CN101412027B - Automatic testing and sorting machine for wafer - Google Patents
Automatic testing and sorting machine for wafer Download PDFInfo
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- CN101412027B CN101412027B CN200710163191A CN200710163191A CN101412027B CN 101412027 B CN101412027 B CN 101412027B CN 200710163191 A CN200710163191 A CN 200710163191A CN 200710163191 A CN200710163191 A CN 200710163191A CN 101412027 B CN101412027 B CN 101412027B
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Abstract
The invention relates to a classifier for automatically testing wafers, which comprises a feeding box, a receiving box and an empty box arranged at the front end of a stand. The feeding box is used for placing wafers to be tested, the receiving box is used for placing the tested wafers with different levels, while the empty box can receive an empty charging tray at the feeding box or an empty charging tray needing to supplement the receiving box. In addition, a test device is arranged at the back end of the stand, and is provided with a tester and a probe capable of lifting; two transfer devices capable of moving between a transportation area and the test device transfer the wafers to be tested alternately to the test device to test, and transfer the wafers after being tested to the transportation area; and a pick-and-place device is used for picking the wafers to be tested on the feeding box and placing the wafers on the two transfer devices, and picking and placing the tested wafers on the two transfer devices to the receiving boxes with different levels respectively according to the test result. Therefore, the classifier can ensure quality of the tested articles and effectively promote working convenience and usage benefit of productivity.
Description
Technical field
But the present invention relates to a kind of automation and carry out wafer sort and sorting operations, and effectively promote the automatic testing and sorting machine for wafer of operation convenience and tested productivity.
Background technology
General wafer is after accomplishing cutting operation, and the dealer is the cost waste of guaranteeing the wafer yield and avoiding the back segment encapsulation procedure, therefore carry out encapsulation procedure before, all can carry out the test jobs of wafer, electrically whether impaired with testing wafer; See also Fig. 1; Described wafer test apparatus 10 is on frame, to set up a probe 11, and described probe 11 has plural probe 111, and makes 111 pairs of through holes that are positioned at frame of plurality of probes; And probe 11 and connection are positioned at the tester 12 at rear; Described tester 12 is in order to determining non-defective unit wafer or defective products wafer, on the board below the probe 11, is provided with microscope carrier mechanism 13 in addition, and described microscope carrier mechanism 13 is on a slide rail 131, to mount microscope carrier 132; Described microscope carrier 132 also can drive the displacement of making shift-in and shifting out by drive source; On described microscope carrier 132, being provided with in addition one can be driven and can be made the tool 133 of displacement by drive source, and then tool 133 can move into corresponding to probe 11 lower position with level via the drive of microscope carrier 132; Drive the probe 111 that rises with contact probe 11 with drive source again; In addition the end face of tool 133 be provided with a vacuum slot 134 and can be by the pusher shoe 135 of drive source drive displacement, described pusher shoe 135 can be when vacuum slot 134 absorption wafers, pass crystal shift a little in order to bit test; See also Fig. 2; When carrying out wafer sort; It is that mode with manual work is placed on wafer to be measured 14 on the tool 133 of testing arrangement 10, described tool 133 and with vacuum slot 134 absorption wafer 14 to be measured, for making the accurately probe 111 to being positioned at probe 11 of wafer to be measured 14; Be to control pusher shoe 135 to pass wafer 14 displacements to be measured, make wafer to be measured 14 location in order to test; See also Fig. 3, shown in Figure 4; After wafer to be measured 14 positioned on the tool 133; Probe 111 belows that tool 133 and wafer 14 to be measured are moved to probe 11 are promptly carried in described microscope carrier mechanism 13, and tool 133 is promptly driven by drive source and does the rising displacement, and stretches through in the through hole of frame; Making the probe 111 of wafer to be measured 14 contact probes 11, in order to do to utilize probe
111 contact conductings wafer 14 to be measured; To carry out the test jobs of wafer 14; Described controller 12 is after differentiation wafer 14 to be measured is non-defective unit or defective products; Can split in rewindings place at different levels according to the wafer that test result will be finished survey with the mode of manual work, be convenient to carry out next operation.
Described wafer test apparatus is because the sorting operations that feed has reached after surveying all is to carry out with the mode of manual work; Therefore described device still fails to reach the operation of automation in the sorting operations of leading portion and back segment; And must effectively improve, and the sorting operations that feed has reached after surveying all makes tester be holding state, and must wait for accomplish the feed operation after; Just can continue and carry out test jobs; Described stand-by time is long will to have a strong impact on tested productivity, so stressing comprehensive automation and promoting under the trend that detects production capacity, how design a kind of operation that can comprehensively carry out automation detection and classification; Detect production capacity with effective lifting, be the target that the dealer endeavours to research and develop.
Summary of the invention
Main purpose of the present invention provides a kind of automatic testing and sorting machine for wafer; It is to comprise feed casket, rewinding casket and the empty boxes that is located at the board front end, then is provided with the testing arrangement of tool tester and probe in addition in the board rear end, and between testing arrangement and transit zone, is provided with transporter; One fetching device is wafer to be measured on the feed casket to be picked and placeed on transporter; And can the intact wafer of surveying on the transporter be picked and placeed the rewinding casket at different brackets respectively according to test result, but and then automation carry out feed and carry out test jobs; And according to test result automatically classification place, reach the utilization benefit of effective lifting operation convenience and tested productivity.
Another purpose of the present invention provides a kind of automatic testing and sorting machine for wafer; It is between testing arrangement and transit zone, to be provided with two transporters; Wherein a transporter is when carrying out test jobs, and another transporter then can carry out rewinding operation and feed operation in the transit zone, and can alternately continue wafer to be measured transferred load to testing arrangement test; And then reduce the stand-by time of testing arrangement, reach the utilization benefit of effective lifting tested productivity.
For realizing above-mentioned purpose, the technical scheme that the present invention adopts is:
A kind of automatic testing and sorting machine for wafer is characterized in that: include:
Feed casket: be to supply to take in the charging tray that bearing has wafer to be measured;
Rewinding casket: be to take in bearing according to different brackets the charging tray of surveying wafer has been arranged;
Testing arrangement: be to be provided with probe and tester, so that wafer to be measured is carried out test jobs;
Transporter: be removable between transit zone and testing arrangement, carry out test jobs in the testing arrangement, and after accomplishing test, will finish and survey wafer and transfer load to the transit zone, for the rewinding operation of classifying so that wafer to be measured is transferred load to;
Fetching device: be to be provided with fetching device, pick and place at transporter, and the intact survey wafer classification on the transporter is picked and placeed on the charging tray of rewinding casket with wafer to be measured on the charging tray with the feed casket;
Central processing unit: be respectively to install start, to carry out automated job in order to control and integration.
Compared with prior art; The beneficial effect that the present invention has is: in view of the above; The present invention utilizes the sequential collocation start of each device; And but automation is carried out test jobs with each wafer, and places according to the test result classification, reaches the utilization benefit of guaranteeing to test quality and effectively promoting operation convenience and production capacity.
Description of drawings
Fig. 1: the sketch map of practising the formula wafer test apparatus;
Fig. 2: the action sketch map () of practising the formula wafer test apparatus;
Fig. 3: the action sketch map (two) of practising the formula wafer test apparatus;
Fig. 4: the action sketch map (three) of practising the formula wafer test apparatus;
Fig. 5: configuration diagram of the present invention;
Fig. 6: the present invention carries out the action sketch map () of wafer sort and sorting operations;
Fig. 7: the present invention carries out the action sketch map (two) of wafer sort and sorting operations;
Fig. 8: the present invention carries out the action sketch map (three) of wafer sort and sorting operations;
Fig. 9: the present invention carries out the action sketch map (four) of wafer sort and sorting operations;
Figure 10: the present invention carries out the action sketch map (five) of wafer sort and sorting operations;
Figure 11: the present invention carries out the action sketch map (six) of wafer sort and sorting operations;
Figure 12: the present invention carries out the action sketch map (seven) of wafer sort and sorting operations;
Figure 13: the present invention carries out the action sketch map (eight) of wafer sort and sorting operations;
Figure 14: the present invention carries out the action sketch map (nine) of wafer sort and sorting operations;
Figure 15: the present invention carries out the action sketch map (ten) of wafer sort and sorting operations;
Figure 16: the present invention carries out the action sketch map (11) of wafer sort and sorting operations.
Description of reference numerals: 10-testing arrangement; The 11-probe; The 111-probe; 12-tries device; 13-microscope carrier mechanism; The 131-slide rail; The 132-microscope carrier; The 133-tool; The 134-vacuum slot; The 135-pusher shoe; The 14-wafer; 20-feed casket; 21-first puts the district temporarily; The 22-feed zone; 23-first empty boxes; 24-second empty boxes; 25-second puts the district temporarily; 26-the 3rd puts the district temporarily; 27-first receiving section; 28-second receiving section; The 29-first rewinding casket; The 30-second rewinding casket; The 31-testing arrangement; The 311-probe; The 32-transit zone; The 33-transit zone; 34-first transporter; 341-groove seat; The 342-vacuum slot; The 343-pusher shoe; 35-second transporter; 351-groove seat; The 352-vacuum slot; The 353-pusher shoe; The 36-fetching device; The 361-fetching device; 40A-charging tray 40B-charging tray 40C-charging tray; The 40D-charging tray; The 50A-wafer.
The specific embodiment
For making your juror do understanding further to the present invention, lift a preferred embodiment now and cooperate graphicly, explain as afterwards:
See also Fig. 5; The present invention is first and second rewinding casket 29,30 that is provided with feed casket 20, first and second empty boxes 23,24 and different brackets at the front end of board; Described feed casket 20 is that liftable is for taking in the charging tray 40A that bearing has wafer to be measured; Bearing has the charging tray 40A of wafer to be measured can be passed to first of rear side by feed casket 20 to put district 21 and feed zone 22 temporarily, and carries out the feed operation by feed zone 22; First and second empty boxes the 23, the 24th, liftable is for taking in sky charging tray 40B, 40C; First and second empty boxes 23,24 also can provide sky charging tray 40B, 40C to put district the 25 and the 3rd temporarily through second respectively and put district 26 temporarily and arrive first receiving section 27 and second receiving section 28; With intact survey wafer, and after charging tray is fully loaded, move into first and second rewinding casket 29,30 that liftable is taken at first receiving section 27 and second receiving section, 28 bearing different brackets; The board rear end is provided with testing arrangement 31 in addition; Described testing arrangement 31 is provided with tester (drawing does not show) and liftable probe 311; Two can move in the transit zone 32,33 and first and second transporters 34,35 of 31 of testing arrangements respectively; It is to be respectively equipped with the groove seat 341,351 that can supply the bearing wafer; And be provided with below each groove seat 341,351 that vacuum slot 342,352 and groove seat 341,351 sides are provided with can be by the pusher shoe 343,353 of drive source drive displacement; Described pusher shoe 343,353 can pass crystal shift a little in order to contraposition, and then first and second transporter 34,35 alternately transfer load to testing arrangement 31 to test with wafer to be measured when vacuum slot 342,352 absorption wafers; And after accomplishing test, transfer load to transit zone 32,33; One fetching device 36 is to be provided with the fetching device 361 that can do three directions (X-Y-Z) displacement, and can wafer to be measured be picked and placeed at first and second transporter 34,35 in feed zone 22, and with the intact wafer of surveying on first and second transporter 34,35; The result of foundation test picks and places respectively on the charging tray of first receiving section 27 of different brackets and second receiving section 28, with feed that carries out automation and the operation of classifying rewinding.
See also Fig. 6; The present invention is when carrying out the operation of wafer automatic test; Its feed casket 20 is to have the charging tray 40A of wafer to be measured to pass to feed zone 22 bearing; And carrying out the feed operation by feed zone 22, first and second empty boxes 23,24 is then passed empty charging tray 40B, 40C to first receiving section 27 and second receiving section 28 respectively, with the intact survey wafer at first receiving section 27 and second receiving section, 28 bearing different brackets.
See also Fig. 7, then the fetching device 361 of fetching device 36 can move to feed zone 22, and after drawing wafer 50A to be measured on the charging tray 40A, wafer 50A to be measured is placed in the groove seat 341 of first transporter 34.See also Fig. 8, when groove seat 341 full loads of first transporter 34, the vacuum slot 342 of first transporter 34 will slightly adsorb wafer 50A, and passes wafer 50A displacement contraposition a little with pusher shoe 343.
See also Fig. 9; Then first transporter 34 moves into wafer 50A to be measured probe 311 belows of testing arrangement 31; The probe 311 and the contact wafer 50A that descends are to carry out test jobs; At this moment, the fetching device 361 of fetching device 36 can move to feed zone 22 again, continues wafer 50A to be measured is placed in the groove seat 351 of second transporter 35.See also Figure 10, when groove seat 351 full loads of second transporter 35, the vacuum slot 352 of second transporter 35 will slightly adsorb wafer 50A, and passes wafer 50A displacement contraposition a little with pusher shoe 353.
See also Figure 11; After the wafer 50A on first transporter 34 accomplishes test; First transporter 34 will be moved to probe 311 belows that 32, the second transporters 35 wafer 50A then that another batch is to be measured in transit zone moves into testing arrangement 31, to carry out test jobs.See also Figure 12; After wafer 50A that first transporter 34 will finish survey is moved to transit zone 32; The fetching device 361 of fetching device 36 will be driven by controller (drawing does not show) control according to test result; The wafer of different brackets on first transporter 34 is placed on empty charging tray 40B, 40C on first receiving section 27 and second receiving section 28 respectively, with the sorting operations after the intact survey of wafer on first transporter 34 of carrying out of automation.
See also Figure 13, after the wafer 50A on first transporter 34 accomplished sorting operations, the fetching device 361 of fetching device 36 continued from feed zone 22 wafer 50A to be measured to be placed in the groove seat 341 of first transporter 34.See also Figure 14; After the wafer 50A on second transporter 35 accomplishes test; Second transporter 35 will be moved to probe 311 belows that 33, the first transporters 34 wafer 50A then that another batch is to be measured in transit zone moves into testing arrangement 31, carry out test jobs to continue.See also Figure 15; After wafer 50A that second transporter 35 will finish survey is moved to transit zone 33; The fetching device 361 of fetching device 36 will be driven by controller (drawing does not show) control according to test result; The wafer of different brackets on second transporter 35 is placed on empty charging tray 40B, 40C on first receiving section 27 and second receiving section 28 respectively, with the sorting operations after the intact survey of wafer on second transporter 35 of carrying out of automation.
See also Figure 16; After the last wafer to be measured of the charging tray 40A of feed zone 22 has been got; Described empty charging tray 40A takes at first empty boxes 23 displaceable, and feed casket 20 has the charging tray 40D of wafer to be measured to pass to feed zone 22 bearing, carries out the feed operation and continue in feed zone 22.
In view of the above, the present invention utilizes sequential collocation start of each device, but and automation is carried out test jobs with each wafer, and place according to the test result classification, reach the utilization benefit of guaranteeing to test quality and effectively promoting operation convenience and production capacity.
More than explanation is just illustrative for the purpose of the present invention; And it is nonrestrictive; Those of ordinary skills understand; Under the situation of spirit that does not break away from claim and limited and scope, can make many modifications, variation or equivalence, but but all will fall within the claim restricted portion of the present invention.
Claims (9)
1. automatic testing and sorting machine for wafer is characterized in that: include:
Feed casket: be to supply to take in the charging tray that bearing has wafer to be measured;
Rewinding casket: be to take in bearing according to different brackets the charging tray of surveying wafer has been arranged;
Testing arrangement: be to be provided with probe and tester, so that wafer to be measured is carried out test jobs;
Transporter: include first and second transporter; Described first transporter is removable between transit zone and testing arrangement; Carry out test jobs in the testing arrangement so that wafer to be measured is transferred load to, and after accomplishing test, will finish and survey wafer and transfer load to the transit zone, described second transporter is removable between another transit zone and said testing arrangement; Transfer load to wafer to be measured and to carry out test jobs in the said testing arrangement another batch; And after accomplishing test, will finish and survey wafer and transfer load to said another transit zone, said first and second transporter replaces the transfer wafer that reach survey to be measured, for the rewinding operation of classifying;
Fetching device: be to be provided with fetching device, pick and place at transporter, and the intact survey wafer classification on the transporter is picked and placeed on the charging tray of rewinding casket with wafer to be measured on the charging tray with the feed casket;
Central processing unit: be respectively to install start, to carry out automated job in order to control and integration.
2. automatic testing and sorting machine for wafer according to claim 1; It is characterized in that: more comprise be provided with first put temporarily the district and feed zone; Put district and feed zone temporarily and make on the feed casket bearing have the charging tray of wafer to be measured can pass to first, and carry out the feed operation in feed zone.
3. automatic testing and sorting machine for wafer according to claim 1 is characterized in that: described rewinding casket is to include the first rewinding casket and the second rewinding casket, to take in bearing according to different brackets the charging tray of surveying wafer has been arranged.
4. automatic testing and sorting machine for wafer according to claim 3; It is characterized in that: the rear side of the described first rewinding casket and the second rewinding casket is to be respectively equipped with first receiving section and second receiving section; Rewinding operation with the intact survey wafer that carries out different brackets; And after charging tray is fully loaded, can charging tray be moved in the first rewinding casket or the second rewinding casket and take in.
5. automatic testing and sorting machine for wafer according to claim 1 is characterized in that: more comprise and be provided with first and second empty boxes, for taking in the sky charging tray and sky charging tray to rewinding casket being provided.
6. automatic testing and sorting machine for wafer according to claim 5; It is characterized in that: the rear side of described first and second empty boxes is to be respectively equipped with second to put the district temporarily and the 3rd put the district temporarily, puts the district temporarily and passes to the rewinding casket and make empty charging tray on first and second empty boxes put district or the 3rd temporarily via second.
7. automatic testing and sorting machine for wafer according to claim 1 is characterized in that: the probe of described testing arrangement is the liftable start, with the contact measured wafer and carry out test jobs.
8. automatic testing and sorting machine for wafer according to claim 1 is characterized in that: described first and second transporter is to be provided with vacuum slot and can be by the pusher shoe of drive source drive displacement, so that wafer is accurately to being positioned on the transporter.
9. automatic testing and sorting machine for wafer according to claim 1 is characterized in that: the fetching device of described fetching device is to do three direction displacements, to pick and place wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710163191A CN101412027B (en) | 2007-10-16 | 2007-10-16 | Automatic testing and sorting machine for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710163191A CN101412027B (en) | 2007-10-16 | 2007-10-16 | Automatic testing and sorting machine for wafer |
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| Publication Number | Publication Date |
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| CN101412027A CN101412027A (en) | 2009-04-22 |
| CN101412027B true CN101412027B (en) | 2012-10-24 |
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| CN200710163191A Active CN101412027B (en) | 2007-10-16 | 2007-10-16 | Automatic testing and sorting machine for wafer |
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| CN102136440B (en) * | 2010-01-26 | 2012-10-10 | 旺矽科技股份有限公司 | Accurate pointing and sorting unit |
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| CN102896093B (en) * | 2012-11-13 | 2014-06-25 | 潍坊永昱电控科技有限公司 | Automatic sorting machine of LED (Light-Emitting Diode) wafer |
| CN103213840A (en) * | 2013-04-01 | 2013-07-24 | 上海功源电子科技有限公司 | Automatic material separating machine |
| TWI560536B (en) * | 2014-06-27 | 2016-12-01 | Mpi Corp | Apparutus of fully-auto loader and control method thereof |
| CN105983543B (en) * | 2015-02-04 | 2019-02-22 | 鸿劲科技股份有限公司 | Electronic components test sorting device |
| CN110239947A (en) * | 2019-07-04 | 2019-09-17 | 范群意 | A kind of wafer automatic testing machine |
| TWI787919B (en) * | 2021-07-23 | 2022-12-21 | 致茂電子股份有限公司 | Multi-layer feeding and binning device and electronic device testing apparatus comprising the same |
| US11740283B2 (en) | 2021-07-23 | 2023-08-29 | Chroma Ate Inc. | Multistory electronic device testing apparatus |
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| CN101412027A (en) | 2009-04-22 |
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Effective date of registration: 20210930 Address after: Taichung City, Taiwan, China Patentee after: HONGJIN PRECISION Co.,Ltd. Address before: Taichung County, Taiwan, China Patentee before: HON TECHNOLOGIES, Inc. |
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