CN101463985B - 发光二极管灯具 - Google Patents
发光二极管灯具 Download PDFInfo
- Publication number
- CN101463985B CN101463985B CN2007102032948A CN200710203294A CN101463985B CN 101463985 B CN101463985 B CN 101463985B CN 2007102032948 A CN2007102032948 A CN 2007102032948A CN 200710203294 A CN200710203294 A CN 200710203294A CN 101463985 B CN101463985 B CN 101463985B
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- radiator
- light
- light emitting
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004411 aluminium Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 238000005286 illumination Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 241001025261 Neoraja caerulea Species 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000009877 rendering Methods 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 1
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102032948A CN101463985B (zh) | 2007-12-21 | 2007-12-21 | 发光二极管灯具 |
US12/040,828 US7682048B2 (en) | 2007-12-21 | 2008-02-29 | Lighting emitting diode lamp |
EP08253993.3A EP2072886A3 (en) | 2007-12-21 | 2008-12-12 | Light emitting diode lamp with two LED arrays and two heat sinks |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102032948A CN101463985B (zh) | 2007-12-21 | 2007-12-21 | 发光二极管灯具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101463985A CN101463985A (zh) | 2009-06-24 |
CN101463985B true CN101463985B (zh) | 2010-12-08 |
Family
ID=40456183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007102032948A Expired - Fee Related CN101463985B (zh) | 2007-12-21 | 2007-12-21 | 发光二极管灯具 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7682048B2 (zh) |
EP (1) | EP2072886A3 (zh) |
CN (1) | CN101463985B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109140252A (zh) * | 2018-08-27 | 2019-01-04 | 佛山市顺德区蚬华多媒体制品有限公司 | 灯具、led光源及其制造方法 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7866852B2 (en) * | 2007-08-29 | 2011-01-11 | Texas Instruments Incorporated | Heat sinks for cooling LEDs in projectors |
US20100226139A1 (en) * | 2008-12-05 | 2010-09-09 | Permlight Products, Inc. | Led-based light engine |
US8220970B1 (en) * | 2009-02-11 | 2012-07-17 | Koninklijke Philips Electronics N.V. | Heat dissipation assembly for an LED downlight |
US7851819B2 (en) * | 2009-02-26 | 2010-12-14 | Bridgelux, Inc. | Transparent heat spreader for LEDs |
US8362677B1 (en) * | 2009-05-04 | 2013-01-29 | Lednovation, Inc. | High efficiency thermal management system for solid state lighting device |
US8217567B2 (en) * | 2009-06-11 | 2012-07-10 | Cree, Inc. | Hot light emitting diode (LED) lighting systems |
JP2011014766A (ja) * | 2009-07-03 | 2011-01-20 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
DE102010002332A1 (de) * | 2009-11-30 | 2011-06-01 | Ledon Lighting Jennersdorf Gmbh | Retrofit LED-Lampe mit warmweissem, insbesondere flammenartigem Weisslicht |
US8391009B2 (en) | 2010-06-18 | 2013-03-05 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipating assembly |
JP2012015148A (ja) * | 2010-06-29 | 2012-01-19 | Rohm Co Ltd | Ledモジュールおよびled照明装置 |
US8491140B2 (en) * | 2010-11-05 | 2013-07-23 | Cree, Inc. | Lighting device with multiple emitters and remote lumiphor |
US9648673B2 (en) * | 2010-11-05 | 2017-05-09 | Cree, Inc. | Lighting device with spatially segregated primary and secondary emitters |
US8664838B2 (en) * | 2010-12-15 | 2014-03-04 | Koninklijke Philips N.V. | Illumination apparatus and a method of assembling the illumination apparatus |
CN103261786B (zh) * | 2010-12-15 | 2018-06-05 | 飞利浦照明控股有限公司 | 照明装置和组装该照明装置的方法 |
DE102011101645A1 (de) * | 2011-05-16 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Mischlichtquelle |
KR101752447B1 (ko) | 2011-06-01 | 2017-07-05 | 서울반도체 주식회사 | 발광 다이오드 어셈블리 |
US8632221B2 (en) * | 2011-11-01 | 2014-01-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | LED module and method of bonding thereof |
WO2013132389A1 (en) * | 2012-03-06 | 2013-09-12 | Koninklijke Philips N.V. | Lighting module and method of manufacturing a lighting module |
US9035331B2 (en) | 2012-12-12 | 2015-05-19 | GE Lighting Solutions, LLC | System for thermal control of red LED(s) chips |
JP6186877B2 (ja) * | 2013-05-17 | 2017-08-30 | セイコーエプソン株式会社 | 光源装置およびプロジェクター |
US9464788B2 (en) | 2013-08-16 | 2016-10-11 | Lighting Science Group Corporation | Method of assembling a lighting device with flexible circuits having light-emitting diodes positioned thereon |
US9557015B2 (en) * | 2013-08-16 | 2017-01-31 | Lighting Science Group Corporation | Lighting device with flexible circuits having light-emitting diodes positioned thereupon and associated methods |
JP6596845B2 (ja) * | 2015-03-06 | 2019-10-30 | 株式会社リコー | 温度制御装置、画像表示装置、車両 |
JP7015455B2 (ja) * | 2017-02-17 | 2022-02-03 | 日本精機株式会社 | ヘッドアップディスプレイ装置 |
CN107969099A (zh) * | 2018-01-02 | 2018-04-27 | 深圳市德彩光电有限公司 | 一种散热装置 |
US11962122B2 (en) * | 2018-07-30 | 2024-04-16 | Panasonic Holdings Corporation | Semiconductor light emitting device and external resonance type laser device |
US12001128B2 (en) * | 2019-02-19 | 2024-06-04 | Sony Group Corporation | Light source unit for projection type display apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2849448Y (zh) * | 2005-12-13 | 2006-12-20 | 上海复弘科技发展有限公司 | 一种手术无影灯 |
CN1956174A (zh) * | 2005-10-24 | 2007-05-02 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6517221B1 (en) * | 1999-06-18 | 2003-02-11 | Ciena Corporation | Heat pipe heat sink for cooling a laser diode |
US6641284B2 (en) * | 2002-02-21 | 2003-11-04 | Whelen Engineering Company, Inc. | LED light assembly |
US7004602B2 (en) * | 2003-02-25 | 2006-02-28 | Ryan Waters | LED light apparatus and methodology |
US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
US20050047170A1 (en) * | 2003-09-02 | 2005-03-03 | Guide Corporation (A Delaware Corporation) | LED heat sink for use with standard socket hole |
JP4096896B2 (ja) * | 2004-03-10 | 2008-06-04 | セイコーエプソン株式会社 | プロジェクタ |
JP5097550B2 (ja) * | 2004-10-22 | 2012-12-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 改善されたヒートシンクを備える半導体発光装置 |
US7217006B2 (en) * | 2004-11-20 | 2007-05-15 | Automatic Power, Inc. | Variation of power levels within an LED array |
EP2587136B1 (en) * | 2006-05-03 | 2014-12-24 | Dialight Corporation | Embedded LED light source |
JP2008153108A (ja) * | 2006-12-19 | 2008-07-03 | Ichikoh Ind Ltd | 車両用灯具 |
US7866852B2 (en) * | 2007-08-29 | 2011-01-11 | Texas Instruments Incorporated | Heat sinks for cooling LEDs in projectors |
-
2007
- 2007-12-21 CN CN2007102032948A patent/CN101463985B/zh not_active Expired - Fee Related
-
2008
- 2008-02-29 US US12/040,828 patent/US7682048B2/en not_active Expired - Fee Related
- 2008-12-12 EP EP08253993.3A patent/EP2072886A3/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1956174A (zh) * | 2005-10-24 | 2007-05-02 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN2849448Y (zh) * | 2005-12-13 | 2006-12-20 | 上海复弘科技发展有限公司 | 一种手术无影灯 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109140252A (zh) * | 2018-08-27 | 2019-01-04 | 佛山市顺德区蚬华多媒体制品有限公司 | 灯具、led光源及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2072886A2 (en) | 2009-06-24 |
US20090161354A1 (en) | 2009-06-25 |
CN101463985A (zh) | 2009-06-24 |
EP2072886A3 (en) | 2013-05-29 |
US7682048B2 (en) | 2010-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101208 Termination date: 20131221 |