CN101466515B - Resin composition and method for mould clean and demould recovery - Google Patents
Resin composition and method for mould clean and demould recovery Download PDFInfo
- Publication number
- CN101466515B CN101466515B CN2007800214719A CN200780021471A CN101466515B CN 101466515 B CN101466515 B CN 101466515B CN 2007800214719 A CN2007800214719 A CN 2007800214719A CN 200780021471 A CN200780021471 A CN 200780021471A CN 101466515 B CN101466515 B CN 101466515B
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- mold
- resin combination
- cleaning
- releasing agent
- mold releasability
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2061/00—Use of condensation polymers of aldehydes or ketones or derivatives thereof, as moulding material
- B29K2061/20—Aminoplasts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Detergent Compositions (AREA)
Abstract
A resin composition for cleaning molds and recovering the release properties of molds which can remove not only stains of a cavity, a runner and a gate but also stains of an air vent and a parting area of a mold and can impart release properties to the surface of a mold. The composition comprises a melamine resin, at least one metal soap type mold-releasing agent, and preferably mannitol and/or a mold-releasing agent other than metal soaps. The composition is a compression-type one which has both the ability to clean a mold and the ability to recover the release properties of a mold and thus dispenses with the release properties recovering step which was to be conducted after the completion of the mold cleaning step.
Description
Technical field
The present invention relates to when the shaping of curable resin moulding material, to remove the dirt of die surface and give die surface with the compression-type cleaning mold that has cleaning property and release property concurrently of release property with and demoulding answer with resin combination and the cleaning mold and the mould answering method that use this resin combination.
Background technology
In the past; When utilizing heat-curing resins such as epoxy resin to carry out the shaping of sealing shaping things such as integrated circuit; Shaping for a long time can make the mould inside surface contaminated, if continue such progressive forming, then the surface of sealing shaping thing can be contaminated; Or sealing shaping thing is attached to mould and forming operation can't be continued, and this phenomenon is very common.Therefore, need regular cleaning mold, with the ratio of spraying for several times cleaning mold is carried out the method for cleaning mold when having proposed every hundreds of the reaction-injection mouldings of moulding material with ester moulding.
For example; In the special public clear 52-788 communique of Japan, proposed " through being that the material of main body forms when being shaped with cleaning curable resin moulding material (wherein except the amino resin moulding material) method at the dirt of die surface in order to amino resin ", and disclose the resin composition for cleaning mold that forms by amino resin, organic substrate and/or inorganic substrate, releasing agent.
In recent years, be accompanied by highly integrated, slimming, the mounted on surfaceization of integrated circuit etc. (abbreviating ICLSI as), the shape of formed products, structure are also more and more diversified, therefore make every effort to the high liquidation of semiconductor sealing material.
But, if adopt the epoxy material for sealing of high liquidation type, then at exhaust outlet resin takes place partly easily and stops up; If these obstructions take place, then gas is through variation, and resin can't flow; Thereby take place not fill and become bad at mould cavity part, so be difficult to progressive forming.For this reason, for fear of these situation, need to implement cleaning, but if adopt transmission type (transfer type) sweeping compound, then same with above-mentioned reason, resin can't proper flow, thereby is difficult to remove the resin that is jammed in exhaust outlet.
On the other hand, after the resin composition for cleaning mold cleaning, though die surface becomes totally, the releasing agent of die surface also is removed but then, therefore has the such problem of release property extreme variation of the mould that forms immediately after the cleaning.For this reason, behind the use resin composition for cleaning mold, need reply resin combination to mold releasability and form, the releasing agent that mold releasability is replied in the resin combination is transferred to die surface, replys release property.
It is that releasing agent is transferred to die surface and made mould recover the material of release property rapidly that this mold releasability is replied resin combination.In the past, replied resin combination, for example can adopt the composition that forms by compositions such as epoxy resin, phenolic resins, curing accelerator, Brazil wax and silica as mold releasability.
These mold releasabilities answer resin combinations and above-mentioned same, resin obstruction partly can't make resin flow into whole exhaust outlet for exhaust outlet, therefore is difficult in exhaust outlet and partly carries out demoulding answer.
Patent documentation 1: the special public clear 52-788 communique of Japan
Summary of the invention
The resin that the present invention is used to solve the above-mentioned exhaust outlet part that is accompanied by the high liquidation of semiconductor sealing material and produces stops up and the cleaning difficulty of the use resin composition for cleaning mold that causes is thus replied difficulty with the demoulding of using mold releasability to reply resin combination.In addition; The present invention can easily implement the cleaning and the demoulding of exhaust outlet part and reply; And be not die surface dirt cleaning back to be used mold releasability reply the existing method of resin with the 2 numerous and diverse discontinuous runnings that replenish the demoulding composition that is removed with dirt, but the compression-type cleaning mold that has cleaning property and demoulding recovery concurrently that the cleaning that can implement mould a stage and the demoulding are replied with and demoulding answer use resin combination.
The present invention is the invention of accomplishing in order to solve the problems of the technologies described above; It provides a kind of cleaning mold to use and resin combination is used in the mold releasability answer; It is characterized in that; Said resin combination is removed the dirt of die surface and is given die surface with release property when the shaping of curable resin moulding material, and it contains melmac, and contains at least a kind of metallic soap class releasing agent.
Cleaning mold of the present invention is used and the mold releasability answer preferably further contains sweet mellow wine with resin combination or/and the releasing agent beyond the metallic soap.
Cleaning mold of the present invention with and mold releasability to reply with resin combination be to have cleaning mold effect and these two effects of mold releasability answer effect concurrently; Can not only remove the dirt of die cavity, running channel, cast gate; Can also remove the dirt of the parting line zone of exhaust outlet part and mould; Particularly can easily implement the cleaning of exhaust outlet part and the compression-type resin combination that the demoulding is replied; Its cleaning mold operation and answer of use mold releasability by the use resin composition for cleaning mold that need not to carry out is in the past replied the 2 numerous and diverse discontinuous runnings that operation constitutes with the mold releasability of resin combination, and can be in the cleaning and the demoulding answer of a stage enforcement mould.
The specific embodiment
Below to cleaning mold of the present invention with and mold releasability reply and to be elaborated with resin combination.
The melmac that the present invention uses can be made through known method.
For example, to make formaldehyde and melamine crystals be 1:1～4:1 with the mol ratio, be preferably 1.5:1～3:1 reacts in the aqueous solution and makes the initial stage condensation product aqueous solution.Can be 20～60% in melamine crystals concentration, reaction temperature is to make it reaction under 70～100 ℃, alkalescent, and in 10～100 minutes, accomplishes reaction.Aldehyde composition beyond a part of available paraformaldehyde of above-mentioned formaldehyde, formaldehyde for example aliphatic aldehydes such as acetaldehyde is replaced.
Cleaning mold of the present invention with and mold releasability reply and except that melmac, also to contain metallic soap class releasing agent with resin combination.
As the example of metallic soap class releasing agent, can give an example out for example calcium stearate, zinc stearate, Zinc tetradecanoate etc.The addition of metallic soap class releasing agent with respect to melmac 100 weight portions, is preferably 0.2～1.0 weight portion, 0.4～0.8 weight portion more preferably.If the addition of metallic soap class releasing agent is not enough, then release property and the decline of cleaning property, if too much, though then release property is good, the decline of cleaning property.
Cleaning mold of the present invention with and mold releasability reply with resin combination preferably except containing melmac and metallic soap class releasing agent, also contain sweet mellow wine.Through containing sweet mellow wine, can add thermo-color keeping to reduce under the state of mold releasability property.
As sweet mellow wine, preferred D-sweet mellow wine.
When containing sweet mellow wine, preferably make proportionally count 90:10～30:70 containing of metallic soap class releasing agent and sweet mellow wine with weight ratio, be preferably 80:20～40:60 especially.If the ratio of sweet mellow wine is too much, then cleaning property variation.
As the addition of sweet mellow wine, with respect to melmac 100 weight portions, be preferably 0.2～1.0 weight portion, more preferably 0.3～0.8 weight portion.If the addition of sweet mellow wine is not enough, then there is not additive effect, if too much, though then release property is good, the decline of cleaning property.
In addition, cleaning mold of the present invention with and mold releasability reply with resin combination also preferably except containing melmac and metallic soap class releasing agent, also contain metallic soap releasing agent in addition.Through containing the releasing agent beyond the metallic soap, can under the influence of the demoulding composition in not receiving the epoxy material for sealing, bring into play mold releasability property.
As the releasing agent beyond the metallic soap, can enumerate out synthetic waxs such as ester class releasing agent, modification hydrocarbon wax or mineral oils synthetic wax such as partly-hydrolysed ester of montanic acid or macromolecule complex ester.Particularly, can preferably use Licowax OP (Clariant Japan Co., Ltd. system, the partly-hydrolysed ester of montanic acid), Loxiol G78 (Cognis Japan Co., Ltd. system, macromolecule complex ester), Licolub H-4 (ClariantJapan Co., Ltd. system, modification hydrocarbon) and Loxiol VPN881 commercially available article such as (Cognis Japan Co., Ltd. system, mineral oils synthetic waxs).As the releasing agent beyond the metallic soap, preferably at this ester class releasing agent and synthetic wax of enumerating, when the releasing agent that uses outside this enumerates, cleaning property variation sometimes.
When the releasing agent that contains beyond these metallic soaps, containing of metallic soap class releasing agent and metallic soap releasing agent in addition proportionally is preferably 90:10～30:70 in weight ratio, is preferably 80:20～40:60 especially.If the ratio of the releasing agent beyond the metallic soap is too much, then cleaning property variation.
Addition as the releasing agent beyond the metallic soap with respect to melmac 100 weight portions, is preferably 0.02～0.7 weight portion, more preferably 0.1～0.5 weight portion.If the addition of the releasing agent beyond the metallic soap is not enough, then there is not additive effect, if too much, though then release property is good, the decline of cleaning property.
Cleaning mold of the present invention with and mold releasability reply with resin combination and preferably contain paper pulp to improve the cleaning effect.As this paper pulp, can use rice straw pulp, bamboo pulp, wood pulp (softwood pulp, broad leaf tree slurry) etc., can also use in chemical pulp, the mechanical pulp any.
This paper pulp preferably with impregnation in this paper pulp as cleaning mold of the present invention with and mold releasability reply with the form (resin impregnation paper pulp) of the melmac of the essential composition of resin combination cleaning mold of the present invention with and the mold releasability answer contain in resin combination.This resin impregnation paper pulp can prepare through impregnation paper pulp and drying in the melamine formaldehyde resin aqueous solution.In addition, the part of above-mentioned paper pulp or all also can use powder paper pulp to replace can further improve flowability thus.
The size of above-mentioned paper pulp does not have particular restriction, is generally 5～1000 μ m, is preferably about 10～200 μ m.In addition,,, be generally 5～70 weight portions, be preferably 20～60 weight portions with respect to melmac 100 weight portions about the content of above-mentioned paper pulp.If the content of paper pulp is lower than 5 weight portions, then there is not additive effect, if surpass 70 weight portions, then mobile variation can not fill up each corner of mould, thereby the pollutant of mould is residual, thereby not preferred.
In addition, cleaning mold of the present invention with and mold releasability reply and also preferably to contain curing catalysts with resin combination.As curing catalysts, can enumerate out the salt of inorganic acids such as organic acids such as phthalic anhydride, oxalic acid, sulfamic acid, p-methyl benzenesulfonic acid, hydrochloric acid, sulfuric acid, these acids and triethylamine, triethanolamine, beta-dimethyl-ethylaminoethanol, 2-methyl-2-amino-1-propyl alcohol etc.About the addition of curing catalysts, with respect to melmac 100 weight portions, be generally 0.05 weight portion～1.5 weight portions, be preferably 0.1 weight portion～1 weight portion.
Cleaning mold of the present invention with and mold releasability reply with resin combination preferably contain be selected from above-mentioned paper pulp and the curing catalysts more than a kind.
In addition, can cleaning mold of the present invention with and mold releasability suitably add in addition bat wool of painted material, paper pulp such as pigment, the packing material of soft small particle diameter etc. in replying with resin combination.
Preparation cleaning mold of the present invention with and mold releasability reply when use resin combination, can adopt can be with mixed uniformly any means of other additive kinds such as melmac, metallic soap class releasing agent and sweet mellow wine, metallic soap releasing agent and paper pulp in addition.
ら い か い machine), barrel mixer etc. for example, (the Japanese original text is: can to exemplify out kneader, ribbon blender, Henschel blender, ball mill, roller muller, bruisher.
As replying the curable resin moulding material that comes the cleaning mold and the demoulding to reply with resin combination with cleaning mold usefulness of the present invention and mold releasability; For example can enumerate out epoxy resin molding material, phenolic resin molding material etc.; The preferred epoxy moulding material, particularly epoxy resin molding material is used in the semiconductor sealing.And, cleaning mold of the present invention with and mold releasability reply in any mould that uses when this curable resin moulding material automatic forming with resin combination and all can use the common mould that forms by iron, chromium etc. that is applicable to.
Through in mould, cleaning mold usefulness of the present invention and mold releasability being replied with the resin combination shaping, can remove the dirt of this die surface and give die surface with release property.Cleaning mold of the present invention uses and mold releasability to reply the molding condition preferred mold temperature of using resin combination be that 160～190 ℃, forming pressure are that 10～20MPa, hardening time are 2～3 minutes.
Embodiment
Below, enumerate embodiment etc. and illustrate in greater detail the present invention.But the invention is not restricted to these embodiment etc.
(making example 1)
With melamine 480 weight portions, formalin (37% aqueous solution) 520 weight portions and water 350 weight portion reacting by heating; Make melamine formaldehyde resin with known method; After in the melmac aqueous solution that obtains, adding paper pulp 257 weight portions and mixing; Drying under reduced pressure obtains resin content and is about 72% the melamine formaldehyde resin powder that is mixed with paper pulp (melmac impregnation paper pulp).
(making example 2)
The melmac aqueous solution (solid constituent is about 60 weight %) that obtains in the example 1 is dry under about 200 ℃ with spray-drying installation with making, and obtains Powdered melmac.
[embodiment 1]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp and mix with ball mill making the resin content that obtains in the example 1 with phthalic anhydride 0.5 weight portion and zinc stearate 6.0 weight portions, thus obtain cleaning mold with and the mold releasability answer use resin combination A.To the resin combination A that obtains, estimate cleaning mold property and mold releasability property with following test method.Its result is shown in table 1.The resin combination A cleaning mold property that demonstrates excellence as shown in table 1.In addition; Behind resin combination A cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
[embodiment 2]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp, make Powdered melmac 30 weight portions, powder paper pulp 30 weight portions, phthalic anhydride 0.5 weight portion, zinc stearate 2.5 weight portions and calcium stearate 3.5 weight portions that obtain in the example 2 and mix making the resin content that obtains in the example 1 with ball mill, thus obtain cleaning mold with and mold releasability reply and use resin combination B.To the resin combination B that obtains, likewise estimate cleaning mold property and mold releasability property with embodiment 1.Its result is shown in table 1.The resin combination B cleaning mold property that demonstrates excellence as shown in table 1.In addition; Behind resin combination B cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
[test method]
The test of cleaning property
Use commercially available biphenyl based epoxy resin moulding material (Sumitomo Bakelite Co., Ltd. system, EME-7351T), form the mould dirt through 500 reaction-injection mouldings with the mould of TQFP.With this contaminated mould, with cleaning mold with and the mold releasability answer be shaped repeatedly till die surface becomes clean with resin combination, estimate thus.
Test is replied in the demoulding
After the off-test of cleaning property, use commercially available biphenyl based epoxy resin moulding material (Sumitomo Bakelite Co., Ltd. system, EME-7351T) to carry out the progressive forming test, confirmed mold releasability property.Wherein, to the cleaning mold that accomplish not to clean of cleaning mold property difference with and mold releasability reply and do not carry out the demoulding with resin combination and reply and test.
Table 1
[embodiment 3]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp, phthalic anhydride 0.5 weight portion, zinc stearate 3.0 weight portions and D-sweet mellow wine 2.0 weight portions and mix making the resin content that obtains in the example 1 with ball mill, thus obtain cleaning mold with and mold releasability reply and use resin combination C.To the resin combination C that obtains, likewise estimate cleaning mold property and mold releasability property with embodiment 1.Its result is shown in table 2.The resin combination C cleaning mold property that demonstrates excellence as shown in table 2.In addition; Behind resin combination C cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
[embodiment 4]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp, phthalic anhydride 0.5 weight portion, zinc stearate 1.5 weight portions and D-sweet mellow wine 3.0 weight portions and mix making the resin content that obtains in the example 1 with ball mill, thus obtain cleaning mold with and mold releasability reply and use resin combination D.To the resin combination D that obtains, likewise estimate cleaning mold property and mold releasability property with embodiment 1.Its result is shown in table 2.The resin combination D cleaning mold property that demonstrates excellence as shown in table 2.In addition; Behind resin combination D cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
Table 2
[embodiment 5]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp, phthalic anhydride 0.5 weight portion, zinc stearate 2.5 weight portions and Licowax OP (Clariant Japan Co., Ltd. system, the partly-hydrolysed ester of montanic acid) 3.5 weight portions and mix making the resin content that obtains in the example 1 with ball mill, thus obtain cleaning mold with and mold releasability reply and use resin combination E.To the resin combination E that obtains, likewise estimate cleaning mold property and mold releasability property with embodiment 1.Its result is shown in table 3.The resin combination E cleaning mold property that demonstrates excellence as shown in table 3.In addition; Behind resin combination E cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
[embodiment 6]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp, phthalic anhydride 0.5 weight portion, zinc stearate 2.5 weight portions and Loxiol G78 (Cognis Japan Co., Ltd. system, macromolecule complex ester) 1.0 weight portions and mix making the resin content that obtains in the example 1 with ball mill, thus obtain cleaning mold with and mold releasability reply and use resin combination F.To the resin combination F that obtains, likewise estimate cleaning mold property and mold releasability property with embodiment 1.Its result is shown in table 3.The resin combination F cleaning mold property that demonstrates excellence as shown in table 3.In addition; Behind resin combination F cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
[embodiment 7]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp, make Powdered melmac 30 weight portions, powder paper pulp 30 weight portions, phthalic anhydride 0.5 weight portion, zinc stearate 2.5 weight portions and Licolub H-4 (Clariant Japan Co., Ltd. system, modification hydrocarbon) 3.5 weight portions that obtain in the example 2 and mix making the resin content that obtains in the example 1 with ball mill, thus obtain cleaning mold with and mold releasability reply and use resin combination G.To the resin combination G that obtains, likewise estimate cleaning mold property and mold releasability property with embodiment 1.Its result is shown in table 3.The resin combination G cleaning mold property that demonstrates excellence as shown in table 3.In addition; Behind resin combination G cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
[embodiment 8]
Be about 72% melamine formaldehyde resin powder 1000 weight portions that are mixed with paper pulp, make Powdered melmac 30 weight portions, powder paper pulp 30 weight portions, phthalic anhydride 0.5 weight portion, zinc stearate 2.5 weight portions and Loxiol VPN881 (Cognis Japan Co., Ltd. system, mineral oils synthetic wax) 3.0 weight portions that obtain in the example 2 and mix making the resin content that obtains in the example 1 with ball mill, thus obtain cleaning mold with and mold releasability reply and use resin combination H.To the resin combination H that obtains, likewise estimate cleaning mold property and mold releasability property with embodiment 1.Its result is shown in table 3.The resin combination H cleaning mold property that demonstrates excellence as shown in table 3.In addition; Behind resin combination H cleaning mold; Do not using mold releasability the epoxy material for sealing to be shaped under replying with the situation of resin combination, the result compares with the situation of resin combination with using existing mold releasability answer, demonstrates not a halfpenny the worse mold releasability property.
Table 3
The cleaning mold of the application of the invention is used and resin combination is used in the mold releasability answer; Can remove because the serious dirt of the caused mould cavity part of multifunction of the multifunction of the resin of epoxy sealing in recent years and semiconductor element, exhaust oral area etc.; In addition; Need not to carry out existing mold releasability essential after the cleaning mold end of job and reply operation, can give mould with release property.Thus, can alleviate very numerous and diverse continuous cleaning mold operation and mold releasability and reply operation, can shorten the activity duration.In addition, when transmitting shaping (transfer molding), do not need essential lead frame, virtual box parts such as (dummyframe), therefore can also reduce continuous cleaning mold operation and mold releasability and reply the required cost of operation.
Claims (13)
- A cleaning mold with and mold releasability reply and use resin combination; It is characterized in that; Said resin combination is removed the dirt of die surface and is given die surface with release property when the shaping of curable resin moulding material, and it contains melmac, at least a kind of metallic soap class releasing agent and sweet mellow wine.
- 2. cleaning mold as claimed in claim 1 is used and resin combination is used in the mold releasability answer, and wherein, containing with respect to melmac 100 weight portions is the said metallic soap class releasing agent of 0.2～1.0 weight portion.
- 3. cleaning mold as claimed in claim 1 is used and resin combination is used in the mold releasability answer, and wherein, said sweet mellow wine is D-sweet mellow wine.
- 4. cleaning mold as claimed in claim 1 with and mold releasability reply and use resin combination, wherein, said metallic soap class releasing agent and said sweet mellow wine contain proportional with weight ratio count 90: 10～30: 70.
- 5. cleaning mold as claimed in claim 1 is used and resin combination is used in the mold releasability answer, and it further contains the releasing agent beyond the metallic soap class releasing agent.
- 6. cleaning mold as claimed in claim 5 is used and resin combination is used in the mold releasability answer, and wherein, the releasing agent beyond the said metallic soap class releasing agent is ester class releasing agent or synthetic wax.
- 7. cleaning mold as claimed in claim 6 is used and resin combination is used in the mold releasability answer, and wherein, said ester class releasing agent is partly-hydrolysed ester of montanic acid or macromolecule complex ester.
- 8. cleaning mold as claimed in claim 6 is used and resin combination is used in the mold releasability answer, and wherein, said synthetic wax is the modification hydrocarbon wax.
- 9. cleaning mold as claimed in claim 6 is used and resin combination is used in the mold releasability answer, and wherein, said synthetic wax is the mineral oils synthetic wax.
- 10. cleaning mold as claimed in claim 5 with and mold releasability reply and use resin combination, wherein, said metallic soap class releasing agent and said metallic soap class releasing agent releasing agent in addition contain proportional with weight ratio count 90: 10～30: 70.
- 11. cleaning mold as claimed in claim 1 is used and resin combination is used in the mold releasability answer, it further contains at least a kind in paper pulp and the curing catalysts.
- 12. cleaning mold as claimed in claim 1 is used and resin combination is used in the mold releasability answer, wherein, said resin combination is a compression-type.
- 13. cleaning mold and mold releasability answering method, wherein adopt in the claim 1～12 each described cleaning mold with and mold releasability reply and use resin combination.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP291888/2006 | 2006-10-27 | ||
| JP291890/2006 | 2006-10-27 | ||
| JP2006291890 | 2006-10-27 | ||
| JP291889/2006 | 2006-10-27 | ||
| JP2006291888 | 2006-10-27 | ||
| JP2006291889 | 2006-10-27 | ||
| PCT/JP2007/070436 WO2008050682A1 (en) | 2006-10-27 | 2007-10-19 | Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101466515A CN101466515A (en) | 2009-06-24 |
| CN101466515B true CN101466515B (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800214719A Expired - Fee Related CN101466515B (en) | 2006-10-27 | 2007-10-19 | Resin composition and method for mould clean and demould recovery |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP4948541B2 (en) |
| KR (1) | KR101395818B1 (en) |
| CN (1) | CN101466515B (en) |
| HK (1) | HK1131099A1 (en) |
| MY (1) | MY155928A (en) |
| TW (1) | TWI410316B (en) |
| WO (1) | WO2008050682A1 (en) |
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| JP5991997B2 (en) * | 2012-01-23 | 2016-09-14 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP6803165B2 (en) * | 2015-08-07 | 2020-12-23 | 日本カーバイド工業株式会社 | Resin composition for mold cleaning |
| JP2022190598A (en) * | 2021-06-14 | 2022-12-26 | Ｔｏｗａ株式会社 | Mold maintenance member, resin molding apparatus, and method for manufacturing resin molded product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3783042B2 (en) * | 1995-08-23 | 2006-06-07 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP2001247755A (en) * | 2000-03-08 | 2001-09-11 | Teijin Ltd | Resin pellet mixture for connector |
| JP4082052B2 (en) * | 2002-03-20 | 2008-04-30 | 東レ株式会社 | Resin composition and molded article comprising the same |
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2007
- 2007-10-19 JP JP2008540962A patent/JP4948541B2/en not_active Expired - Fee Related
- 2007-10-19 CN CN2007800214719A patent/CN101466515B/en not_active Expired - Fee Related
- 2007-10-19 MY MYPI20090131A patent/MY155928A/en unknown
- 2007-10-19 WO PCT/JP2007/070436 patent/WO2008050682A1/en active Application Filing
- 2007-10-19 KR KR1020087027063A patent/KR101395818B1/en not_active IP Right Cessation
- 2007-10-26 TW TW096140490A patent/TWI410316B/en not_active IP Right Cessation
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2009
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI410316B (en) | 2013-10-01 |
| JPWO2008050682A1 (en) | 2010-02-25 |
| JP4948541B2 (en) | 2012-06-06 |
| CN101466515A (en) | 2009-06-24 |
| WO2008050682A1 (en) | 2008-05-02 |
| MY155928A (en) | 2015-12-31 |
| TW200843927A (en) | 2008-11-16 |
| KR101395818B1 (en) | 2014-05-16 |
| KR20090084669A (en) | 2009-08-05 |
| HK1131099A1 (en) | 2010-01-15 |
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