CN101431868A - 与绕组一体的多层pcb的制作方法 - Google Patents
与绕组一体的多层pcb的制作方法 Download PDFInfo
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- CN101431868A CN101431868A CNA2008102412053A CN200810241205A CN101431868A CN 101431868 A CN101431868 A CN 101431868A CN A2008102412053 A CNA2008102412053 A CN A2008102412053A CN 200810241205 A CN200810241205 A CN 200810241205A CN 101431868 A CN101431868 A CN 101431868A
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- 238000004804 winding Methods 0.000 title claims abstract description 186
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 14
- 239000007767 bonding agent Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 210000005056 cell body Anatomy 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 238000010297 mechanical methods and process Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims 4
- 239000010410 layer Substances 0.000 description 68
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000006424 Flood reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
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Abstract
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Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102412053A CN101431868B (zh) | 2008-12-11 | 2008-12-11 | 与绕组一体的多层pcb的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2008102412053A CN101431868B (zh) | 2008-12-11 | 2008-12-11 | 与绕组一体的多层pcb的制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN101431868A true CN101431868A (zh) | 2009-05-13 |
CN101431868B CN101431868B (zh) | 2012-03-21 |
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CN2008102412053A Active CN101431868B (zh) | 2008-12-11 | 2008-12-11 | 与绕组一体的多层pcb的制作方法 |
Country Status (1)
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CN (1) | CN101431868B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102186316A (zh) * | 2011-05-14 | 2011-09-14 | 汕头超声印制板(二厂)有限公司 | 任意层印制电路板制作方法 |
US9818527B2 (en) | 2012-02-20 | 2017-11-14 | Futurewei Technologies, Inc. | High current, low equivalent series resistance printed circuit board coil for power transfer application |
CN107809858A (zh) * | 2017-12-06 | 2018-03-16 | 广东电网有限责任公司江门供电局 | 一种多层电路印刷板机构 |
CN109698058A (zh) * | 2019-01-11 | 2019-04-30 | 深圳顺络电子股份有限公司 | 一种平面变压器及其制作方法 |
US10418337B2 (en) | 2017-06-21 | 2019-09-17 | Delta Electronics (Shanghai) Co., Ltd. | Inductor structure mounted on PCB board and voltage regulator module having the same |
CN112087122A (zh) * | 2020-08-19 | 2020-12-15 | 西安空间无线电技术研究所 | 一种调整多路高压输出交叉调整率的绕制结构及方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100339563B1 (ko) * | 1999-10-08 | 2002-06-03 | 구자홍 | 전자 부품 장착구조 및 방법 |
KR100464095B1 (ko) * | 2002-08-09 | 2005-01-03 | 삼성전자주식회사 | 트랜스포머의 보빈 고정장치 |
KR100547360B1 (ko) * | 2003-09-16 | 2006-01-26 | 삼성전기주식회사 | 권선 코일이 일체화된 보빈, 이를 채용한 광픽업액추에이터 및 그 제조 방법 |
JP2008124231A (ja) * | 2006-11-13 | 2008-05-29 | Taiyo Yuden Co Ltd | 電子部品連およびその製造方法 |
-
2008
- 2008-12-11 CN CN2008102412053A patent/CN101431868B/zh active Active
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102186316A (zh) * | 2011-05-14 | 2011-09-14 | 汕头超声印制板(二厂)有限公司 | 任意层印制电路板制作方法 |
CN102186316B (zh) * | 2011-05-14 | 2013-03-13 | 汕头超声印制板(二厂)有限公司 | 任意层印制电路板制作方法 |
US9818527B2 (en) | 2012-02-20 | 2017-11-14 | Futurewei Technologies, Inc. | High current, low equivalent series resistance printed circuit board coil for power transfer application |
US9837201B2 (en) | 2012-02-20 | 2017-12-05 | Futurewei Technologies, Inc. | High current, low equivalent series resistance printed circuit board coil for power transfer application |
US10431372B2 (en) | 2012-02-20 | 2019-10-01 | Futurewei Technologies, Inc. | High current, low equivalent series resistance printed circuit board coil for power transfer application |
US11120937B2 (en) | 2012-02-20 | 2021-09-14 | Futurewei Technologies, Inc. | High current, low equivalent series resistance printed circuit board coil for power transfer application |
US11538622B2 (en) | 2012-02-20 | 2022-12-27 | Futurewei Technologies, Inc. | High current, low equivalent series resistance printed circuit board coil for power transfer application |
US10418337B2 (en) | 2017-06-21 | 2019-09-17 | Delta Electronics (Shanghai) Co., Ltd. | Inductor structure mounted on PCB board and voltage regulator module having the same |
CN107809858A (zh) * | 2017-12-06 | 2018-03-16 | 广东电网有限责任公司江门供电局 | 一种多层电路印刷板机构 |
CN109698058A (zh) * | 2019-01-11 | 2019-04-30 | 深圳顺络电子股份有限公司 | 一种平面变压器及其制作方法 |
CN112087122A (zh) * | 2020-08-19 | 2020-12-15 | 西安空间无线电技术研究所 | 一种调整多路高压输出交叉调整率的绕制结构及方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101431868B (zh) | 2012-03-21 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ZHONGGUO ZHENHUA (GROUP) XINYUN ELECTRONIC COMP. + Free format text: FORMER OWNER: TIAN XIANPING Effective date: 20120309 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 400047 SHAPINGBA, CHONGQING TO: 550018 GUIYANG, GUIZHOU PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20120309 Address after: 550018 Guizhou province Guiyang city Wudang District North New Road No. 232 Patentee after: China Zhenhua (Group) Xinyun Electronic Component Co., Ltd. Address before: 400047 Chongqing city Shapingba District tianxingqiao sun light flat 69 13-11-3 Patentee before: Tian Xianping |