CN101436819A - 具有集成栅极驱动电路的功率电子装置 - Google Patents

具有集成栅极驱动电路的功率电子装置 Download PDF

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CN101436819A
CN101436819A CNA2008102147630A CN200810214763A CN101436819A CN 101436819 A CN101436819 A CN 101436819A CN A2008102147630 A CNA2008102147630 A CN A2008102147630A CN 200810214763 A CN200810214763 A CN 200810214763A CN 101436819 A CN101436819 A CN 101436819A
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semiconductor chip
power
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CN101436819B (zh
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D·F·内尔森
G·约翰
G·S·史密斯
D·唐
J·M·纳加斯马
G·加尔戈斯-洛佩茨
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GM Global Technology Operations LLC
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Abstract

功率转换装置，包括：基层；装配到所述基层上的半导体芯片，并包括为高功率、交流电马达的应用而使用的功率电子电路；和装配到基层上的栅极驱动电路，能与半导体芯片的功率电子电路电耦合。

Description

具有集成栅极驱动电路的功率电子装置
相关申请的交叉参考
本申请主张申请日为2007年7月30日，申请号为60/952761的美国临时申请的优先权，其整个内容都被引入作为参考。
技术领域
本发明主要涉及功率电子装置，尤其涉及带有集成栅极驱动电路的功率电子装置。
背景技术
近年来，随着技术的发展，以及在类型上不断演变的尝试，给汽车的设计带来了巨大的变化。其中一样变化包括汽车中电气***的复杂性，尤其是替代燃料车辆，例如混合动力，电动和燃料电池车辆。这种替代燃料车辆代表性的用到或一个多个电动马达，也可能与其它致动器结合，来驱动车轮。另外，这种汽车也可能包括别的马达，以及别的高电压元件，来操纵汽车中的其他各种***，例如空调装置。
由于这样的事实：替代燃料汽车典型的只包括直流(DC)电源，提供直流到交流(DC/AC)的转换器(或功率转换器)来把直流电源变成马达所需要的交流电源。这种车辆，尤其是燃料电池车辆，也经常用到两个独立电压源，例如电池和燃料电池，来给电动马达提供功率来驱动车轮。这样，功率转换器，例如直流到直流(DC/DC)的转换器，也被典型地提供用来管理和传递两个电压源来的功率。
随着对替代燃料车辆的电气***的功率需求的不断增长的，需要不断地把这种***的效率和可靠性最大化。另外，不断的需要减小这种电气***内部件要求的成本和空间以使汽车的总体成本和重量最小化。一个特别的增加成本的来源就是许多功率转换器按传统所需要的直接结合的铜基层。
因此，需要提供一种功率电子装置，尤其是一种转换器，具有低成本，高电流，紧凑设计的特性。另外，根据随后的细节描述和附加的权利要求，考虑进相应的附图和之前的技术领域和背景技术，关于本发明的其它的希望的特征和性质也会变得明显。
发明内容
根据一个典型实施例，功率转换装置包括基层，装配到基层上的和包括为高功率，交流电马达的应用而使用的功率电子电路的半导体芯片，和装配到基层上的栅极驱动电路，能与半导体芯片的功率电子电路电耦合。
根据另一个典型的实施例，汽车驱动***包括电动马达；耦合电动马达的直流电(DC)电源；耦合电动马达和直流电电源的功率转换装置，来从直流电电源接受直流电功率并把交流电(AC)功率提供给电动马达。功率转化装置包括基层；装配到基层上和包括将直流电功率转换成交流电功率的功率电子电路的半导体芯片；和装配到基层上的栅极驱动电路，能与半导体芯片的功率电子电路电耦合。
根据另一个典型的实施例，功率转换装置，包括印刷电路板(PCB)基层；装配到基层上的多个半导体芯片，半导体芯片包括为高功率，交流电马达的应用而使用的绝缘栅双极晶体管(IGBI)，和装配到基层上的栅极驱动电路，能与半导体芯片的绝缘栅双极晶体管电耦合。
附图说明
本发明将联系随后附图进行描述，其中相同附图标记表示类似的部件，并且其中
附图1是根据本发明的一个实施例的典型汽车的示意图；和
附图2是如图1的汽车的转换器组件的功率转换装置的典型布局图。
具体实施方式
下文的细节描述在本质上仅是示例的，而不应被认为是限制了本发明或本发明的应用及使用。并且，还打算通过在前的技术领域，背景技术，发明内容或随后的具体实施方式所涉及的任何明示或暗示的理论进行限制。
广泛地，这里描述的典型实施例提供了更为紧凑且更少成本的功率电子装置。更特别的是，典型实施例提供了一种带有半导体芯片和装配到相对的低成本的基层上的栅极驱动电路的转换器组件。
以下描述涉及到“连接”或“耦合”到一起的元件或特征。当用在此处时，“连接”涉及一个元件/特征与另一个元件/特征的机械的结合(或直接的联系)，而不必是直接的。同样的，”耦合”涉及一个元件/特征直接或间接的结合(或直接或间接的联系)到另一个元件/特征上，而不必是机械的。然而，应当被理解的是在以下的描述中，一个实施例中两个元件被描述成“连接”，在可选择的实施例中类似的元件被描述成“耦合”，反之亦然。因此，在此显示的示意图中描述的元件、附加的介入元件、设备、特征或部件的示例布置可以出现在真实的实施例中。
另外，在这里描述的各种部件和特征可能用到特殊的数字的描述，例如第一、第二、第三等，也有位置和/或角度描述，例如水平的和垂直的。然而，这种描述仅仅是为了达到描述附图的目的而不构成限制，因为各种不同的部件可以在另外的实施例中重新布置。也应当被理解的是图1和2仅仅是示例性的而不是按照比例绘制的。
图1示例了根据本发明的一个实施例的一种汽车(或“汽车驱动***”)10。汽车10包括底盘12，车体14，多个车轮16，和电子控制***18。所述车体14布置在底盘12上并且大致封闭汽车10的其它部件。所述车体14和底盘12可以结合到一起形成框架。所述车轮16中的每一个在接近车体14各自角落的地方可旋转联接到所述底盘12上。
汽车10可以是多种不同类型的汽车中的任何一种，例如，轿车，货车，卡车或运动型多用途车辆(SUV)，且可以是两轮驱动(2WD)(即后轮驱动或前轮驱动)，四轮驱动(4WD)，或全轮驱(AWD)。汽车10也可以包括多种不同类型的引擎中的任何一种或组合，例如，汽油或柴油燃料的燃烧引擎，“柔性燃料车辆”(FFV)引擎(即使用汽油和酒精的混合物)，气体化合物(例如氢气和/或天然气)燃料引擎，燃料/电动马达的混合动力引擎和电动马达。
如图1所示的典型实施例中，汽车10是混合动力车辆，并且还包括驱动器组件20，电池(或直流(DC)电源)22，功率电子装置24，和散热器26。在这个典型实施例中，所述功率电子装置24是转换器组件并且在随后会被这样涉及到。所述驱动器组件20包括燃料引擎28和电动马达/发电机(或马达)30。作为本领域技术人员应当得知，电动马达30其中包括变速器，并且虽然没有示例，它还包括定子组件(包括传导线圈)，转子组件(包括铁磁芯)，和一种冷却流体(即冷却剂)。电动马达30中的定子组件和/或转子组件可以包括多个电磁极(例如16个极)，这都是众所周知的。
依然参考图1，在一个实施例中，燃烧引擎28和电动马达30结合成一体，这样两者通过一个或多个驱动轴32机械联接到至少一些车轮16上。所述散热器26在其外部上被连接到框架上并且虽然没有细节上的示例，它包括多个冷却通道，其包含有冷却流体(即冷却剂)像水和/或乙二醇(即“防冻剂”)并被联接到引擎28和转换器组件24。
在运行时，车辆10通过由燃烧引擎28和电动马达30交替和/或同时驱动车轮16来运行。为了给电动马达30提供功率，直流电功率从电池22提供至转换器组件24，在此把直流电功率转换成交流电功率，然后功率送至电动马达30。作为本领域技术人员可以得知，这种从直流电功率到交流电功率的转换大致通过操作(即重复的转换)转换器组件24中的功率转换器的晶体管电路来实现的，这将在下面参照图2进行讨论。
参考图2，在转换器组件24中的功率转换装置100的典型布局被细致的描述。一般的，一个或多个功率转换装置100组成转换器组件24。所述功率转换装置100和较大的转换器组件24每个被当作“功率电子”装置。一般的，功率电子学是与通过静态装置从其可得的输入形式到期望的电输出形式有效转换，控制和调节电力相关联的技术。这种转换是通过半导体转换装置例如二极管，可控硅整流器和晶体管进行的，并且大量电能量被处理。形成对照的是，其它电子***与信号和数据的传输和处理有关，但是不处理大量的能量。
功率转换装置100特别的包括装配到基层110上的并且包含在外壳120内的半导体芯片105。半导体芯片105可以是焊接到基层110上，但其余的安置方式也是可以的。所述的半导体芯片105可以包括半导体基层(例如硅基层)，集成电路形成在其上，包括一个或多个以单独半导体装置形式的转换器，例如绝缘栅双极晶体管(IGBT)，这是众所周知的。在一个实施例中，半导体芯片105一般包括与马达30和电池22(图1)耦合的三相电路。
在一个实施例中，所述基层110是相对而言低成本基层，例如印刷电路板。所述基层可以是，例如，一种环氧树脂/玻璃纤维材料，但其他的材料也可以用。标准印刷电路板技术可以用于安装和相互连接基层110上的各种部件。一般的，功率转换装置100并不需要直接或者双结合铜(DBC)基层或其它类型的具有高导热性的基层。尽管图示只给出了单一基层110带有两个半导体芯片105，但也可以提供额外的或较少的半导体芯片，以及额外的基层，其形成例如转换模块。
栅极驱动电路130在基层110上形成。一般的，所述栅极驱动电路130把逻辑电平控制信号转换成合适的电压和电流来为功率转换装置100提供高效，可靠的转换，特别是形成在半导体芯片105上的绝缘栅双极晶体管的电路。在传统的功率转换中，栅极驱动电路是在独立的基层上提供的。
所述功率转换装置100也包括多个引线接合器140把半导体芯片105和形成在基层110里或上的各种导体元件(例如母线)相互连接起来，这样半导体芯片105与栅极驱动电路130电耦合，并且栅极驱动电路130可以与功率转换装置100外的部件耦合。
典型的实施例提供了一种功率转换装置100，带有比传统组件需要更少相互连接的集成栅极驱动电路130。例如，独立的栅极驱动板并不是必要的。这就允许电气设计的另外的创造性和灵活性。
如上所述，所述功率转换装置100也包括外壳120，其封闭半导体芯片105，基层110，及关联电路。外壳34可以是由模制的塑料材料制成或是其它任何合适的材料制成。
在运行过程中，所述半导体芯片105产生热量。在一个实施例中，半导体芯片105产生的热量流通密度是至少10W/cm2，同时在另一个实施例中，产生的热量流通密度是至少20W/cm2。为了能够移除半导体芯片105的热量，所述散热器26中的流体经由泵32(图1)循环到功率转换装置100中的一个或多个喷嘴180。所述流体经喷嘴180喷射到半导体芯片105上。热量在所述流体流走前从半导体芯片105上传递到流体中。所述流体可以然后被收集并经过泵32返回到散热器26中，以由散热器26(图1)中的冷却通道冷却。该冷却剂流体最好是电介质液体。像本领域技术人员知道的那样，所述选择的特别的电介质液体取决于装置的化学特性和应用。合适的电介质液体可以包括，但并不限制于碳氟化合物，硅酮油，和聚α-烯烃(polyalphaolephins)。在这个典型实施例中，所述功率转换装置100和/或转换器组件24不包括散热装置。别的热量去除示例中包括喷雾器和别的冷却机构。
虽然至少一个典型实施例在前述中进行了细节描述，但是应当理解还存在很多的变型。也应当理解的是一个或多个典型的实施例仅仅是例子，而并不能以任何方式限制本发明的保护范围、应用或结构。相反，前面详细描述仅是为本领域的技术人员提供了一种实现该一个或多个典型实施例的方便方法。应当被理解的是，可以对元件做出的功能和布置的各种变化而不偏离如附加的权利要求和法律等同物件阐述的本发明的范围。

Claims (20)

1、功率转换装置，包括：
基层；
装配到所述基层上的半导体芯片，并且半导体芯片包括用于高功率、交流电马达的应用的功率电子电路；和
装配到基层上的栅极驱动电路，且栅极驱动电路与半导体芯片上的功率电子电路电耦合。
2、如权利要求1所述的功率转换装置，其中所述基层是印刷电路板(PCB)。
3、如权利要求1所述的功率转换装置，其中所述功率电子电路包括绝缘栅双极晶体管(IGBT)。
4、如权利要求1所述的功率转换装置，其中所述半导体芯片用焊接装配到所述基层上。
5、如权利要求1所述的功率转换装置，其中栅极驱动电路构造为接收逻辑电平控制信号并把该控制信号转换成合适的电压和电流来控制功率电子电路的转换。
6、如权利要求1所述的功率转换装置，还包括用于将栅极驱动电路与半导体芯片上的功率电子电路电耦合的引线接合器。
7、如权利要求1所述的功率转换装置，其中所述半导体芯片是第一半导体芯片并且转换器组件还包括装配到基层上的第二半导体芯片。
8、如权利要求1所述的功率转换装置，其中所述半导体芯片包括装配到基层上的第一侧和与第一侧相对的第二侧，所述功率转换装置还包括用来冷却所述半导体芯片的第二侧的冷却***。
9、如权利要求1所述的功率转换装置，还包括外壳用来装入所述基层和所述半导体芯片。
10、如权利要求9所述的功率转换装置，还包括联接到所述外壳上的喷嘴，用于把冷却流体传送到所述半导体芯片上。
11、汽车驱动***，包括：
电动马达；
与电动马达耦合的直流电(DC)电源；
耦合到电动马达和直流电电源的功率转换装置，以从直流电电源接收直流电功率且提供交流电(AC)功率到电动马达，所述功率转换装置包括：
基层；
装配到所述基层上的半导体芯片并且半导体芯片包括功率电子电路来把直流电功率转换成交流电功率；和
装配到基层上的栅极驱动电路，且栅极驱动电路与半导体芯片上的功率电子电路电耦合。
12、如权利要求11所述的汽车驱动***，其中所述基层是印刷电路板(PCB)。
13、如权利要求11所述的汽车驱动***，其中所述功率电子电路包括绝缘栅双极晶体管(IGBT)。
14、如权利要求11所述的汽车驱动***，其中所述半导体芯片用焊接装配到所述基层上。
15、如权利要求11所述的汽车驱动***，还包括用于将栅极驱动电路电配合到半导体芯片上的功率电子电路的引线接合器。
16、如权利要求11所述的汽车驱动***，其中所述半导体芯片是第一半导体芯片并且所述转换器组件还包括装配到基层上的第二半导体芯片。
17、如权利要求11所述的汽车驱动***，其中所述半导体芯片包括装配到基层上的第一侧和与第一侧相对的第二侧，所述功率转换装置还包括用来冷却所述半导体芯片的第二侧的冷却***。
18、如权利要求11所述的汽车驱动***，还包括外壳用来装入所述基层和所述半导体芯片。
19、如权利要求18所述的汽车驱动***，还包括联接到所述外壳上的喷嘴，用于把冷却流体传送到所述半导体芯片上。
20、功率转换装置，包括：
印刷电路板(PCB)基层；
装配到基层上的多个半导体芯片，所述半导体芯片包括用于高功率、交流电马达应用的绝缘栅双极晶体管(IGBT)；和
装配到基层上的栅极驱动电路，栅极驱动电路与半导体芯片上的绝缘栅双极晶体管电耦合。
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101931365A (zh) * 2009-06-17 2010-12-29 通用汽车环球科技运作公司 具有宽带隙功率晶体管的机动车功率电子器件
WO2015039398A1 (zh) * 2013-09-23 2015-03-26 广东美的制冷设备有限公司 智能功率模块及其制造方法
CN104582437A (zh) * 2014-12-24 2015-04-29 珠海格力电器股份有限公司 密闭盒散热装置和蒸汽压缩式空调
WO2017215169A1 (zh) * 2016-06-16 2017-12-21 广东合一新材料研究院有限公司 高功率电磁波发生器的工质接触式冷却***及其工作方法
CN110998777A (zh) * 2017-08-30 2020-04-10 三菱电机株式会社 功率转换装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100090625A1 (en) * 2008-10-09 2010-04-15 Gm Global Technology Operations, Inc. Automotive system and power converter assembly with a braking circuit
US8929074B2 (en) * 2012-07-30 2015-01-06 Toyota Motor Engineering & Manufacturing North America, Inc. Electronic device assemblies and vehicles employing dual phase change materials

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5229633A (en) * 1987-06-08 1993-07-20 U.S. Philips Corporation High voltage lateral enhancement IGFET
JP2995590B2 (ja) 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
CN2150672Y (zh) 1993-02-01 1993-12-22 王刚 逆变式集成一体化电源器件
US5453911A (en) * 1994-02-17 1995-09-26 General Motors Corporation Device for cooling power electronics
JP3516789B2 (ja) 1995-11-15 2004-04-05 三菱電機株式会社 半導体パワーモジュール
JP3674333B2 (ja) 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP2002043496A (ja) 2000-07-21 2002-02-08 Hitachi Ltd 半導体装置
US6411514B1 (en) 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
US20020162673A1 (en) * 2001-05-03 2002-11-07 Cook Derrick E. Use of doped synthetic polymer materials for packaging of power electric assemblies for a liquid cooled module
US6972957B2 (en) 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US20040037044A1 (en) 2002-08-21 2004-02-26 Alexander Cook Heat sink for surface mounted power devices
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management
US6833628B2 (en) * 2002-12-17 2004-12-21 Delphi Technologies, Inc. Mutli-chip module
JP3696211B2 (ja) * 2003-02-10 2005-09-14 株式会社東芝 パワースイッチング装置
US7167043B2 (en) 2003-11-24 2007-01-23 International Rectifier Corporation Decoupling circuit for co-packaged semiconductor devices
US20050128706A1 (en) * 2003-12-16 2005-06-16 Ballard Power Systems Corporation Power module with heat exchange
US7633752B2 (en) * 2004-03-29 2009-12-15 Intel Corporation Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
KR101230299B1 (ko) * 2005-01-07 2013-02-07 삼성디스플레이 주식회사 박막 트랜지스터 표시판
US7289326B2 (en) * 2006-02-02 2007-10-30 Sun Microsystems, Inc. Direct contact cooling liquid embedded package for a central processor unit
CN100391768C (zh) 2006-02-27 2008-06-04 华南理工大学 一种油-电混合动力汽车的多桥驱动***及应用该***改善汽车转弯半径的方法
US7755313B2 (en) 2007-09-12 2010-07-13 Gm Global Technology Operations, Inc. Power inverter module thermal management
JP5285258B2 (ja) 2007-09-28 2013-09-11 三菱重工業株式会社 電動圧縮機
US8314578B2 (en) 2009-03-09 2012-11-20 GM Global Technology Operations LLC Control of an alternator-starter for a hybrid electric vehicle having a disconnected high-voltage battery

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101931365A (zh) * 2009-06-17 2010-12-29 通用汽车环球科技运作公司 具有宽带隙功率晶体管的机动车功率电子器件
WO2015039398A1 (zh) * 2013-09-23 2015-03-26 广东美的制冷设备有限公司 智能功率模块及其制造方法
CN104582437A (zh) * 2014-12-24 2015-04-29 珠海格力电器股份有限公司 密闭盒散热装置和蒸汽压缩式空调
CN104582437B (zh) * 2014-12-24 2017-10-13 珠海格力电器股份有限公司 蒸汽压缩式空调
WO2017215169A1 (zh) * 2016-06-16 2017-12-21 广东合一新材料研究院有限公司 高功率电磁波发生器的工质接触式冷却***及其工作方法
CN110998777A (zh) * 2017-08-30 2020-04-10 三菱电机株式会社 功率转换装置

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