CN101410976B - 带有电气部件的基板的制造方法 - Google Patents

带有电气部件的基板的制造方法 Download PDF

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CN101410976B
CN101410976B CN2007800112838A CN200780011283A CN101410976B CN 101410976 B CN101410976 B CN 101410976B CN 2007800112838 A CN2007800112838 A CN 2007800112838A CN 200780011283 A CN200780011283 A CN 200780011283A CN 101410976 B CN101410976 B CN 101410976B
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electric component
substrate
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supporting substrate
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CN101410976A (zh
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谷口雅树
古田和隆
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Dexerials Corp
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Abstract

本发明涉及用简易方法来制造具有空腔结构的带有电气部件的基板。由于支撑基板(20)和电气部件(31、32)一起连接在底基板(10)的第一面(13)上，所以连接的工序数减少了，缩短了制造时间。在将电气部件(32、33)连接到第二面(14)上时，通过支撑基板(20)支撑底基板(10)，连接于第一面(13)上的电气部件(31、32)不接触处理台(51)而不受损伤。因此，根据本发明，能够以短时间来制造可靠性高的带有电气部件的基板(1)。

Description

带有电气部件的基板的制造方法
技术领域
本发明涉及带有电气部件的基板的制造方法。
背景技术
以往，通信用模块、无线LAN、调谐器这样的电子部件模块，由于搭载于以便携式电话为代表的电子设备中，所以要求小型/薄型。
电子部件模块通常具有用于信号处理等的IC数个和C、R等无源部件或其它异形部件数十个，并将这些部件安装于主板上。
作为电子部件模块，有一种在底(base)基板的表面和背面搭载有电气部件的带有电气部件的基板，作为这种基板的一个例子，是在底基板的表面或背面上形成包围电气部件的环状的基板，在其环内侧的空间(空腔(cavity))连接电气部件。
这种空腔结构由于在组合(build-up)基板的制造工艺中难以制作，所以一般预先在底基板的表面上连接环状基板而形成空腔结构，电气部件在形成空腔结构之后连接于底基板上。
但是，由于在这种方法中是在连接电气部件之前在底基板上形成空腔结构，所以空腔结构会妨碍焊料等连接材料的供给，存在无法通过金属掩模印刷或各向异性导电性薄膜贴附等简易方法供给连接材料的问题。因此，连接材料的供给方法限定于使用分配器(dispenser)的方法，连接材料限定于分配器的排出性良好的物质，而且难以向微细图形供给连接材料。
专利文献1：日本专利申请公开特开平11-45904号公报
专利文献2：日本专利申请公开特开2000-105388号公报
专利文献3：日本专利申请公开特开2002-93933号公报
专利文献4：日本专利申请公开特开2002-359264号公报
专利文献5：日本专利申请公开特开2005-32952号公报
发明内容
发明所要解决的问题
本发明是为了解决上述问题而做成的，其目的是提供一种能够用简易方法来制造具有空腔结构的基板的技术。
用于解决问题的方案
为了解决上述问题，本发明是一种带有电气部件的基板的制造方法，在作为底基板的单面的第一面和作为与上述第一面相反侧的面的第二面上分别连接电气部件，其中，在上述底基板的上述第一面上配置上述电气部件和厚度比上述电气部件厚的支撑基板，将上述电气部件和上述支撑基板一起按压而连接于上述底基板上之后，在用上述支撑基板支撑上述底基板的状态下，将上述电气部件载置于上述第二面上，使上述电气部件连接于上述第二面上。
本发明是带有电气部件的基板的制造方法，上述支撑基板和上述电气部件的按压是将按压橡胶压紧于上述支撑基板和上述电气部件上。
本发明是带有电气部件的基板的制造方法，上述电气部件和上述支撑基板的配置是，以使上述底基板的通孔与上述支撑基板的通孔电连接的方式，使上述电气部件与上述支撑基板进行定位。
本发明是带有电气部件的基板的制造方法，上述支撑基板的俯视形状为环形，在上述支撑基板的环内侧配置上述电气部件。
本发明如上述构成，电气部件和支撑基板通过各向异性导电性粘接剂、各向异性导电性薄膜、糊状(paste)导电材料、低熔点金属(焊料)等连接材料连接到底基板上。
在将电气部件连接到第一面上之前，由于在第一面上也未连接支撑基板，不会对连接材料的配置造成妨碍，所以连接材料的配置方法不限于使用分配器的方法。
发明效果
根据本发明，由于能够一次连接电气部件和支撑基板，与现有技术相比连接工序的数量减少了，所以能够缩短带有电气部件的基板的制造时间。另外，当在连接电气部件或支撑基板的工序中需要加热时，由于连接工序的数量少和对底基板或电气部件加热的次数减少了，所以由加热造成的损害减少了。在将电气部件连接于与支撑基板相反侧的面上时，尽管支撑基板与处理台接触，但是连接于与支撑基板相同的面的电气部件不会接触处理台，因此即使没有特别的支撑夹具也不会损伤电气部件。在按压橡胶变形时，由于按压橡胶的流动被支撑基板阻拦，所以不会引起电气部件的移位，能够获得可靠性高的带有电气部件的基板。
附图说明
图1(a)是底基板的剖视图，(b)是支撑基板的剖视图，(c)是电气部件的剖视图，(d)是电气部件的侧视图。
图2(a)～(c)是说明带有电气部件的基板的制造工序的剖视图。
图3(a)～(c)是说明带有电气部件的基板的制造工序的剖视图。
图4(a)、(b)是说明带有电气部件的基板的制造工序的剖视图。
图5是说明将L字形的支撑基板连接到底基板上的状态的俯视图。
图6是说明将直线状或柱状的支撑基板连接到底基板上的状态的俯视图。
附图标记说明
1：带有电气部件的基板；10：底基板；12：布线膜；13：第一面；14：第二面；16：连接部；20：支撑基板；31、32、33：电气部件；45：粘接剂层
具体实施方式
图4(b)中附图标记1表示通过本发明的制造方法制造的带有电气部件的基板的一例，带有电气部件的基板1具有底基板10和支撑基板20。
底基板10具有基板主体11，在基板主体11的表面和背面上配置有通过构图而形成的布线膜12。
布线膜12具有通过构图而成为宽度较大的连接部16以及通过构图而成为细长的布线部17，连接部16与连接部16之间通过布线部17彼此连接。
在基板主体11的表面配置有电气部件32和此处的异形部件33，在基板主体11的背面配置有电气部件31和厚度比该电气部件31薄的电气部件32。
电气部件31～33具有连接端子36、37，基板主体11表面的电气部件32，在连接端子37与连接部16接触的状态下，通过固化的焊料18固定，异形部件33也通过固化的焊料18固定在连接部16上。
基板主体11背面的电气部件31、32，在连接端子36、37直接地或经由后述的导电性粒子与连接部16接触的状态下，通过硬化的粘接剂层46固定。因此，电气部件31～33在与布线膜12电连接的状态下，还与底基板10机械连接。
在基板主体11上设有从表面贯通至背面的通孔15，在通孔15内部形成有未图示的导电体。在通孔15的两端连接有连接部16，基板主体11表面的布线膜12和背面的布线膜12经由通孔15的导电体而电连接。如上所述，由于电气部件31～33与布线膜12电连接，因此电气部件31～33也与通孔15电连接。
支撑基板20具有基板主体12、在基板主体21上从表面贯通至背面的通孔25以及在通孔25的一端和另一端上形成的布线膜(焊盘)22。
支撑基板20的俯视形状为环形，其环内周的大小小于基板主体11的俯视形状，支撑基板20以利用环内周来包围至少1个电气部件31、32的方式，通过硬化的粘接剂层46固定在基板主体11的背面上。
焊盘22位于通孔25的正上方，位于底基板10的通孔15正上方的连接部16连接于该焊盘22上。因此，底基板10的通孔15与支撑基板20的通孔25以在直线上排列的状态彼此连接。
另外，通孔15、25不限于排列在直线上的情况，也包含底基板10的通孔15不在支撑基板20的通孔25的正上方而处于离开的位置的情况。
如上所述，在底基板10上连接的电气部件31、32，与底基板10的通孔15连接，因此电气部件31、32与支撑基板20的通孔25连接。
这里，在支撑基板20的与底基板10相反侧配置的焊盘22上，配置有用于将通孔25与其它布线板或电气装置连接的焊料球27。
当将底基板10的连接有支撑基板20一侧的面作为第一面13、将与第一面13相反一侧的面作为第二面14时，支撑基板20的厚度大于配置在第一面13上的电气部件31、32。
因此，支撑基板20比电气部件31、32从第一面13更高地突出，在将该带有电气部件的基板1与其它布线板连接时，能够使支撑基板20的焊盘22与布线板的端子抵接，将布线板与带有电气部件的基板1电连接。
其次，对制造上述带有电气部件的基板1的工序进行说明。
图1(a)示出了电气部件31、32与支撑基板20连接前的底基板10，这里底基板10为刚性基板。
在第一面13的连接部16上配置有粘接剂层45，将底基板10载置于载置台48，使第二面14的布线膜12与载置台48的平坦载置面49紧密接触，则第一面13配置在没有凹凸的平面内(图2(a))。
图1(b)～(d)分别表示与底基板10连接前的支撑基板20和电气部件31、32，这里支撑基板20为刚性基板。
底基板10的连接电气部件31、32的部位按每个电气部件31、32而预先确定。当将较厚的电气部件31与较薄的电气部件32分别配置到第一面13上的确定部位时，较厚的电气部件31的连接端子36与较薄的电气部件32的连接端子37隔着粘接剂层45装载到确定的连接部16上。
支撑基板20和底基板10的相对位置关系预先设定。以未图示的对准标记重合的方式，对厚度比电气部件31、32厚的支撑基板20与底基板10进行定位，之后将支撑基板20载置到第一面13上，则支撑基板20的焊盘22隔着粘接剂层45装载到预定的连接部16上(图2(b))。
如上所述，由于支撑基板20比第一面13上的电气部件31、32厚，所以在将支撑基板20和电气部件31、32载置在第一面13上的状态下，支撑基板20的前端与电气部件31、32的前端相比从第一面13更高地突出。
图2(c)的附图标记40表示在金属制的按压板41上装配有按压橡胶42的按压头。
按压橡胶42由弹性体这样的弹性材料构成，当按压头40下降时，首先，按压橡胶42先接触支撑基板20的前端，当进一步下降时，按压橡胶42按压在支撑基板20上，即使对按压橡胶42施加横向力，按压橡胶42的按压于支撑基板20的部分也不会移动，而是相对于支撑基板20成为静止的状态。
如上所述，由于电气部件31、32的厚度不同，所以从第一面13到电气部件31、32前端的高度不同。
按压头40进一步下降，与最厚的电气部件31接触，接着，与厚度薄的电气部件32接触，电气部件31、32被按压橡胶42按压。
此时，按压橡胶42由于电气部件31、32而凹陷，其它部分则相应地膨胀而向电气部件31、32之间的间隙或者电气部件31、32与支撑基板20之间移动，但是由于按压橡胶42的与支撑基板20紧密接触的部分不会移动，所以即使因按压橡胶42的膨胀而产生从支撑基板20的环中心向外侧的力，按压橡胶42也不会从环内侧超越支撑基板20而流到外侧，在外表上不会对电气部件31、32施加横向力。
在电气部件31、32被按压橡胶42按压时，如果在电气部件31、32的周围没有支撑基板20，则按压橡胶42会流到外侧，对电气部件31、32作用向外侧移动的力而引起移位。
这里，电气部件31、32位于支撑基板20的环内侧，电气部件31、32在外表上不会被施加横向力，因此在电气部件31、32和支撑基板20一起被按压橡胶42按压时，电气部件31、32不会横向移动而不会引起电气部件31、32的移位。
粘接剂层45由在粘合剂中分散导电性粒子的各向异性导电性粘接剂构成，当按压支撑基板20和电气部件31、32时，粘接剂层45因按压而被挤出，电气部件31、32的连接端子36、37和支撑基板20的焊盘22直接地或者经由导电性粒子与连接部16抵接，支撑基板20与电气部件31、32电连接在底基板10上。
这里，将加热装置47设置于载置台48，通过加热装置47预先加热载置台48，通过热传递加热粘接剂层45。粘接剂层45的粘合剂含有热硬化性树脂，当粘接剂层45升温到规定温度以上时，热硬化性树脂聚合而使粘接剂层45硬化。
图3(a)示出了在使粘接剂层45硬化后将按压头40与电气部件31、32或支撑基板20离开的状态。
支撑基板20和电气部件31、32通过硬化的粘接剂层45保持电连接于底基板10上而固定，因此支撑基板20和电气部件31、32与底基板10机械连接且电连接。
这里，第一面13的布线膜12位于同一平面内，如上所述，支撑基板20比电气部件31、32厚，因此在支撑基板20和电气部件31、32与底基板10电连接且机械连接的状态下，支撑基板20的前端距离第一面13的高度高于电气部件31、32的前端距离第一面13的高度。
当以使支撑基板20为下侧的方式将连接支撑基板20和电气部件31、32状态的底基板10载置于处理台51的平坦处理面52时，尽管支撑基板20与处理面52接触，但是电气部件31、32成为悬垂于第一面13的状态，在电气部件31、32和处理面52之间存在间隙(图3(b))。
在以使第二面14大致水平的方式配置处理台51的状态下，在第二面14的连接部16上配置焊料膏而形成低熔点金属层18，接着，将电气部件32和异形部件33载置于第二面14上的确定的部位，则电气部件32的连接端子37隔着低熔点金属层18与连接部16相面对，异形部件33也成为装载在连接部16上的状态(图3(c))。
保持第二面14维持大致水平的状态，例如将底基板10与处理台51一起放入回流焊炉中加热，使低熔点金属层18升温到熔点以上，则低熔点金属层18软化，使电气部件32的连接端子37与连接部16抵接，异形部件33也与连接部16抵接，电气部件32和异形部件33与底基板10电连接(图4(a))。
在低熔点金属层18升温时，硬化的粘接剂层46也会升温，但是热硬化性树脂的聚合物至少不会在低熔点金属层18的熔融温度下软化，粘接剂层46会保持硬化，因此第一面13一侧的电气部件31、32不会掉落而能够维持悬垂的状态。
接着对整体冷却而使低熔点金属层18固化，则电气部件32和异形部件33保持与底基板10连接而通过固化的低熔点金属层18固定。因此，电气部件32和异形部件33通过固化的低熔点金属层18与底基板10电连接且机械连接。
接着，若在与底基板10相反一侧的焊盘22上配置焊料球27，则能够获得图4(b)所示的带有电气部件的基板1。
以上，底基板10和支撑基板20不限于刚性基板(例如玻璃环氧基板)，也可以使用挠性布线板。在对支撑基板20使用挠性布线板的情况下，优选在支撑底基板10时不会压缩变形。
在对底基板10使用具有挠性的挠性布线板时，在将底基板10载置于载置台48时，底基板10不会挠曲，在使第一面13位于平面内的状态下，若进行支撑基板20与电气部件31、32的连接，则在将连接有支撑基板20和电气部件31、32的底基板10移载到处理台51时，底基板10不会挠曲而不会使电气部件31、32接触处理台51。
支撑基板20的环形不特别限于四边形、圆形等。其环形或环的大小只要能够配置在底基板10上而避免支撑基板20从第一面13掉落即可，例如环的一部分也可以从底基板10的边缘伸出。
另外，支撑基板20不限于环形，只要能够通过支撑基板20支撑底基板10，则可以是コ字形、L字形、直线状、柱状，但是若支撑基板20是环形，则如上所述能够防止电气部件31、32移位。
电气部件31、32不限于仅在支撑基板20的环内侧配置的情况，也可以将在支撑基板20的环外侧配置的电气部件31、32与支撑基板20或位于支撑基板20的环内侧的电气部件31、32一起连接到底基板10上。
在支撑基板20为L字形的情况下，为了稳定地支撑底基板10，如图5所示，优选在底基板10的第一面13侧连接2个以上的支撑基板20。此外，在支撑基板20为直线状或柱状的情况下，如图6所示，优选在底基板10的第一面13侧空出间隔地连接3个或4个以上支撑基板20。
在支撑基板20为直线状或柱状的情况下，在与第一面13连接的支撑基板20上装配固定器具，使支撑基板20彼此的相对位置关系固定，则即使底基板10为具有挠性的挠性布线板，在通过支撑基板20支撑底基板10时，底基板10也不会产生弯曲。
以上，对于仅在第一面13上连接支撑基板20的情况进行了说明，但是本发明不限于此，也可以在第一、第二面13、14两者上都连接支撑基板20。这种情况下，在将支撑基板20与第一面13连接后，在通过该支撑基板20支撑底基板10的状态下，将支撑基板20与第二面14连接。
以上，虽然对于将电气部件31、32连接到第二面14上的连接材料使用低熔点金属(焊料)并使低熔点金属熔融进行连接的情况进行了说明，但是本发明不限于此。
例如，在底基板10是刚性基板等，在由即使按压也不会变形的基板构成的情况下，当在第二面14上连接电气部件32或异形部件33时，即使按压电气部件32或异形部件33，由于底基板10不会弯曲，因此也能够维持电气部件31、32悬垂于第一面13的状态。
因此，作为在第二面14上连接电气部件32或异形部件33时的连接材料，除了低熔点金属以外，也可以使用热硬化性粘接剂、热塑性粘接剂等。
在第二面14上连接电气部件32或异形部件33时进行加热的情况下，将该加热温度设定为不会使将电气部件31、32固定在第一面13上的连接材料熔融或破坏的温度。
例如，为了在第一面13上连接电气部件31、32，可以使用熔点比在第二面14上连接电气部件32或异形部件33时的加热温度高的低熔点金属、软化温度低于该加热温度的热塑性粘接剂。
本发明中使用的热硬化性粘接剂是在含有热硬化性树脂的粘合剂中分散导电性粒子而成的，热塑性粘接剂是在含有热塑性树脂的粘合剂中分散导电性粒子而成的。另外，如果在热硬化性粘接剂的粘合剂中还含有热塑性树脂，则能够提高热硬化性粘接剂的粘接性。
第一、第二面13、14的连接材料的配置方法没有特别限定，可以采用：使用形成有规定图形的开口的掩模并将连接材料涂敷成规定图形的掩模印刷法、使用分配器排出连接材料的分配器法、贴附薄膜状的连接材料(粘接薄膜)的方法等多种方法。
另外，由于连接材料的配置方法没有限定，因此连接材料的种类也没有限定，可以配合电气部件31、32、33或支撑基板20的特性来选择连接材料。
在底基板10上连接的电气部件31、32例如有半导体芯片、电阻元件等，其种类也没有特别限定。

Claims (4)

1.一种带有电气部件的基板的制造方法，在作为底基板的单面的第一面连接第一电气部件，在作为与上述第一面相反侧的面的第二面上连接第二电气部件，其中，
在上述底基板的上述第一面上配置上述第一电气部件和厚度比上述第一电气部件厚的支撑基板，将上述第一电气部件和上述支撑基板一起按压而连接于上述底基板上之后，在用上述支撑基板支撑上述底基板的状态下，将上述第二电气部件载置于上述第二面上，使上述第二电气部件连接于上述第二面上。
2.如权利要求1记载的带有电气部件的基板的制造方法，其中，上述支撑基板和上述第一电气部件的按压是将按压橡胶压紧于上述支撑基板和上述第一电气部件上。
3.如权利要求1记载的带有电气部件的基板的制造方法，其中，上述第一电气部件和上述支撑基板的配置是，以使上述底基板的通孔与上述支撑基板的通孔电连接的方式，使上述电气部件与上述支撑基板进行定位。
4.如权利要求1记载的带有电气部件的基板的制造方法，其中，上述支撑基板的俯视形状为环形，在上述支撑基板的环内侧配置上述第一电气部件。
CN2007800112838A 2006-03-28 2007-03-26 带有电气部件的基板的制造方法 Expired - Fee Related CN101410976B (zh)

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