CN101655329B - Heat pipe radiator - Google Patents
Heat pipe radiator Download PDFInfo
- Publication number
- CN101655329B CN101655329B CN 200910130171 CN200910130171A CN101655329B CN 101655329 B CN101655329 B CN 101655329B CN 200910130171 CN200910130171 CN 200910130171 CN 200910130171 A CN200910130171 A CN 200910130171A CN 101655329 B CN101655329 B CN 101655329B
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- China
- Prior art keywords
- heat
- heat pipe
- endothermic section
- groove
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005452 bending Methods 0.000 claims abstract description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 30
- 239000002250 absorbent Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000007423 decrease Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat pipe radiator. The heat pipe radiator comprises a heat pipe and a base, wherein the heat pipe is provided with a heat-absorbing part and a radiating part in bending connection with the heat-absorbing part; the base supports the heat pipe; one side of the base is provided with at least one groove; the heat-absorbing part of the heat pipe is partially arranged in the groove; and the heat-absorbing part of the heat pipe is extruded to deform and fixed in the groove by extruding projection part of the heat-absorbing part. The heat pipe is extruded and fixed in the groove of the base by adopting the structure, therefore, the invention simplifies the production process, improves the radiation efficiency and decreases the production cost.
Description
[technical field]
The present invention relates to a kind of heat-pipe radiator, particularly for the heat-pipe radiator that electronic devices and components are dispelled the heat.
[background technology]
Aspect the heat dissipation problem of electronic device, because heat pipe has characteristics such as capacity of heat transmission height, pyroconductivity height, heat transfer rate be fast, in light weight, simple in structure, add it and can transmit a large amount of heat but do not consume electric power, so heat pipe is widely used in the heat abstractor of various electronic products.Therefore, heat-pipe radiator has become the important topic that solves the dissipation from electronic devices problem.
At present, known radiator mainly includes fin, heat pipe and heat-conducting block, and wherein beginning on the heat-conducting block has a plurality of parallel grooves.In when assembling, will apply eutectic solder in the groove, the endothermic section of heat pipe is placed in this groove and by heating heat pipe is welded on the heat-conducting block then, realizes that thus heat pipe fixes its manufacturing process complexity, manufacturing cost height.In addition, in the prior art, be the heating surface that heat-conducting block is fixed to electronic component after heat pipe and heat-conducting block are fixing, because heat-conducting block itself has thermal resistance, cause the heat-transfer rate of radiator and heat dispersion to reduce.
[summary of the invention]
Heat pipe is connected by welding procedure with pedestal in the prior art radiator in order to overcome, and the manufacturing process complicated technical problem the present invention proposes the fixing heat-pipe radiator of a kind of heat pipe and pedestal extruding.In addition, the present invention also further provides a kind of heat-pipe radiator with higher heat-transfer rate and heat dispersion.
The present invention solves that heat pipe is connected by welding procedure with pedestal in the radiator of prior art, the technical scheme that the manufacturing process complicated technical problem is taked is: a kind of heat-pipe radiator is provided, comprise: have endothermic section and the heat pipe of the radiating part that is connected with the endothermic section bending and the pedestal that supports heat pipe, one side of pedestal is provided with at least one groove, the endothermic section part of heat pipe is arranged in the groove, by the projection of extruding endothermic section, make the endothermic section of heat pipe be extruded distortion and therefore be fixed in the groove.Heat pipe is the U-shaped heat pipe, the U-shaped heat pipe comprises two radiating parts that arrange at interval and is connected in endothermic section between the adjacent end portion of two radiating parts, pedestal integral body is between two radiating parts, and heat-pipe radiator further comprises a plurality of fin that are located on two radiating parts, the first type surface of fin and the upper surface of pedestal arrange at interval, and the area of the first type surface of fin is greater than the area of the upper surface of pedestal.
According to one preferred embodiment of the present invention, groove is arranged on the base plane of pedestal, and the endothermic section of heat pipe has equal with the base plane of pedestal and as the compressive plane of heat-absorbent surface.
According to one preferred embodiment of the present invention, pedestal is the tabular fixed block, and groove is vertically arranged on the side of fixed block and laterally extending and leap tabular fixed block.
According to one preferred embodiment of the present invention, groove has the opening of gradually closing shape, and the endothermic section of extruding heat pipe is fixed in the groove endothermic section of heat pipe from the projection of opening.
According to one preferred embodiment of the present invention, heat-conducting medium further is set between groove and the endothermic section.
By adopting said structure, the heat pipe extruding is fixed in the groove of pedestal on, can simplify radiator production technology, improve radiating efficiency, reduce production costs.
[description of drawings]
Fig. 1 is the decomposing schematic representation of heat-pipe radiator one embodiment of the present invention;
Fig. 2 is the decomposing schematic representation of heat pipe and pedestal in the heat-pipe radiator shown in Figure 1;
Fig. 3 is the assembling schematic diagram of heat-pipe radiator one embodiment of the present invention.
[specific embodiment]
Relevant feature of the present invention and technology contents please refer to following detailed description and accompanying drawing, and accompanying drawing only provides reference and explanation, and the present invention is limited.
As shown in Figure 1-Figure 3, radiator 1 of the present invention mainly comprises: have endothermic section 111 and with the pedestal 12 of the heat pipe 11 of the crooked radiating parts 112 that are connected in endothermic section 111 and support heat pipe 11 and be located in a plurality of fin 13 on the heat pipe 11.In the present embodiment, pedestal 12 is the tabular fixed block, and a side of pedestal 12 is provided with vertical arrangement and laterally extending groove 121, and endothermic section 111 press nip of heat pipe 12 are in groove 121.As shown in the figure, in the present embodiment, groove 121 laterally extending and leap pedestals 12.Groove 121 preferentially has the opening of gradually closing shape, to strengthen fixed effect.Fin 13 is made with aluminium, copper or other thermal diffusivity good metal material, is provided with a plurality of perforation thereon.Heat pipe 11 can be L type, U-shaped or have the heat pipe of other curved shape, and its inside has capillary structure and hydraulic fluid, and the outside is formed with endothermic section 111 and radiating part 112.In addition, radiator 1 can also adopt other appropriate configuration except can be above-mentioned kenel.Because endothermic section 111 press nip are in groove 121, the manufacturing process of radiator 1 is simpler, and fixed effect is better.
In the process of extruding endothermic section 111, should make the compressive plane of endothermic section 111 equal with the base plane of pedestal 12.Like this with radiator 1 and electronic component (not shown) when fixing, the compressive plane of endothermic section 111 and the pyrotoxin of electronic component be surperficial directly to be contacted and as heat-absorbent surface, increases heat-conducting effect and the heat dispersion of radiator thus.In addition, between endothermic section 111 and groove 121, can also heat-conducting medium be set further, endothermic section 111 is fully contacted with pedestal 12 by heat-conducting medium, further promote heat-conducting effect thus.
Introduce manufacture method one preferred embodiment of heat-pipe radiator of the present invention below, in the present embodiment, at first, provide to have endothermic section 111 and the heat pipe 11 of the radiating parts 112 that are connected with endothermic section 111 bendings and the pedestal 12 that the side is provided with groove 121; Endothermic section 111 parts of heat pipe 11 are arranged in the groove 121 of pedestal 12, utilize the projection of anchor clamps extruding endothermic section 111, endothermic section 111 distortion, and and then be clamped in the groove 121.In extrusion process, the extruding endothermic section 111 make compressive plane equal with the base plane of pedestal 12, and with this compressive plane as heat-absorbent surface.
By adopting said structure and method, on the heat pipe extruding is fixed in the groove of pedestal, can simplify radiator production technology, improve radiating efficiency, reduce production costs.
The above, be the preferred embodiments of the present invention only, be not so namely limit claim of the present invention, the equivalent structure transformation that every application specification of the present invention and accompanying drawing content are done, direct or letter scoops out and is used in other relevant technical field, all in like manner is included in the claim of this invention.
Claims (2)
1. heat-pipe radiator, described heat-pipe radiator comprises: have endothermic section and the heat pipe of the radiating part that is connected with the bending of described endothermic section and the pedestal that supports described heat pipe, it is characterized in that: a side of described pedestal is provided with at least one groove, the endothermic section part of described heat pipe is arranged in the described groove, by pushing the projection of described endothermic section, make the endothermic section of described heat pipe be extruded distortion and therefore be fixed in the described groove, described groove is arranged on the base plane of described pedestal, the endothermic section of described heat pipe has equal with the base plane of described pedestal and as the compressive plane of heat-absorbent surface, described groove has the opening of gradually closing shape, the endothermic section of pushing described heat pipe is from the projection of described opening and the described endothermic section of described heat pipe is fixed in the described groove, described pedestal is the tabular fixed block, described groove is vertically arranged on the side of described fixed block and is laterally extending and cross over described tabular fixed block, described heat pipe is the U-shaped heat pipe, described U-shaped heat pipe comprises two described radiating parts that arrange at interval and is connected in described endothermic section between the adjacent end portion of described two radiating parts, described pedestal integral body is between described two radiating parts, and described heat-pipe radiator further comprises a plurality of fin that are located on described two radiating parts, the first type surface of described fin and the upper surface of described pedestal arrange at interval, and the area of the first type surface of described fin is greater than the area of the upper surface of described pedestal.
2. heat-pipe radiator according to claim 1 is characterized in that: between described groove and the described endothermic section heat-conducting medium is set further.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910130171 CN101655329B (en) | 2006-09-22 | 2006-09-22 | Heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910130171 CN101655329B (en) | 2006-09-22 | 2006-09-22 | Heat pipe radiator |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610062795.4A Division CN101149234B (en) | 2006-09-22 | 2006-09-22 | Heat pipe radiator production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101655329A CN101655329A (en) | 2010-02-24 |
| CN101655329B true CN101655329B (en) | 2013-09-04 |
Family
ID=41709714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910130171 Ceased CN101655329B (en) | 2006-09-22 | 2006-09-22 | Heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101655329B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010022225A1 (en) * | 2010-04-28 | 2011-12-15 | J. Eberspächer GmbH & Co. KG | Heat transfer assembly, heat exchanger and manufacturing process |
| CN103759561A (en) * | 2014-01-21 | 2014-04-30 | 华南理工大学 | Heat pipe radiator based on phase change compression, and manufacturing method of heat pipe radiator |
| CN105737656B (en) * | 2014-07-25 | 2017-07-11 | 东莞市闻誉实业有限公司 | Heat-pipe radiator |
| CN105489968B (en) * | 2016-01-27 | 2018-08-14 | 深圳海斯迪能源科技股份有限公司 | The assembling method of power battery module and the module |
| CN109084605A (en) * | 2018-08-01 | 2018-12-25 | 中国科学技术大学 | A kind of pulsating heat pipe of the non-elbow structure of bringing-up section |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2500070Y (en) * | 2001-08-03 | 2002-07-10 | 富准精密工业(深圳)有限公司 | Radiator device |
| CN1540751A (en) * | 2003-04-21 | 2004-10-27 | 刘俊富 | Method for combining heat-conducting tube with heat-conducting base |
| CN2694359Y (en) * | 2004-04-02 | 2005-04-20 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe radiator |
| CN2770093Y (en) * | 2004-12-24 | 2006-04-05 | 富准精密工业(深圳)有限公司 | Radiating device |
-
2006
- 2006-09-22 CN CN 200910130171 patent/CN101655329B/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2500070Y (en) * | 2001-08-03 | 2002-07-10 | 富准精密工业(深圳)有限公司 | Radiator device |
| CN1540751A (en) * | 2003-04-21 | 2004-10-27 | 刘俊富 | Method for combining heat-conducting tube with heat-conducting base |
| CN2694359Y (en) * | 2004-04-02 | 2005-04-20 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe radiator |
| CN2770093Y (en) * | 2004-12-24 | 2006-04-05 | 富准精密工业(深圳)有限公司 | Radiating device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-71635A 2004.03.04 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101655329A (en) | 2010-02-24 |
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Owner name: SHENZHEN FLUENCE TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DU JIANJUN Effective date: 20110402 |
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Free format text: CORRECT: ADDRESS; FROM: 518000 3-25D, JINGPENG BUILDING, FUTIAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 BUILDING 3, JUNTIAN INDUSTRIAL ZONE, PINGSHAN, LONGGANG DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE |
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Effective date of registration: 20110402 Address after: Ping Jun Tian Industrial Zone of Longgang District of Shenzhen City, Guangdong Province, 3, 518000 Applicant after: Shenzhen Fluence Technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong province Futian District Jing Peng building 3-25D Applicant before: Du Jianjun Effective date of registration: 20110402 Address after: Ping Jun Tian Industrial Zone of Longgang District of Shenzhen City, Guangdong Province, 3, 518000 Applicant after: Shenzhen Fluence Technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong province Futian District Jing Peng building 3-25D Applicant before: Du Jianjun |
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Owner name: SHENZHEN FLUENCE TECHNOLOGY PLC. Free format text: FORMER NAME: SHENZHEN FLUENCE TECHNOLOGY CO., LTD. |
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| CP03 | Change of name, title or address |
Address after: 518118 Guangdong city of Shenzhen province Pingshan Pingshan office six community Jun Tian Industrial Zone No. 3 building first Patentee after: SHENZHEN FLUENCE TECHNOLOGY CO., LTD. Address before: Ping Jun Tian Industrial Zone of Longgang District of Shenzhen City, Guangdong Province, 3, 518000 Patentee before: Shenzhen Fluence Technology Co., Ltd. Address after: 518118 Guangdong city of Shenzhen province Pingshan Pingshan office six community Jun Tian Industrial Zone No. 3 building first Patentee after: SHENZHEN FLUENCE TECHNOLOGY CO., LTD. Address before: Ping Jun Tian Industrial Zone of Longgang District of Shenzhen City, Guangdong Province, 3, 518000 Patentee before: Shenzhen Fluence Technology Co., Ltd. |
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Decision date of declaring invalidation: 20150720 Decision number of declaring invalidation: 26504 Granted publication date: 20130904 |