CN101618484A - Lead-free solder and preparation method thereof - Google Patents
Lead-free solder and preparation method thereof Download PDFInfo
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- CN101618484A CN101618484A CN200810068426A CN200810068426A CN101618484A CN 101618484 A CN101618484 A CN 101618484A CN 200810068426 A CN200810068426 A CN 200810068426A CN 200810068426 A CN200810068426 A CN 200810068426A CN 101618484 A CN101618484 A CN 101618484A
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Abstract
The invention provides a lead-free solder and a preparation method thereof. The lead-free solder has compositions shown as the following general formula: SnaZnbBicCud, wherein a, b, c and d are all mass percent; b is more than or equal to 7 weight percent and less than or equal to 9 weight percent; c is more than or equal to 1 weight percent and less than or equal to 5 percent; d is more than or equal to 0.1 weight percent and less than or equal to 3 weight percent; the balance is Sn; and the sum of the a, b, c and d is 100 percent. The lead-free solder prepared by the invention has good wettability and creep resistance, and simultaneously improves the oxidation resistance and the corrosion resistance of the solder.
Description
Technical field
The present invention relates to a kind of lead-free solder and preparation method thereof.
Background technology
Traditional used for electronic packaging solder is the Sn-Pb solder, because good welding performance, technology is reliable, technology is reliable, uses is stable and cost of manufacture conduct always a bit for a long time such as cheap encapsulates the connection material.But the lead in the Sn-Pb scolder is of great impact to human and environment, so for the consideration of environmental protection, European Union, the U.S., Japan have announced clearly that all electronic product will realize unleaded.The unleaded of current leadless electronic product is inexorable trend.Lead-free solder unleaded played main effect in the unleaded process of electronic product.At present, substitute as solder containing pb, mainly contain: SnAg system, SnZn system, SnCu system and SnBi are scolder, and compare with other lead-free solder, SnCu system, the acquisition with low cost, easy of eutectic system scolder and modified alloy thereof, but at alloy melting point, soldering reliability, non-oxidizability aspect exist not enough.To have a fusing point lower and Sn-Zn is a scolder, as Sn
8Zn
3The fusing point of Bi is 189 ℃, and its cost is lower, and its physical property, and is better as impact flexibility, hot strength, the anti-fatigue life of scolder.But, Sn-Zn is that the wetability of scolder is poor, non-oxidizability and corrosion resistance are relatively poor, in order to improve these performances that Sn-Zn is a scolder, the researcher has been that the alloying of scolder has been carried out number of research projects around SnZn, for example in " Sn-Zn-Bi lead-free solder surface tension and wetability research ", (Zhou Jian, Sunyang is kind, Xue Feng electronic component and material, Vol.24, No.8,2005, open with a kind of lead-free solder and preparation method thereof in P49-52), this lead-free solder consist of Sn-Zn-Bi, because the adding of Bi has reduced the solid-liquid interface tension force between solder alloy melt and copper sheet, has increased the wetting power of melt on copper sheet.But the adding of Bi can make alloy structure become thick, and skewness, makes the easy oxidation of alloy, so the wetability of the product that obtains at last, creep resistance all descend to some extent.
Summary of the invention
The objective of the invention is for overcome prior art lead-free solder wetability, creep resistance is poor, the shortcoming of non-oxidizability difference provides that a kind of wetability is good, the lead-free solder of creep resistance, good in oxidation resistance and preparation method thereof.
The invention provides a kind of lead-free solder, wherein, the composed as follows of this scolder stated shown in the general formula: Sn
aZn
bBi
cCu
dWherein, a, b, c, d are mass percent, 7%≤b≤9%, 1≤c≤5%, 0.1≤d≤3%, and surplus is that Sn and a, b, c, d sum are 100%.
The present invention also provides above-mentioned Sn
aZn
bBi
cCu
dThe preparation method of lead-free solder, this method may further comprise the steps:
1) preparation Sn-Zn-Bi alloy is pressed Zn 7-9wt%; Bi 1-5wt%; Cu 0.1-3wt% surplus is the proportioning of Sn, under protective gas atmosphere or vacuum environment, will mix by Zn, Bi, the Sn that proportioning takes by weighing, and carries out the melting first time and obtains the Sn-Zn-Bi alloy;
2) scaling powder, the Cu that takes by weighing according to proportioning described in the step 1 are mixed with the Sn-Zn-Bi alloy, under protective gas or vacuum environment, carry out the melting second time, cooling, the cast back obtains the lead-free solder ingot blank.
Lead-free solder provided by the present invention has excellent wetting capacity, creep resistance and non-oxidizability, and as the lead-free solder that the present invention obtains, its angle of wetting has reached 50 °, and the SnZn that obtains according to prior art
9The angle of wetting of lead-free solder is 120 °.Its bending angle has only 0.002 θ/rad, and SnZn
8Bi
3Bending angle can reach 0.010 θ/rad, the mass loss amount of lead-free solder provided by the invention after oxidation test is 0.2100g/mm
2, the present invention also has excellent corrosion resisting performance in addition, and wherein corrosion rate is 0.1950g/mm
2
Description of drawings
Accompanying drawing 1: the metallographic structure figure of the solder of Comparative Examples 1 preparation;
The metallographic structure figure of the solder of accompanying drawing 2: embodiment 1 preparation;
The metallographic structure figure of the solder of accompanying drawing 3: embodiment 2 preparations;
The metallographic structure figure of the solder of accompanying drawing 4: embodiment 3 preparations;
The metallographic structure figure of the solder of accompanying drawing 5: embodiment 4 preparations;
The specific embodiment
The composed as follows of lead-free solder stated shown in the general formula: Sn
aZn
bBi
cCu
dWherein, a, b, c, d are mass percent, 7wt%≤b≤9wt%, and 1wt%≤c≤5wt%, 0.1wt%≤d≤3wt%, surplus is that Sn and a, b, c, d sum are 100%.
Wherein the each component in the lead-free solder forms that can be preferably Zn be 7.5-8.5wt%, and Bi is 2.5-3.5wt%, and Cu is 0.5-2wt%, and surplus is Sn.
The preparation method of lead-free solder provided by the present invention, this method comprises:
1) preparation Sn-Zn-Bi alloy is pressed Zn 7-9wt%; Bi 1-5wt%; Cu 0.1-3wt% surplus is the proportioning of Sn, under protective gas atmosphere or vacuum environment, will mix by Zn, Bi, the Sn that proportioning takes by weighing, and carries out the melting first time and obtains the Sn-Zn-Bi alloy;
2) scaling powder, the Cu that takes by weighing according to proportioning described in the step 1 are mixed with the Sn-Zn-Bi alloy, under protective gas or vacuum environment, carry out the melting second time, cooling, the cast back obtains the lead-free solder ingot blank.
The composed as follows of resulting lead-free solder stated shown in the general formula:
Sn
aZn
bBi
cCu
d, in the formula, a, b, c, d are percetage by weight, 7wt%≤b≤9wt%, and 1wt%≤c≤5wt%, 0.1wt%≤d≤3wt% and a, b, c, d sum are 100%.
Lead-free solder Sn
aZn
bBi
cCu
dThe preparation method specifically comprise:
1, the preparation of Sn-Zn-Bi alloy:
Preparation Sn-Zn-Bi alloy is pressed Zn 7-9wt%; Bi 1-5wt%; Cu 0.1-3wt% surplus is the proportioning of Sn, under protective gas atmosphere or vacuum environment, will mix by bulk, granular or pulverous Zn, Bi, the Sn that proportioning takes by weighing, and obtains mixed material, mixed material is carried out the melting first time obtain the Sn-Zn-Bi alloy;
Wherein saidly be mixed into various mixed method known in those skilled in the art, mix as ball milling, mechanical mixture is preferably mechanical mixture among the present invention.
When first time melting, with mixed material, under vacuum or protective atmosphere condition, temperature is risen to more than the fusing point of Metal Zn, promptly control temperature in 450-550 ℃ of scope, fusing back insulation 0.5-1 hour, and fully stir.It is melting under inert gas shielding atmosphere or vacuum condition that the method adopts, and obtains the Sn-Zn-Bi alloy, its objective is more effectively to prevent the oxidization burning loss of metal in fusion process.
2, the preparation of Sn-Zn-Bi-Cu alloy
Cu with the 0.1-3wt% that takes by weighing in the step 1, join in the scaling powder, again scaling powder is joined in the Sn-Zn-Bi intermediate alloy of above-mentioned fusion with Cu, and be warming up to more than the fusing point of Cu, be in 1100-1200 ℃ of scope of temperature control, treat that alloy melts back insulation 15-30 minute fully, stirs simultaneously and constantly; Above-mentioned alloy is cooled to 250-350 ℃, under continuous stirring condition, is incubated after 20-30 minute, be cooled to room temperature, be cast into ingot as required.
Wherein said cooldown rate is that 10-20 ℃/min is preferably 12-16 ℃/min, the present inventor finds by a large amount of tests, too fast cooldown rate can cause last alloy structure refinement, mechanical performances such as the hardness of final solder alloy, fragility are too high, slower cooldown rate can cause alloy structure thick, the mechanical performance of final solder alloy descends, and selects suitable cooldown rate can effectively improve the mechanical performances such as intensity, hardness of lead-free solder.
Above-mentioned scaling powder is the common various scaling powders in this area, as disclosed scaling powder among the CN101176957, it consists of, newtrex 25%-30%, Foral 8%-16%, abienol 6%-12%, modified hydrogenated castor oil 2%-3%, rilanit special wax 2%-3%, organic acid and halogen compounds isoreactivity agent 6%-11%, antioxidant 0.5%-3% such as hydroquinones, surfactant 2%-4%, all the other are organic solvent.The scaling powder that adopts among the present invention consists of: 65wt%-75wt% common rosin, the mixture of the dimethylamine hydrochloric acid (DMA) of the ethanol of 25wt%-32wt% and 1wt%-3wt%.
The inventor finds by a large amount of experiments, and the adding of Cu makes rich Zn phase refinement among the leadless welding alloy Sn-Zn-Bi.And along with the adding of Cu, occurred intermetallic compound on the matrix, the existence of these intermetallic compounds makes Sn-Zn-Bi-Cu be greatly improved aspect creep-resistant property, the wettability.
Described protective gas atmosphere or vacuum environment are in order to make alloy raw material obtain protection in fusion process, to avoid oxidized.The antioxygenic property of alloy raw material of the present invention is relatively poor, therefore to the requirement of protective gas atmosphere and vacuum environment than higher.Described protective gas is one or more in the group 0 element gas in the periodic table of elements.The purity of described protective gas is not less than 95 volume % and gets final product, and for example can be 95-99.9 volume %.Only need be evacuated to vacuum before the feeding protective gas in the smelting furnace is to get final product below 200 handkerchiefs.In addition, described vacuum environment is meant that vacuum is no more than 200 handkerchiefs, is preferably the 0.1-200 handkerchief.Vacuum of the present invention is represented with absolute pressure.
Under vacuum or protective gas protective condition, the condition of described melting is a melting condition common in this area, as long as with the abundant fusion of leadless welding alloy raw material, for example can in smelting equipment, carry out melting, smelting temperature and smelting time are along with fusion process different have some variations, among the present invention, when the melting intermediate alloy, temperature is 300-800 ℃, smelting time 16-90 minute, preferred smelting temperature is 450-550 ℃, and smelting time is 45-85 minute; Melting Sn
aZn
bBi
cCu
dSmelting temperature is 1000-1500 ℃ during alloy, and smelting time 15-55 minute, being preferably smelting time was 23-40 minute, and smelting temperature is 1100-1200 ℃, and described smelting equipment can be the smelting equipment of routine, for example arc-melting furnace or induction melting furnace.
The crystallized ability of leadless welding alloy of the present invention is strong, and therefore described cooling forming can adopt the casting cooling forming method of various routines in this area, for example, with the alloy material of fusion, is cast in the mould, then cooling.Described casting method can be for gravity casting, inhale in casting, spray to cast, the die casting any one.Preferred gravity casting among the present invention, gravity casting is meant that the gravity effect that utilizes melt itself is cast in the mould.Gravity casting realize easily, and cost is low because method is simple, therefore preferably uses for the present invention.The concrete operation method of described casting is conventionally known to one of skill in the art.Mold materials can be 30-400W/mK for copper alloy, stainless steel and thermal conductivity factor, is preferably the material of 50-200W/mK.
Describe the present invention in detail below by embodiment.
Embodiment 1
Present embodiment illustrates leadless welding alloy provided by the invention and preparation method thereof.
According to 8wt%Zn; 3wt%Bi; 0.5wt%Cu, the weight proportion of the alloy raw material of 88.5wt%Sn drops into Zn, Cu, Bi (Shenyang scientific instrument Co., Ltd production in the arc-melting furnace earlier; model is DHR-1250); with electric arc melting stove evacuation (vacuum is 5 handkerchiefs), the argon gas that feeds purity then and be 99.9 volume % is as protective gas, under 500 ℃ of conditions; melting 20 minutes obtains the Sn-Zn-Bi alloy.
(composition of scaling powder is that ethanol+2% dimethylamine hydrochloric acid (DMA) of 70% common rosin+28% mixes, adds in the above-mentioned metal melting product for Cu that will take by weighing by said ratio and scaling powder then, melting once more, the temperature of fusion is to be 20 minutes 1100 melting times, be cooled to 350 ℃, be incubated 30 minutes, method by gravity casting is cast in the column type punching block, is placed on and is cooled to room temperature in the air, and formation is of a size of
20 * 50 millimeters leadless welding alloy sample A1.Elementary analysis shows, this leadless welding alloy sample A1 consists of Sn
88.5Zn
8Bi
3Cu
0.5
Comparative Examples 1
Method according to embodiment 1 prepares leadless welding alloy, and different is that the kind of the raw material of lead-free solder and consumption are the Zn of Sn, the 8wt% of 89wt%, the Bi of 3wt%.
Finally obtain leadless welding alloy sample D1.Elementary analysis shows, this leadless welding alloy sample D1 consists of Sn
89Zn
8Bi
3Solder alloy.
Embodiment 2
Method according to embodiment 1 prepares leadless welding alloy, different is, the kind of each raw material and consumption are the Cu of 1.0wt%, the Zn of 8wt%, the Bi of 3wt%, surplus is Sn, and smelting time is 60 minutes for the first time, and smelting temperature is 800 ℃, smelting time is 55 minutes for the second time, and smelting temperature is 1500 ℃
Finally obtain leadless welding alloy sample A2.Elementary analysis shows, this leadless welding alloy sample A2 consists of Sn
88Zn
8Bi
3Cu.
Embodiment 3
Method according to embodiment 1 prepares leadless welding alloy, different is, the kind of each lead-free solder raw material and consumption are the Cu of 1.5wt%, the Zn of 8wt%, the Bi of 3wt%, surplus is Sn, and smelting temperature is 300 ℃ for the first time, and smelting time is 18 minutes, smelting temperature is 1050 ℃ for the second time, and smelting time is 50 minutes.
Finally obtain leadless welding alloy sample A3.Elementary analysis shows, this leadless welding alloy sample A3 consists of Sn
87.5Zn
8Bi
3Cu
1.5
Embodiment 4
Method according to embodiment 1 prepares leadless welding alloy, and different is, the kind of each lead-free solder raw material and consumption are the Cu of 2.0wt%, the Zn of 8wt%, the Bi of 3wt%, and surplus is Sn.
Finally obtain leadless welding alloy sample A4.Elementary analysis shows, this leadless welding alloy sample A4 consists of Sn
87Zn
8Bi
3Cu
2
Embodiment 5-8
These embodiment illustrate the performance test of the leadless welding alloy sample that the present invention makes
1, Vickers hardness test
The leadless welding alloy that the foregoing description 1-4 is made carries out the Vickers hardness test on Micro Hardness Text Hv1000 Vickers hardness test machine, pressure head weight is 200 grams, and the load time is 10 seconds, and every kind of sample is got three numerical value, get its arithmetic mean of instantaneous value at last, the result is as shown in table 1.
2, creep resistance test
The creep resistant test can be according to precious strict and impartial bright electronic component of unrestrained yellow favour of flat week of " leadless electronic brazing filler metal alloy creep performance study " Liao Fu and material, the method of testing of interim record in April the 4th in 2005, test, according to the testing arrangement in the document, the solder alloy coupon is owing to be subjected to the pulling force effect meeting generation strain of load, and the glo-stick that is held together along with the generation and the coupon of strain also can move downward, so the coordinate that luminous point is reflected on the coordinate system also can change, and bending angle wherein
, θ=tg θ=Δ X/D in addition, when bending angle θ was big more, promptly displacement was big more, showed that then the deflection of scolder is big more, illustrated that the creep resistance of scolder is then poorer; Otherwise then good more, test data is as shown in table 1.
3, wetability test
The leadless welding alloy that embodiment 1-4 is prepared is made
20 * 0.3mm sample, place through polishing, Ethanol Treatment and be of a size of on 40 * 40 * 0.1mm red copper sheet, between red copper sheet and sample for being the coverture layer of coverture with rosin, red copper sheet is put into the full-automatic reflow machine of SMT (Beijing high official position QHL320 of scientific ﹠ technical corporation) under 250 ℃ of environment with sample placed on it, cool off behind the insulation 5min, to be cooled to room temperature, measure the spreading area that alloy melts body.Spreading ratio S is defined as A '/A, and wherein A ' and A represent spreading area and disk initial area respectively.Every kind of alloy is got the mean value of measuring for 5 times weigh its wetability to copper, spreading area is big more, proves that then the wetability of sample is good more, otherwise then poor more, test result is as shown in table 1.
4, non-oxidizability test
With the prepared leadless welding alloy of embodiment 1-4, respectively make the sample powder of five parts of equivalent weight, a copy of it prepared powder sample is put into evaporating dish.Heating (101A-1B type) design temperature is 260 ℃ in electric drying oven with forced convection, after 15 minutes, take out cooling, cool off and weigh after 10 minutes, be exposed in the air ambient by measuring alloy powder, gain in weight is at the appointed time weighed the antioxygenic property of sample, repeat above-mentioned test 5 times, get testing mean, test data is as shown in table 1.
5, corrosion resistance experiment
With each prepared among embodiment 1-4 leadless welding alloy, make and be of a size of
20 * 4mm, sample.Sample put into fill the beaker of pH value for the hydrochloric acid solution of 4-5, take out after corroding for 10 seconds, wash sample surfaces 2-3 time with absolute ethyl alcohol, oven dry is weighed, record initial weight W1, then sample is put into and filled the beaker of pH value for the sulfuric acid solution of 4-5, put into water bath with thermostatic control mortise water-bath heating, wherein the thermostat temperature is set at 50 ℃, behind the temperature retention time 20H sample is taken out, and washes sample surfaces 2-3 time with absolute ethyl alcohol, weigh after the oven dry, record corrosion back example weight W2 calculates the corrosion loss amount, and corrosion loss amount W is defined as W1-W2, same composition sample is divided into 5 parts that size equates, repeat above-mentioned test 5 times, get 5 results' mean value, be used for weighing the corrosion resistance of lead-free solder.
6, metallograph
With lead-free solder sample prepared among the embodiment 1-4, make the required sample of metallographic observation.Preparation process is as follows:
The configuration quality ratio is: 94: 6 the epoxy resin and the mixture of curing agent, both mixing are stirred in the sample for preparing is put into preprepared punching block, again epoxy resin and curing agent are poured in the mould, treat its curing molding, sanding and polishing, nitric acid alcohol with 4% corrodes burnishing surface, uses absolute ethyl alcohol wiping burnishing surface 2-3 time then, makes the metallographic observation sample.Examine under a microscope, and take pictures, used microscope is the high depth of field measuring microscope of Keyence VHX-100 type 3D, 800 times of multiplication factors.Observed result such as accompanying drawing 2-accompanying drawing institute 5 show.
Comparative Examples 2
These embodiment illustrate the performance test of the leadless welding alloy sample that the present invention makes.
According to the described method of embodiment 5-8 the lead-free solder sample D1 that Comparative Examples 1 makes is carried out above-mentioned performance test, wherein the metallograph of D1 as shown in Figure 1, Vickers hardness, wetability, non-oxidizability, corrosion resistance, croop property test result are as shown in table 1.
Table 1
With Fig. 1 and Fig. 2-5 contrast, can find, compare with the sample that Comparative Examples 1 is prepared, rich Zn refinement more mutually in the lead-free solder sample that embodiment 1-4 is obtained, and intermetallic compound appearred on matrix, the existence of these intermetallic compounds makes Sn-Zn-Bi-Cu be greatly improved aspect creep-resistant property, the wettability.
As can be seen from Table 1, the wetting areas of embodiment of the invention 1-4 institute sampling reaches 53.5mm at least
2, and wetting areas is 50.39mm in the Comparative Examples 1
2The bending angle of embodiment of the invention 1-4 institute sampling also has only 0.007rad at the most, and bending angle is 0.01rad in the Comparative Examples 1; Mass loss behind the lead-free solder process corrosion experiment that embodiment of the invention 1-4 makes is all less than 0.1827g, and the mass loss through behind the corrosion experiment of the lead-free solder that Comparative Examples 1 makes is 0.3450g; The lead-free solder that embodiment of the invention 1-4 makes increases weight all less than 0.6945g through the quality behind the oxidation experiment, and the weightening finish through the quality behind the oxidation experiment of the lead-free solder that Comparative Examples 1 makes is 1.2105g, much larger than lead-free solder provided by the present invention, illustrate that lead-free solder provided by the present invention has good wettability, creep-resistant property, has excellent corrosion resisting performance and antioxygenic property simultaneously.
Claims (9)
1, a kind of lead-free solder is characterized in that, the composed as follows of this lead-free solder stated shown in the general formula: Sn
aZn
bBi
cCU
dWherein, a, b, c, d are mass percent, and a, b, c, d sum be 100%, 7wt%≤b≤9wt%, and 1wt%≤c≤5wt%, 0.1wt%≤d≤3wt%, surplus is Sn.
2, lead-free solder according to claim 1, wherein, 7.5wt%≤b≤8.5wt%, 2.5wt%≤c≤3.5wt%, 0.5wt%≤d≤2wt%, surplus is Sn.
3, a kind of preparation method of lead-free solder as claimed in claim 1, this method may further comprise the steps:
1) preparation Sn-Zn-Bi alloy is pressed Zn7-9wt%; Bi 1-5wt%; Cu 0.1-3wt% surplus is the proportioning of Sn, under protective gas atmosphere or vacuum environment, will mix by Zn, Bi, the Sn that proportioning takes by weighing, and carries out the melting first time and obtains the Sn-Zn-Bi alloy;
2) with scaling powder and the Cu that takes by weighing according to proportioning described in the step 1, mix, under protective gas or vacuum environment, carry out the melting second time with the Sn-Zn-Bi alloy, cooling, the cast back obtains the ingot blank of lead-free solder.
4, method according to claim 3, wherein, described first time, smelting temperature was 300-800 ℃, smelting time is 16-90 minute.
5, method according to claim 3, wherein, the temperature 1000-1500 of the described melting second time ℃, smelting time is 15-55 minute.
6, method according to claim 3, wherein, described protective gas is one or more in the group 0 element gas.
7, method according to claim 3, wherein, the vacuum of described vacuum environment is the 0.1-200 handkerchief.
8, method according to claim 3, wherein, the method for described casting is a gravity casting.
9, method according to claim 3, wherein, the speed of described cooling is 10-20 ℃/min.
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101817127A (en) * | 2010-05-10 | 2010-09-01 | 哈尔滨工业大学 | Sn-58Bi lead-free solder reinforced by carbon nano tube and preparation method thereof |
| CN101914702A (en) * | 2010-06-13 | 2010-12-15 | 深圳市亿铖达工业有限公司 | Preparation method of reinforced lead-free solder |
| CN103737194A (en) * | 2013-12-23 | 2014-04-23 | 苏州宏泉高压电容器有限公司 | Welding material and manufacturing method thereof |
| CN104353840A (en) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder |
| CN106181108A (en) * | 2016-08-11 | 2016-12-07 | 北京康普锡威科技有限公司 | A kind of SnBiZn series low-temperature leadless solder and preparation method thereof |
| CN108356441A (en) * | 2018-05-16 | 2018-08-03 | 深圳市亿铖达工业有限公司 | A kind of Sn base solders and preparation method thereof can be used for automotive electronics encapsulation |
| CN109175765A (en) * | 2018-08-07 | 2019-01-11 | 云南科威液态金属谷研发有限公司 | A kind of solder and its application for flip LED |
| CN109352207A (en) * | 2018-11-14 | 2019-02-19 | 清华大学 | A kind of preparation method of SnZn base low-temperature lead-free solder |
| CN109560515A (en) * | 2018-12-12 | 2019-04-02 | 云南电网有限责任公司电力科学研究院 | A kind of bolt connection and connection method using low-melting alloy |
| CN109638479A (en) * | 2018-12-12 | 2019-04-16 | 云南电网有限责任公司电力科学研究院 | It is a kind of for the liquid metal connector of aerial cable and connection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101817127A (en) * | 2010-05-10 | 2010-09-01 | 哈尔滨工业大学 | Sn-58Bi lead-free solder reinforced by carbon nano tube and preparation method thereof |
| CN101914702A (en) * | 2010-06-13 | 2010-12-15 | 深圳市亿铖达工业有限公司 | Preparation method of reinforced lead-free solder |
| CN103737194A (en) * | 2013-12-23 | 2014-04-23 | 苏州宏泉高压电容器有限公司 | Welding material and manufacturing method thereof |
| CN104353840A (en) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder |
| CN106181108A (en) * | 2016-08-11 | 2016-12-07 | 北京康普锡威科技有限公司 | A kind of SnBiZn series low-temperature leadless solder and preparation method thereof |
| CN108356441A (en) * | 2018-05-16 | 2018-08-03 | 深圳市亿铖达工业有限公司 | A kind of Sn base solders and preparation method thereof can be used for automotive electronics encapsulation |
| CN109175765A (en) * | 2018-08-07 | 2019-01-11 | 云南科威液态金属谷研发有限公司 | A kind of solder and its application for flip LED |
| CN109352207A (en) * | 2018-11-14 | 2019-02-19 | 清华大学 | A kind of preparation method of SnZn base low-temperature lead-free solder |
| CN109352207B (en) * | 2018-11-14 | 2020-10-20 | 北京联金新材科技有限公司 | Preparation method of SnZn-based low-temperature lead-free solder |
| CN109560515A (en) * | 2018-12-12 | 2019-04-02 | 云南电网有限责任公司电力科学研究院 | A kind of bolt connection and connection method using low-melting alloy |
| CN109638479A (en) * | 2018-12-12 | 2019-04-16 | 云南电网有限责任公司电力科学研究院 | It is a kind of for the liquid metal connector of aerial cable and connection method |
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Application publication date: 20100106 |