CN101494213A - 元件安装用基板、半导体组件及其制造方法及便携式设备 - Google Patents
元件安装用基板、半导体组件及其制造方法及便携式设备 Download PDFInfo
- Publication number
- CN101494213A CN101494213A CN 200810191061 CN200810191061A CN101494213A CN 101494213 A CN101494213 A CN 101494213A CN 200810191061 CN200810191061 CN 200810191061 CN 200810191061 A CN200810191061 A CN 200810191061A CN 101494213 A CN101494213 A CN 101494213A
- Authority
- CN
- China
- Prior art keywords
- electrode
- insulating resin
- resin layer
- projected electrode
- projected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/116—Manufacturing methods by patterning a pre-deposited material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP335819/07 | 2007-12-27 | ||
JP2007335819A JP2009158751A (ja) | 2007-12-27 | 2007-12-27 | 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器 |
JP091664/08 | 2008-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101494213A true CN101494213A (zh) | 2009-07-29 |
Family
ID=40924721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200810191061 Pending CN101494213A (zh) | 2007-12-27 | 2008-12-26 | 元件安装用基板、半导体组件及其制造方法及便携式设备 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2009158751A (ja) |
CN (1) | CN101494213A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102473690A (zh) * | 2009-08-18 | 2012-05-23 | 日本电气株式会社 | 具有屏蔽层和电容耦合芯片侧电源端子的半导体器件 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010087229A (ja) * | 2008-09-30 | 2010-04-15 | Sanyo Electric Co Ltd | 半導体モジュール、半導体モジュールの製造方法および携帯機器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004247483A (ja) * | 2003-02-13 | 2004-09-02 | Fujitsu Ltd | 回路基板の製造方法 |
JP2004349361A (ja) * | 2003-05-21 | 2004-12-09 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
JP2005197532A (ja) * | 2004-01-08 | 2005-07-21 | Nippon Mektron Ltd | 多層回路基板およびその製造方法ならびに回路基材 |
JP4772424B2 (ja) * | 2005-08-23 | 2011-09-14 | 日本メクトロン株式会社 | 回路基板の製造方法 |
JP2007123798A (ja) * | 2005-09-28 | 2007-05-17 | Kyocera Corp | 配線基板および電子装置 |
JP4568215B2 (ja) * | 2005-11-30 | 2010-10-27 | 三洋電機株式会社 | 回路装置および回路装置の製造方法 |
-
2007
- 2007-12-27 JP JP2007335819A patent/JP2009158751A/ja active Pending
-
2008
- 2008-12-26 CN CN 200810191061 patent/CN101494213A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102473690A (zh) * | 2009-08-18 | 2012-05-23 | 日本电气株式会社 | 具有屏蔽层和电容耦合芯片侧电源端子的半导体器件 |
CN102473690B (zh) * | 2009-08-18 | 2014-10-08 | 日本电气株式会社 | 具有屏蔽层和电容耦合芯片侧电源端子的半导体器件 |
Also Published As
Publication number | Publication date |
---|---|
JP2009158751A (ja) | 2009-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20090729 |