CN101565819A - Magnetic controlled sputtering ring - Google Patents
Magnetic controlled sputtering ring Download PDFInfo
- Publication number
- CN101565819A CN101565819A CNA2009101173045A CN200910117304A CN101565819A CN 101565819 A CN101565819 A CN 101565819A CN A2009101173045 A CNA2009101173045 A CN A2009101173045A CN 200910117304 A CN200910117304 A CN 200910117304A CN 101565819 A CN101565819 A CN 101565819A
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- ring
- magnetic
- ring body
- umbo
- threaded hole
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Abstract
The invention relates to a magnetic controlled sputtering ring, comprising a circular ring body made from tantalum or niobium metal, a convex junction assembled along the outer edge of the ring body, a convex rhombic pattern on the circular ring body. The sputtering ring is used on the sputtering machine using tantalum as target, and performance on every aspect reaches the requirement of design.
Description
Technical field:
The present invention relates to electronic technology, belong to magnetic force control method utilisation technology in the semiconductor wafer sputter field, particularly a kind of magnetic-control sputtering ring.
Background technology:
Sputter is a kind of method of semiconductor wafer or other substrate being carried out coating in being full of the processing vessel of rare gas element.The magnetic-control sputtering ring piece that includes sputtering target in these containers and place near the sputtering target place.Electric field in the container makes rare gas element produce ionization, and clashes into atom from target, so that sputter target material is deposited on the wafer.Simultaneously, being clashed into the atom that on the sputter target material is the diffuse-reflectance shape, need use restraint to it.Magnetic-control sputtering ring piece is exactly the parts that cooperate the planar targets sputter to use, and it mainly acts on is that electromagnetic field by its generation retrains the target material atomic motion that sputters, and adsorbs the big particle that might occur in the sputter procedure simultaneously.
Separation magnet ring (200680008750.7) on the Chinese patent magnetron sputter chamber discloses a kind of magnet ring, and the ring body structurc of this invention and the present invention have bigger difference, and its application purpose is also different with the present invention.
Summary of the invention:
The purpose of this invention is to provide a kind of magnetic-control sputtering ring that is used in the semiconductor wafer sputter deposition apparatus.
Purpose of the present invention realizes according to following proposal:
A kind of magnetic-control sputtering ring comprises the circular ring body made from tantalum or niobium metal (1), along the ring body outer rim umbo body (2) fixing and the introducing galvanic action has been housed, and there is protruding rhombic knurling on circular ring body (1) surface;
Described umbo body (2) adopts electrons leaves welding to be connected with ring body (1);
Described umbo body (2) is cylindric, and there is threaded hole (6) outer end along shaft core position, and annular recesses (5) is arranged outside threaded hole (6), and the circular hole (7) that communicates with threaded hole is radially arranged.
The present invention uses on sputter as target at tantalum, and various aspects of performance reaches design requirements.
Description of drawings:
Fig. 1 is a schematic top plan view of the present invention;
Fig. 2 is a front schematic view of the present invention;
Fig. 3 is an A-A cross-sectional schematic of the present invention;
Fig. 4 is the upward view of boss of the present invention.
Embodiment:
As shown in Figure 1 and Figure 2, the present invention is made of a circular ring body (1) and several umbo bodies (2) of being positioned at its outer rim, material employing purity surpasses 99.9% tantalum or niobium metal, and electrons leaves welding is adopted in both connections, and galvanic action is fixed and introduced to main rising; Structure such as Fig. 3 of umbo body (2), shown in Figure 4, its integral body is T-shaped cylindric, the outer end has threaded hole (6) along shaft core position, annular recesses (5) is arranged outside threaded hole (6), the circular hole (7) that communicates with threaded hole is radially arranged, adding man-hour, have the circular hole that matches with umbo body (2) diameter at butt end in the corresponding position of the external side of circular rings, umbo body (2) is bumped into the back electrons leaves welding, umbo body (2) exposed parts carries out sandblasting, the surface of circular ring body (1) is carried out annular knurl and is handled, at Fig. 3, be expressed as annular knurl district (3) and sandblast district (4) on Fig. 4, the standard of institute's annular knurl is the protruding rhombic knurling of 80TPI (80 " road " fin is arranged in the per inch scope).
Claims (3)
1, a kind of magnetic-control sputtering ring comprises the circular ring body made from tantalum or niobium metal (1), it is characterized in that along the ring body outer rim umbo body (2) fixing and the introducing galvanic action being housed, and there is protruding rhombic knurling on circular ring body (1) surface.
2, magnetic-control sputtering ring as claimed in claim 1 is characterized in that described umbo body (2) and ring body (1) adopt electrons leaves welding to be connected.
3, magnetic-control sputtering ring as claimed in claim 1 is characterized in that described umbo body (2) for cylindric, and there is threaded hole (6) outer end along shaft core position, and annular recesses (5) is arranged outside threaded hole (6), and the circular hole (7) that communicates with threaded hole is radially arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009101173045A CN101565819A (en) | 2009-06-04 | 2009-06-04 | Magnetic controlled sputtering ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009101173045A CN101565819A (en) | 2009-06-04 | 2009-06-04 | Magnetic controlled sputtering ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101565819A true CN101565819A (en) | 2009-10-28 |
Family
ID=41282178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009101173045A Pending CN101565819A (en) | 2009-06-04 | 2009-06-04 | Magnetic controlled sputtering ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101565819A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101920437A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Flat knurling process for sputtering inner and outer surfaces of tantalum ring |
| CN101920438A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Coiling machine continuous knurling technique on inner and outer surfaces of sputtering tantalum ring |
| CN101920439A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Reeling, welding and knurling process for inner and outer surfaces of sputtered tantalum ring |
| CN102049568A (en) * | 2010-10-29 | 2011-05-11 | 宁波江丰电子材料有限公司 | Machining device for tantalum ring fixing component |
| CN102418076A (en) * | 2011-12-07 | 2012-04-18 | 宁波江丰电子材料有限公司 | Focus ring, focus ring combination and ionized metal plasma (IMP) sputtering equipment |
| CN102418075A (en) * | 2011-12-07 | 2012-04-18 | 宁波江丰电子材料有限公司 | Focus ring, focus ring combination and ionized metal plasma (IMP) sputtering equipment |
| CN104726830A (en) * | 2013-12-24 | 2015-06-24 | 宁波江丰电子材料股份有限公司 | Correction equipment of focusing ring |
| CN105088155A (en) * | 2014-04-25 | 2015-11-25 | 宁波江丰电子材料股份有限公司 | Magnetron sputtering ring, magnetron sputtering ring apparatus and magnetron sputtering reactor |
| EP2554710A4 (en) * | 2010-03-29 | 2016-08-10 | Jx Nippon Mining & Metals Corp | Tantalum coil for sputtering and method for processing the coil |
| CN106493525A (en) * | 2016-12-23 | 2017-03-15 | 有研亿金新材料有限公司 | A kind of preparation method of sputtering titanacycle |
| CN107755540A (en) * | 2016-08-18 | 2018-03-06 | 宁波江丰电子材料股份有限公司 | The processing method of press-working apparatus and focusing ring boss |
| CN108070833A (en) * | 2016-11-17 | 2018-05-25 | 宁波江丰电子材料股份有限公司 | Focusing ring and its method of work |
| CN108406225A (en) * | 2018-05-28 | 2018-08-17 | 宁波江丰电子材料股份有限公司 | Etch guard member production method, device and numerically controlled lathe |
| CN109277771A (en) * | 2017-07-19 | 2019-01-29 | 宁波江丰电子材料股份有限公司 | Sputter ring umbo body rose work method |
| CN111015301A (en) * | 2019-12-31 | 2020-04-17 | 有研亿金新材料有限公司 | Machining method for mounting hole position and opening area of sputtering ring piece |
| CN111469052A (en) * | 2020-04-03 | 2020-07-31 | 宁波江丰电子材料股份有限公司 | Treatment method for prolonging service life of ring piece |
| CN111575663A (en) * | 2020-05-15 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Magnetron sputtering ring piece and machining method of matching hole of magnetron sputtering ring piece |
| CN113560825A (en) * | 2021-07-30 | 2021-10-29 | 宁波江丰电子材料股份有限公司 | Semiconductor sputtering ring protection piece and processing method thereof |
-
2009
- 2009-06-04 CN CNA2009101173045A patent/CN101565819A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2554710A4 (en) * | 2010-03-29 | 2016-08-10 | Jx Nippon Mining & Metals Corp | Tantalum coil for sputtering and method for processing the coil |
| CN101920438A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Coiling machine continuous knurling technique on inner and outer surfaces of sputtering tantalum ring |
| CN101920439A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Reeling, welding and knurling process for inner and outer surfaces of sputtered tantalum ring |
| CN101920437A (en) * | 2010-08-20 | 2010-12-22 | 宁夏东方钽业股份有限公司 | Flat knurling process for sputtering inner and outer surfaces of tantalum ring |
| CN102049568A (en) * | 2010-10-29 | 2011-05-11 | 宁波江丰电子材料有限公司 | Machining device for tantalum ring fixing component |
| CN102418076A (en) * | 2011-12-07 | 2012-04-18 | 宁波江丰电子材料有限公司 | Focus ring, focus ring combination and ionized metal plasma (IMP) sputtering equipment |
| CN102418075A (en) * | 2011-12-07 | 2012-04-18 | 宁波江丰电子材料有限公司 | Focus ring, focus ring combination and ionized metal plasma (IMP) sputtering equipment |
| CN104726830B (en) * | 2013-12-24 | 2017-06-30 | 宁波江丰电子材料股份有限公司 | The correcting device of focusing ring |
| CN104726830A (en) * | 2013-12-24 | 2015-06-24 | 宁波江丰电子材料股份有限公司 | Correction equipment of focusing ring |
| CN105088155A (en) * | 2014-04-25 | 2015-11-25 | 宁波江丰电子材料股份有限公司 | Magnetron sputtering ring, magnetron sputtering ring apparatus and magnetron sputtering reactor |
| CN107755540A (en) * | 2016-08-18 | 2018-03-06 | 宁波江丰电子材料股份有限公司 | The processing method of press-working apparatus and focusing ring boss |
| CN108070833A (en) * | 2016-11-17 | 2018-05-25 | 宁波江丰电子材料股份有限公司 | Focusing ring and its method of work |
| CN106493525A (en) * | 2016-12-23 | 2017-03-15 | 有研亿金新材料有限公司 | A kind of preparation method of sputtering titanacycle |
| CN109277771A (en) * | 2017-07-19 | 2019-01-29 | 宁波江丰电子材料股份有限公司 | Sputter ring umbo body rose work method |
| CN108406225A (en) * | 2018-05-28 | 2018-08-17 | 宁波江丰电子材料股份有限公司 | Etch guard member production method, device and numerically controlled lathe |
| CN111015301A (en) * | 2019-12-31 | 2020-04-17 | 有研亿金新材料有限公司 | Machining method for mounting hole position and opening area of sputtering ring piece |
| CN111469052A (en) * | 2020-04-03 | 2020-07-31 | 宁波江丰电子材料股份有限公司 | Treatment method for prolonging service life of ring piece |
| CN111575663A (en) * | 2020-05-15 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Magnetron sputtering ring piece and machining method of matching hole of magnetron sputtering ring piece |
| CN113560825A (en) * | 2021-07-30 | 2021-10-29 | 宁波江丰电子材料股份有限公司 | Semiconductor sputtering ring protection piece and processing method thereof |
| CN113560825B (en) * | 2021-07-30 | 2022-07-15 | 宁波江丰电子材料股份有限公司 | Semiconductor sputtering ring protection piece and processing method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGFANG TANTALUM INDUSTRY CO. LTD., NINGXIA Free format text: FORMER OWNER: XIBEI INST. OF RARE METAL MATERIAL Effective date: 20100811 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 753000 NO.119, YEJIN ROAD, DAWUKOU DISTRICT, SHIZUISHAN CITY, NINGXIA HUI AUTONOMOUS REGION TO: 753000 YEJIN ROAD, DAWUKOU DISTRICT, SHIZUISHAN CITY, NINGXIA HUI AUTONOMOUS REGION |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20100811 Address after: 753000 the Ningxia Hui Autonomous Region City, Shizuishan Province Metallurgical Road, Dawukou Applicant after: Dongfang Tantalum Industry Co., Ltd., Ningxia Address before: 753000 Dawukou Road, Shizuishan, the Ningxia Hui Autonomous Region metallurgical Road, No. 119 Applicant before: Xibei Inst. of Rare Metal Material |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20091028 |