CN101265030B - Substrate thinning apparatus and method for thinning substrate - Google Patents
Substrate thinning apparatus and method for thinning substrate Download PDFInfo
- Publication number
- CN101265030B CN101265030B CN2008100963263A CN200810096326A CN101265030B CN 101265030 B CN101265030 B CN 101265030B CN 2008100963263 A CN2008100963263 A CN 2008100963263A CN 200810096326 A CN200810096326 A CN 200810096326A CN 101265030 B CN101265030 B CN 101265030B
- Authority
- CN
- China
- Prior art keywords
- substrate
- glass substrate
- etching
- pad
- etching reagent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 194
- 238000000034 method Methods 0.000 title abstract description 38
- 238000005530 etching Methods 0.000 claims abstract description 113
- 239000003153 chemical reaction reagent Substances 0.000 claims description 61
- 230000005484 gravity Effects 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 124
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 18
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 239000007921 spray Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005507 spraying Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000005554 pickling Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Surface Treatment Of Glass (AREA)
- Weting (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0025590 | 2007-03-15 | ||
KR1020070025590A KR100865767B1 (en) | 2007-03-15 | 2007-03-15 | Device for slimming of plate and method for slimming of plate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101265030A CN101265030A (en) | 2008-09-17 |
CN101265030B true CN101265030B (en) | 2011-04-06 |
Family
ID=39987754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100963263A Expired - Fee Related CN101265030B (en) | 2007-03-15 | 2008-03-14 | Substrate thinning apparatus and method for thinning substrate |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100865767B1 (en) |
CN (1) | CN101265030B (en) |
TW (1) | TWI394727B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100860294B1 (en) * | 2008-01-09 | 2008-09-25 | 주식회사 이코니 | An apparatus for etching a glass wafer, and a glass sheet manufactured by the same |
CN101514081B (en) * | 2009-01-22 | 2011-02-16 | 上海仪捷光电科技有限公司 | Waterfall type laminar flow etching and cutting method |
KR101674210B1 (en) * | 2010-06-03 | 2016-11-09 | 동우 화인켐 주식회사 | Etching composition for slope-type etching apparatus and etching method using the same |
CN102659321B (en) * | 2012-05-14 | 2015-03-18 | 汕头市拓捷科技有限公司 | Equipment and method for single-surface thinning of multiple pieces of glass |
CN103508673B (en) * | 2012-06-25 | 2016-01-13 | 江西沃格光电股份有限公司 | Glass substrate operator's console |
CN108455078A (en) * | 2017-12-21 | 2018-08-28 | 凯盛科技股份有限公司 | A kind of large scale liquid crystal panel thinning single surface bearing basket tool |
CN108874226B (en) * | 2018-06-29 | 2021-06-11 | 信利光电股份有限公司 | Etching method of ITO film layer of touch screen and touch screen assembly |
CN112645603A (en) * | 2021-01-15 | 2021-04-13 | 赣州帝晶光电科技有限公司 | Special waterfall flow type chemical etching jig and preparation method of ultrathin glass |
CN113233780A (en) * | 2021-04-07 | 2021-08-10 | 合肥京东方半导体有限公司 | Liquid crystal glass substrate thinning and etching equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0814174A1 (en) * | 1996-06-20 | 1997-12-29 | Qqc, Inc. | Glassy carbon coatings having water repellant and corrosion-erosion-, and wear-resistant characteristics |
CN1669967A (en) * | 2004-03-17 | 2005-09-21 | 西山不锈化学股份有限公司 | Glass panel surface etching method and apparatus, glass panel and flat display |
CN1903683A (en) * | 2005-07-25 | 2007-01-31 | 芝浦机械电子株式会社 | Substrate processing device and method |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6189482B1 (en) | 1997-02-12 | 2001-02-20 | Applied Materials, Inc. | High temperature, high flow rate chemical vapor deposition apparatus and related methods |
AU2002219978A1 (en) | 2000-11-30 | 2002-06-11 | Kyma Technologies, Inc. | Method and apparatus for producing miiin columns and miiin materials grown thereon |
KR100521399B1 (en) * | 2003-05-26 | 2005-10-12 | 세메스 주식회사 | Apparatus for manufacturing flat panel display devices |
KR100971511B1 (en) * | 2003-10-29 | 2010-07-21 | 주성엔지니어링(주) | Substrate tray, apparatus for manufacturing LCD and method of transporting substrate using the same |
KR101119798B1 (en) * | 2004-12-29 | 2012-03-23 | 엘지디스플레이 주식회사 | Chemical vapor deposition system |
-
2007
- 2007-03-15 KR KR1020070025590A patent/KR100865767B1/en not_active IP Right Cessation
- 2007-09-03 TW TW096132735A patent/TWI394727B/en not_active IP Right Cessation
-
2008
- 2008-03-14 CN CN2008100963263A patent/CN101265030B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0814174A1 (en) * | 1996-06-20 | 1997-12-29 | Qqc, Inc. | Glassy carbon coatings having water repellant and corrosion-erosion-, and wear-resistant characteristics |
CN1669967A (en) * | 2004-03-17 | 2005-09-21 | 西山不锈化学股份有限公司 | Glass panel surface etching method and apparatus, glass panel and flat display |
CN1903683A (en) * | 2005-07-25 | 2007-01-31 | 芝浦机械电子株式会社 | Substrate processing device and method |
Non-Patent Citations (1)
Title |
---|
JP特开平10-79371A 1998.03.24 |
Also Published As
Publication number | Publication date |
---|---|
CN101265030A (en) | 2008-09-17 |
TWI394727B (en) | 2013-05-01 |
TW200837030A (en) | 2008-09-16 |
KR100865767B1 (en) | 2008-10-28 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LI CHENGYU Effective date: 20110830 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20110830 Address after: Seoul, South Kerean Patentee after: Li Chengyu Address before: Gyeonggi Do, South Korea Patentee before: Yujin Advanced Technology KK |
|
ASS | Succession or assignment of patent right |
Owner name: SUZHOU KAILI ANG OPTOELECTRONICS TECHNOLOGY CO., L Free format text: FORMER OWNER: LI CHENGYU Effective date: 20111117 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 215433 SUZHOU, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20111117 Address after: 215433 No. 10 East Dongfang Road, Port Development Zone, Jiangsu, Taicang Patentee after: SUZHOU CRANE OPTOELECTRONICS TECHNOLOGY CO., LTD. Address before: Seoul, South Kerean Patentee before: Li Chengyu |
|
ASS | Succession or assignment of patent right |
Owner name: LI CHENGYU Free format text: FORMER OWNER: SUZHOU KAILI ANG OPTOELECTRONICS TECHNOLOGY CO., LTD. Effective date: 20131017 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131017 Address after: South Korea Chungbuk Zhen Chuan County town Kawamura loose in 191-1 Patentee after: Li Chengyu Address before: 215433 No. 10 East Dongfang Road, Port Development Zone, Jiangsu, Taicang Patentee before: SUZHOU CRANE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20140314 |