CN101494142A - Novel thick film sheet type fuse and method of manufacturing the same - Google Patents
Novel thick film sheet type fuse and method of manufacturing the same Download PDFInfo
- Publication number
- CN101494142A CN101494142A CNA2009101191575A CN200910119157A CN101494142A CN 101494142 A CN101494142 A CN 101494142A CN A2009101191575 A CNA2009101191575 A CN A2009101191575A CN 200910119157 A CN200910119157 A CN 200910119157A CN 101494142 A CN101494142 A CN 101494142A
- Authority
- CN
- China
- Prior art keywords
- fuse
- electrode
- ceramic substrate
- link
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Fuses (AREA)
Abstract
The invention provides a production method of a novel thick-film fuse and a product thereof. The method includes the following steps: a ceramic substrate of which the essential components are MgO and Al2O3 is provided; a fuse-link metal wire of signal component and an electrode are formed on the front surface of the ceramic substrate; and a strip insulating protective layer completely covering the fuse-link metal wire is also formed on the front surface of the ceramic substrate; a precise cutting method is used for slitting the ceramic substrate into smallest units; conductive paste is encapsulated on the electrode to form a complete internal electrode of a termination point; and electric plating is carried out to each unit to form a termination electrode covering the internal electrode of the termination point. In the method, key components (the fuse link, the electrode and the protective layer) of the fuse can be produced respectively with only one step so as to effectively shorten production processing procedures and reduce production cost. The overall performance of the product made by the method is enhanced compared with the existing fuses.
Description
Technical field
The present invention relates to the fuse technical field, refer in particular to a kind of novel thick film sheet type fuse and manufacture method thereof.
Background technology
Minitype paster fuse is owing to current progressing greatly day by day of electronic industry miniaturization is widely used in the various wiring boards.Existing various SMD fuse; its fuse-link layer is to generate with the thin-film technique sputter; the film blade fuse comprises a rectangle insulating substrate; the termination electrode that forms required metal fuse-link layer in the above and be connected with the fuse-link layer, and the protective layer that is covered with the fuse-link layer that forms in the above in order to protect the fuse-link layer in the formation of fuse-link layer two ends.There is following deficiency in the blade fuse manufacture method of current thin film technology manufacturing:
The manufacturing of key components such as fuse-link, electrode and protective layer all needs a plurality of steps to finish, and complicated operation relates to kinds of processes simultaneously, and material therefor and cost of labor are more, and manufacturing cost is high.
The body portion of fuse adopts pure Al2O3 ceramic substrate, its thermal conductivity height, and heat radiation easily can't be in the short time heat build-up with the fuse metal silk.Fuse-link partly adopts copper-tin metal silk in the industry commonly used, and the fuse reaction mechanism of copper-tin metal silk structure is: the copper and tin reaction forms the lower signal bronze of fusing point under the situation of overload, and the final total overall reaction wire that finishes disconnects.Its weakness is, under the influence of the clutter/surge of circuit, copper and tin constantly carries out faint alloying reaction, finally causes wire to disconnect in advance.That is show as this fuse structure and can not bear the 100k surge test; Cause the overall performance of fuse to be short of to some extent.
Summary of the invention
Main purpose of the present invention is to provide the manufacture method of the thick film sheet type fuse that a kind of manufacturing process shortens, cost is reduced.
A kind of novel thick film sheet type fuse comprises ceramic substrate, is fixed in fuse-link wire and electrode on the ceramic substrate, and wherein, the main component of described ceramic substrate is MgO and Al
2O
3, described fuse-link composition wiry is Ag, and described fuse-link wire covers by glass dielectric layer, and described glass dielectric layer cover part electrode.
Thick film sheet type fuse of the present invention has used magnesium oxide (MgO) and alundum (Al (Al
2O
3) the composite ceramics substrate, its with the tradition used pure Al
2O
3Ceramics is compared, and has more suitably characteristic, sees following table for details:
| Characteristic | Pure alundum (Al (Al 2O 3) ceramics | Magnesium oxide (MgO) and alundum (Al (Al 2O 3) compound ceramics |
| Bulk density (kg/m 3) | 3.7x10 3 | 2.8x10 3 |
| Vickers hardness (GPa) | 13.7 | 5.8 |
| Flexural strength (MPa) | 350 | 190 |
| Thermal conductivity (W/ (m*K), 20 ℃) | 24 | 2 |
| Specific heat capacity (J/ (kg*K)) | 0.78x10 3 | 0.75x10 3 |
| Dielectric strength (V/m) | 15x10 6 | 18x10 6 |
| Dielectriclossfactor (x10 -4) | 38 | 108 |
The characteristic of most critical is thermal conductivity, and lower thermal conductivity allows fuse-link wire a large amount of heat of accumulation under the situation of overload, and self fuses then, and circuit safety is disconnected.
Used in the present invention is the fuse-link wire of single component (silver), and stronger surge tolerance is provided.Its reaction mechanism is: compare with copper-tin metal silk commonly used in the industry, sharply accumulate a large amount of heat in the following short time of overload situations self is fused; When normal the use, the shortage of heat that clutter/surge produced of circuit is to disconnect fuse-link, and this heat is distributed soon, and the fuse-link wire produces and reply original state without any reaction.
Strip glass insulation protective layer used herein has covered the fuse-link wire fully, and has partly covered electrode, and the part exposed electrodes is soaked in the envelope operation on follow-up plane provides more contact area, has guaranteed good contact.
Another object of the present invention is to provide a kind of manufacture method of novel thick film sheet type fuse, and it in turn includes the following steps:
A), provide magnesium oxide (MgO) and alundum (Al (Al
2O
3) be the ceramic substrate of main component;
B), form the fuse-link wire of single component in the front of ceramic substrate;
C), at the positive surface forming electrode of ceramic substrate;
D), cover fuse-link strip insulating protective layer wiry fully in the formation of the front of ceramic substrate;
E), with precise cutting method ceramic substrate is cut into minimum unit;
F), electrocondution slurry is encapsulated on the electrode to form electrode in the complete termination;
G), form the termination electrode that covers electrode in the broken end by electroplating in each unit.
At step b) and c) between also comprise the step of sintered ceramic substrate.
In step c), adjust fuse-link resistance wiry by adjusting electrode spacing.
At step c) and d) between also comprise the step of sintered ceramic substrate.
In step d), insulation protection layer segment coated electrode guarantees that electrode has more closely connection follow-up soaking in the envelope process.
At step d) and e) between the step that also comprises sintering or solidify ceramic substrate.
In step f), the mode of soaking envelope by the plane forms electrode in the termination respectively at the two ends of each minimum unit.
At step f) and g) between the step that also comprises sintering or solidify ceramic substrate.
In step g), termination electrode is formed by two-layer coating, and two-layer coating is respectively nickel metal film and tin metal film from the inside to the outside.
The invention has the beneficial effects as follows: in the manufacture method of thick film sheet type fuse; the fuse key component: fuse-link, electrode and protective layer only need a step to finish respectively; need not the correction of laser resistance, shortened procedure for producing effectively and reduced manufacturing cost.Adopt the fuse of this method manufacturing, used the composite ceramics substrate of magnesium oxide and alundum (Al, and the fuse-link wire of single component, having the strip insulating protective layer and obtain accurate cutting, overall performance is significantly promoted.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the schematic flow sheet of a kind of embodiment of manufacture method of the present invention;
Fig. 2 is the structural representation of thick-film type fuse goods of the present invention.
Embodiment
The present invention is further detailed explanation introduces below in conjunction with embodiment:
First embodiment
With reference to shown in Figure 1, a kind of manufacture method of novel thick film sheet type fuse, it in turn includes the following steps:
Magnesium oxide (MgO) and alundum (Al (Al are provided
2O
3) be the ceramic substrate of main component.Possess lower thermal conductivity, allow fuse-link wire a large amount of heat of accumulation under the situation of overload, self fuses then, and circuit safety is disconnected.
Form the fuse-link wire of single component in the front of ceramic substrate.With respect to copper-tin metal silk structure commonly used in the industry, single component stronger surge tolerance is provided.The weakness of the fuse of copper-tin metal silk structure is, under the influence of the clutter/surge of circuit, copper and tin constantly carries out faint alloying reaction, finally causes wire to disconnect in advance.That is show as this fuse structure and can not bear the 100k surge test; Used in the present invention is the fuse-link wire of single component (silver), and its reaction mechanism is: match with above-mentioned first, sharply accumulate a large amount of heat in the following short time of overload situations self is fused; When normal the use, the shortage of heat that clutter/surge produced of circuit is to disconnect fuse-link, and this heat is distributed soon, and the fuse-link wire produces and reply original state without any reaction.
Positive surface forming electrode at ceramic substrate.
Cover fuse-link strip insulating protective layer wiry fully in the formation of the front of ceramic substrate.This strip insulating protective layer has covered the fuse-link wire fully, and has partly covered electrode, and the part exposed electrodes is soaked in the envelope operation on follow-up plane provides more contact area, has guaranteed good contact.
With precise cutting method ceramic substrate is cut into minimum unit, each unit comprises one and is positioned at middle fuse-link wire, and all there is the part exposed electrodes at two ends.Substrate unit after the accurate cutting, the edge is smooth, does not have ceramic peak, is ready-portioned in advance ceramics, directly breaks into elementary cell then into two with one's hands that this technology causes porcelain grain bottom damaged easily and use in the industry more at present, and ceramic peak is more.And the present invention uses is the ceramics of not dividing in advance, the method for using the high-precision diamond blade to cut at a high speed then, and otch does not smoothly have peak.
Electrocondution slurry is encapsulated on the electrode to form electrode in the complete termination.
Form the termination electrode that covers electrode in the broken end by electroplating in each unit.
In manufacture method of the present invention, the fuse key component: fuse-link, electrode and protective layer only need a step to finish respectively, need not the correction of laser resistance, have shortened procedure for producing effectively and have reduced manufacturing cost.
The thick film sheet type fuse that obtains according to above-mentioned manufacture method, with reference to shown in Figure 2, constitute matrix by ceramic substrate 2, metallic film between the ceramic substrate 2 is as interior electrode 4, two ends of ceramic substrate 2 are provided with termination electrode 1, ceramic substrate 2 bottom faces are provided with metal fuse-link 3, are provided with glassy layer 5 below the metal fuse-link 3.The body portion of this fuse adopts MgO and Al
2O
3Be the composite ceramics substrate of main component, fuse-link partly adopts the fuse-link wire of single component (silver), thereby overall performance improves greatly.
Second embodiment
On the basis of first embodiment, increase the part intermediate steps, it in turn includes the following steps: magnesium oxide (MgO) and alundum (Al (Al are provided
2O
3) be the ceramic substrate of main component; Form the fuse-link wire of single component in the front of ceramic substrate; The sintered ceramic substrate; At the positive surface forming electrode of ceramic substrate, adjust fuse-link resistance wiry by adjusting electrode spacing; The sintered ceramic substrate; Cover fuse-link strip insulating protective layer wiry fully in the formation of the front of ceramic substrate, insulation protection layer segment coated electrode guarantees that electrode has more closely connection follow-up soaking in the envelope process; Sintering or curing ceramic substrate; With precise cutting method ceramic substrate is cut into minimum unit; Electrocondution slurry is encapsulated on the electrode to form electrode in the complete termination, that is: the plane mode of soaking envelope forms electrode in the termination respectively at the two ends of each minimum unit; Sintering or curing ceramic substrate; Form the termination electrode that covers electrode in the broken end by electroplating in each unit, termination electrode is formed by two-layer coating, and two-layer coating is respectively nickel metal film and tin metal film from the inside to the outside.
Above-described only is preferred implementation of the present invention, should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not break away from the invention design, can also make some distortion and improvement, and these all belong to protection scope of the present invention.
Claims (10)
1, a kind of novel thick film sheet type fuse comprises ceramic substrate, is fixed in fuse-link wire and electrode on the ceramic substrate, and it is characterized in that: the main component of described ceramic substrate is MgO and Al
2O
3, described fuse-link composition wiry is Ag, and described fuse-link wire covers by glass dielectric layer, and described glass dielectric layer cover part electrode.
2, a kind of manufacture method of novel thick film sheet type fuse is characterized in that, it in turn includes the following steps:
A), provide magnesium oxide (MgO) and alundum (Al (Al2O3) to be the ceramic substrate of main component;
B), form the fuse-link wire of single component in the front of ceramic substrate;
C), at the positive surface forming electrode of ceramic substrate;
D), cover fuse-link strip insulating protective layer wiry fully in the formation of the front of ceramic substrate;
E), with precise cutting method ceramic substrate is cut into minimum unit;
F), electrocondution slurry is encapsulated on the electrode to form electrode in the complete termination;
G), form the termination electrode that covers electrode in the broken end by electroplating in each unit.
3, manufacture method according to claim 2 is characterized in that, at step b) and c) between also comprise the step of sintered ceramic substrate.
4, manufacture method according to claim 2 is characterized in that, in step c), adjusts fuse-link resistance wiry by adjusting electrode spacing.
5, manufacture method according to claim 2 is characterized in that, at step c) and d) between also comprise the step of sintered ceramic substrate.
6, manufacture method according to claim 2 is characterized in that, in step d), insulation protection layer segment coated electrode guarantees that electrode has more closely connection follow-up soaking in the envelope process.
7, manufacture method according to claim 2 is characterized in that, at step d) and e) between the step that also comprises sintering or solidify ceramic substrate.
8, manufacture method according to claim 2 is characterized in that, in step f), the mode of soaking envelope by the plane forms electrode in the termination respectively at the two ends of each minimum unit.
9, manufacture method according to claim 2 is characterized in that, at step f) and g) between the step that also comprises sintering or solidify ceramic substrate.
10, manufacture method according to claim 2 is characterized in that, in step g), termination electrode is formed by two-layer coating, and two-layer coating is respectively nickel metal film and tin metal film from the inside to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009101191575A CN101494142A (en) | 2009-03-05 | 2009-03-05 | Novel thick film sheet type fuse and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009101191575A CN101494142A (en) | 2009-03-05 | 2009-03-05 | Novel thick film sheet type fuse and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101494142A true CN101494142A (en) | 2009-07-29 |
Family
ID=40924670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009101191575A Pending CN101494142A (en) | 2009-03-05 | 2009-03-05 | Novel thick film sheet type fuse and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101494142A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623272A (en) * | 2012-04-25 | 2012-08-01 | 东莞市贝特电子科技股份有限公司 | Chip fuse |
| CN102623254A (en) * | 2012-04-25 | 2012-08-01 | 东莞市贝特电子科技股份有限公司 | Method for manufacturing sheet fuse |
| CN114093723A (en) * | 2021-12-08 | 2022-02-25 | 中国振华集团云科电子有限公司 | Preparation method of all-solid-state fuse |
-
2009
- 2009-03-05 CN CNA2009101191575A patent/CN101494142A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623272A (en) * | 2012-04-25 | 2012-08-01 | 东莞市贝特电子科技股份有限公司 | Chip fuse |
| CN102623254A (en) * | 2012-04-25 | 2012-08-01 | 东莞市贝特电子科技股份有限公司 | Method for manufacturing sheet fuse |
| CN114093723A (en) * | 2021-12-08 | 2022-02-25 | 中国振华集团云科电子有限公司 | Preparation method of all-solid-state fuse |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8004820B2 (en) | Ceramic electronic component, method of manufacturing the same, and collective component | |
| US9136057B2 (en) | Ceramic electronic component, method of manufacturing the same, and collective component | |
| US20100289612A1 (en) | Current protection device and the method for forming the same | |
| US20140118100A1 (en) | Laminated coil component | |
| CN103219151A (en) | Multilayer ceramic electronic component and fabrication method thereof | |
| US9456494B2 (en) | Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate | |
| CN103035404A (en) | Multilayer ceramic electronic component and method of fabricating the same | |
| CN102316665A (en) | Flexible circuit board and manufacture method thereof | |
| CN101494142A (en) | Novel thick film sheet type fuse and method of manufacturing the same | |
| CN205609464U (en) | Fuse for overcurrent protection | |
| US10193332B2 (en) | ESD protection device | |
| JP4524876B2 (en) | Conductive paste and multilayer ceramic substrate | |
| KR100807217B1 (en) | Ceramic component and Method for the same | |
| CN101593644B (en) | Miniature surface-adhered type fuse | |
| SE519461C2 (en) | Electronic component and radio terminal utilizing this | |
| JP7023890B2 (en) | Method for manufacturing high-conductivity base metal electrodes and alloy low ohm chip resistors | |
| CN101548347A (en) | Static electricity resistant component and method for manufacturing the same | |
| CN101950645A (en) | Chip overvoltage protector and manufacturing method thereof | |
| KR102021667B1 (en) | Method of fabricating highly conductive low-ohmic chip resistor having electrodes of base metal or base-metal alloy | |
| JP3740374B2 (en) | Multiple wiring board | |
| KR101148259B1 (en) | Chip resistor device and preparing method of the same | |
| CN214847970U (en) | Surface-mounted electronic element with novel film electrode pattern | |
| JP4161696B2 (en) | Chip-type surge absorber and manufacturing method thereof | |
| US20240153709A1 (en) | Ceramic electronic component | |
| JP2001135501A (en) | Chip type thermistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20090729 |