CN101450423B - Laser cutting method - Google Patents

Laser cutting method Download PDF

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Publication number
CN101450423B
CN101450423B CN 200810241663 CN200810241663A CN101450423B CN 101450423 B CN101450423 B CN 101450423B CN 200810241663 CN200810241663 CN 200810241663 CN 200810241663 A CN200810241663 A CN 200810241663A CN 101450423 B CN101450423 B CN 101450423B
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Prior art keywords
cutting
laser
motor
cutting head
cut
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CN 200810241663
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CN101450423A (en
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高云峰
雷群
翟学涛
严超
孙毅
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Shenzhen Hans CNC Technology Co Ltd
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Shenzhen Hans Laser Technology Co Ltd
Shenzhen Hans CNC Technology Co Ltd
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Abstract

The invention relates to a laser cutting method. Before cutting, a cutting head is accelerated to reach an end point to be cut, and does not emit laser at accelerating sections; after the cutting head reaches the end point to be cut, the laser begins emitting, and the cutting head cuts one side of a rectangle at a uniform speed; and after the cutting of the side is finished, a motor decelerates to drive the cutting head for running, and the laser does not emit at decelerating sections, thereby ensuring that the cutting of rectangular sides is finished under uniform speed state, completely removing angular points, simultaneously reducing carbonization, and improving the cutting quality.

Description

A kind of laser cutting method
[technical field]
The present invention relates to the laser cutting field and be specially adapted to high-speed cutting method laser sensitive nonmetallic materials.
[background technology]
Wiring board is to be made of jointly the insulating carrier between multiple layer of copper tinsel cord and the Copper Foil line, this carrier is exactly the P/P plate, in the process of making wiring board, generally need carry out laser cutting to the P/P plate, see also Fig. 1, the P/P plate is made up of the glass fiber 91 of braiding and colloid 91 (epoxy resin) and is that web-like deposits.Existing cutting mode to the P/P plate is, the P/P plate of rolling is positioned on the proprietary equipment, again with the P/P plate with being laser-cut into required size.
But because the P/P plate is laser sensitive material, the cutting mode of existing this class laser-sensitive material is in cutting process, the carbonization of beginning part and latter end is more serious, if this phenomenon of graphics processing more obviously its basic reason is that motor is not to finish under a constant at the uniform velocity state when cutting, slower at accelerating and decelerating part owing to speed, can cause the unit length inner laser to beat at the number of times on the workpiece, thereby can cause that carbonization is more serious than many under the state at the uniform velocity.
As the schematic diagram of Fig. 2 for the cutting mode of existing cutting laser-sensitive material, as we can see from the figure, when existing cutting mode is the motor setting in motion, laser is synchronous bright dipping, like this in the process of motor acceleration and deceleration, laser also is to be under the state of bright dipping, because the velocity ratio of the acceleration and deceleration period at the uniform velocity speed of period is low, and speed changes, and going out under the certain situation of light frequency at laser, accelerating and decelerating part is greater than the at the uniform velocity number of times of period at the number of times that the unit length inner laser is transmitted into the material to be cut surface, so the cut quality of accelerating and decelerating part is than at the uniform velocity section is poor.
Structural representation when Fig. 3 is the cutting rectangle, all can there be accelerating sections and braking section in each limit shown in the figure, and the joint portion on limit and limit (being angle point) all produces very serious carbonization, its reason is because the angle point place is the beginning or end on each limit, and it is slow more the closer to the speed of angle point, so near the laser that causes being subjected to the angle point is the most intensive, and carbonization phenomenon can occur, has a strong impact on cut quality.
[summary of the invention]
The invention reside in a kind of laser cutting mode, this method are provided is to avoid accelerating and decelerating part in cutting process, i.e. not bright dipping of accelerating and decelerating part laser, and state laser of following time goes out again when motor is at the uniform velocity, to improve the quality of laser cutting.
The technical solution adopted in the present invention is: a kind of laser cutting method that is used for the laser-sensitive material, comprise the steps: the first step: before the cutting, the driven by motor cutting head quickens operation one segment distance to endpoint location to be cut along cut direction, and in this segment distance process, do not launch laser; Second step: when driven by motor cutting head during with the normal speed uniform motion, cutting head begins to launch laser, begins to treat the cutting article and carries out laser and at the uniform velocity cut; The 3rd step: when cutting finishes, stop to launch laser, the driven by motor cutting head segment distance that continues to run slowly;
Wherein at first cutting head is set in endpoint location to be cut in the first step, starter motor then, make the driven by motor cutting head quicken operation one segment distance to the direction opposite with cutting, continue again along with the opposite direction of the cutting segment distance that runs slowly, stop until motor, then the driven by motor cutting head quickens operation one segment distance to endpoint location to be cut along cut direction to returning.
Wherein, the motor in the above-mentioned first step quickens the distance moved for the first time motor is last to quicken to backhauling row and reaching the at the uniform velocity distance of state with being not less than apart from sum of running slowly.
The distance of motion when wherein, the distance of operation is not less than motor and decelerates to zero by state at the uniform velocity in above-mentioned the 3rd step.
The present invention is by before cutting, quicken earlier to make cutting head arrive end points to be cut, and do not penetrate laser at accelerating sections, after cutting head reaches end points to be cut, laser just begins bright dipping, and cutting head at the uniform velocity cuts one side of rectangle, after finishing this limit of cutting, motor slows down and drives the cutting head operation, and also do not penetrate laser at braking section, thereby the limit that can satisfy the cutting rectangle all is to finish under state at the uniform velocity, can remove angle point fully like this, also reduced simultaneously carbonization, the cutting quality is improved.
[description of drawings]
Fig. 1 is the structural representation of existing P/P plate;
Fig. 2 is the schematic diagram of existing cutting straight line method;
Fig. 3 is the schematic diagram of existing cutting pattern method;
Fig. 4 is the schematic diagram of cutting straight line method of the present invention;
Fig. 5 is the schematic diagram of cutting pattern method of the present invention;
Fig. 6 is put figure for the part before the cutting pattern shown in Figure 5.
[specific embodiment]
Also the present invention is described in further detail in conjunction with the accompanying drawings below by specific embodiment.
Laser cutting method of the present invention, be mainly used in cutting to laser sensitive nonmetallic materials such as P/P plates, this is because nonmetallic materials require very high to cut quality, not so influence its quality, the present invention is exactly that cutting at laser sensitive nonmetallic materials has designed a kind of brand-new laser cutting method, not only reach the demand of cutting, and the cutting be of high quality.
Sometimes only the P/P plate need be carried out simple straight cuts, be the schematic diagram of independent cutting straight line as Fig. 4, during cutting, sets the power and the speed of laser cutting in advance, begins starter motor again, and whole cutting step is as follows:
The first step: motor places required cutting straight line left position, starter motor, the driven by motor cutting head quickens operation gradually, this moment, laser instrument was not launched laser, this distance is generally the several millimeters about 5-6mm, and this distance is not less than the distance of motor accelerated motion, and this moment, the speed of service of cutting head arrived normal high speed, promptly traveled at the uniform speed.
Second step: when cutting head arrives predefined speed, motor begins to drive cutting head to travel at the uniform speed, arrive the initial end points of required cutting straight line, this moment, cutting head began laser, begin material is carried out laser cutting, such cutting mode can guarantee that the number of times that cutting unit length inner laser is transmitted into the material to be cut surface is identical, thereby cut quality also is improved.
The 3rd step: after having cut predefined distance, motor reduces speed now and stops, in this section of running slowly, and not bright dipping of laser, out of service until the driven by motor cutting head.
The schematic diagram of the cutting method of cutting pattern as Fig. 5 is, that Fig. 5 illustrates is the regular rectangle ABCD of cutting, because the cutting rectangle need cut four edges, so normal high-speed cutting, generally be that two laser cutting heads cut relative two limit AB or CD simultaneously, can improve cutting efficiency like this, during cutting, set the size and the initial point position of power, speed and the rectangle to be cut of laser cutting in advance, begin starter motor again, whole cutting step following (consulting Fig. 6 simultaneously):
The first step: earlier simultaneously relative two limit AB and CD are carried out laser cutting with two cutting heads, at first, the starting point of setting motor is positioned at the terminal A and the D of rectangle to be cut; Then, the beginning starter motor makes the driven by motor cutting head move a segment distance s1 to the direction opposite with cutting with acceleration a1, is generally the 2-3 millimeter apart from s1; Then make motor continue the direction opposite and move a segment distance s2, be generally the 2-3 millimeter, stop until motor apart from s2 with cutting with deceleration a2; Then continue starter motor, make the driven by motor cutting head along the direction of cutting with acceleration a3 to backhauling row and the segment distance s3 when reaching at the uniform velocity, be generally the 4-6 millimeter apart from s3, and make motor that cutting head is taken back former terminal A and D, this moment, motor reached predefined high speed v with cutting head.
At above-mentioned process accelerating sections a1, braking section a2 and accelerating sections a2, laser instrument all is not bright dipping.
Wherein, motor drive for the first time cutting head with acceleration a1 operation apart from s1 and deceleration a2 operation apart from the s2 sum, being not less than motor, to drive cutting head for the second time capable of s3 to backhauling with acceleration a3, if certainly apart from s1 with apart from the s2 sum during greater than distance s3, when the driven by motor cutting head travels at the uniform speed, need the not bright dipping temporarily of control laser instrument, wait the end points of the rectangle that reaches to be cut after, could bright dipping; If if certainly certainly apart from s1 with when just equaling apart from s3 apart from the s2 sum, after the driven by motor cutting head arrived former end points, laser instrument just can begin bright dipping.
Second step: when the driven by motor cutting head moves back former terminal A and D with acceleration a3, controller control laser instrument begins bright dipping, this moment, motor continued to drive cutting head with at the uniform velocity v operation, and prolonging rectilinear path AB and CD in regular turn and carrying out the laser high-speed cutting, until another terminal B and the C of rectangle to be cut.
This step makes that the limit of cutting rectangle all is to finish under state at the uniform velocity.
The 3rd step: when driven by motor cutting head during to the terminal B of rectangle and C, motor will be with deceleration a4 range ability s4 to stopping, the also not bright dipping of braking section laser, and run slowly be not less than motor and slow down apart from s4 the time motion distance.
And with the two other limit AD and the BC of same method cutting rectangle.
The present invention is by before cutting, quicken earlier to make cutting head arrive end points to be cut, and do not penetrate laser at accelerating sections, after cutting head reaches end points to be cut, laser just begins bright dipping, and cutting head at the uniform velocity cuts one side of rectangle, after finishing this limit of cutting, motor slows down and drives the cutting head operation, and also do not penetrate laser at braking section, thereby the limit that can satisfy the cutting rectangle all is to finish under state at the uniform velocity, can remove angle point fully, also reduced simultaneously carbonization, the cutting quality is improved.

Claims (2)

1. a laser cutting method that is used for the laser-sensitive material is characterized in that, comprises the steps:
The first step: before the cutting, the driven by motor cutting head quickens operation one segment distance to endpoint location to be cut along cut direction, and in this segment distance process, does not launch laser;
Second step: when driven by motor cutting head during with the normal speed uniform motion, cutting head begins to launch laser, begins to treat the cutting article and carries out laser and at the uniform velocity cut;
The 3rd step: when cutting finishes, stop to launch laser, the driven by motor cutting head segment distance that continues to run slowly;
Wherein at first cutting head is set in endpoint location to be cut in the first step, starter motor then, make the driven by motor cutting head quicken operation one segment distance to the direction opposite with cutting, continue again along with the opposite direction of the cutting segment distance that runs slowly, stop until motor, then the driven by motor cutting head quickens operation one segment distance to endpoint location to be cut along cut direction to returning.
2. laser cutting method as claimed in claim 1 is characterized in that: the motor in the above-mentioned first step quickens the distance moved for the first time, and motor is last to quicken to backhauling row and reaching the at the uniform velocity distance of state with being not less than apart from sum of running slowly.
CN 200810241663 2008-12-24 2008-12-24 Laser cutting method Active CN101450423B (en)

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CN101450423B true CN101450423B (en) 2011-08-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615434A (en) * 2012-04-13 2012-08-01 常熟市平冶机械有限公司 Method for cutting titanium alloy steel plate through laser
CN109434279A (en) * 2017-09-04 2019-03-08 Hb技术有限公司 With the laser system of motor encoder signal information

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107145127B (en) * 2017-05-12 2019-11-12 广东大族粤铭智能装备股份有限公司 A kind of method and system based on the asynchronous vision positioning flight processing of double end
CN110340520A (en) * 2019-06-27 2019-10-18 武汉铱科赛科技有限公司 A kind of pulse dislocation laser processing, device and system
CN111761232A (en) * 2020-06-09 2020-10-13 国宏激光科技(江苏)有限公司 Method for cutting metal plate by optical fiber laser
CN112429958A (en) * 2020-11-30 2021-03-02 苏州科韵激光科技有限公司 Display panel electrode laser cutting method, device, equipment and medium
CN112756797A (en) * 2020-12-30 2021-05-07 中国科学院西安光学精密机械研究所 High-precision laser engraving method
CN113727526B (en) * 2021-08-31 2023-05-26 深圳市大族数控科技股份有限公司 Windowing method for circuit board protection layer

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Publication number Priority date Publication date Assignee Title
CN1411943A (en) * 2002-09-30 2003-04-23 华中科技大学 Laser hole-making method for non-metal thin type material and its equipment
CN1470355A (en) * 2002-07-24 2004-01-28 星云电脑股份有限公司 Method for controlling projected laser matched with optical lens seat in laser processing machine
CN101101869A (en) * 2001-08-10 2008-01-09 株式会社半导体能源研究所 Laser annealing apparatus and semiconductor device manufacturing method
JP2008307562A (en) * 2007-06-13 2008-12-25 Shibuya Kogyo Co Ltd Fracture apparatus of brittle material

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
CN101101869A (en) * 2001-08-10 2008-01-09 株式会社半导体能源研究所 Laser annealing apparatus and semiconductor device manufacturing method
CN1470355A (en) * 2002-07-24 2004-01-28 星云电脑股份有限公司 Method for controlling projected laser matched with optical lens seat in laser processing machine
CN1411943A (en) * 2002-09-30 2003-04-23 华中科技大学 Laser hole-making method for non-metal thin type material and its equipment
JP2008307562A (en) * 2007-06-13 2008-12-25 Shibuya Kogyo Co Ltd Fracture apparatus of brittle material

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Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615434A (en) * 2012-04-13 2012-08-01 常熟市平冶机械有限公司 Method for cutting titanium alloy steel plate through laser
CN109434279A (en) * 2017-09-04 2019-03-08 Hb技术有限公司 With the laser system of motor encoder signal information

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Address after: 518051 Dazu laser building, 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong

Co-patentee after: Shenzhen Dazu Digital Control Science & Technology Co., Ltd.

Patentee after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD.

Address before: No. 5 road 518057 in Guangdong province Shenzhen city Nanshan District high tech park of Pine Hill Factory District No. 8

Co-patentee before: Shenzhen Dazu Digital Control Science & Technology Co., Ltd.

Patentee before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen

CP03 Change of name, title or address
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Effective date of registration: 20200616

Address after: 518101 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province

Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd.

Address before: 518051 Dazu Laser Building, No. 9 Xinxi Road, North District, Nanshan High-tech Park, Shenzhen City, Guangdong Province

Co-patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd.

Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd.

TR01 Transfer of patent right
CP01 Change in the name or title of a patent holder

Address after: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen Han's CNC Technology Co.,Ltd.

Address before: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province

Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd.

CP01 Change in the name or title of a patent holder