CN101344653A - LCD and its encapsulation - Google Patents
LCD and its encapsulation Download PDFInfo
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- CN101344653A CN101344653A CNA2008101310936A CN200810131093A CN101344653A CN 101344653 A CN101344653 A CN 101344653A CN A2008101310936 A CNA2008101310936 A CN A2008101310936A CN 200810131093 A CN200810131093 A CN 200810131093A CN 101344653 A CN101344653 A CN 101344653A
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- anisotropic conductive
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- lcd
- electronic component
- circuit region
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Abstract
The invention provides an LCD and a corresponding packaging method. The LCD comprises a liquid crystal panel, an anisotropic conductive plastic and a first electronic element. The liquid crystal panel comprises a first base plate, a second base plate and a circuitry; wherein, the first base plate is provided with a peripheral circuit zone and the first base plate is covered by the second base plate and the peripheral circuit zone is exposed. The circuitry is positioned on the peripheral circuit zone. The anisotropic conductive plastic is adopted to cover a range from the edge of the first base plate to the second base plate so as to completely cover the circuitry on the peripheral circuit zone. The first electronic element is arranged on the anisotropic conductive plastic.
Description
Technical field
The invention relates to a kind of LCD, and particularly relevant in the LCD in order to connect the periphery circuit region of external circuit.
Background technology
Along with the progress of optics science and technology with semiconductor technology, liquid crystal indicator (Liquid CrystalDisplayer; LCD) be widely used on the electronic product display device.Advantages such as high image quality, volume are little, in light weight because of having for LCD, low voltage drive, low consumpting power and applied range, so at portable television, mobile phone, shoot with video-corder in consumer electronics such as projector, notebook, console display and projection TV or the computer product, all replaced cathode-ray tube (CRT) (Cathode RayTube; CRT) become the main flow of display.
The main body of general LCD is a liquid crystal panel, and it is made of two transparency carriers and the liquid crystal that is enclosed between the substrate.(for example: driving voltage display card) or signal provide to liquid crystal panel, (the Thin Film TransistorArray Substrate of the thin-film transistor array base-plate in the liquid crystal panel in order to allow external circuit; TFT Array Substrate) can reserve some circuits mostly on periphery circuit region, so that be electrically connected to external circuit.
Yet,,, just be easy to allow circuit lose efficacy, and then influence the Presentation Function of LCD because of oxidation or physical damnification therefore if in the process of making or using, properly protected because these circuits on periphery circuit region are very fragile mostly.
Summary of the invention
Therefore, a technology aspect of the present invention is a kind of method for packing, and it is the liquid anisotropic conductive of complete coating on periphery circuit region, so that the circuit on the protection periphery circuit region makes it not to be vulnerable to oxidation or physically impaired influence.
One embodiment of method for packing according to the present invention comprises the following step:
(1) provide liquid crystal panel, this liquid crystal panel comprises first substrate and second substrate, and wherein first substrate has periphery circuit region, and second substrate then covers first substrate, but exposes periphery circuit region.
(2) anisotropic conductive of liquid state is applied to contact second substrate from the edge of first substrate, with complete covering periphery circuit region.
(3) first electronic component is set on anisotropic conductive.
(4) pressing first electronic component, anisotropic conductive and periphery circuit region.
Another technology aspect of the present invention is for using the made LCD of above-mentioned method for packing.
One embodiment of LCD according to the present invention, a kind of LCD comprises liquid crystal panel, anisotropic conductive and first electronic component.Liquid crystal panel comprises first substrate, second substrate and circuit.Wherein, first substrate has periphery circuit region, and second substrate then covers first substrate, but exposes periphery circuit region.Circuit is positioned on the periphery circuit region.Anisotropic conductive from the edges cover of first substrate to contacting second substrate, with the circuit on the complete covering periphery circuit region.First electronic component is arranged on the anisotropic conductive.
Description of drawings
Fig. 1 illustrates the stereographic map according to the liquid crystal panel of one embodiment of the invention.
Fig. 2 A-Fig. 2 E illustrates the flow process sectional view of the liquid crystal panel of Fig. 1 being implemented method for packing.
Fig. 3 illustrates the local enlarged diagram of Fig. 2 E.
Drawing reference numeral
110: liquid crystal panel
112: the first substrates
113: periphery circuit region
114: the second substrates
116: circuit
120: anisotropic conductive
122: the first conduction regions
124: the first insulation layers
125: conducting particles
126: the second conduction regions
128: the second insulation layers
130: the first electronic components
140: the second electronic components
2-2: profile line
P: pressure
Embodiment
Fig. 1 illustrates the stereographic map according to the liquid crystal panel 110 of one embodiment of the invention.Fig. 2 A-Fig. 2 E illustrates the flow process sectional view of the liquid crystal panel 110 of Fig. 1 being implemented method for packing, and its profile position is shown in the 2-2 profile line of Fig. 1.Should be appreciated that mentioned in the present embodiment step except that chatting bright its order person especially, all can be adjusted its front and back order according to actual needs, even can carry out simultaneously simultaneously or partly.
Please earlier with reference to Fig. 2 A, the fabricator can provide a liquid crystal panel 110 earlier, and this liquid crystal panel 110 comprises first substrate 112 respect to one another and second substrate 114.Wherein, first substrate 112 has periphery circuit region 113, the second substrates 114 and then covers first substrate 112, but exposes periphery circuit region 113.In the present embodiment, above-mentioned liquid crystal panel 110 can be the liquid crystal panel in thin film transistor (TFT)-LCD (TFT-LCD).That is to say that the first above-mentioned substrate 112 can be thin-film transistor array base-plate, the second above-mentioned substrate 114 then can be colored filter substrate (Color Filter Substrate).Generally speaking, first substrate 112 (being thin-film transistor array base-plate) can be reserved some circuits 116 mostly on periphery circuit region 113, makes the driving voltage of external circuit or signal to provide to liquid crystal panel 110 by these circuits 116.
With reference to Fig. 2 B, then the fabricator can be applied to contact second substrate 114 from the edge of first substrate 112 with the anisotropic conductive 120 of liquid state, with complete covering periphery circuit region 113.Above-mentioned anisotropic conductive 120 can be the anisotropy conduction and sticks with paste (Anisotropic Conductive Paste; ACP), anisotropy conduction sticker (Anisotropic Conductive Adhesives; ACA) or both mixing.In the present embodiment, the working temperature of coating anisotropic conductive 120 can be between about 25 ℃ to 85 ℃.But what pay particular attention to is that this operating temperature range is an illustration only, is not that one of ordinary skill in the art should (for example: the kind of anisotropic conductive 120), elasticity be adjusted this operating temperature range according to the actual process situation in order to restriction the present invention.
Should be appreciated that, " pact " but be in order to modifying the quantity of any slight variations, but this slight variations can't change its essence.For instance, " working temperature of coating anisotropic conductive 120 can be between about 25 ℃ to 85 ℃ ", this one describe except the working temperature of representing above-mentioned application step really between 25 ℃ to 85 ℃, as long as when the application step practical operation, anisotropic conductive 120 can keep liquid and not solidify, and the working temperature of application step also can be slightly larger than 85 ℃ or be slightly less than 25 ℃.
With reference to Fig. 2 C, the fabricator can be provided with first electronic component 130 on anisotropic conductive 120 then.This first electronic component 130 for example can be integrated circuit (IC) chip.Certainly, the fabricator can be provided with second electronic component 140 at this moment in addition on anisotropic conductive 120, and this second electronic component 140 for example can be flexible printed wiring board.
With reference to Fig. 2 D, then the fabricator can be to first electronic component 130 P that exerts pressure, with pressing first electronic component 130, anisotropic conductive 120 and periphery circuit region 113.Certainly, if the fabricator has second electronic component 140 is set in addition on anisotropic conductive 120 in previous step is rapid, this moment also can be in the lump to second electronic component 140 P that exerts pressure, with pressing second electronic component 140, anisotropic conductive 120 and periphery circuit region 113.In the present embodiment, the fabricator is the same to 140 applied pressure P of first electronic component 130 and second electronic component, all between about 2Mpa to 6Mpa.
Should be appreciated that, though present embodiment is in the lump to first electronic component 130 and second electronic component 140 P that exerts pressure, but this does not limit the present invention, one of ordinary skill in the art also can be according to the actual process situation (for example: the compression capability of first electronic component 130 and second electronic component 140), respectively first electronic component 130 and second electronic component 140 are exerted pressure.
Similarly, " pact " but be in order to modifying the quantity of any slight variations, but this slight variations can't change its essence.For instance, " fabricator is to first electronic component 130 and 140 applied pressure P of second electronic component ... all between about 2Mpa to 6Mpa ", this description is except representing the above-mentioned pressing step applied pressure P of institute really between 2Mpa to 6Mpa, as long as pressing first electronic component 130/ second electronic component 140, anisotropic conductive 120 and periphery circuit region 113 really, the applied pressure P of pressing step institute also can be slightly larger than 6Mpa or be slightly less than 2Mpa.
At last, solidify anisotropic conductive 120, can obtain the LCD that is illustrated as Fig. 2 E.More than comprehensive, because present embodiment has been coated with full anisotropic conductive 120 on periphery circuit region 113, so the circuit on the periphery circuit region 113 116 will be subjected to appropriate protection because of anisotropic conductive 120, not need to go up in addition protection glue again.
Another technology aspect of the present invention is for using the made LCD of above-mentioned method for packing.Shown in Fig. 2 E, this LCD comprises liquid crystal panel 110, anisotropic conductive 120 and first electronic component 130.Liquid crystal panel 110 comprises first substrate 112, second substrate 114 and circuit 116.Wherein, first substrate 112 has periphery circuit region 113, the second substrates 114 and then covers first substrate 112, but exposes periphery circuit region 113.Circuit 116 is positioned on the periphery circuit region 113.Anisotropic conductive 120 to contacting second substrate 114, with complete covering periphery circuit region 113, and is positioned at circuit 116 on the periphery circuit region 113 from the edges cover of first substrate 112.First electronic component 130 is arranged on the anisotropic conductive 120.
In the present embodiment, the first above-mentioned electronic component 130 may be selected to be integrated circuit (IC) chip.Certainly, one of ordinary skill in the art also can be provided with at least one second electronic component 140 in addition according to actual needs on anisotropic conductive 120, for example: flexible printed wiring board.
Can comprise conducting particles and insulating gel material in the anisotropic conductive 120 of Fig. 2 E.Under the situation of pressurized not, conducting particles can not contact to each other, so anisotropic conductive 120 will maintain state of insulation.(for example: the pressure P of Fig. 2 D) put on the anisotropic conductive 120, conducting particles will be oppressed and be contacted with each other, and and then the characteristic of giving anisotropic conductive 120 vertical conductings in case the fabricator is with suitable pressure.
Fig. 3 illustrates the local enlarged diagram of Fig. 2 E.As shown in the figure, anisotropic conductive 120 can have first conduction region 122 and first insulation layer 124.Wherein, first conduction region, 122 electrical connection first electronic components 130 (being integrated circuit (IC) chip) and circuit 116, the first insulation layers 124 are then between first conduction region 122 and second substrate 114, so that the function of insulation to be provided.Particularly, the influence of P (illustrating) because first conduction region 122 is under pressure as Fig. 2 D, therefore conducting particles 125 wherein will contact with each other and conducting first electronic component 130 (being integrated circuit (IC) chip) and circuit 116., therefore will can not contact to each other and maintain state of insulation because the effect that is not under pressure as for 125 of conducting particless in first insulation layer 124.
If the fabricator is provided with second electronic component 140 in addition on anisotropic conductive 120, then anisotropic conductive 120 has second conduction region 126 and second insulation layer 128 with other.Wherein, second conduction region, 126 electrical connection second electronic components 140 (being flexible printed wiring board) and circuit 116, the second insulation layers 128 are then between first conduction region 122 and second conduction region 126, so that the function of insulation to be provided.Similarly, the influence of P (illustrating) because second conduction region 126 is under pressure as Fig. 2 D, therefore conducting particles 125 wherein will contact with each other and conducting second electronic component 140 (being flexible printed wiring board) and circuit 116., therefore will can not contact to each other and maintain state of insulation because the effect that is not under pressure as for 125 of conducting particless in second insulation layer 128.
Though the present invention discloses as above with embodiment; right its is not in order to qualification the present invention, any one of ordinary skill in the art, without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention attached claim person of defining before looking is as the criterion.
Claims (16)
1. method for packing comprises:
One liquid crystal panel is provided, and this liquid crystal panel comprises one first substrate and one second substrate, and wherein this first substrate has a periphery circuit region, and this second substrate then covers this first substrate, but exposes this periphery circuit region;
One anisotropic conductive of liquid state is applied to this second substrate of contact from the edge of this first substrate, with this periphery circuit region of complete covering;
At least one first electronic component is set on this anisotropic conductive; And
This first electronic component of pressing, this anisotropic conductive and this periphery circuit region.
2. method for packing as claimed in claim 1 is characterized in that, the working temperature that is coated with this anisotropic conductive is between about 25 ℃ to 85 ℃.
3. method for packing as claimed in claim 1 is characterized in that, this first electronic component of pressing, this anisotropic conductive and this periphery circuit region institute applied pressure are between about 2Mpa to 6Mpa.
4. method for packing as claimed in claim 1 more comprises:
At least one second electronic component is set on this anisotropic conductive; And
This second electronic component of pressing, this anisotropic conductive and this periphery circuit region.
5. method for packing as claimed in claim 4 is characterized in that, this second electronic component of pressing, this anisotropic conductive and this periphery circuit region institute applied pressure are between about 2Mpa to 6Mpa.
6. a LCD is characterized in that, this LCD comprises:
One liquid crystal panel comprises:
One first substrate has a periphery circuit region;
One second substrate covers this first substrate, but exposes this periphery circuit region; And
At least one circuit is positioned on this periphery circuit region;
One anisotropic conductive, from the edges cover of this first substrate to contacting this second substrate, with this circuit on this periphery circuit region of complete covering; And
At least one first electronic component is arranged on this anisotropic conductive.
7. LCD as claimed in claim 6 is characterized in that, this periphery circuit region of the complete covering of this anisotropic conductive.
8. LCD as claimed in claim 6 is characterized in that, this anisotropic conductive has one first conduction region, is electrically connected this first electronic component and this circuit.
9. LCD as claimed in claim 8 is characterized in that, has a plurality of conducting particless in this first conduction region, this first electronic component of conducting and this circuit.
10. LCD as claimed in claim 8 is characterized in that, this anisotropic conductive has one first insulation layer, between this first conduction region and this second substrate.
11. LCD as claimed in claim 10 is characterized in that, has a plurality of conducting particless in this first insulation layer, so those conducting particless are insulated from each other.
12. LCD as claimed in claim 6 is characterised in that, this LCD more comprises:
At least one second electronic component is arranged on this anisotropic conductive.
13. LCD as claimed in claim 12 is characterized in that, this anisotropic conductive has one second conduction region, is electrically connected this second electronic component and this circuit.
14. LCD as claimed in claim 13 is characterized in that, has a plurality of conducting particless in this second conduction region, this second electronic component of conducting and this circuit.
15. LCD as claimed in claim 12 is characterized in that, this anisotropic conductive has one second insulation layer, between this first conduction region and this second conduction region.
16. LCD as claimed in claim 15 is characterized in that, has a plurality of conducting particless in this second insulation layer, so those conducting particless are insulated from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101310936A CN101344653A (en) | 2008-08-21 | 2008-08-21 | LCD and its encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101310936A CN101344653A (en) | 2008-08-21 | 2008-08-21 | LCD and its encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101344653A true CN101344653A (en) | 2009-01-14 |
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ID=40246676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101310936A Pending CN101344653A (en) | 2008-08-21 | 2008-08-21 | LCD and its encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101344653A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102413644A (en) * | 2010-09-24 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module |
| CN107015391A (en) * | 2017-04-26 | 2017-08-04 | 武汉华星光电技术有限公司 | Liquid crystal display panel and its compression method and liquid crystal display |
| CN109254430A (en) * | 2018-11-12 | 2019-01-22 | 成都中电熊猫显示科技有限公司 | A kind of panel compression bonding method and compression bonding apparatus |
-
2008
- 2008-08-21 CN CNA2008101310936A patent/CN101344653A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102413644A (en) * | 2010-09-24 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module |
| CN102413644B (en) * | 2010-09-24 | 2013-11-27 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module |
| CN107015391A (en) * | 2017-04-26 | 2017-08-04 | 武汉华星光电技术有限公司 | Liquid crystal display panel and its compression method and liquid crystal display |
| CN109254430A (en) * | 2018-11-12 | 2019-01-22 | 成都中电熊猫显示科技有限公司 | A kind of panel compression bonding method and compression bonding apparatus |
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Open date: 20090114 |