CN101398619B - 压印装置 - Google Patents

压印装置 Download PDF

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Publication number
CN101398619B
CN101398619B CN2008102114410A CN200810211441A CN101398619B CN 101398619 B CN101398619 B CN 101398619B CN 2008102114410 A CN2008102114410 A CN 2008102114410A CN 200810211441 A CN200810211441 A CN 200810211441A CN 101398619 B CN101398619 B CN 101398619B
Authority
CN
China
Prior art keywords
chamber
substrate
soft mode
chamber shell
imprinting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008102114410A
Other languages
English (en)
Chinese (zh)
Other versions
CN101398619A (zh
Inventor
朴春成
吴相泽
申泰炅
李真香
郑昌镐
李宰一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weihai dianmei Shiguang electromechanical Co Ltd
Original Assignee
Display Manufacturing Services Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020070117545A external-priority patent/KR100916298B1/ko
Application filed by Display Manufacturing Services Co Ltd filed Critical Display Manufacturing Services Co Ltd
Publication of CN101398619A publication Critical patent/CN101398619A/zh
Application granted granted Critical
Publication of CN101398619B publication Critical patent/CN101398619B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN2008102114410A 2007-09-28 2008-09-22 压印装置 Expired - Fee Related CN101398619B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020070098097 2007-09-28
KR1020070098097A KR100898146B1 (ko) 2007-09-28 2007-09-28 기판에 식각 영역을 만들기 위한 장치
KR10-2007-0098097 2007-09-28
KR1020070117545A KR100916298B1 (ko) 2007-11-16 2007-11-16 기판에 식각 영역을 만들기 위한 장치
KR1020070117545 2007-11-16
KR10-2007-0117545 2007-11-16

Publications (2)

Publication Number Publication Date
CN101398619A CN101398619A (zh) 2009-04-01
CN101398619B true CN101398619B (zh) 2012-04-04

Family

ID=40517253

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008102114410A Expired - Fee Related CN101398619B (zh) 2007-09-28 2008-09-22 压印装置

Country Status (2)

Country Link
KR (1) KR100898146B1 (ko)
CN (1) CN101398619B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103257473B (zh) * 2013-06-03 2016-06-15 郴州市晶讯光电有限公司 一种有减振器的液晶显示屏撒粉装置
CN105034344B (zh) * 2015-06-01 2017-09-29 青岛博纳光电装备有限公司 一种大面积纳米压印软模具复制装置及方法
CN107238957A (zh) * 2017-08-02 2017-10-10 业成科技（成都）有限公司 贴合设备及其贴合方法
JP7066559B2 (ja) * 2018-07-13 2022-05-13 東京エレクトロン株式会社 接合装置および接合方法
CN114505817B (zh) * 2022-03-11 2024-04-19 深圳市凯威达电子有限公司 一种智能照明驱动芯片生产用可精准定位的插接装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685922B1 (ko) * 2002-03-25 2007-02-23 엘지.필립스 엘시디 주식회사 액정표시소자용 합착 장치
KR100550803B1 (ko) * 2004-06-17 2006-02-09 주식회사 에이디피엔지니어링 플라즈마 식각장비
KR101147098B1 (ko) * 2005-06-30 2012-05-17 엘지디스플레이 주식회사 미세 패턴 형성 장치 및 이를 이용한 미세 패턴 형성방법
JP4470923B2 (ja) * 2006-08-02 2010-06-02 株式会社日立プラントテクノロジー 基板組立て装置

Also Published As

Publication number Publication date
KR100898146B1 (ko) 2009-05-19
KR20090032666A (ko) 2009-04-01
CN101398619A (zh) 2009-04-01

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: WEIHAI DIANMEISHI OPTO-MECHATRONICS CO., LTD.

Free format text: FORMER OWNER: DISPLAY PRODUCTION SERVICE CO., LTD.

Effective date: 20140226

COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; TO: 264205 WEIHAI, SHANDONG PROVINCE

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20140226

Address after: 264205 Shandong city in Weihai Province, its economic and Technological Development Zone Road No. 88-1

Patentee after: Weihai dianmei Shiguang electromechanical Co Ltd

Address before: Gyeonggi Do, South Korea

Patentee before: Display Production Service Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120404

Termination date: 20180922