CN101526404A - Temperature and pressure compound sensor - Google Patents
Temperature and pressure compound sensor Download PDFInfo
- Publication number
- CN101526404A CN101526404A CN200910042536A CN200910042536A CN101526404A CN 101526404 A CN101526404 A CN 101526404A CN 200910042536 A CN200910042536 A CN 200910042536A CN 200910042536 A CN200910042536 A CN 200910042536A CN 101526404 A CN101526404 A CN 101526404A
- Authority
- CN
- China
- Prior art keywords
- temperature
- pressure
- strain
- sensor
- elastic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a temperature and pressure compound sensor which comprises an elastomer, an insulated film and a protective film, wherein the insulated film and the protective film are covered on the elastomer; a strain resistor is arranged in a strain region in the center of the elastomer and connected with the elastomer by electrode leads into a Wheatstone bridge, and a thermal resistor connected with the electrode leads is arranged in a non-strain region on the periphery of the elastomer. The temperature and pressure compound sensor can simultaneously finish the tests of a pressure signal and a temperature signal, and the pressure signal can test the manometer pressure and the absolute pressure. The invention has simple structure and small size and is convenient to use.
Description
Technical field
The invention discloses a kind of temperature and pressure compound sensor.
Background technology
In recent years, flourish along with sensor technology, the user is also more and more higher to the request for utilization of sensor, and the sensor type of Chu Xianing is also more and more thereupon.
The wherein most widely used still test of pressure and temperature signal.Adopts pressure sensor as pressure detection wherein just comprises the strain pressure transducer, and it is a kind of sensor that utilizes strain measurement technique to grow up, and is used widely.Its principle is, by flexible member, converts pressure to strain as flat diaphragm, convoluted diaphragm, corrugated tube or elasticity tube etc., makes sensitive element with the strain resistor that is bonded on the flexible member, converts strain to electric signal.
In using at ordinary times, because both test philosophies are different, generally selection pressure sensor or temperature sensor detect the user as requested.And when the user need monitor simultaneously to the pressure and temperature signal, generally need just can reach testing goal by while adopts pressure sensor and temperature sensor test.Be unfavorable for saving cost like this, and when installing and using, also cumbersome.
Summary of the invention
At above-mentioned prior art, the technical issues that need to address of the present invention are that a kind of temperature and pressure compound sensor can be arranged, simultaneously detected pressures and temperature, and simple in structure, be convenient to realize and apply.
For solving the problems of the technologies described above; the technical solution used in the present invention is: a kind of temperature and pressure compound sensor; comprise elastic body, cover dielectric film, diaphragm on the elastic body; being provided with in the strain regions at elastic body center goes between by electrode connects strain resistor into Wheatstone bridge, it is characterized in that being provided with the thermal resistance that is connected with contact conductor in the non-strain regions of elastomeric perimeter.
As preferred version, what described strain resistor adopted is alloy firm resistance; What thermal resistance adopted is platinum resistance thermometer sensor.
Principle of work of the present invention is, described temperature and pressure compound sensor is provided with thermal resistance and strain resistor by the mode of ion sputtering and ion etching on same metallic elastic body, realize the synchronism detection of temperature and pressure, wherein the strain resistor preparation is in the strain regions of metallic elastic body, realize the test of pressure, thermal resistance then prepares in the non-strain regions of metallic elastic body, realize the test of temperature signal, the influence of signal is not stressed, by the processing of circuit, obtain the needed standard signal of user at last.
The present invention is a kind of temperature and pressure compound sensor of realize temperature and pressure signal time test, can finish the test of pressure and temperature signal simultaneously, and its pressure signal can carry out the test of gauge pressure and absolute pressure.It is simple in structure, and volume is little, and is easy to use.
Description of drawings
Fig. 1 distribution of resistance figure of the present invention;
Fig. 2 structural representation of the present invention;
In above-mentioned accompanying drawing,
1-strain resistor 2-strain regions; The non-strain regions of 3-; The 4-electrode;
The 5-thermal resistance; The 6-diaphragm; The 7-dielectric film; The 8-elastic body;
Embodiment
At first determine suitable metallic elastic body, comprise elastomeric volume size and diaphragm thickness etc. according to test environment.Mode by ion sputtering is preparing one deck dielectric film 7 on metallic elastic body 8 again, guarantees the insulating property of chip; Wherein in the strain regions 2 at metallic elastic body center, alloy firm resistance is set as strain resistor 1, when diaphragm applied force is out of shape, sheet resistance generation respective change.And in the non-strain regions 3 of metallic elastic body 8 peripheries, be provided with platinum resistance thermometer sensor, 5 as metal fever resistance, and when variation of ambient temperature,, heat is conducted to platinum resistance thermometer sensor, 5 by the conduction of heat of elastic body 8, make resistance that respective change also take place; Finish temperature test.On alloy firm resistance and platinum resistance thermometer sensor, 5, prepare layer protecting film 6 at last; resistance is formed protection; on diaphragm 6, make the lead-in wire electrode at last and go between, strain resistor 1 is formed Wheatstone bridge, obtain electric signal with the linear variation of pressure and temperature signal by electrode 4.
The testing range of the described temperature and pressure compound sensor of present embodiment is optional between 0 ~ 60MPa; The test specification of temperature signal is-55 ℃ ~ 200 ℃, and both measuring accuracy height are 0.2%.
Claims (3)
1, a kind of temperature and pressure compound sensor; comprise elastic body, cover dielectric film and diaphragm on the elastic body; in the strain regions at elastic body center, be provided with by contact conductor and connect strain resistor, it is characterized in that in the non-strain regions of elastomeric perimeter, being provided with the thermal resistance that is connected with contact conductor into Wheatstone bridge.
2, according to the described temperature and pressure compound sensor of claim 1, what it is characterized in that described strain resistor employing is alloy firm resistance.
3, according to claim 1,2 described temperature and pressure compound sensors, what it is characterized in that described thermal resistance employing is platinum resistance thermometer sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910042536A CN101526404A (en) | 2009-01-19 | 2009-01-19 | Temperature and pressure compound sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910042536A CN101526404A (en) | 2009-01-19 | 2009-01-19 | Temperature and pressure compound sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101526404A true CN101526404A (en) | 2009-09-09 |
Family
ID=41094391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910042536A Pending CN101526404A (en) | 2009-01-19 | 2009-01-19 | Temperature and pressure compound sensor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101526404A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102221429A (en) * | 2011-06-16 | 2011-10-19 | 沈阳市传感技术研究所 | High-temperature pressure and temperature compounded sensor and preparation method thereof |
CN102564678A (en) * | 2010-12-14 | 2012-07-11 | 联创汽车电子有限公司 | High-pressure common-rail pressure sensor |
CN102815174A (en) * | 2011-06-07 | 2012-12-12 | 无锡华润安盛科技有限公司 | Pressure sensor, automobile tyre pressure monitoring system, and pressure sensor manufacturing method |
CN107014438A (en) * | 2017-04-24 | 2017-08-04 | 西北工业大学 | High temperature high pressure liquid pressure, sensor for measuring temperature based on ceramic package |
KR20180051117A (en) * | 2016-11-08 | 2018-05-16 | 암페놀센싱코리아 유한회사 | All-in-one complex sensor measuring pressure and temperature |
CN112213028A (en) * | 2020-10-13 | 2021-01-12 | 北京航天发射技术研究所 | Device and method for identifying absolute gauge pressure sensor |
WO2022056850A1 (en) * | 2020-09-18 | 2022-03-24 | 深圳纽迪瑞科技开发有限公司 | Temperature and pressure sensor and electronic device |
-
2009
- 2009-01-19 CN CN200910042536A patent/CN101526404A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102564678A (en) * | 2010-12-14 | 2012-07-11 | 联创汽车电子有限公司 | High-pressure common-rail pressure sensor |
CN102815174A (en) * | 2011-06-07 | 2012-12-12 | 无锡华润安盛科技有限公司 | Pressure sensor, automobile tyre pressure monitoring system, and pressure sensor manufacturing method |
CN102221429A (en) * | 2011-06-16 | 2011-10-19 | 沈阳市传感技术研究所 | High-temperature pressure and temperature compounded sensor and preparation method thereof |
CN102221429B (en) * | 2011-06-16 | 2013-01-02 | 沈阳市传感技术研究所 | High-temperature pressure and temperature compounded sensor and preparation method thereof |
KR20180051117A (en) * | 2016-11-08 | 2018-05-16 | 암페놀센싱코리아 유한회사 | All-in-one complex sensor measuring pressure and temperature |
KR101889309B1 (en) * | 2016-11-08 | 2018-08-20 | 암페놀센싱코리아 유한회사 | All-in-one complex sensor measuring pressure and temperature |
CN107014438A (en) * | 2017-04-24 | 2017-08-04 | 西北工业大学 | High temperature high pressure liquid pressure, sensor for measuring temperature based on ceramic package |
CN107014438B (en) * | 2017-04-24 | 2019-05-10 | 西北工业大学 | High temperature high pressure liquid pressure based on ceramic package, sensor for measuring temperature |
WO2022056850A1 (en) * | 2020-09-18 | 2022-03-24 | 深圳纽迪瑞科技开发有限公司 | Temperature and pressure sensor and electronic device |
CN112213028A (en) * | 2020-10-13 | 2021-01-12 | 北京航天发射技术研究所 | Device and method for identifying absolute gauge pressure sensor |
CN112213028B (en) * | 2020-10-13 | 2022-04-15 | 北京航天发射技术研究所 | Device and method for identifying absolute gauge pressure sensor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101526404A (en) | Temperature and pressure compound sensor | |
CN105466626B (en) | Diaphragm pressure sensor and its manufacturing method | |
CN103308223B (en) | Device and method for testing wall shear stress based on flexible heat-sensitive sensors | |
CN205785644U (en) | MEMS minute-pressure pressure transducer | |
CN202304895U (en) | Sputtered film chip for realizing simultaneous test of temperature and pressure signals | |
EP3073237B1 (en) | Pressure sensor | |
AU2003279271A1 (en) | Apparatus and methods for heat loss pressure measurement | |
CN204214475U (en) | A kind of prosthetic hand Wearable flexible touch sensation sensor and sense of touch pick-up unit thereof | |
CN104406627A (en) | Wearable flexible touch sensor of artificial hand and touch detection system thereof | |
CN110736421A (en) | Thin film strain gauge for elastomer strain measurement and preparation method thereof | |
JP2012013616A (en) | Semiconductor mechanical quantity sensor | |
CN207395944U (en) | A kind of one-piece type sensor of new construction pressure and temp | |
CN109238525A (en) | Metallic film type pressure-temperature compound sensor and preparation method thereof | |
CN113175948A (en) | Flexible integrated sensor and method for simultaneously measuring temperature, pressure and medium | |
KR102179016B1 (en) | Loadcell With Semiconductor Strain Gauge | |
CN205138699U (en) | Wainscot formula is drawn to press and is turned round special sensor | |
US11976994B2 (en) | Sensor for detecting pressure, filling level, density, temperature, mass and/or flow rate including nanowires arranged on coupling section | |
JPS5844323A (en) | Pressure sensor | |
CN110108751A (en) | A kind of touch sensor and measurement method of measurable thermal conductivity and thermal diffusivity | |
CN102052985B (en) | MEMS cylinder-type high-temperature and superhigh-pressure resistant sensor | |
CN211060824U (en) | Flexible temperature and strain sensor | |
CN109994596A (en) | A kind of high-performance wide-range band temperature sensitive type film chip varistor | |
CN208206352U (en) | A kind of three-dimensional force flexible sensor | |
CN207816492U (en) | A kind of pressure resistance type ceramics tension sensor | |
RU2391641C1 (en) | Pressure sensor of strain gauge with thin-film nano- and microelectromechanical system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090909 |