CN101636036A - Flexible circuit board as well as hot-pressed device and method for manufacturing same - Google Patents
Flexible circuit board as well as hot-pressed device and method for manufacturing same Download PDFInfo
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- CN101636036A CN101636036A CN200910303560A CN200910303560A CN101636036A CN 101636036 A CN101636036 A CN 101636036A CN 200910303560 A CN200910303560 A CN 200910303560A CN 200910303560 A CN200910303560 A CN 200910303560A CN 101636036 A CN101636036 A CN 101636036A
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Abstract
The invention relates to a flexible circuit board as well as a hot-pressed device and a method for manufacturing the same. The flexible circuit board comprises a main part and a contact part, wherein the contact part is arranged at one end of the main part; the main part comprises a first insulation layer, a plurality of conductive lines and a protecting layer; the conductive lines are arranged between the first insulation layer and the protecting layer; the contact part comprises a second insulation layer connected with the first insulation layer of the main part; the second insulation layer comprises a contact surface and a bottom surface opposite to the contact surface; the surface of the contact surface is provided with a plurality of conductive terminals for being electrically connected with an external line; the conductive terminals are electrically connected with the conductive lines of the main part, and a reinforced layer is covered on the bottom surface. The invention has simple structure, simple and convenient assembly and multiple functions. The flexible circuit board is difficultly influenced by the thermal expansion factor and can improve the press precision when being pressed with an external electronic element.
Description
Technical field
The present invention relates to a kind of flexible circuit board, make the manufacture method of hot pressing device and this flexible circuit board of this flexible circuit board.
Background technology
Flourish along with semiconductor technology and material science, the application of chip for driving and flexible circuit board also more and more widely.Flexible circuit board has reelability and bending property, demand that can cooperating equipment and with in the different shape embedded conductor, make two electronic building bricks electrically connect.
Flexible circuit board generally includes an insulating barrier, many conducting wires, a plurality of conducting terminal and protective layers in the prior art.These many conducting wires are arranged on this surface of insulating layer.These a plurality of conducting terminals are used for being electrically connected with outside line, and it is arranged on the end of this insulating barrier and electrically connects with these many conducting wires respectively.This protective layer is used for providing insulation protection for these many conducting wires, and it is arranged on first surface of insulating layer, and covers this many conducting wires, feasible be provided with a plurality of conducting terminals the end of insulating barrier come out.
Yet, in the prior art, a plurality of conducting terminals of flexible circuit board only are arranged on the insulating barrier, so, when a plurality of conducting terminals of this flexible circuit board and exterior electrical components hot binding, the influence of its expanded by heating coefficient is bigger, causes hot pressing contraposition out-of-flatness easily, and then produce defective such as hot pressing off normal, and then reduce the production yield of product.
Summary of the invention
During for solution prior art flexible circuit board and exterior electrical components hot binding, the influence of expanded by heating coefficient is bigger, causes the technical problem of hot pressing off normal defective, the invention provides a kind of flexible circuit board.
A kind of flexible circuit board; it comprises that a main part and is arranged on the contact site of this main part one end; this main part comprises one first insulating barrier; a plurality of conducting wires and a protective layer; these a plurality of conducting wires are arranged between this first insulating barrier and this protective layer; this contact site comprises second insulating barrier that is connected with first insulating barrier of this main part; this second insulating barrier comprises a contact-making surface and one and this contact-making surface opposed bottom surface; this contact-making surface is provided with a plurality of conducting terminals of being electrically connected with outside line of being used for; these a plurality of conducting terminals are electrically connected with the conducting wire of this main part, and this bottom surface is provided with a reinforced layer.
The material of described reinforced layer is a polythioamine.
Described flexible circuit board also comprises two fixed parts that are arranged on the both sides of this main part, correspondingly on two fixed parts is provided with one and is used for the fixing hole affixed with external device (ED).
The present invention also provides a kind of hot pressing device of pressing flexible circuit board, flexible circuit board wherein to be laminated comprises that the bottom surface and of a tool contact site is arranged on the reinforced layer of this bottom surface, this hot pressing device comprises a control unit and a hot pressing contact that is electrically connected with this control unit, this hot pressing contact comprises a plurality of heater bodies, this control unit is controlled each heater body respectively and is converted electrical energy into heat energy, and electric energy offered the bottom surface and the reinforced layer of described contact site, make the bottom surface of contact site and reinforced layer by the scolder hot press.
Described hot pressing device also comprises a temperature sense instrument that is electrically connected with this control unit, and this control unit also comprises a comparator that is electrically connected with this temperature sense instrument.
Described control unit comprises a plurality of minutes control units, and each divides the corresponding control of control unit one heater body.
Described comparator receives the temperature signal of this temperature sense instrument, and feedback signal is to this minute control unit.
Described a plurality of heater body evenly is provided with at interval.
Described hot pressing contact also comprises an abutment end, and it is positioned at the end of this hot pressing contact.
A kind of manufacture method of this flexible circuit board, it comprises the steps: to provide an insulating tape; On this insulating tape, form many conducting wires; One protection film is set on these many conducting wires and this insulating tape, forms a contact site; This contact site comprise one be provided with a plurality of electrical contact surfaces opposed bottom surface, a reinforced layer is set on this bottom surface.
Compared to prior art, in flexible circuit board of the present invention, bottom surface at its contact site increases one deck reinforced layer, when a plurality of conducting terminals of the contact site of this flexible circuit board and exterior electrical components hot binding, reinforcement compensating action by this reinforced layer, make this contact site be difficult for the influence of expanded by heating coefficient, thereby guarantee that it is more smooth with contacting of exterior electrical components, and then improve the precision of pressing and the production yield of product.
When adopting hot pressing device provided by the invention and hot pressing method to make this flexible circuit board, because the hot pressing contact comprises a plurality of heater bodies, when each heater body synchronous working, the thermal conduction rate difference of every adjacent two heater bodies is little, thereby the feasible abutment end that contacts with element to be laminated is release heat uniformly, guarantee that the flexible circuit board that adopts this hot pressing device and hot pressing method to make is more smooth with contacting of exterior electrical components, and then improve the precision of pressing and the production yield of product.
Description of drawings
Fig. 1 is the front view of the present invention's flexible circuit board that a kind of better embodiment discloses.
Fig. 2 is the end view of flexible circuit board shown in Figure 1.
Fig. 3 is the rearview of flexible circuit board shown in Figure 1.
Fig. 4 is the schematic perspective view of the present invention's hot pressing device that a kind of better embodiment discloses.
Fig. 5 is another angle operating state floor map of hot pressing device shown in Figure 4.
Fig. 6 is the three-dimensional enlarged diagram of the hot pressing contact of hot pressing device shown in Figure 4.
Fig. 7 is the block diagram of the control unit of hot pressing device shown in Figure 4.
Embodiment
The present invention relates to a kind of flexible circuit board, make the hot pressing device and the hot pressing method of this this flexible circuit board, describe technical scheme of the present invention in detail below in conjunction with accompanying drawing:
Please consult Fig. 1, Fig. 2 and Fig. 3 simultaneously, wherein Fig. 1 is the front view of flexible circuit board shown in a kind of better embodiment of the present invention, and Fig. 2 is the end view of flexible circuit board shown in Figure 1, and Fig. 3 is the rearview of flexible circuit board shown in Figure 1.This flexible circuit board 1 comprises a main part 11, a contact site 12 and two fixed parts 13.This contact site 12 is arranged on an end of this main part 11, and these two fixed parts 13 are symmetricly set on the both sides of this main part 11.This main part 11 comprises one first insulating barrier 111, a plurality of conducting wire (figure does not show) and a protective layer 112.These protective layer 112 usefulness think that these many conducting wires provide insulation protection, and it is arranged on this first insulating barrier, 111 surfaces, and cover these many conducting wires.These a plurality of conducting wires are arranged between this first insulating barrier 111 and this protective layer 112.All be provided with a fixing hole 131 on these two fixed parts 13, in order to affixed with external device (ED).
This contact site 12 comprises one second insulating barrier 121, itself and first insulating barrier, the 111 corresponding electrical connections of this main part 11.This second insulating barrier 121 comprises a contact-making surface 123 and one and these contact-making surface 123 opposed bottom surface 125.This contact-making surface 123 is provided with a plurality of conducting terminals that are used for being electrically connected with outside line (figure does not show).These a plurality of conducting terminals are electrically connected with the conducting wire of this main part 11.Be coated with a reinforced layer 127 on this bottom surface 125, this reinforced layer 127 is used for changing the thermal coefficient of expansion of this contact site 12, reaches the effect of buffering.The material of this reinforced layer 127 be polythioamine (Polyimide, PI).
See also Fig. 4 and Fig. 5 again, wherein to be that the present invention is a kind of be used to make the schematic perspective view of the hot pressing device of flexible circuit board as shown in Figure 1 to Fig. 4, and Fig. 5 is another angle operating state floor map of hot pressing device shown in Figure 4.This hot pressing device 2 is used for making the bottom surface 123 of the contact site 12 of this flexible circuit board 1 to pass through solder bonds with described reinforced layer 127.This hot pressing device comprises a base station 21, an X-Y board 22, an infrared temperature inductance gauge 23, a hot pressing contact 24, an elevating mechanism 25, a movable table 26, a horizontal frame 27 and a control unit 28.
This X-Y board 22 is arranged on this base station 21 and plays a supportive role, and it can move along orthogonal directions X and Y direction in horizontal plane.
The ambient temperature that this infrared temperature inductance gauge 23 is used for sensing is converted to the signal of telecommunication, and it is arranged in this X-Y board 22, and this infrared temperature inductance gauge 23 of drive that moves freely of this X-Y board 22 moves in horizontal plane.
Seeing also Fig. 6, is the three-dimensional enlarged diagram of the hot pressing contact of hot pressing device shown in Figure 4.This hot pressing contact 24 is devices that are used for providing for the contact site 12 of flexible circuit board to be laminated 1 and described reinforced layer 127 thermal source, and it is connected an end of this elevating mechanism 25.This hot pressing contact 24 comprises a plurality of heater bodies 241 and an abutment end 243.These a plurality of heater body 241 parallel interval are arranged and are provided with, each heater body 241 be a cross section for root is flat the narrow cylinder in end, it converts electrical energy into heat energy under the control of drive control signal.This abutment end 243 is horizontally extending flat surfaces that the end by this heater body 241 is connected to form.This heater body 241 adopts hot good conductor to make, and to this abutment end 243, this abutment end 243 offers heat energy the contact site 12 of described reinforced layer 127 and described flexible circuit board 1 with the thermal energy conduction that produces for it.
The other end of this elevating mechanism 25 and this movable table 26 are affixed.This elevating mechanism 25 can be that cylinder or other can drive the mechanism that this hot pressing contact 24 moves up and down.
This movable table 26 is set on this horizontal frame 27 simultaneously.This horizontal frame 27 is installed on this base station 21, and this movable table 26 this horizontal frame 27 relatively moves freely along these horizontal frame 27 directions.
Seeing also Fig. 7, is the block diagram of the control unit of hot pressing device shown in Figure 4.This control unit 28 is used for producing drive control signal and controls this hot pressing contact 24 work, it comprises a plurality of minutes control units 281 and a comparator 283, each divides control unit 281 to be electrically connected with each heater body 241, this a plurality of minutes control units 281 all are electrically connected with this comparator 283, and this comparator 283 is electrically connected with this infrared temperature inductance gauge 23.
In the pressing process, these control unit 28 transmission drive control signal are to each heater body 241; This heater body 241 produces heat under the effect of this drive control signal, and conducts heat to this abutment end 243 respectively, and this abutment end 243 conducts heat to the surface of element 31 to be laminated; The surface temperature of these infrared temperature inductance gauge 23 inductions element to be laminated, and feedback signal is to the comparator 283 of this control unit 28,283 pairs of these feedback signals of this comparator and drive control signal compare, and the drive control signal of initial setting is carried out FEEDBACK CONTROL according to this comparative result, make this minute control unit 281 adjust the work that drive control signal are controlled this heater body 241, guarantee that the surface temperature of element to be laminated reaches unanimity.
Simultaneously, when utilizing these hot pressing device 2 these flexible circuit boards 1 of pressing, it comprises the steps:
At first, one insulating tape is provided, with this reelability insulating tape furl on one first rolling wheel, the material of this insulating tape is pi (Polyimide, PI), poly terephthalic acid second two fat (Polyethylene Terephalate), liquid crystal polymer (Liquid Crystal Polymer, LCP) or Teflon (Teflon, PTFE) any one in waiting.
Then, on this insulating tape, form many conducting wires, at first this insulating tape is rolled out by this first rolling wheel, and it is furled on one second rolling wheel, and Copper Foil (copper foil) is rolled out by the 3rd rolling wheel that is positioned at this first rolling wheel top, be provided with a pressing roller bearing between this first rolling wheel and this second rolling wheel, this pressing spool is pressed on Copper Foil on this insulating tape and it is furled on this second rolling wheel; After the same method dry film (dry film) is pressed together on this Copper Foil then; Then dry film is carried out the exposure video picture, make dry film form the patterning dry film of setting; Then Copper Foil is carried out etching, utilize its position that is not covered of etching solution etching off, make Copper Foil form the metallic circuit of patterning by this patterning dry film; Afterwards,, remove this patterning and get dry film, make metallic circuit reveal by the mode that liquid cleans.
Then, cover a protection film on these many conducting wires and this insulating tape, coming out in the end that makes this insulating tape be provided with a plurality of conducting terminals, forms a contact site; Mode by hot pressing; on this insulating tape and these many conducting wires, cover a protection film; make it constitute the protective layer of this insulating tape; with the protection metallic circuit; and the end that makes this insulating tape be provided with a plurality of conducting terminals comes out, and forms to be used for the contact site that is electrically connected with outside line.The material of this protection film be pi (Polyimide, PI), polyester (Polyester, PET) or liquid crystal polymer (Liquid CrystalPolymer LCP) waits insulating material.
This contact site comprise one be provided with a plurality of electrical contact surfaces opposed bottom surface, on this bottom surface, cover one and strengthen film; This flexible circuit board upset is placed on the board, will strengthens the bottom surface that film plaster is combined in this contact site by the mode of hot pressing then.The material of this reinforcement film be pi (Polyimide, PI).
The invention provides flexible circuit board, make the manufacture method of hot pressing device and this flexible circuit board of this flexible circuit board, compared to prior art, main beneficial effect of the present invention is:
(1). the bottom surface at the contact site of this flexible circuit board has increased one deck reinforced layer, when a plurality of conducting terminals of the contact site of this flexible circuit board and exterior electrical components hot binding, reinforcement compensating action by this reinforced layer, make this contact site be difficult for the influence of expanded by heating coefficient, thereby make more smooth with contacting of exterior electrical components, and then improve the precision of pressing, improve the production yield of product.
(2). in this hot pressing device, because the hot pressing contact comprises a plurality of heater bodies, when each heater body synchronous working, the thermal conduction rate difference of every adjacent two heater bodies is little, thereby makes the abutment end that contacts with element to be laminated release heat uniformly.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1. flexible circuit board; it comprises that a main part and is arranged on the contact site of an end of this main part; this main part comprises one first insulating barrier; a plurality of conducting wires and a protective layer; a plurality of conducting wires are arranged between this first insulating barrier and this protective layer; this contact site comprises second insulating barrier that is connected with first insulating barrier of this main part; this second insulating barrier comprises a contact-making surface and one and this contact-making surface opposed bottom surface; this contact-making surface is provided with a plurality of conducting terminals of being electrically connected with outside line of being used for; these a plurality of conducting terminals are electrically connected with the conducting wire of this main part, it is characterized in that: be coated with a reinforced layer on this bottom surface.
2. flexible circuit board as claimed in claim 1 is characterized in that: the material of this reinforced layer is a polythioamine.
3. flexible circuit board as claimed in claim 2 is characterized in that: this flexible circuit board also comprises two fixed parts that are arranged on the both sides of this main part, all is provided with one on two fixed parts and is used for the fixing hole affixed with external device (ED).
4. make the hot pressing device of flexible circuit board according to claim 1 for one kind, it comprises a control unit and a hot pressing contact that is electrically connected with this control unit, this hot pressing contact comprises a plurality of heater bodies, it is characterized in that: this control unit is controlled each heater body respectively and is converted electrical energy into heat energy, and electric energy offered the bottom surface and the reinforced layer of described contact site, make the bottom surface of contact site and reinforced layer by the scolder hot press.
5. hot pressing device as claimed in claim 4 is characterized in that: this hot pressing device also comprises a temperature sense instrument that is electrically connected with this control unit, and this control unit also comprises a comparator that is electrically connected with this temperature sense instrument.
6. hot pressing device as claimed in claim 5 is characterized in that: this control unit comprises a plurality of minutes control units, and each divides the corresponding control of control unit one heater body.
7. hot pressing device as claimed in claim 6 is characterized in that: this comparator receives the temperature signal of this temperature sense instrument, and feedback signal is to this minute control unit.
8. hot pressing device as claimed in claim 4 is characterized in that: a plurality of heater bodies evenly are provided with at interval.
9. hot pressing device as claimed in claim 4 is characterized in that: this hot pressing contact also comprises an abutment end, and it is positioned at the end of this hot pressing contact.
10. the manufacture method of a flexible circuit board as claimed in claim 1 is characterized in that, comprises step:
One insulating tape is provided;
On this insulating tape, form many conducting wires;
On these many conducting wires and this insulating tape, cover a protection film;
This contact site comprise one be provided with the face opposed bottom surface of a plurality of conducting terminals, a reinforced layer is set on this bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103035603A CN101636036B (en) | 2009-06-23 | 2009-06-23 | Flexible circuit board as well as hot-pressed device and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103035603A CN101636036B (en) | 2009-06-23 | 2009-06-23 | Flexible circuit board as well as hot-pressed device and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101636036A true CN101636036A (en) | 2010-01-27 |
| CN101636036B CN101636036B (en) | 2011-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009103035603A Active CN101636036B (en) | 2009-06-23 | 2009-06-23 | Flexible circuit board as well as hot-pressed device and method for manufacturing same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101969743A (en) * | 2010-09-26 | 2011-02-09 | 徐波 | Flexible circuit board production process |
| CN103957669A (en) * | 2014-05-13 | 2014-07-30 | 深圳华麟电路技术有限公司 | Jig and method for automatically attaching reinforcing steel sheets to flexible circuit board |
| CN107457497A (en) * | 2017-09-08 | 2017-12-12 | 宁波大红鹰学院 | A kind of multi-functional hot welding press welding method |
| US10737475B2 (en) | 2015-06-26 | 2020-08-11 | Sunpower Corporation | Thermo-compression bonding tool with high temperature elastic element |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI286629B (en) * | 2000-07-20 | 2007-09-11 | Samsung Electronics Co Ltd | Liquid crystal display device and flexible circuit board |
| CN1224511C (en) * | 2002-01-28 | 2005-10-26 | 飞赫科技股份有限公司 | Structure and making method of flexible circuit board for ink-jet printing head |
| CN101336048A (en) * | 2007-06-27 | 2008-12-31 | 英华达(上海)电子有限公司 | Method and apparatus for reinforced locating of flexible circuit board |
-
2009
- 2009-06-23 CN CN2009103035603A patent/CN101636036B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101969743A (en) * | 2010-09-26 | 2011-02-09 | 徐波 | Flexible circuit board production process |
| CN103957669A (en) * | 2014-05-13 | 2014-07-30 | 深圳华麟电路技术有限公司 | Jig and method for automatically attaching reinforcing steel sheets to flexible circuit board |
| CN103957669B (en) * | 2014-05-13 | 2016-09-14 | 深圳华麟电路技术有限公司 | The steel disc automatic attaching tool to flexible circuit board and applying method will be strengthened |
| US10737475B2 (en) | 2015-06-26 | 2020-08-11 | Sunpower Corporation | Thermo-compression bonding tool with high temperature elastic element |
| TWI725975B (en) * | 2015-06-26 | 2021-05-01 | 美商太陽電子公司 | A system and method for bonding a metal sheet to a substrate |
| CN107457497A (en) * | 2017-09-08 | 2017-12-12 | 宁波大红鹰学院 | A kind of multi-functional hot welding press welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101636036B (en) | 2011-11-16 |
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Effective date of registration: 20230802 Address after: 3rd Floor, Building B1, Wanjiang Fortune Plaza, No. 88 Ruixiang Road, Guandou Street, Jiujiang District, Wuhu City, Anhui Province 241060 Patentee after: Wuhu Tianma Automotive Electronics Co.,Ltd. Address before: 518000, Guangdong, Shenzhen, Futian District Shennan Road, building 22, South Airlines Patentee before: Tianma Micro-Electronics Co.,Ltd. |
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