CN101577301A - 白光led的封装方法及使用该方法制作的led器件 - Google Patents
白光led的封装方法及使用该方法制作的led器件 Download PDFInfo
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Abstract
一种白光LED的封装方法,包括以下步骤:准备组件,在基板上预留注胶孔和排气孔;将LED芯片安装于基板上;在封装外壳内壁涂覆荧光粉;利用承载框连接涂覆有荧光粉的封装外壳与基板,使封装外壳与基板之间形成空腔;将胶体通过注胶孔注入封装外壳与基板所形成的空腔内,空腔内的气体通过排气孔排出;将注胶完的LED器件进行固化。本发明的封装方法,通过在封装外壳内壁涂覆荧光粉,使封装外壳作为荧光粉的承载体,同时,通过在封装外壳以及基板之间注胶的方式,实现封装,生产工艺简单,适合大批量生产,特别适合于多芯片、大面积、以蓝光LED芯片激发荧光粉混合产生白光的封装。另外,本发明还提供一种使用该方法制作的LED器件。
Description
技术领域
本发明涉及一种发光器件的封装方法及其产品,尤其涉及一种白光发光二极管(Light Emitting Diode,LED)的封装方法及使用该方法制作的LED器件。
背景技术
发光二极管(Light Emitting Diode,LED)是一种固态的半导体器件,它可以直接把电转化为光。由于LED不含汞、体积小、寿命长、反应速度快、环保、节能,并具有高色彩饱和度等特性,使其应用越来越广泛,尤其是白光LED,被认为是继白炽灯、荧光灯以后的第三代照明光源,被广泛应用在液晶投影装置、手机背光源、显示屏幕等。
目前,白光LED的实现方法主要有多种,其中一种方法是采用蓝光LED芯片配合荧光粉,产生白光,即,蓝光LED芯片发出的蓝光,激励荧光粉发出黄色的荧光,通过黄光与另一部分透过荧光粉的蓝光复合成白光。这种蓝光LED芯片激发荧光粉混合产生白光的方式,常用的封装方式如下:(a)在LED芯片的整个反射腔内填满荧光粉,然而,芯片点亮时温度较高,荧光粉会发生淬灭、老化等,光衰严重;(b)在LED芯片表面先点透明胶,然后在该透明胶上再涂覆荧光粉,然而,一致性难以得到良好的控制,且,以上两种方法实施过程中,都需要将荧光粉粉末混入透明胶体中进行涂敷;(c)将荧光粉直接涂覆在LED芯片的表面,然而,这种方式对工艺要求较高,实施难度较大。
中国发明专利申请公开说明书中公开号“CN1976069”名称为“隔热式封装结构的白光LED的制造方法”公开了一种隔热式封装结构的白光LED的制造方法,其工艺步骤为:(1)将LED芯片固定在衬底基板上;(2)将电极引线与LED芯片的PN节电极引线孔相焊接;(3)将荧光粉涂覆在透明的环氧树脂或玻璃薄片上;(4)将涂有荧光粉层薄片与LED芯片安装固定,间距不小于50微米;(5)在1个大气压的氮气或氩气的保护性气氛下将荧光粉层薄片与LED芯片封接。这种荧光粉与LED芯片非接触式的封装方式,涂覆有荧光粉的玻璃薄片或环氧树脂胶制成的保护基板通过周边的隔离封接层与装配有LED芯片的衬底基板封接在一起,而在薄片与基板之间充保护性气氛,其工艺要求较高,不利于大批量生产制造,且,制造出来的产品散热性较差、发光效率低。
发明内容
有鉴于此,须提供一种生产工艺简单、散热性较好、发光效率高,适合大批量生产的白光LED的封装方法。
另外,还需提供一种结构简单、发光效率高、色度均匀、一致性高的LED器件。
一种白光LED的封装方法,包括以下步骤:准备组件,在基板上预留注胶孔和排气孔;将LED芯片安装于基板上;在封装外壳内壁涂覆荧光粉;利用承载框连接涂覆有荧光粉的封装外壳与基板,使封装外壳与基板之间形成空腔;将胶体通过注胶孔注入封装外壳与基板所形成的空腔内,空腔内的气体通过排气孔排出;将注胶完的LED器件进行固化。
上述的白光LED的封装方法,其中:所述将LED芯片安装于基板上的步骤包括以下步骤:在基板的凹陷部点上粘合剂;将LED芯片平贴在粘合剂上;连接LED芯片上的电极和基板上的导电层。
上述的白光LED的封装方法,其中:所述在封装外壳内壁涂覆荧光粉的步骤包括以下步骤:将无机免烤胶液、免烤加固剂、免烤分散剂、免烤增塑剂和荧光粉按比例配成混合液,加入玛瑙球并用球磨的方法搅拌所述的混合液;用真空吸涂法或灌涂法在所述的封装外壳内壁上涂覆所述搅拌后的混合液,涂粉时要不断搅拌所述混合液,以防荧光粉沉淀,涂粉完毕后立即吹定型风;把所述的涂粉定型好的封装外壳通入干燥热空气,或放置在烘箱内烘干,让溶剂挥发完后,即可擦粉。
上述的白光LED的封装方法,其中:所述利用承载框连接涂覆有荧光粉的封装外壳与基板,使封装外壳与基板之间形成空腔的步骤包括以下步骤:在承载框的部分内壁上电镀或涂覆高反射材料;将承载框装配于基板上;将封装外壳安装于承载框上。
上述的白光LED的封装方法,其中:所述将封装外壳安装于承载框的方式为嵌入安装或者粘接安装。
一种使用上述方法制作的LED器件,包括基板,设置于所述基板上的LED芯片、封装外壳和连接所述基板和封装外壳的承载框,所述基板上设置有注胶孔和排气孔,所述封装外壳内壁上涂覆有荧光粉,所述封装外壳与基板之间填充有胶体,所述LED芯片通过胶体与荧光粉隔离。
上述的LED器件,其中:所述基板向内凹陷形成用于容纳所述LED芯片的凹陷部;所述凹陷部的外表面上设置有反射层。
上述的LED器件,其中:所述基板为具有热沉的印刷电路板、陶瓷基板或金属线路板;所述基板的横截面形状为矩形或者圆形。
上述的LED器件,其中:所述承载框的上表面向内凹陷形成用于支撑所述封装外壳的台阶,所述承载框的下表面设置有定位销,所述承载框的部分内壁设置有高反射材料;所述基板上设置有与所述定位销配合的定位孔。
上述的LED器件,其中:所述胶体为透明材料的软体硅胶;所述封装外壳的材质为玻璃,其外表面形状为平面形。
上述的LED器件,其中:所述LED芯片的数量为多个,呈矩阵或圆形排列在基板上。
本发明的白光LED的封装方法,通过在封装外壳内壁涂覆荧光粉,使封装外壳作为荧光粉的承载体,同时,通过在封装外壳以及基板之间注胶的方式,实现封装,生产工艺简单,散热性较好,发光效率高,适合大批量生产,特别适合于多芯片、大面积、以蓝光LED芯片激发荧光粉混合产生白光的封装。而使用该方法制作的LED器件,结构简单,荧光粉是设置在封装外壳的内壁上,使LED器件发出色度均匀的白光,且一致性较高;同时,封装外壳与基板之间设置有胶体,LED芯片与荧光粉之间通过胶体隔离,提高于LED器件的散热性以及光发射效率。
附图说明
为了易于说明,本发明由下述的较佳实施例及附图作以详细描述。
图1为本发明一实施方式中白光LED的封装方法的流程图;
图2为本发明图1中步骤S102的细化流程图;
图3为本发明图1中步骤S103的细化流程图;
图4为本发明图1中步骤S104的细化流程图;
图5为本发明第一实施方式中LED器件的立体分解图;
图6为本发明图5的立体组装图;
图7为本发明图5中基板的结构示意图;
图8为本发明注胶时的示意图;
图9是本发明第二实施方式中LED器件的俯视结构示意图。
具体实施方式
图1所示为本发明一实施方式中白光LED的封装方法的流程图。在步骤S101,准备组件,在基板上预留注胶孔和排气孔。本实施方式中,组件包括:基板、LED芯片、封装外壳、承载框及胶体。而在基板上预留用于注胶的注胶孔的同时也预留用于排气的排气孔,且,该注胶孔与排气孔是贯穿基板的通孔。
在本发明其它实施方式中,注胶孔与排气孔之间的位置可以互换,换句话说,就是注胶孔作为排气,而排气孔作为注胶入口。
在步骤S102,安装LED芯片,即将LED芯片安装于基板上。
在步骤S103,在封装外壳内壁涂覆荧光粉。本实施方式中,该封装外壳材质为玻璃。
在步骤S104,整合并形成空腔,即利用承载框连接涂覆有荧光粉的封装外壳与基板,使封装外壳与基板之间形成空腔。
在步骤S105,注胶,即将胶体通过注胶孔注入封装外壳与基板所形成的空腔内,空腔内的气体通过排气孔排出。本实施方式中的胶体为透明材料的软体硅脂,由于硅脂导热系数比保护性气体(如氮气、氩气)大,因此,其散热性能比保护性气体好。同时,由于硅胶的折射率介于封装外壳的折射率与芯片材料的折射率之间,而保护性气体的折射率与空气的折射率接近,所以填充硅胶的LED比填充保护性气体的发光效率要高。注胶时,由于注胶孔与排气孔都是贯穿整个基板的,而基板的上表面设置有LED芯片以及封装外壳,因此,胶体是由基板的下表面注入(参阅图8)。具体说,胶体通过外部的压力由注胶孔缓慢进入空腔中,同时把空气从排气孔中排出,使胶体慢慢填满整个空腔。由于注胶区域是封装外壳与基板所形成的空腔,而LED芯片也在该空腔内,因此,通过胶体,封装外壳、基板以及LED芯片等组件就能结合成为一个整体,实现封装。
本发明中的注胶可以采用人工注胶,也可以采用机械注胶,这里不再赘述。
在步骤S106,固化,即将注胶完的LED器件进行固化。本实施方式中,是通过高温烘烤固化,当然,也可以在常温下固化。通常,固化时间是根据组件的材料而定。固化后的LED器件具有更高的强度,从而确保产品有良好的可靠性。
图2所示为本发明图1中步骤S102的细化流程图。在步骤S1021,点胶,即在基板的凹陷部点上粘合剂。粘合剂的作用是把LED芯片粘在基板上的凹陷部,一般使用导电银浆作为粘合剂,但对于蓝宝石衬底的芯片,因两个电极都在正面,因此使用绝缘胶作为粘合剂。粘合剂的性能对LED器件的可靠性及透光效果有直接影响,因此,必须根据实际情况,选择合适的粘合剂。在步骤S1022,固晶,即将LED芯片平贴在粘合剂上。在步骤S1023,引线连接,即通过金线连接LED芯片上的电极和基板上的导电层,形成回路。本发明的LED芯片的数量可以为一个,也可以为两个以上。如果LED芯片的数量为两个以上,可以通过基板上的导电层以串联连接、并联连接或者串联与并联的混合连接方式实现。
图3所述为本发明图1中步骤S103的细化流程图。在步骤S1031,配粉,即将无机免烤胶液、免烤加固剂、免烤分散剂、免烤增塑剂和荧光粉按比例配成混合液后备用;加入玛瑙球,用球磨的方法搅拌所述的混合液。在步骤S1032,涂粉,即用真空吸涂法或灌涂法在封装外壳内壁上涂覆所述含有荧光粉的混合液,涂粉时要不断搅拌混合液,以防荧光粉沉淀;涂粉完毕后立即吹定型风。在步骤S1033,烘干,即将所述涂粉定型好的封装外壳通入干燥热空气,或放置在烘箱内烘干,让溶剂挥发完后,即可擦粉。
图4所示为本发明图1中步骤S104的细化流程图。在步骤S1041,电镀或涂覆高反射材料,即在承载框的部分内壁上电镀或涂覆高反射材料。本发明其它实施方式中,对光效的要求不高的话,步骤S1041也可以省略。在步骤S1042,将承载框装配于基板上。在步骤S1043,将封装外壳安装于承载框上。本实施方式中,将封装外壳安装于承载框的方式为嵌入安装或者粘接安装。
本发明的白光LED的封装方法,通过在封装外壳内壁涂覆荧光粉,使封装外壳作为荧光粉的承载体,同时,通过在封装外壳以及基板之间注胶的方式,实现封装,生产工艺简单,适合大批量生产,特别适合于多芯片、大面积、以蓝光LED芯片激发荧光粉混合产生白光的封装,且,制造出来的产品散热性好、发光效率高。此外,由于荧光粉是涂覆于封装外壳的内壁上,增强了白光的色度和亮度。
图5所示为本发明第一实施方式中LED器件的立体分解图,同时参阅图6至图8。使用本发明的方法制作的LED器件,包括:基板10,设置于基板10上的LED芯片20,封装外壳30以及连接基板10与封装外壳30的承载框50,其中,封装外壳30的材质是玻璃,其内壁上涂覆有荧光粉(图中未标示),所述封装外壳与基板之间填充有胶体40(参阅图8),LED芯片20通过胶体40与荧光粉隔离。
基板10的上表面以及下表面印刷有导电层11,用于连接外部电极与LED芯片20上的电极21。当然,在本发明其它实施方式中,也可以仅在基板10的上表面设置导电层11。本实施方式中,基板10向内凹陷形成用于容纳LED芯片20的凹陷部12。凹陷部12的表面上设置有反射层(图中未标示)。该反射层为银,具有反射功能,有利于提高光效。又,基板10上还设置有注胶孔13(参阅图7)与排气孔14(参阅图7)。该注胶孔13与排气孔14均为贯穿基板10的通孔。基板10是具有热沉的印刷电路板、陶瓷基板或金属线路板。由于金属线路板和陶瓷基板本身散热性能比较好,因此不需要加热沉。本实施方式中,热沉可以冲压形成凹陷部12,而在热沉表面镀银即可形成反射杯。基板10的横截面形状为矩形。
承载框50作为封装外壳30的承载体,采用腔体结构,其材质为白色塑胶。承载框50的上表面向内凹陷形成用于支撑封装外壳30的台阶51(参阅图5);承载框50的下表面设置有定位销52。本实施方式中,定位销52的数量为3对,对称设置在承载框50的两侧。同时,承载框50的部分内壁(具体说是朝向LED芯片20、临近台阶51的内壁)设置有高反射材料,同样用于提高光效。而基板10上设置有与定位销52配合的定位孔15。换句话说,基板10与承载框50是通过定位孔15与定位销52之间的配合而固定装配于一体。定位孔15的数量与定位销52的数量一致。而定位孔15设置在凹陷部12的外侧。
LED芯片20设置在基板10上,具体说,是设置在凹陷部12的底部。本实施方式中,LED芯片20为蓝光LED芯片,能发出蓝光,其数量为多个,呈矩阵排列(参阅图5)在基板10上,形成面状光源。当然,多个LED芯片20也可以采用圆形排列设置在基板10上,这里不在赘述。
本发明其它实施方式中,多个LED芯片20也可以采用其他排列方式设置在基板10上。当然,LED芯片20的数量也可以为1个。
封装外壳30的外表面形状为平面形。封装外壳30采用嵌入安装或粘接安装方式装配于承载框50上的台阶51处。此处的嵌入安装方式指的是封装外壳30与台阶51过盈配合。因此,当承载框50以及封装外壳30装配到基板10上时,承载框50、封装外壳30以及基板10之间形成密闭的空腔。
荧光粉设置于封装外壳30的内壁,当荧光粉受LED芯片20所发出的蓝光激发时,能发出黄色的荧光,黄光与另一部分透过荧光粉的蓝光复合,产生白光。
本例所述的荧光粉涂覆在封装外壳30内壁的方法包括:将无机免烤胶液、免烤加固剂、免烤分散剂、免烤增塑剂和能发出黄光的荧光粉按比例配成混合液后,加入玛瑙球并用球磨的方法搅拌所述的混合液;用真空吸涂法或灌涂法在封装外壳内壁上涂覆所述粉浆,涂粉时要不断搅拌所述粉浆,以防荧光粉沉淀,涂粉完毕后立即吹定型风;把所述的涂粉定型好的封装外壳通入干燥热空气,或放置在烘箱内烘干,让溶剂挥发完后,即可擦粉。
胶体40为透明材料的软体硅胶,填充在密闭的空腔中,使得LED芯片20通过胶体40与荧光粉隔离。采用荧光粉与LED芯片之间用硅胶等材料隔开的方式,使得荧光粉和LED芯片20上产生的两部分热量热热分离,提高了LED器件的散热性以及光发射效率。
因此,应用本发明封装方法制作的LED器件,结构简单,而荧光粉是设置在封装外壳30的内壁上,使LED器件发出色度均匀的白光,且一致性较高;同时,封装外壳30与基板10之间设置有胶体40,LED芯片20与荧光粉之间通过胶体40隔离,提高了LED器件的散热性以及光发射效率。
图9所示为本发明第二实施方式中LED器件的俯视结构示意图。该LED器件与图5所示的LED器件的结构基本相同,区别仅在于,图9所示的LED器件的基板10’的横截面形状为圆形,封装外壳30’的外表面形状为圆平面形,该LED器件形成圆形面状光源。
以上所述之具体实施方式为本发明的较佳实施方式,并非以此限定本发明的具体实施范围,本发明的范围包括并不限于本具体实施方式。凡依照本发明之形状、结构所作的等效变化均包含本发明的保护范围内。
Claims (11)
1.一种白光LED的封装方法,其特征在于,所述白光LED的封装方法包括以下步骤:
准备组件,在基板上预留注胶孔和排气孔;
将LED芯片安装于基板上;
在封装外壳内壁涂覆荧光粉;
利用承载框连接涂覆有荧光粉的封装外壳与基板,使封装外壳与基板之间形成空腔;
将胶体通过注胶孔注入封装外壳与基板所形成的空腔内,空腔内的气体通过排气孔排出;以及
将注胶完的LED器件进行固化。
2.根据权利要求1所述的白光LED的封装方法,其特征在于,所述将LED芯片安装于基板上的步骤包括以下步骤:
在基板的凹陷部点上粘合剂;
将LED芯片平贴在粘合剂上;以及
连接LED芯片上的电极和基板上的导电层。
3.根据权利要求1所述的白光LED的封装方法,其特征在于,所述在封装外壳内壁涂覆荧光粉的方法包括以下步骤:
将无机免烤胶液、免烤加固剂、免烤分散剂、免烤增塑剂和荧光粉按比例配成混合液,加入玛瑙球并用球磨的方法搅拌所述的混合液;
用真空吸涂法或灌涂法在所述的封装外壳内壁上涂覆所述搅拌后的混合液,涂粉时要不断搅拌所述混合液,以防荧光粉沉淀,涂粉完毕后立即吹定型风;以及
把所述的涂粉定型好的封装外壳通入干燥热空气,或放置在烘箱内烘干,让溶剂挥发完后,即可擦粉。
4.根据权利要求1所述的白光LED的封装方法,其特征在于,所述利用承载框连接涂覆有荧光粉的封装外壳与基板,使封装外壳与基板之间形成空腔的步骤包括以下步骤:
在承载框的部分内壁上电镀或涂覆高反射材料;
将承载框装配于基板上;以及
将封装外壳安装于承载框上。
5.根据权利要求4所述的白光LED的封装方法,其特征在于,所述将封装外壳安装于承载框的方式为嵌入安装或者粘接安装。
6.一种使用权力要求1至5任意一项方法制作的LED器件,包括基板,设置于所述基板上的LED芯片以及封装外壳,所述基板上设置有注胶孔和排气孔,其特征在于,还包括连接所述基板和封装外壳的承载框,所述封装外壳内壁上涂覆有荧光粉,所述封装外壳与基板之间填充有胶体,所述LED芯片通过胶体与荧光粉隔离。
7.根据权利要求6所述的LED器件,其特征在于,所述基板向内凹陷形成用于容纳所述LED芯片的凹陷部;所述凹陷部的外表面上设置有反射层。
8.根据权利要求6所述的LED器件,其特征在于,所述基板为具有热沉的印刷电路板、陶瓷基板或金属线路板;所述基板的横截面形状为矩形或者圆形。
9.根据权利要求6所述的LED器件,其特征在于,所述承载框的上表面向内凹陷形成用于支撑所述封装外壳的台阶,所述承载框的下表面设置有定位销,所述承载框的部分内壁设置有高反射材料;所述基板上设置有与所述定位销配合的定位孔。
10.根据权利要求6所述的LED器件,其特征在于,所述胶体为透明材料的软体硅胶;所述封装外壳的材质为玻璃,其外表面形状为平面形。
11.根据权利要求6所述的LED器件,其特征在于,所述LED芯片的数量为多个,呈矩阵或圆形排列在基板上。
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