CN101417862A - Waterfall type lamellar flow etching apparatus - Google Patents
Waterfall type lamellar flow etching apparatus Download PDFInfo
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- CN101417862A CN101417862A CNA2007101642744A CN200710164274A CN101417862A CN 101417862 A CN101417862 A CN 101417862A CN A2007101642744 A CNA2007101642744 A CN A2007101642744A CN 200710164274 A CN200710164274 A CN 200710164274A CN 101417862 A CN101417862 A CN 101417862A
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- opticglass
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- microscope carrier
- etching solution
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Abstract
The invention provides a waterfall type laminar flow etching device which mainly comprises a platform deck, a convex object on the surface of the platform deck, and an etching solution releaser. During operation, optical glass is firstly led to be in an inclining state and etching solution overflowing from the groove of the etching solution releaser evenly flows through the optical glass on the platform deck in a waterfall flowing down mode, thus evenly etching and thinning the optical glass. Therefore, the optical glass is in the sloping state, and products generated by etching optical glass flow down along the sloping direction of optical glasses with the remaining etching solution.
Description
Technical field
The present invention relates to a kind of laminar flow etching device, relate in particular to a kind of waterfall type lamellar flow etching apparatus.
Background technology
Under the trend of liquid-crystal display lightweight, thin typeization and wide viewing angle, high brightness, liquid crystal manufacturers proposes the thin type means at different spare parts one after another, particularly takies the bigger glass substrate of volume, especially the main thin type means that adopt of manufacturers.
For the thinning glass substrate, existing manufacturer proposes the whole bag of tricks one after another, and these methods roughly are divided into Dip (immersion of multi-disc vertical type), In-line horizontal (sprinkling of monolithic level), Spray (sprinkling of monolithic vertical type).No matter which kind of method is mainly all carried out isotropic etching with chemical solution (for example hydrogen fluoride solution) to glass substrate, utilize control device such as etching period to come thinning glass substrate gradually, the further thinning glass substrate of the rational etching of title complex.Adopt above technology, the thickness of glass substrate develops into present 0.1mm from the 1.2mm of nineteen ninety-five.Yet the defective of above-mentioned means itself has caused producing other problem in the thinning process.
When adopting the Dip means, the multi-disc glass substrate is dipped in the etching solution storage tank simultaneously, utilizes etching solution to the chemical reaction that glass substrate produced, and take away the silicon fluoride that is produced after the etching, and etching thinning glass substrate gradually.Yet, in order to take away silicon fluoride, must use Bubble (foamed) device, but the Bubble device is wayward, make that making degree of difficulty improves many.In manufacturing processed,, be easy to cause the surface slightly to make because glass surface bears the power inequality.In this manufacturing processed, have original etching solution and resultant of reaction all to stay in the chemical tank, make still to be immersed in glass substrate in the etching solution, its surface easily again secondary response adhere to.If want accelerated reaction, then must improve temperature, but the chemical tank volume is big, cause effectively temperature control in the chemical liquids, cause speed of response to differ, therefore after thinning is finished, also need regrinding, to obtain evenly smooth surface.Can accelerate to make glass homogeneity variation according to fluid mechanics principle two ends etching speed.Original etching solution and resultant of reaction are all stayed in the chemical tank, make reusable chemical liquids cause proliferation too much, can't efficient recovery, and cost is promoted relatively.Because glass substrate is soaked in the etching solution, the two sides of glass substrate can be by the same efficiency etching, makes when if there is different etching requirement on its two sides, is difficult for overcoming.Work as thinning glass substrate, glass is positioned at cassette (film magazine) can cause mura (flaw) by the formation radian.The reservoir size is constant, so processing small size cost can't descend.Be to reduce cost and must reuse chemical liquids, but glass be dissolved in chemical liquids after density inequality, so each batch rate of etch difference, and need be in each batch adjustment program, to reach the same etch rate.Attrition process risk height and mechanical stress problem.
Such as above disappearance, industry adopts non-steeped In-line horizontal (sprinkling of monolithic level), Spray (sprinkling of monolithic vertical type) mostly at present, but these two kinds of spray patterns still have its shortcoming to exist.
In In-line horizontal (sprinkling of monolithic level), still utilize glass and chemical liquids to produce chemical reaction, but only etching solution is sprayed in the glass substrate upper end that level is put, power by its sprinkling is come accelerated reaction, and the chemical reaction product on the glass baseplate surface (for example silicon fluoride) taken away, preferable recovery working conditions, resultant are arranged attached to the first-class problem of glass substrate to avoid reducing the concentration of etching solution.Simultaneously, because during each etching glass substrate, only make etch processes, so can satisfy the different etching requirements in two sides at single.
Yet when taking away the glass baseplate surface reactant, its spray area and power are wayward for In-line horizontal (sprinkling of monolithic level), and what make glass baseplate surface bears the power inequality, is easy to generate Dimple (nest).Because peripheral chemical liquids of spraying also can be extended toward glass is inner, the chemical liquids of center of glass is difficult for flowing, and makes centerplane manufacture into speed of response and differs, and makes glass homogeneity variation.Throughput (transmission rate) is slow, and intact when thinning, still needs regrinding.
In order to solve the not runny problem of chemical liquids, in Spray (sprinkling of monolithic vertical type), still utilize etching solution that glass substrate is produced chemical reaction, but only the glass substrate of vertically putting is sprayed etching solution, make etching solution and resultant fall naturally, and there is not immobilising problem, and spray power by it and come accelerated reaction, and the chemical reaction product on the glass baseplate surface (for example silicon fluoride) is taken away, but and hydrofluoric acid after spraying and the recovery of reacted silicon fluoride direct filtration, and preferable recovery working conditions is arranged.Can be after long-time reaction unlike the Dip mode at reacted resultant and hydrofluoric acid, credit union is more fixing because of chemical bonded refractory, is difficult for filtering decomposing, and In-line horizontal or Spray does not then have resultant attached to problem on the glass substrate or the like.Simultaneously, because during each etching glass substrate, only make etch processes, so can satisfy the different etching requirements in two sides at single.
Yet, adopt Spray (sprinkling of monolithic vertical type) method, though can allow etching solution and resultant fall naturally, but when taking away the glass baseplate surface reactant, only flusher is housed in the glass substrate left and right sides, what make glass baseplate surface bears the power inequality, is easy to generate Dimple.Glass is difficult for upright fully fixing after thinning, and if glass does not have complete erect type to become radian to fall sheet and etching inequality easily.
Summary of the invention
Main purpose of the present invention provides a kind of waterfall type lamellar flow etching apparatus, it allows etching solution flow down the mode glass substrate of flowing through with waterfall, make etching solution along with gravity evenly falls, because of etching solution has preferable flowability at the opticglass that tilts, can obtain average etched surfaces again.
Secondary objective of the present invention provides a kind of waterfall type lamellar flow etching apparatus, it props up opticglass by protruded object, make that the contact area of opticglass and microscope carrier is minimum, and make that flowing down etching solution that mode flows down etc. with waterfall can not adsorb opticglass yet, and avoid stripping damage when taking out.
Based on above-mentioned purpose, waterfall type lamellar flow etching apparatus of the present invention mainly comprises:
One microscope carrier, this microscope carrier can be adjusted to skewed, and this opticglass of being put also presents skewed with this microscope carrier; And
One etching solution reliever is arranged on the top of this microscope carrier, and has the strip groove that stores etching solution;
Wherein, but under the etching solution spontaneous current that overflows by the groove of etching solution reliever, be placed in this opticglass on this microscope carrier and flow through equably.
In when operation, mainly make opticglass present heeling condition earlier, and the etching solution that overflows by the groove of etching solution reliever, available waterfall flows down mode and flows through equably and be placed in opticglass on the microscope carrier, makes opticglass by etching thinning equably.So, based on the opticglass of heeling condition, the resultant that etching opticglass is produced will flow down along the vergence direction of opticglass together along with remaining etching solution.
Wherein, have a plurality of protruded objects on this microscope carrier, feasible this opticglass that is placed on this microscope carrier does not touch the tabular surface of this microscope carrier.
But described microscope carrier left and right sidesing shifting makes to be placed in also left and right sidesing shifting of this opticglass on the scarp, and makes the etching solution of flowing through on this opticglass flow down more equably.
Based on this opticglass of heeling condition, the resultant that this opticglass of etching is produced will flow down along the vergence direction of this opticglass together along with remaining etching solution, make this resultant can not remain on this opticglass.
The etching solution of this opticglass of etching is a hydrogen fluoride solution, and this resultant that this opticglass of etching produced then is silicon fluoride.
This waterfall type lamellar flow etching apparatus further comprises:
One fixed jig is fixed this opticglass that is placed on this microscope carrier.
The angle of inclination on this scarp can influence etching solution and rest on time length on this opticglass, and influence is to the etch-rate of this opticglass.
The invention has the beneficial effects as follows: in the time of the thinning glass substrate, at many means of the prior art, the present invention uses the gravity essence of etching solution self dexterously, it is flowed down in the surface of opticglass in the mode that waterfall flows down equably, and can not be adsorbed on the opticglass, and then opticglass can be etched equably; Opticglass relies on protruded object with contacting of microscope carrier on the other hand, makes its resultant that produces in etching process also easily along with etching solution flows down.
Description of drawings
Fig. 1 is the synoptic diagram of waterfall type lamellar flow etching apparatus in the embodiment of the invention.
Fig. 2 A～2B is the synoptic diagram of waterfall type lamellar flow etching apparatus in another embodiment of the present invention.
Wherein, description of reference numerals is as follows:
10 microscope carriers
12 etching solution relievers
14 etching solutions
16 opticglass
18 fixed jigs
20 protruded objects
Embodiment
With reference to figure 1, Fig. 1 is the synoptic diagram of waterfall type lamellar flow etching apparatus of the present invention.As shown in Figure 1, waterfall type lamellar flow etching apparatus of the present invention mainly comprises microscope carrier 10, has the etching solution reliever 12 of the strip groove that stores etching solution 14.This wherein, fixed jig 18 can be fixed the opticglass 16 that is placed on the microscope carrier 10.The concentration of etching solution 14 can be 20～28%, and the per minute usage quantity is 1～1.5L/pc, to reach 10 μ m/ minutes etching speed.
In simple terms, waterfall type lamellar flow etching apparatus of the present invention mainly utilizes the scarp (for example 5 °～10 °) of microscope carrier 10, make the opticglass 16 that is carried also present heeling condition, and the etching solution 14 that overflows by the groove of etching solution reliever 12, can take as the waterfall mode under the spontaneous current to flow through equably to be placed in the opticglass 16 on the microscope carrier 10, by etching solution 14 etch capabilities own, make opticglass 16 by etching thinnings equably to glass.If when need adjusting etch-rate, can be by adjusting the angle of inclination, rest on time length on the opticglass 16 and change etching solution, and the control etch-rate.
Thus, waterfall type lamellar flow etching apparatus of the present invention can be based on the opticglass 16 of heeling condition, make the resultant that etching opticglass 16 is produced, will be along with remaining etching solution flows down along the vergence direction of opticglass 16 together, to avoid resultant and etching solution to mix, and then reduce the concentration of etching solution, and and preferable recovery working conditions is arranged, also solved resultant simultaneously attached to problem on the glass substrate or the like.When if the etching solution of etching opticglass 16 is hydrofluoric acid solution, the resultant that etching opticglass produced then is silicon fluoride.
Homogeneity when flowing through opticglass 16 in order further to improve etching solution 14, but utilize special entity to make microscope carrier 10 left and right sidesing shiftings, make to be placed in also left and right sidesing shifting thereupon of opticglass 16 on the scarp, and make and flow through etching solution 14 on the opticglass 16 more equably by under the run by gravity.
In addition, for opticglass 16 is fixed on the microscope carrier 10, can cover on the graph area panel by direct rubberizing film usually; but complicated operation so not only; when starting glued membrane after etching is finished, may destroy the front surface of opticglass 16, even make opticglass 16 breakages.In addition, remain in etching solution 14 on the microscope carrier 10 also may etching the side of opticglass 16 with positive.Therefore,, also can avoid taking-up to be corrupted to opticglass 16 because of carelessness simultaneously, on microscope carrier 10 surfaces, also special protruded object can be set additionally for side and the front of protecting opticglass 16.
With reference to figure 2A～2B, Fig. 2 A～2B is another synoptic diagram of waterfall type lamellar flow etching apparatus of the present invention.Shown in Fig. 2 A, have a plurality of protruded objects 20 on the microscope carrier 10 in the waterfall type lamellar flow etching apparatus of the present invention, and the feasible opticglass 16 that is placed on the microscope carrier 10 does not touch the tabular surface of microscope carrier 10, shown in Fig. 2 B.
Thus, the edge contact of opticglass 16 is to the fixed jig 18 of microscope carrier 10, and that the back side of opticglass 16 is almost is unsettled, as the damascene structures as the photo frame, as long as hole can be sealed by enough adhesive tapes on every side, just can avoid etching solution 14 to flow on the surface of microscope carriers 10 fully, glued membrane does not cover on the graph area panel fully simultaneously, avoids suffering that etching solution 14 or mechanical type peel off the destruction of being caused.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (7)
1. waterfall type lamellar flow etching apparatus, is characterized in that this etching system comprises in order to etching one opticglass:
One microscope carrier, this microscope carrier can be adjusted to skewed, and this opticglass of being put also presents skewed with this microscope carrier; And
One etching solution reliever is arranged on the top of this microscope carrier, and has the strip groove that stores etching solution;
Wherein, but under the etching solution spontaneous current that overflows by the groove of etching solution reliever, be placed in this opticglass on this microscope carrier and flow through equably.
2. waterfall type lamellar flow etching apparatus as claimed in claim 1 is characterized in that, has a plurality of protruded objects on this microscope carrier, and feasible this opticglass that is placed on this microscope carrier does not touch the tabular surface of this microscope carrier.
3. waterfall type lamellar flow etching apparatus as claimed in claim 2 is characterized in that, but this microscope carrier left and right sidesing shifting make to be placed in also left and right sidesing shifting of this opticglass on the scarp, and make the etching solution of flowing through on this opticglass flow down more equably.
4. waterfall type lamellar flow etching apparatus as claimed in claim 2, it is characterized in that, this opticglass based on heeling condition, the resultant that this opticglass of etching is produced, to make this resultant can not remain on this opticglass along with remaining etching solution flows down along the vergence direction of this opticglass together.
5. waterfall type lamellar flow etching apparatus as claimed in claim 4 is characterized in that, the etching solution of this opticglass of etching is a hydrogen fluoride solution, and this resultant that this opticglass of etching produced then is silicon fluoride.
6. waterfall type lamellar flow etching apparatus as claimed in claim 4 is characterized in that, this waterfall type lamellar flow etching apparatus further comprises:
One fixed jig is fixed this opticglass that is placed on this microscope carrier.
7. waterfall type lamellar flow etching apparatus as claimed in claim 4 is characterized in that, the angle of inclination on this scarp can influence etching solution and rest on time length on this opticglass, and influence is to the etch-rate of this opticglass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101642744A CN101417862A (en) | 2007-10-23 | 2007-10-23 | Waterfall type lamellar flow etching apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101642744A CN101417862A (en) | 2007-10-23 | 2007-10-23 | Waterfall type lamellar flow etching apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN101417862A true CN101417862A (en) | 2009-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101642744A Pending CN101417862A (en) | 2007-10-23 | 2007-10-23 | Waterfall type lamellar flow etching apparatus |
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| CN (1) | CN101417862A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659321A (en) * | 2012-05-14 | 2012-09-12 | 深圳市拓捷科技发展有限公司 | Equipment and method for single-surface thinning of multiple pieces of glass |
| CN106773214A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display base plate and its manufacture method, display device |
| CN108455078A (en) * | 2017-12-21 | 2018-08-28 | 凯盛科技股份有限公司 | A kind of large scale liquid crystal panel thinning single surface bearing basket tool |
| CN112390536A (en) * | 2019-08-12 | 2021-02-23 | 重庆鑫景特种玻璃有限公司 | Ultrathin glass cover plate, ultrathin strengthened glass cover plate and preparation method thereof |
| CN112645603A (en) * | 2021-01-15 | 2021-04-13 | 赣州帝晶光电科技有限公司 | Special waterfall flow type chemical etching jig and preparation method of ultrathin glass |
| CN113233780A (en) * | 2021-04-07 | 2021-08-10 | 合肥京东方半导体有限公司 | Liquid crystal glass substrate thinning and etching equipment |
| CN113979643A (en) * | 2020-12-31 | 2022-01-28 | 安徽金龙浩光电科技有限公司 | Preparation process of glass with glittering sand effect |
-
2007
- 2007-10-23 CN CNA2007101642744A patent/CN101417862A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659321A (en) * | 2012-05-14 | 2012-09-12 | 深圳市拓捷科技发展有限公司 | Equipment and method for single-surface thinning of multiple pieces of glass |
| CN102659321B (en) * | 2012-05-14 | 2015-03-18 | 汕头市拓捷科技有限公司 | Equipment and method for single-surface thinning of multiple pieces of glass |
| CN106773214A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display base plate and its manufacture method, display device |
| CN108455078A (en) * | 2017-12-21 | 2018-08-28 | 凯盛科技股份有限公司 | A kind of large scale liquid crystal panel thinning single surface bearing basket tool |
| CN112390536A (en) * | 2019-08-12 | 2021-02-23 | 重庆鑫景特种玻璃有限公司 | Ultrathin glass cover plate, ultrathin strengthened glass cover plate and preparation method thereof |
| CN112390536B (en) * | 2019-08-12 | 2022-07-15 | 重庆鑫景特种玻璃有限公司 | Ultrathin glass cover plate, ultrathin strengthened glass cover plate and preparation method of ultrathin glass cover plate |
| CN113979643A (en) * | 2020-12-31 | 2022-01-28 | 安徽金龙浩光电科技有限公司 | Preparation process of glass with glittering sand effect |
| CN112645603A (en) * | 2021-01-15 | 2021-04-13 | 赣州帝晶光电科技有限公司 | Special waterfall flow type chemical etching jig and preparation method of ultrathin glass |
| CN113233780A (en) * | 2021-04-07 | 2021-08-10 | 合肥京东方半导体有限公司 | Liquid crystal glass substrate thinning and etching equipment |
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Open date: 20090429 |