CN101497150A - 激光切割装置 - Google Patents
激光切割装置 Download PDFInfo
- Publication number
- CN101497150A CN101497150A CNA2008103003167A CN200810300316A CN101497150A CN 101497150 A CN101497150 A CN 101497150A CN A2008103003167 A CNA2008103003167 A CN A2008103003167A CN 200810300316 A CN200810300316 A CN 200810300316A CN 101497150 A CN101497150 A CN 101497150A
- Authority
- CN
- China
- Prior art keywords
- lens barrel
- cutting device
- black assembly
- gyro black
- rotor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (10)
- 【权利要求1】一种激光切割装置,其包括一个激光源、一个镜筒及一个喷头,该激光源发出的激光束经镜筒聚焦后出射,其特征在于:该激光切割装置还包括一个第一回转组件及一个第二回转组件,该第一回转组件与第二回转组件相对激光源分别转动;该第一回转组件与镜筒相连并带动镜筒旋转,以使从镜筒出射的激光束绕其中心旋转;该喷头连接于该第二回转组件上并可随第二回转组件转动。
- 【权利要求2】如权利要求1所述的激光切割装置,其特征在于:该第一回转组件包括一个第一套筒,其套设于该镜筒上,且该第一套筒上绕设有多匝线圈,该镜筒由导电材料制成,该多匝线圈通电后可使镜筒旋转。
- 【权利要求3】如权利要求1所述的激光切割装置,其特征在于:该第一回转组件包括一个第一转子及一个第一套筒,该第一转子由导电材料制成,其套设于镜筒上并与镜筒固定连接,该第一套筒套设于该第一转子上;该第一套筒上绕设有多匝线圈,该多匝线圈通电后可使第一转子旋转,从而带动镜筒旋转。
- 【权利要求4】如权利要求1所述的激光切割装置,其特征在于:该第二回转组件包括一个第二转子及一个第二套筒,该第二套筒套设于第二转子上;该第二转子由导电材料制成,该第二套筒上绕设有多匝线圈,该多匝线圈通电后可使第二转子旋转,以带动喷头旋转。
- 【权利要求5】如权利要求4所述的激光切割装置,其特征在于:该第二转子为圆环形,其套设于镜筒上并可相对镜筒转动。
- 【权利要求6】如权利要求5所述的激光切割装置,其特征在于:该第二回转组件还包括一个圆环形的连接件,其与第二转子固定连接,该喷头固设于该连接件上。
- 【权利要求7】如权利要求6所述的激光切割装置,其特征在于:该连接件的侧壁上开设有三个环形槽,该第二回转组件还包括两个O形环;该两个O形环分别套设于两端的环形槽中;该连接件上还开设有一个通道,其两端分别与中间的环形槽及喷头相连通。
- 【权利要求8】如权利要求7所述的激光切割装置,其特征在于:该第二套筒上开设有与连接件上的中间的环形槽相连通的通孔。
- 【权利要求9】如权利要求8所述的激光切割装置,其特征在于:该喷头连接于该连接件的底端,其包括一个与镜筒轴向平行的杆状部及由该杆状部的末端垂直该杆状部朝向镜筒延伸形成的延伸部;该喷头内开设有通道,该通道的一端与连接件上的通道相通,另一端连接有一个喷嘴。
- 【权利要求10】一种激光切割装置,其包括一个激光源、一个镜筒、一个喷头及一个回转组件,该激光源发出的激光束经镜筒聚焦后投射于待切割物上进行加热,该喷头用于喷出冷却物质流对待切割物进行冷却,其特征在于:该喷头连接于该回转组件上并可随该回转组件转动,从而使喷头喷出的冷却物质流始终位于待切割物的预定切割曲线上。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810300316A CN101497150B (zh) | 2008-02-01 | 2008-02-01 | 激光切割装置 |
US12/131,048 US8053703B2 (en) | 2008-02-01 | 2008-05-31 | Laser cutting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810300316A CN101497150B (zh) | 2008-02-01 | 2008-02-01 | 激光切割装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101497150A true CN101497150A (zh) | 2009-08-05 |
CN101497150B CN101497150B (zh) | 2012-10-10 |
Family
ID=40930650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810300316A Active CN101497150B (zh) | 2008-02-01 | 2008-02-01 | 激光切割装置 |
Country Status (2)
Country | Link |
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US (1) | US8053703B2 (zh) |
CN (1) | CN101497150B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110504616A (zh) * | 2019-09-04 | 2019-11-26 | 广东国志激光技术有限公司 | 光纤激光准直输出装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102596830A (zh) * | 2009-08-28 | 2012-07-18 | 康宁股份有限公司 | 利用激光从化学强化玻璃基板切割出制品的方法 |
JP2015515431A (ja) * | 2012-02-08 | 2015-05-28 | コーニング インコーポレイテッド | 担体付のフレキシブルガラスの処理 |
CN109794648B (zh) * | 2019-03-20 | 2023-08-18 | 广东电网有限责任公司 | 一种用于破除配电箱预置孔的破除组件 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4303824A (en) * | 1980-05-12 | 1981-12-01 | Gte Automatic Electric Laboratories, Inc. | Method and apparatus protecting a lens from airborne particulates |
DK160136C (da) * | 1986-09-01 | 1991-07-08 | Aga Ab | Dyse til laserbearbejdning |
US5021704A (en) * | 1990-02-21 | 1991-06-04 | Fusion Systems Corporation | Method and apparatus for cooling electrodeless lamps |
DE9013943U1 (de) * | 1990-10-06 | 1991-01-03 | Trumpf GmbH & Co, 7257 Ditzingen | Laserdüse |
US5422899A (en) * | 1994-05-10 | 1995-06-06 | Premier Laser Systems, Inc. | High repetition rate mid-infrared laser |
US7616986B2 (en) * | 2001-05-07 | 2009-11-10 | University Of Washington | Optical fiber scanner for performing multimodal optical imaging |
JP3823108B2 (ja) * | 2001-08-10 | 2006-09-20 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の面取り方法 |
KR100794284B1 (ko) * | 2001-09-29 | 2008-01-11 | 삼성전자주식회사 | 비금속 기판 절단 방법 |
US20040094526A1 (en) * | 2002-11-15 | 2004-05-20 | Mccoy Edward D. | Cutting laser beam nozzle assembly |
KR20050082602A (ko) | 2004-02-19 | 2005-08-24 | 엘지전자 주식회사 | 복수의 렌즈가 구비된 광픽업 장치 |
JP4722054B2 (ja) * | 2004-10-25 | 2011-07-13 | 三星ダイヤモンド工業株式会社 | クラック形成方法およびクラック形成装置 |
DE102005027800A1 (de) | 2005-06-13 | 2006-12-14 | Jenoptik Automatisierungstechnik Gmbh | Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser |
JP4763389B2 (ja) * | 2005-09-05 | 2011-08-31 | 株式会社ディスコ | 切削工具 |
-
2008
- 2008-02-01 CN CN200810300316A patent/CN101497150B/zh active Active
- 2008-05-31 US US12/131,048 patent/US8053703B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110504616A (zh) * | 2019-09-04 | 2019-11-26 | 广东国志激光技术有限公司 | 光纤激光准直输出装置 |
Also Published As
Publication number | Publication date |
---|---|
US8053703B2 (en) | 2011-11-08 |
CN101497150B (zh) | 2012-10-10 |
US20090194517A1 (en) | 2009-08-06 |
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C06 | Publication | ||
PB01 | Publication | ||
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C14 | Grant of patent or utility model | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20180419 Address after: Guangdong Shenzhen Guanlan Foxconn Hong Guan Science Park B plant 5 buildings C09 building 4 stories, C07 2, C08 3 3, 4 C04, 1 floor. Patentee after: SHENZHENSHI YUZHAN PRECISION TECHNOLOGY Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. Patentee before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518109 Foxconn H5 plant 101, No. 2, Donghuan 2nd Road, Fukang community, Longhua street, Longhua District, Shenzhen, Guangdong Province; plant 5, building C09, 4th floor, building C07, 2nd floor, building C08, 3rd floor, 4th floor, building C04, zone B, Foxconn Hongguan science and Technology Park, Fucheng Dasan community, Guanlan street, Guangdong Province Patentee after: Fulian Yuzhan Technology (Shenzhen) Co.,Ltd. Address before: 518109 Guangzhou Guanlan Foxconn Hongguan Science Park B workshop 5 C09 buildings 4 floors, C07 buildings 2 floors, C08 buildings 3 floors 4 floors, C04 buildings 1 floors Patentee before: SHENZHENSHI YUZHAN PRECISION TECHNOLOGY Co.,Ltd. |