CN101607690A - The method and system of nano wire or nanotube discharge machining hole - Google Patents
The method and system of nano wire or nanotube discharge machining hole Download PDFInfo
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- CN101607690A CN101607690A CNA2009100695635A CN200910069563A CN101607690A CN 101607690 A CN101607690 A CN 101607690A CN A2009100695635 A CNA2009100695635 A CN A2009100695635A CN 200910069563 A CN200910069563 A CN 200910069563A CN 101607690 A CN101607690 A CN 101607690A
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Abstract
The invention belongs to technical field of micro-nano manufacture, relate to the method for a kind of nano wire or nanotube discharge machining hole: (1) bonds to the nano wire or the nanotube of electric conductivity on the tungsten tip; (2) electrode clamping device is placed on the displacement platform, and the mobile of displacement platform controlled by multi-axis motion controller; (3) conductive material workpieces is placed on the X/Y precision displacement table, by moving of multi-axis motion controller control X/Y precision displacement table; (4) negative pole of the pulse power is received on the tungsten tip, its positive pole is received on the workpiece; (5) utilize industrial computer to send instruction to multi-axis motion control card, control is placed with the displacement platform of electrode clamping device, the operating voltage of discharge processing is provided by the pulse power, and by gap voltage checkout gear collection discharge gap voltage, industrial computer then according to the moving of gap voltage control electrode feeding displacement platform, is realized nanometer discharge machining hole process.The present invention makes electric-discharge machining dimension reach micron, nanoscale, and has solved the chip removal problem of process.
Description
Technical field
The invention belongs to technical field of micro-nano manufacture, relate to a kind of method and system of the machining hole that discharges.
Background technology
Discharge technology has a wide range of applications in industry as one of special processing technology.Along with the product miniaturization, the process technology of micro-nano structure and the research of method have become one of the major subjects in manufacturing field.Press the difference of process principle, the processing of micro hole is divided into two big classes: the traditional machining and the special process.In the micro hole machining field, machining process commonly used is drilling.And drilling be difficult to realize the processing of high hardness material, and when carrying out capillary processing for obtaining required cutting force, need to adopt very high rotating speed, simultaneously the strength and stiffness of drill bit reducing and reduce frangibility in the processing with diameter.In the special process, the surface roughness of Laser Processing is poor, and the cone angle that exists the increase with working depth to increase in the processing in hole, and its working depth is subjected to the restriction of power output and focusing power; Tool wear is big during ultrasonic vibration processing aperture, owing to be subjected to the chip removal conditionality, the aperture is difficult to further reduce simultaneously; Electron beam and ion beam processing need vacuum environment, have limitation in the practical application; Discharge processing can realize soft tool processes high rigidity workpiece because of the contactless stress of process, just can realize the capillary processing of corresponding scale simultaneously by the control electrode size.
Online electric spark grinding is the main method of processing fine electrospark electrode at present, and the electrode diameter that this method is processed can only reach 10
1Micron order is subjected to the influence of material stiffness simultaneously, and the electrode draw ratio is limited, thereby has limited the ability of discharge processing micropore.Therefore, big L/D ratio micron, nanoscale electrode be prepared into for discharge processing a difficult problem.Simultaneously, because the diameter of machining hole is too little, utilize outside mode towards liquid, be difficult to carry out chip removal, the chip removal problem seems more outstanding in the feasible discharge process, thereby has restricted the development of big aspect ratio micron, the processing of nanoscale aperture.
If utilize some nano wire, nanotube,, so just can solve the problem of the electrode preparation difficulty of micro-nano level discharge processing as the spark machined electrode material with excellent conducting performance and heat conductivility.For example, the process technology of carbon current nanotube is very perfect, and prior art can prepare the nanotube of several nanometer to one hundred nanometers of diameter, and the diameter of carbon nano-tube bundle also can reach several microns, is suitable for very much micro-nano discharge processing.
Summary of the invention
The objective of the invention is to, overcome the deficiencies in the prior art,, propose the method in a kind of nanometer discharge processing micron, nanoscale micro-nano hole at as conductive materials such as brass, red copper, aluminium, steel, carbide alloy.
For achieving the above object, the technical scheme taked of the present invention is as follows:
The method of a kind of nano wire or nanotube discharge machining hole is used for machining hole on conductive material, it is characterized in that, comprises the following steps:
(1) adopts the platinum sedimentation, utilize the FIB process technology that the nano wire or the nanotube of electric conductivity are bonded on the tungsten tip, and tungsten tip is fixed on the electrode clamping device;
(2) electrode clamping device is placed on the electrode feeding displacement platform with nanometer resolution;
(3) conductive material workpieces is placed on the X/Y precision displacement table;
(4) negative pole of the pulse power is received on the tungsten tip, its positive pole is received on the workpiece;
(5) utilize multi-axis motion controller control to be placed with the displacement platform of electrode clamping device, the operating voltage of discharge processing is provided by the pulse power, and by gap voltage checkout gear collection discharge gap voltage, the data that collect are admitted in the industrial computer, judge the state of current discharge processing according to gap voltage by industrial computer, and pass through moving of multi-axis motion controller control electrode feeding displacement platform, thereby the feeding of control electrode realizes stabilized nano discharge machining hole process; And by industrial computer by the moving of multi-axis motion controller control control X/Y precision displacement table, realize adjustment to the location of workpiece.
As preferred implementation, nanotube is bonded on the tungsten tip that is fixed on electrode clamping device, in the discharge process, import the working solution of 1～3Mpa pressure, working fluid is input to the discharge machining area, utilizes the pressure of working solution that the scrap that produces in the discharge process is taken away; The pulse width variations scope 2-30 microsecond of the pulse power, voltage 0-120V, maximum output current 2A; Industrial computer utilizes the feeding of following method control electrode according to the state of current discharge processing: if discharge processing is in the regular picture state, then electrode keeps current location; If discharge processing is in open-circuit condition, industrial computer then sends instruction to multi-axis motion controller, make electrode feeding displacement platform march forward to, then electrode moves to the direction near workpiece, to reduce discharging gap, enter the regular picture machining state from open-circuit condition up to discharge processing; If discharge processing is in short circuit, arc discharge state, industrial computer then sends instruction to multi-axis motion controller, electrode feeding displacement platform is retreated, then electrode moves to the direction away from workpiece, to increase discharging gap, enter the regular picture machining state from short circuit, conditions at the arc up to discharge processing.
The present invention provides the system of a kind of nano wire or nanotube discharge machining hole simultaneously, be used for machining hole on conductive material workpieces, comprise tungsten tip, the electrode clamping device that is bonded with the nano wire that can conduct electricity or nanotube, electrode feeding displacement platform, X/Y precision displacement table, multi-axis motion controller, the pulse power, gap voltage checkout gear and industrial computer with nanometer resolution.Wherein, electrode clamping device is used for fixing tungsten tip, and places on the electrode feeding displacement platform with nanometer resolution; The X/Y precision displacement table is used for place work piece; Multi-axis motion controller has the nanoscale numerical control to be differentiated, and is used for moving of control electrode feeding displacement platform and X/Y precision displacement table; The pulse power provides discharge processing needed operating voltage; The voltage data of gap voltage checkout gear collection is admitted to industrial computer, judge the state of current discharge processing according to gap voltage by industrial computer, by moving of multi-axis motion controller control electrode feeding displacement platform, thereby the feeding of control electrode, the process of realization stabilized nano discharge machining hole; And by industrial computer by the moving of multi-axis motion controller control X/Y precision displacement table, realize adjustment to the location of workpiece.
As preferred implementation, the pulse width variations scope 2-30 microsecond of the described pulse power, voltage 0-120V, maximum output current 2A.
The present invention makes electric-discharge machining dimension reach micron, nanoscale, has solved the chip removal problem of process simultaneously, thereby can realize the processing of big aspect ratio micron, nanoscale aperture, has enriched the technical method of micro-nano manufacture field.
Description of drawings
Fig. 1 nano wire, nanotube electrode prepare micrograph.
The nanometer discharge system of processing block diagram that Fig. 2 the present invention adopts.
The specific embodiment
The present invention uses nano wire, nanotube to carry out the processing of micron, nanoscale aperture as nanometer discharge processing with electrode, and need possess following condition as nano wire, the nanotube of electrode:
Nano wire, nanotube need possess favorable conductive, heat conductivility and mechanical property.For example, the fusing point of CNT is the highest in the present known materials, is difficult for by heat erosion in discharge processing; Secondly, the carbon nanotube molecule Stability Analysis of Structures has very high heat endurance; The 3rd, the structure of CNT is identical with the lamellar structure of graphite, thereby has good electric property, and CNT is very high along heat exchange on the tube axial direction simultaneously, is beneficial to heat radiation in the processing; At last, CNT has the good mechanical performance, and its tensile strength reaches 50～200GPa, is 100 times of steel, can process draw ratio near 1000 little axle, also has higher radial rigidity simultaneously.The above-mentioned characteristic of CNT makes CNT use electrode as discharge processing, can satisfy low-loss rate and non-deformability required in the fine discharge process.
And nanotube is as the discharge machined electrode, and its structure is a hollow structure, but the hole of nanotube has reached Nano grade, and the discharge in the processing can cover this zone, thereby can realize blind hole processing.
In addition, nanotube is done the electrode processing of discharging, can utilize the characteristics of its hollow structure, import the dielectric of certain pressure, the working fluid that will have certain pressure is input to the discharge machining area, utilize the pressure of working solution that the chip that produces in the discharge process is taken away, thereby solve the chip removal problem of micro-nano discharge processing.
As shown in Figure 1, adopt the platinum sedimentation, utilize FIB (FIB process technology) that nano wire, nanotube are bonded on the tungsten tip, voltage just can be directed at nano wire, nanotube by tungsten tip so.
As shown in Figure 2, nanometer discharge system of processing is made of electrode feed control system, nanometer discharge processing power source, gap voltage checkout gear, discharging gap control algolithm, X/Y precision displacement table and industrial computer.
Introduce the method for nanometer discharge processing micron of the present invention, nano grade pore below in detail.
1, nanometer discharge machined electrode preparation
Adopt the platinum sedimentation, utilize FIB (FIB process technology) that nano wire or nanotube 2 are bonded on the tungsten tip 1.In addition, nanotube 2 is done the electrode processing of discharging, can utilize the characteristics of its hollow structure, import the working solution of 1～3Mpa pressure, as kerosene, spark processing oil, deionized water or the like, the working solution that will have certain pressure is input to the discharge machining area, utilizes the pressure of working solution that the chip that produces in the discharge process is taken away, thereby solves the chip removal problem in the micro-nano discharge processing.
2, electrode feed control system
Make up the high-precision electrode feed control system of a suitable nanometer discharge processing, comprise the multi-axis motion controller that displacement platform with nanometer resolution and nanoscale numerical control are differentiated.Electrode feeding displacement platform is equipped with high-accuracy grating, the position feedback device that moves as the displacement platform, provide position feedback information to multi-axis motion controller, multi-axis motion controller is then according to mobile the controlling of position feed back signal to electrode feeding displacement platform, constitute position full cut-off ring control with this, thereby realize the nanoscale feeding with high precision of electrode.
3, nanometer discharge processing power source
Make up the high-quality pulse power of a suitable nanometer discharge processing, the pulse width variations scope 2-30 microsecond of power supply, voltage 0-120V, maximum output current 2A.Negative polarity is adopted in processing, and promptly electrode connects negative pole, and workpiece connects positive pole.
4, gap voltage checkout gear
Make up the voltage acquisition system of a high sampling rate, the discharge gap voltage between nano wire, nanotube and the workpiece of nanometer discharge process is gathered.Realize the discharge voltage collection by the high-frequency data capture card, its highest sample frequency can reach 5MHz.At first adopt bleeder circuit that discharge voltage is adjusted to 0 to 5V, then voltage is imported data collecting card, voltage is gathered, and then gather current discharge gap voltage in real time, at last the discharge gap voltage sampled value is transferred to the calculation process that industrial computer carries out gap voltage, as the foundation of control electrode feeding.
5, discharging gap control algolithm
Establishment discharging gap control algolithm, algorithm can carry out calculation process to the gap voltage that the gap voltage checkout gear collects.The voltage waveform that industrial computer then obtains according to calculation process is judged the state of current discharge processing.If discharge processing is in the regular picture state, industrial computer is the stabilized electrodes current location then; If discharge processing is in the regular picture state, then electrode keeps current location; If discharge processing is in open-circuit condition, industrial computer then sends instruction to multi-axis motion controller, make electrode feeding displacement platform march forward to, then electrode moves to the direction near workpiece, to reduce discharging gap, enter the regular picture machining state from open-circuit condition up to discharge processing; If discharge processing is in short circuit, arc discharge state, industrial computer then sends instruction to multi-axis motion controller, electrode feeding displacement platform is retreated, then electrode moves to the direction away from workpiece, to increase discharging gap, enter the regular picture machining state from short circuit, conditions at the arc up to discharge processing.
6, X/Y precision displacement table
Multi-axis motion controller can be realized the control of 8 interlock precise motions, and when realizing the control of electrode feeding displacement platform, control X/Y precision displacement table is adjusted the location of workpiece on the X/Y plane.X-axis and Y-axis precision displacement table all are equipped with high-accuracy grating, the position feedback device that moves as the displacement platform, provide position feed back signal to multi-axis motion controller, multi-axis motion controller then moves it respectively according to X-axis and Y-axis position feed back signal separately and controls, constitute position full cut-off ring control with this, thereby realize the high precision movement control of workpiece.
7, the motion control device of multi-axis motion controller and industrial computer formation
The motion control device that multi-axis motion controller and industrial computer constitute can be finished the functions such as control of man-machine interaction, location of workpiece adjustment, discharging gap.
Electrode feeding displacement platform and X/Y precision displacement table have been equipped with high-accuracy grating respectively, as they position feedback devices separately, grating provides position feed back signal to multi-axis motion controller, multi-axis motion controller is then controlled the mobile of displacement platform according to position feed back signal, constitute position full cut-off ring control with this, thereby realize high-precision motion control.
Industrial computer has loaded the discharge procedure, the interface that the user can utilize program to provide sends online movement instruction or CAM machining code to multi-axis motion controller, realization is to the instruction control or the code control of electrode feeding displacement platform and X/Y precision displacement table, thereby realization is to the adjustment of the electrode and the location of workpiece; The gap voltage control algolithm has also been realized in discharge procedure inside, add man-hour carrying out nanometer discharge, program can be carried out real-time Communication for Power with the gap voltage checkout gear, discharge gap voltage is gathered in real time, by the discharging gap control algolithm discharge gap voltage is handled then, judge next step displacement of electrode, by send the mode of instruction to multi-axis motion controller, realize the feeding of electrode at last.
Claims (6)
1. the method for nano wire or nanotube discharge machining hole is used for machining hole on conductive material, it is characterized in that, comprises the following steps:
(1) adopts the platinum sedimentation, utilize the FIB process technology that the nano wire or the nanotube of electric conductivity are bonded on the tungsten tip, and tungsten tip is fixed on the electrode clamping device;
(2) electrode clamping device is placed on the electrode feeding displacement platform with nanometer resolution;
(3) conductive material workpieces is placed on the X/Y precision displacement table;
(4) negative pole of the pulse power is received on the tungsten tip, its positive pole is received on the workpiece;
(5) utilize multi-axis motion controller control to be placed with the displacement platform of electrode clamping device, the operating voltage of discharge processing is provided by the pulse power, and by gap voltage checkout gear collection discharge gap voltage, the data that collect are admitted in the industrial computer, judge the state of current discharge processing according to gap voltage by industrial computer, and pass through moving of multi-axis motion controller control electrode feeding displacement platform, thereby the feeding of control electrode realizes stabilized nano discharge machining hole process; And by industrial computer by the moving of multi-axis motion controller control control X/Y precision displacement table, realize adjustment to the location of workpiece.
2. the method for nano wire according to claim 1 or nanotube discharge machining hole, it is characterized in that, nanotube is bonded on the tungsten tip that is fixed on electrode clamping device, in the discharge process, import the working solution of 1～3Mpa pressure, working fluid is input to the discharge machining area, utilizes the pressure of working solution that the scrap that produces in the discharge process is taken away.
3. the method for nano wire according to claim 1 or nanotube discharge machining hole is characterized in that the pulse width variations scope 2-30 microsecond of the described pulse power, voltage 0-120V, maximum output current 2A.
4. the method for nano wire according to claim 1 or nanotube discharge machining hole, it is characterized in that, industrial computer utilizes the feeding of following method control electrode according to the state of current discharge processing: if discharge processing is in the regular picture state, then electrode keeps current location; If discharge processing is in open-circuit condition, industrial computer then sends instruction to multi-axis motion controller, make electrode feeding displacement platform march forward to, then electrode moves to the direction near workpiece, to reduce discharging gap, enter the regular picture machining state from open-circuit condition up to discharge processing; If discharge processing is in short circuit, arc discharge state, industrial computer then sends instruction to multi-axis motion controller, electrode feeding displacement platform is retreated, then electrode moves to the direction away from workpiece, to increase discharging gap, enter the regular picture machining state from short circuit, conditions at the arc up to discharge processing.
5. the system of nano wire or nanotube discharge machining hole, be used for machining hole on conductive material workpieces, comprise tungsten tip, the electrode clamping device that is bonded with the nano wire that can conduct electricity or nanotube, electrode feeding displacement platform, X/Y precision displacement table, multi-axis motion controller, the pulse power, gap voltage checkout gear and industrial computer with nanometer resolution.
Wherein, electrode clamping device is used for fixing tungsten tip, and places on the electrode feeding displacement platform with nanometer resolution; The X/Y precision displacement table is used for place work piece; Multi-axis motion controller has the nanoscale numerical control to be differentiated, and is used for moving of control electrode feeding displacement platform and X/Y precision displacement table; The pulse power provides discharge processing needed operating voltage; The voltage data of gap voltage checkout gear collection is admitted to industrial computer, judge the state of current discharge processing according to gap voltage by industrial computer, by moving of multi-axis motion controller control electrode feeding displacement platform, thereby the feeding of control electrode, the process of realization stabilized nano discharge machining hole; And by industrial computer by the moving of multi-axis motion controller control X/Y precision displacement table, realize adjustment to the location of workpiece.
6. the system of nano wire according to claim 5 or nanotube discharge machining hole, the pulse width variations scope 2-30 microsecond of the described pulse power, voltage 0-120V, maximum output current 2A.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896446A (en) * | 2012-10-09 | 2013-01-30 | 上海交通大学 | Precise cutting control system for offshore oil platform |
| CN109986152A (en) * | 2017-12-29 | 2019-07-09 | 沈阳高精数控智能技术股份有限公司 | Numerical control device and its control method for spark erosion equipment |
| CN111451622A (en) * | 2020-04-17 | 2020-07-28 | 西安交通大学 | Design method of repetition frequency X pinch load based on metal wire micro-nano processing technology |
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2009
- 2009-07-03 CN CNA2009100695635A patent/CN101607690A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896446A (en) * | 2012-10-09 | 2013-01-30 | 上海交通大学 | Precise cutting control system for offshore oil platform |
| CN102896446B (en) * | 2012-10-09 | 2014-12-10 | 上海交通大学 | Precise cutting control system for offshore oil platform |
| CN109986152A (en) * | 2017-12-29 | 2019-07-09 | 沈阳高精数控智能技术股份有限公司 | Numerical control device and its control method for spark erosion equipment |
| CN111451622A (en) * | 2020-04-17 | 2020-07-28 | 西安交通大学 | Design method of repetition frequency X pinch load based on metal wire micro-nano processing technology |
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Application publication date: 20091223 |