CN101494213A - 元件安装用基板、半导体组件及其制造方法及便携式设备 - Google Patents

元件安装用基板、半导体组件及其制造方法及便携式设备 Download PDF

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Publication number
CN101494213A
CN101494213A CN 200810191061 CN200810191061A CN101494213A CN 101494213 A CN101494213 A CN 101494213A CN 200810191061 CN200810191061 CN 200810191061 CN 200810191061 A CN200810191061 A CN 200810191061A CN 101494213 A CN101494213 A CN 101494213A
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CN
China
Prior art keywords
electrode
insulating resin
resin layer
projected electrode
projected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200810191061
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English (en)
Chinese (zh)
Inventor
斋藤浩一
冈山芳央
高野洋
中里真弓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of CN101494213A publication Critical patent/CN101494213A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/116—Manufacturing methods by patterning a pre-deposited material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

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  • Wire Bonding (AREA)
CN 200810191061 2007-12-27 2008-12-26 元件安装用基板、半导体组件及其制造方法及便携式设备 Pending CN101494213A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP335819/07 2007-12-27
JP2007335819A JP2009158751A (ja) 2007-12-27 2007-12-27 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器
JP091664/08 2008-03-31

Publications (1)

Publication Number Publication Date
CN101494213A true CN101494213A (zh) 2009-07-29

Family

ID=40924721

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200810191061 Pending CN101494213A (zh) 2007-12-27 2008-12-26 元件安装用基板、半导体组件及其制造方法及便携式设备

Country Status (2)

Country Link
JP (1) JP2009158751A (ja)
CN (1) CN101494213A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473690A (zh) * 2009-08-18 2012-05-23 日本电气株式会社 具有屏蔽层和电容耦合芯片侧电源端子的半导体器件

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010087229A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247483A (ja) * 2003-02-13 2004-09-02 Fujitsu Ltd 回路基板の製造方法
JP2004349361A (ja) * 2003-05-21 2004-12-09 Casio Comput Co Ltd 半導体装置およびその製造方法
JP2005197532A (ja) * 2004-01-08 2005-07-21 Nippon Mektron Ltd 多層回路基板およびその製造方法ならびに回路基材
JP4772424B2 (ja) * 2005-08-23 2011-09-14 日本メクトロン株式会社 回路基板の製造方法
JP2007123798A (ja) * 2005-09-28 2007-05-17 Kyocera Corp 配線基板および電子装置
JP4568215B2 (ja) * 2005-11-30 2010-10-27 三洋電機株式会社 回路装置および回路装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473690A (zh) * 2009-08-18 2012-05-23 日本电气株式会社 具有屏蔽层和电容耦合芯片侧电源端子的半导体器件
CN102473690B (zh) * 2009-08-18 2014-10-08 日本电气株式会社 具有屏蔽层和电容耦合芯片侧电源端子的半导体器件

Also Published As

Publication number Publication date
JP2009158751A (ja) 2009-07-16

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Application publication date: 20090729