CN101529604B - 上下电极型发光二极管用封装集合体及使用该集合体的发光装置的制造方法 - Google Patents

上下电极型发光二极管用封装集合体及使用该集合体的发光装置的制造方法 Download PDF

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Publication number
CN101529604B
CN101529604B CN2007800384211A CN200780038421A CN101529604B CN 101529604 B CN101529604 B CN 101529604B CN 2007800384211 A CN2007800384211 A CN 2007800384211A CN 200780038421 A CN200780038421 A CN 200780038421A CN 101529604 B CN101529604 B CN 101529604B
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China
Prior art keywords
light
lower electrode
emitting diode
substrate portion
mentioned
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Expired - Fee Related
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CN2007800384211A
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English (en)
Chinese (zh)
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CN101529604A (zh
Inventor
伏见宏司
西山研吾
工藤幸二
山本济宫
光山和磨
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CI Kasei Co Ltd
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CI Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006282635A external-priority patent/JP2008103402A/ja
Priority claimed from JP2006291220A external-priority patent/JP2008108958A/ja
Application filed by CI Kasei Co Ltd filed Critical CI Kasei Co Ltd
Priority claimed from PCT/JP2007/070509 external-priority patent/WO2008047933A1/ja
Publication of CN101529604A publication Critical patent/CN101529604A/zh
Application granted granted Critical
Publication of CN101529604B publication Critical patent/CN101529604B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
CN2007800384211A 2006-10-17 2007-10-16 上下电极型发光二极管用封装集合体及使用该集合体的发光装置的制造方法 Expired - Fee Related CN101529604B (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP282635/2006 2006-10-17
JP282634/2006 2006-10-17
JP2006282634A JP2008103401A (ja) 2006-10-17 2006-10-17 上下電極型発光ダイオード用パッケージおよび上下電極型発光ダイオード用パッケージの製造方法
JP2006282635A JP2008103402A (ja) 2006-10-17 2006-10-17 上下電極型発光ダイオード用パッケージ集合体および上下電極型発光ダイオード用パッケージ集合体の製造方法
JP2006291220A JP2008108958A (ja) 2006-10-26 2006-10-26 発光装置および発光装置の製造方法
JP291220/2006 2006-10-26
JP2006302731 2006-11-08
JP302731/2006 2006-11-08
JP2007060180 2007-03-09
JP060180/2007 2007-03-09
PCT/JP2007/070509 WO2008047933A1 (en) 2006-10-17 2007-10-16 Package assembly for upper/lower electrode light-emitting diodes and light-emitting device manufacturing method using same

Publications (2)

Publication Number Publication Date
CN101529604A CN101529604A (zh) 2009-09-09
CN101529604B true CN101529604B (zh) 2012-06-13

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CN2007800384211A Expired - Fee Related CN101529604B (zh) 2006-10-17 2007-10-16 上下电极型发光二极管用封装集合体及使用该集合体的发光装置的制造方法

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JP (1) JP2008103401A (ja)
CN (1) CN101529604B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8567988B2 (en) * 2008-09-29 2013-10-29 Bridgelux, Inc. Efficient LED array
KR100908299B1 (ko) * 2008-10-16 2009-07-17 (주)참빛 다이오드 패키지용 리드프레임 기판 및 이를 구비한다이오드 패키지
DE102009051129A1 (de) 2009-10-28 2011-06-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
BR112013012333A2 (pt) 2010-11-19 2019-03-06 Koninklijke Philips Electronics N.V método, dispositivo emissor de luz e quadro condutor carregador isolado para dispositivo emissor de luz
CN102185039B (zh) * 2011-01-10 2013-04-24 常熟工大工业科技有限公司 一种提高led集成面光源安规绝缘耐压的方法
CN104022215B (zh) * 2013-03-01 2017-02-01 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
JP6393518B2 (ja) * 2014-05-15 2018-09-19 チームラボ株式会社 ３次元ディスプレイ及びデータ生成方法
EP3244448A1 (de) * 2016-05-09 2017-11-15 Heraeus Deutschland GmbH & Co. KG Verbinder, verfahren zur herstellung eines verbinders, leistungshalbleitermodul und verfahren zur herstellung eines leistungshalbleitermoduls

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1523681A (zh) * 2003-02-18 2004-08-25 夏普株式会社 半导体发光装置及其制造方法和电子图像拾取装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
JP2006282634A (ja) * 2005-04-04 2006-10-19 Kureha Corp 全身性炎症反応症候群予防又は治療剤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1523681A (zh) * 2003-02-18 2004-08-25 夏普株式会社 半导体发光装置及其制造方法和电子图像拾取装置

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
JP平1-181490A 1989.07.19
JP平2-116186A 1990.04.27
JP平2-94688A 1990.04.05
JP昭58-201388A 1983.11.24
JP昭61-281578A 1986.12.11
JP特开2000-244022A 2000.09.08
JP特开2003-31848A 2003.01.31

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CN101529604A (zh) 2009-09-09
JP2008103401A (ja) 2008-05-01

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