remove removing of said metal level and a part of middle layer that will expose, and the said packaging material basement membrane that exposes carried out thinning processing,
(d) the face laminated core resin bed that exists at said conducting metal pattern,
(e) do not need part through what remove said core resin bed, in crooked flexible portion, implement at least to form optical waveguide core pattern on the said packaging material basement membrane of thinning processing,
(f) lining packaging material overlayer is to cover said optical waveguide core pattern.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-217118 | 2008-08-26 | ||
| JP2008217118 | 2008-08-26 | ||
| JP2008217118A JP5160346B2 (en) | 2008-08-26 | 2008-08-26 | Photoelectric composite flexible wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101661134A CN101661134A (en) | 2010-03-03 |
| CN101661134B true CN101661134B (en) | 2012-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910151605 Expired - Fee Related CN101661134B (en) | 2008-08-26 | 2009-06-22 | Photoelectric composite flexible wiring board and manufacturing method thereof |
Country Status (2)
| Country | Link |
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| JP (1) | JP5160346B2 (en) |
| CN (1) | CN101661134B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101118905B1 (en) | 2009-07-23 | 2012-03-07 | 삼성전기주식회사 | Printed circuit board for optical waveguides and method of manufacturing the same |
| JP5754130B2 (en) * | 2010-12-22 | 2015-07-29 | 日立化成株式会社 | Photoelectric composite substrate and manufacturing method thereof |
| US9146348B2 (en) | 2011-01-07 | 2015-09-29 | Panasonic Intellectual Property Management Co., Ltd. | Optical-electrical composite flexible circuit substrate including optical circuit and electrical circuit |
| JP5870489B2 (en) * | 2011-01-24 | 2016-03-01 | 日立化成株式会社 | Optical waveguide, photoelectric composite substrate, optical waveguide manufacturing method, and photoelectric composite substrate manufacturing method |
| JP6098917B2 (en) * | 2011-12-28 | 2017-03-22 | パナソニックＩｐマネジメント株式会社 | Opto-electric composite flexible wiring board |
| JP5964143B2 (en) | 2012-05-31 | 2016-08-03 | 日本メクトロン株式会社 | Manufacturing method of opto-electric hybrid printed wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2578846Y (en) * | 2002-09-26 | 2003-10-08 | 上海讯桥通信技术有限公司 | Double-core wiring module |
| CN101093263A (en) * | 2006-06-19 | 2007-12-26 | 富士施乐株式会社 | Optical waveguide, method of manufacturing the same and optical communication module |
| CN101206288A (en) * | 2006-12-22 | 2008-06-25 | 富士施乐株式会社 | Optoelectric composite wiring module and information processing apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04146684A (en) * | 1990-10-08 | 1992-05-20 | Matsushita Electric Ind Co Ltd | Circuit board and manufacture thereof |
| JP2002228876A (en) * | 2001-02-07 | 2002-08-14 | Japan Aviation Electronics Industry Ltd | Light guide cable and method for connecting the same |
| US7130511B2 (en) * | 2004-03-30 | 2006-10-31 | Motorola, Inc. | Flexible active signal cable |
| JP2007033688A (en) * | 2005-07-25 | 2007-02-08 | Fuji Xerox Co Ltd | Optical waveguide film and optical transmission and reception module |
| JP4735435B2 (en) * | 2006-03-08 | 2011-07-27 | 日立化成工業株式会社 | Connection method of optical element to optical / electrical composite wiring |
| JP2007293239A (en) * | 2006-03-31 | 2007-11-08 | Hitachi Chem Co Ltd | Optical module |
| JP2009080451A (en) * | 2007-09-05 | 2009-04-16 | Toshiba Corp | Flexible optoelectric interconnect and method for manufacturing same |
-
2008
- 2008-08-26 JP JP2008217118A patent/JP5160346B2/en not_active Expired - Fee Related
-
2009
- 2009-06-22 CN CN 200910151605 patent/CN101661134B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2578846Y (en) * | 2002-09-26 | 2003-10-08 | 上海讯桥通信技术有限公司 | Double-core wiring module |
| CN101093263A (en) * | 2006-06-19 | 2007-12-26 | 富士施乐株式会社 | Optical waveguide, method of manufacturing the same and optical communication module |
| CN101206288A (en) * | 2006-12-22 | 2008-06-25 | 富士施乐株式会社 | Optoelectric composite wiring module and information processing apparatus |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-215494A 2004.07.29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5160346B2 (en) | 2013-03-13 |
| CN101661134A (en) | 2010-03-03 |
| JP2010054617A (en) | 2010-03-11 |
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