CN101578341A - Composition and method for stripping organic coatings - Google Patents
Composition and method for stripping organic coatings Download PDFInfo
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- CN101578341A CN101578341A CNA2008800016873A CN200880001687A CN101578341A CN 101578341 A CN101578341 A CN 101578341A CN A2008800016873 A CNA2008800016873 A CN A2008800016873A CN 200880001687 A CN200880001687 A CN 200880001687A CN 101578341 A CN101578341 A CN 101578341A
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- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 238000000576 coating method Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 230000007797 corrosion Effects 0.000 claims abstract description 15
- 238000005260 corrosion Methods 0.000 claims abstract description 15
- 239000003112 inhibitor Substances 0.000 claims abstract description 15
- 239000002798 polar solvent Substances 0.000 claims abstract description 8
- 239000004642 Polyimide Substances 0.000 claims description 23
- 229920001721 polyimide Polymers 0.000 claims description 23
- -1 glycols compound Chemical class 0.000 claims description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- 150000002989 phenols Chemical class 0.000 claims description 5
- 150000005846 sugar alcohols Chemical class 0.000 claims description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 4
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims description 4
- MEIRRNXMZYDVDW-MQQKCMAXSA-N (2E,4E)-2,4-hexadien-1-ol Chemical compound C\C=C\C=C\CO MEIRRNXMZYDVDW-MQQKCMAXSA-N 0.000 claims description 2
- SERLAGPUMNYUCK-DCUALPFSSA-N 1-O-alpha-D-glucopyranosyl-D-mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO[C@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O SERLAGPUMNYUCK-DCUALPFSSA-N 0.000 claims description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 2
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 claims description 2
- BKILWHYRLBCASZ-UHFFFAOYSA-M 2-[bis(2-hydroxyethyl)amino]ethanol;2-hydroxypropanoate;phenylmercury(1+) Chemical compound CC(O)C([O-])=O.[Hg+]C1=CC=CC=C1.OCCN(CCO)CCO BKILWHYRLBCASZ-UHFFFAOYSA-M 0.000 claims description 2
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 claims description 2
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 claims description 2
- GUBGYTABKSRVRQ-DCSYEGIMSA-N Beta-Lactose Chemical compound OC[C@H]1O[C@@H](O[C@H]2[C@H](O)[C@@H](O)[C@H](O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@H]1O GUBGYTABKSRVRQ-DCSYEGIMSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 claims description 2
- 239000004375 Dextrin Substances 0.000 claims description 2
- 229920001353 Dextrin Polymers 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 claims description 2
- 229930195725 Mannitol Natural products 0.000 claims description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 2
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 claims description 2
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 2
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 claims description 2
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 claims description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 2
- 235000019439 ethyl acetate Nutrition 0.000 claims description 2
- 239000000845 maltitol Substances 0.000 claims description 2
- 235000010449 maltitol Nutrition 0.000 claims description 2
- 239000000594 mannitol Substances 0.000 claims description 2
- 235000010355 mannitol Nutrition 0.000 claims description 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 2
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 2
- BJAARRARQJZURR-UHFFFAOYSA-N trimethylazanium;hydroxide Chemical compound O.CN(C)C BJAARRARQJZURR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000811 xylitol Substances 0.000 claims description 2
- 235000010447 xylitol Nutrition 0.000 claims description 2
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 2
- 229960002675 xylitol Drugs 0.000 claims description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- DLRVVLDZNNYCBX-UHFFFAOYSA-N Polydextrose Polymers OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(O)O1 DLRVVLDZNNYCBX-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SERLAGPUMNYUCK-YJOKQAJESA-N 6-O-alpha-D-glucopyranosyl-D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO[C@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O SERLAGPUMNYUCK-YJOKQAJESA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-O N-dimethylethanolamine Chemical compound C[NH+](C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-O 0.000 description 1
- 229920001100 Polydextrose Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012940 design transfer Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000001259 polydextrose Substances 0.000 description 1
- 235000013856 polydextrose Nutrition 0.000 description 1
- 229940035035 polydextrose Drugs 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention relates to a composition for stripping an organic coating from a substrate, which comprises about 5 wt% to about 90 wt% of a polar solvent, about 0.01wt% to about 50 wt% of an alkaline compound, and about 100 ppm to about 15 wt% of a metal corrosion inhibitor, based on the total weight of the composition. The composition of the invention can effectively remove the organic coating without damaging the surface of a metal substrate.
Description
Technical field
The present invention relates to a kind of organic coating film and peel off and use composition, and be particularly related to and be used for stripping liquid crystal display and semiconducter device as the composition of the organic coating film of protective membrane or insulating film and use the stripping means of said composition.
Background technology
Etching process can be described as one of middle most crucial steps of imprint lithography (lithographic process) of whole liquid-crystal display and semiconductor industry.Generally speaking, the assembly pattern on the photoresist mask is transferred on the photo-resist by imprint lithography earlier, and then utilizes etching process to finish the final purpose of whole design transfer to film.This layer will become the some of liquid-crystal display or semiconductor subassembly through lithography and etched film.
For instance, in the common methods of making liquid-crystal display, usually on the glass substrate that comprises metal electrode, form the organic coating film of polyimide (PI) precursor, on this organic coating film, form the patterning photoresist mask then, organic coating film to exposure carries out etching again, then on glass substrate, adopt the photo-resist stripping liquid,, thereby form etched polyimide precursor with the removing photoresist mask.Then, carry out the heat treated of polyimide precursor, to make polyimide coating film.Polyimide is the extremely wide high-temperature resistance plastice of purposes, can be used as insulation compound, also can prevent the metal level oxidation on the substrate.
When there is defective in the assembly with this imprint lithography manufacturing; too thin or too thick as the protective membrane on the aluminium conductor in the semiconductor package process; or conductor wire is too narrow or when too wide; this protective membrane can be removed; so that form protective membrane again, make to comprise that the glass substrate of metal electrode can continue recycling.
The ordinary method utilization of the organic coating film of release etch is such as the aqueous sodium hydroxide solution of heating or the dangerous alkali lye of the hydrazine aqueous solution from the glass substrate.Though use alkali lye can peel off organic coating film fully, fully the control splitting time.In addition, some glass substrate can cause the metal level corrosion because of the alkali lye stripping.
Summary of the invention
In order to eliminate above-mentioned shortcoming, main purpose of the present invention is to provide a kind of organic coating film to peel off and uses composition, and it can be safely, remove organic coating film from glass substrate effectively, and can not cause damage to metallic substrate surfaces.
Another purpose of the present invention is to provide a kind of method of peeling off organic coating film, it comprises that the metal substrate that will comprise organic coating film and organic coating film of the present invention are peeled off to contact with this substrate certainly with composition and removes organic coating film, and can not cause damage to metallic substrate surfaces.
Description of drawings
Fig. 1 is presented at the etched polyimide on the substrate.
Fig. 2 shows the state after the polyimide of Fig. 1 is removed with conventional composition.
Fig. 3 shows the state after the polyimide of Fig. 1 is removed with the composition of the embodiment of the invention 1.
Embodiment
Organic coating film of the present invention is peeled off with composition and is comprised basic cpd and the about 100ppm extremely metal corrosion inhibitor of about 15 weight %s of about 5 weight % to the polar solvent of about 90 weight %, about 0.01 weight % to about 50 weight % in composition total weight.
Can peel off the organic coating film of effectively peeling off with composition by organic coating film of the present invention and include but not limited to polyimide coating film,, be preferably polyimide coating film by filming that acrylic resin, novolac resin, Resins, epoxy or polyvinyl alcohol resin form.
Polar solvent used in the present invention is the solvent that has excellent affinity with organic coating film, be preferably non-proton property aqueous organic solvent, include but not limited to glycols compound, N-Methyl pyrrolidone (NMP), N, N-N,N-DIMETHYLACETAMIDE (DMAC), N, dinethylformamide (DMF), methyl-sulphoxide (DMSO) or its mixture.
Be applicable among the present invention as the glycols compound of polar solvent preferably Trivalin SF and derivative thereof, include but not limited to diethylene glycol monobutyl ether (BDG), diethylene glycol monoethyl ether, diglyme, diethyl carbitol, diethylene glycol dibutyl ether, glycol ether acetic ester monobutyl ether or its mixture.
The content of polar solvent used in the present invention is counted about 5 weight % to about 90 weight % with composition total weight, is preferably about 20 weight % to about 85 weight %.
Basic cpd used in the present invention is preferably selected from the group who is made up of amino alcohol compound, quaternary ammonium compound and composition thereof.
Be applicable to that the amino alcohol compound as basic cpd is preferably selected from by monoethanolamine (MEA), N-Mono Methyl Ethanol Amine, N among the present invention, N-dimethylethanolamine, N-ehtylethanolamine, N-methyl-N-ehtylethanolamine, N, the group that N-diethylethanolamine and composition thereof is formed.
Be applicable to that the quaternary ammonium compound as basic cpd is preferably selected from the group who is made up of hydroxide trimethylammonium puratized agricultural spray, benzyltrimethylammonium hydroxide, bursine, Tetramethylammonium hydroxide (TMAH), TPAOH and composition thereof among the present invention.
The content of basic cpd used in the present invention is counted about 0.01 weight % to about 50 weight % with composition total weight, is preferably about 0.1 weight % to about 50 weight %.
Metal corrosion inhibitor used in the present invention is preferably selected from the group who is made up of benzotriazole derivatives, glycitols derivative, organic phenolic compound and composition thereof.
Be applicable to that the glycitols derivative as metal corrosion inhibitor is preferably selected from the group who is made up of maltose alcohol, poly-dextrin (polydextrose), Xylitol, Saccharum lactis, N.F,USP MANNITOL, maltitol syrup, Palatinitol (isomaltitol), sorbyl alcohol and composition thereof among the present invention.
Be applicable among the present invention as the organic phenolic compound of metal corrosion inhibitor catechol preferably.
The content of metal corrosion inhibitor used in the present invention is counted about 100ppm to about 15 weight % with composition total weight, is preferably about 500ppm to about 12 weight %.
Organic coating film of the present invention is peeled off with composition can optionally further comprise known other component of those of ordinary skill in this technical field, for example reduces surface tension or prevents organic coating film and the tensio-active agent of substrate attachment.
Because polar solvent and basic cpd and organic coating film have excellent affinity, so the present composition can be peeled off organic coating film effectively from glass substrate.In addition, for avoiding the metal level on the glass substrate etched, the present composition comprises metal corrosion inhibitor, and it can prevent from metallic substrate surfaces is caused damage, makes that the metal substrate after organic coating film is peeled off can be recycled.
The present invention also provides a kind of method of peeling off organic coating film, and it comprises that the metal substrate that will comprise organic coating film and organic coating film of the present invention are peeled off to contact with this substrate certainly with composition and remove organic coating film that it can not cause damage to metallic substrate surfaces.
In the method, preferred lift-off processing temperature is to be about 40 ℃ to about 90 ℃, and the preferred lift-off processing time is about 5 minutes to about 30 minutes.
The present invention describes in detail with reference to following non-limiting examples.Modification and change that those skilled in the art can reach easily are included within the disclosed in this specification and the appended claims.
Embodiment
(1) organic coating film is peeled off measure of merit:
A. preparation is peeled off as the organic coating film following of the present invention of table 1 and is used composition.
Table 1
The metal substrate that B. will contain etched polyimide impregnated in this polyimide stripping composition about 5 minutes to about 30 minutes, and temperature is about 40 ℃ to about 90 ℃.The result is as shown in table 2.
Table 2
C. use deionized water clean metal substrate.
D. observe to check on the metal substrate whether the residual of polyimide is arranged with scanning electronic microscope (SEM).
Fig. 1 to Fig. 3 is an electron scanning micrograph.Fig. 1 is presented at the etched polyimide on the substrate; Fig. 2 is the state after the polyimide of Fig. 1 is removed with conventional composition, and this photo shows that etched polyimide is not removed fully; Fig. 3 is the state after the polyimide of Fig. 1 is removed with the composition of the embodiment of the invention 1, the good polyimide removal effect of the clear demonstration of this photo.
(2) metallic corrosion test:
A. preparation contain metal corrosion inhibitor (as glycitols derivative or organic phenolic compound) and not the polyimide of containing metal corrosion inhibitor peel off and use composition.
The metal substrate that B. will contain etched polyimide impregnated in this polyimide stripping composition about 5 minutes to about 30 minutes, and temperature is about 4 ℃ to about 90 ℃.
C. use deionized water clean metal substrate.
D. detect the rate of etch of metallic conductor on the substrate with the four-point probe method.
Experimental result is as shown in table 3 below.Compare with using the composition do not comprise metal corrosion inhibitor, the composition that uses the present invention to comprise metal corrosion inhibitor is peeled off organic coating film can effectively reduce rate of etch to metal substrate, to avoid causing the damage of metallic substrate surfaces.
Table 3
| Rate of etch (dust/minute) | |
| The composition that comprises inhibitor | ＜10 |
| The composition that does not comprise inhibitor | ＞10000 |
Though the present invention with preferred embodiment openly as above, it is not in order to limit the present invention.It is evident that to those skilled in the art, in not breaking away from spirit of the present invention and scope, can do a little change and retouching.Therefore protection scope of the present invention should be limited by the accompanying Claim book.
Claims (11)
1. an organic coating film is peeled off and is used composition, and it comprises basic cpd and the about 100ppm extremely metal corrosion inhibitor of about 15 weight %s of about 5 weight % to the polar solvent of about 90 weight %, about 0.01 weight % to about 50 weight % in composition total weight.
2. organic coating film as claimed in claim 1 is peeled off and is used composition, and wherein said organic coating film is a polyimide coating film.
3. organic coating film as claimed in claim 1 is peeled off and is used composition, wherein said polar solvent is selected from by glycols compound, N-Methyl pyrrolidone (NMP), N, N-N,N-DIMETHYLACETAMIDE (DMAC), N, the group that dinethylformamide (DMF), methyl-sulphoxide (DMSO) and composition thereof are formed.
4. organic coating film as claimed in claim 3 is peeled off and is used composition, and wherein said glycols compound is selected from the group who is made up of diethylene glycol monobutyl ether (BDG), diethylene glycol monoethyl ether, diglyme, diethyl carbitol, diethylene glycol dibutyl ether, glycol ether acetic ester monobutyl ether and composition thereof.
5. organic coating film as claimed in claim 1 is peeled off and is used composition, and wherein said basic cpd is selected from the group who is made up of amino alcohol compound, quaternary ammonium compound and composition thereof.
6. organic coating film as claimed in claim 5 is peeled off and is used composition, wherein said amino alcohol compound is selected from by monoethanolamine (MEA), N-Mono Methyl Ethanol Amine, N, N-dimethylethanolamine, N-ehtylethanolamine, N-methyl-N-ehtylethanolamine, N, the group that N-diethylethanolamine and composition thereof is formed.
7. organic coating film as claimed in claim 5 is peeled off and is used composition, and wherein said quaternary ammonium compound is selected from the group who is made up of hydroxide trimethylammonium puratized agricultural spray, benzyltrimethylammonium hydroxide, bursine, Tetramethylammonium hydroxide, TPAOH and composition thereof.
8. organic coating film as claimed in claim 1 is peeled off and is used composition, and wherein said metal corrosion inhibitor is selected from the group who is made up of benzotriazole derivatives, glycitols derivative, organic phenolic compound and composition thereof.
9. organic coating film as claimed in claim 8 is peeled off and is used composition, and wherein said glycitols derivative is selected from the group who is made up of maltose alcohol, poly-dextrin, Xylitol, Saccharum lactis, N.F,USP MANNITOL, maltitol syrup, Palatinitol, sorbyl alcohol and composition thereof.
10. organic coating film as claimed in claim 8 is peeled off and is used composition, and wherein said organic phenolic compound is a catechol.
11. a method of peeling off organic coating film, it comprises with comprising that the metal substrate of organic coating film contacts with peeling off with composition as each described organic coating film in the claim 1 to 10, to remove organic coating film from described substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2008800016873A CN101578341A (en) | 2008-01-07 | 2008-01-07 | Composition and method for stripping organic coatings |
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|---|---|---|---|
| CNA2008800016873A CN101578341A (en) | 2008-01-07 | 2008-01-07 | Composition and method for stripping organic coatings |
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Cited By (10)
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| CN102804074A (en) * | 2009-05-07 | 2012-11-28 | 巴斯夫欧洲公司 | Resist stripping compositions and methods for manufacturing electrical devices |
| CN103389627A (en) * | 2012-05-11 | 2013-11-13 | 安集微电子科技(上海)有限公司 | Photoresist cleaning liquid |
| CN103869636A (en) * | 2012-12-17 | 2014-06-18 | 安集微电子科技(上海)有限公司 | Photoresist remover |
| WO2014089908A1 (en) * | 2012-12-10 | 2014-06-19 | 安集微电子科技(上海)有限公司 | Cleaning solution for removing photoresist |
| CN105676601A (en) * | 2014-12-03 | 2016-06-15 | 东京应化工业株式会社 | Pretreatment method of glass substrate used for forming etching mask |
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| CN107037697A (en) * | 2016-02-03 | 2017-08-11 | 李长荣化学工业股份有限公司 | Composition for removing polyimide, use thereof and method for removing polyimide by using composition |
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2008
- 2008-01-07 CN CNA2008800016873A patent/CN101578341A/en active Pending
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| CN107037697A (en) * | 2016-02-03 | 2017-08-11 | 李长荣化学工业股份有限公司 | Composition for removing polyimide, use thereof and method for removing polyimide by using composition |
| CN106543801A (en) * | 2016-12-11 | 2017-03-29 | 孙祎 | A kind of preparation method of quick depainting environmental protection paint remover |
| CN107400893A (en) * | 2017-07-27 | 2017-11-28 | 苏州天承化工有限公司 | A kind of fine-line takes off film liquid and takes off membrane process |
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