CN101324472A - Method for manufacturing embedded type multi-layer compound film cutting temperature sensor - Google Patents

Method for manufacturing embedded type multi-layer compound film cutting temperature sensor Download PDF

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CN101324472A
CN101324472A CNA2008100123561A CN200810012356A CN101324472A CN 101324472 A CN101324472 A CN 101324472A CN A2008100123561 A CNA2008100123561 A CN A2008100123561A CN 200810012356 A CN200810012356 A CN 200810012356A CN 101324472 A CN101324472 A CN 101324472A
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film
nicr
nisi
thermocouple
cutting
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CN100582698C (en
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孙宝元
孙奉道
崔云先
钱敏
张军
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Dalian University of Technology
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Dalian University of Technology
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Abstract

The invention relates to a method for manufacturing an embedded multi-layer composite thin-film cutting temperature sensor, in particular to a method for measuring the transient cutting temperature of a cutter point during cutting and manufacturing, and belongs to the temperature sensor field. SiO2 insulating film deposition on a cutter body is carried out for a plurality of times, so as to form a multi-layer composite thin film; then a thin-film thermocouple is formed through sputtering deposition of a NiCr thin-film electrode and a NiSi thin-film electrode; and then the prepared thin-film thermocouple is embedded into a protective layer. The radio-frequency reactive unbalanced magnetron sputtering technology is enhanced by adopting a microwave ECR plasma; the prepared thin-film thermocouple is embedded into the protective layer, so as to be prepared into an embedded multi-layer composite thin-film temperature measurement sensor integrating the cutting and the temperature measurement. The sensor has the advantages of long service life and cost-effectiveness. The thermocouple has the advantages of minimum size of a hot end and short response time, thereby achieving the submicrosecond level. A compensation conducting wire is hidden in a cutter head, so that the anti-interference capability is strong. Therefore, the cutting temperature of the cutter point can be measured rapidly, accurately and stably by the method.

Description

The method for making of embedded type multi-layer compound film cutting temperature sensor
Technical field
The invention belongs to the temperature sensor field, the measuring method of cutter point of a knife place transient cutting temp of cutting when relating to cut.
Background technology
Owing to produce a large amount of heat in metal cuttings in the high-speed machining process, cutting temperature is raise, directly influence workpiece thermal deformation, machined surface quality, cutter rake face built-up edge generation and disappear and cutter life etc., so monitor crudy and the cutter duty that cutting temperature can obtain workpiece quickly and accurately.
The method of at present more common measurement cutting temperature has: natural thermocouple, artificial thermopair, far infrared radiation method, metal micro structure and microhardness changing method etc.What natural thermocouple method was measured is the medial temperature of cutting zone, and the cutting temperature of utilizing this method to record is easy to be reliable.But a kind of cutter material of every change or workpiece material just need to demarcate again.Artificial thermopair can only be measured the temperature from rake face a distance point, and can not directly measure the temperature on the rake face.The far infrared radiation method is applicable to remote noncontact monitoring object surface temperature under the rugged surroundings, and above-mentioned numerous measuring methods all each have its relative merits and suitable application area, but all can't directly measure the cutting temperature at point of a knife place.Because cutting zone is hidden is in semi-closed state between point of a knife and workpiece, common temp measuring method can't touch, can only be by setting up three-dimensional heat conduction model, and Gauss's thermal source formula is for example derived the temperature at point of a knife place.Though temperature that obtains the point of a knife place and thermograde that a large amount of sunykatuib analyses and heat conduction model result of calculation can be similar to, all there is many-sided hypothesis in the foundation of all these models, and the precision of analysis result is difficult to be guaranteed.
Film thermocouple is the temperature sensor that a kind of advanced person's of rise in modern age measurement transient temperature changes, and is widely applied to the temperature survey of firearm chamber inwall, internal combustion engine end face, forging film surface and shuttle motor inwall.US National Aeronautics and Space Administration's Lewis Research Center is devoted for years in the applied research of film thermocouple under rugged surroundings such as high temperature, high pressure, chemical corrosion.Through years of development, film thermocouple is no matter be that size or volume are all very small, and the response time is extremely short even tens ns are only arranged, and can stablize to such an extent that work reliably and with long-term under rugged surroundings.
At present the research of the cutting temperature during applied film thermocouple measurement cutting metal is fewer.People's deposit film thermopairs on the rake face of sintex such as Ali Basti of Japan, sputter HfO on the film thermocouple 2As insulation course, cutting such as sputtered with Ti AlSiN coating more afterwards.But sintex application percentage in factory is smaller, and the wearing and tearing of rake face are more violent relatively, makes two coatings on the thin film thermoelectric double-layer, can hinder the transmission of heat in metal cutting, reduces the measuring accuracy of sensor.And hot junction has certain distance from point of a knife, not the cutting temperature at energy measurement point of a knife place.The people such as Ceng Qiyong of sensing observing and controlling research institute of Dalian University of Technology adopt branch blade type structure, make film thermocouple in last lower knife body junction, and hot junction directly is produced on the point of a knife.Though this film thermocouple can be measured the cutting temperature at point of a knife place accurately, it is soft nonmetal to divide blade structure only to be fit to cutting, and the crack of branch blade is filled in smear metal during cutting metal, and wearing and tearing thermoelectricity occasionally makes the thermopair short circuit.Therefore this paper invents a kind ofly based on hard alloy substrate, makes SiO on knife face behind the cutter 2Multilayer insulating film, the sputtered film thermopair deposits Si at last afterwards 3N 4Protective seam is embedded in the sensor film thermocouple.The hot junction of film thermocouple directly plating is put at the point of a knife place, can measure the cutting temperature at point of a knife place accurately; Be produced on behind the cutter on the knife face, it is slight relatively to wear and tear, and makes protective seam again, more can prolong the life-span of sensor.
Summary of the invention
The technical problem to be solved in the present invention is to develop a kind of embedded film thermocouple thermometric cutter sensor, and collection cutting, thermometric are one, can be used to measure quickly and accurately the cutting temperature at point of a knife place.Point of a knife place's temperature survey in the time of can solving the cutting explosive material owing to use damascene structures effectively to protect sensor, can be convenient for measuring the high-speed cutting temperature of thin-walled non-ferrous alloy.
The preparation method of a kind of embedded type multi-layer compound film cutting temperature sensor of the technical solution used in the present invention, the step of its making is as follows:
1, utilize accurate line cutting numerically-controlled machine high-speed steel or carbide cutter tool piece to be processed into the cutter hub 1 of standard clamped cutting bit sheet form, leave a groove C in cutter hub 1 bottom, back knife face A sanding and polishing with cutter hub (1), use the diamond paste looking-glass finish of granularity at last less than 0.1 μ m, cutter hub 1 is put into acetone, alcohol or resistance respectively greater than 13M Ω deionized water, use ultrasonic cleaning, put into vacuum chamber after cutter hub 1 usefulness nitrogen is dried up;
2, adopt the microwave ECR plasma source to strengthen radio frequency reaction non-balance magnetically controlled sputter technology, operation in the following order: highly purified Si target is installed, is vacuumized, plasma sputtering cleans, and sputtering sedimentation cools off with stove; At last at cutter hub 1 back knife face A sputtering sedimentation ground floor SiO 2 Dielectric film 2; To make SiO 2The cutter hub 1 of dielectric film 2 is put into the alcohol ultrasonic cleaning, and then puts vacuum chamber into, and sputter is twice under identical parameters; I.e. sputter three times under identical parameters forms three layers of compound inslation film;
3, unloading Si target is installed the NiCr target; Give and made SiO 2The cutter hub 1 of dielectric film 2 is installed the mask of NiCr, covers the position that does not need plated film; Adopt the microwave ECR plasma source to strengthen radio frequency reaction non-balance magnetically controlled sputter technology, sputtering sedimentation NiCr membrane electrode 3 after the stove cooling, takes out and puts into the alcohol ultrasonic cleaning; Unloading NiCr target is installed the NiSi target, and is taken off the NiCr mask, replaces with the NiSi mask, adopts the microwave ECR plasma source to strengthen radio frequency reaction non-balance magnetically controlled sputter technology, continues deposition NiSi film 4; Form the hot junction B of film thermocouple by NiCr and NiSi double-layer films at the point of a knife place;
4, the Si target is installed, on the cold junction of NiCr membrane electrode 3, is made the mask of a circle, also make the mask of a circle at the cold junction of NiSi film 4 simultaneously; Making SiO 2On the high-speed steel or wimet cutter hub 1 of dielectric film 2, NiCr film 3, NiSi film 4, utilize the microwave ECR plasma source to strengthen the radio frequency reaction non-balance magnetically controlled sputter and cover Si 3N 4 Protective seam 5 is embedded into the film thermocouple of making in the protective seam; Remove above-mentioned two masks, the cold junction of membrane electrode exposes out;
5, with the cold junction exposed locations bonding of high temperature resistant conductive silver glue 6 with NiCr thermocouple wire 7 with the NiCr film 3 of φ 0.2mm; With the cold junction exposed locations bonding of NiSi thermocouple wire 8 with NiSi film 4;
6, NiCr thermocouple wire 7 and NiSi thermocouple wire 8 are drawn by groove C, groove C insulating gel 9 embeddings, and the cutting of formation collection, thermometric are the embedded type multi-layer compound film temperature probe of one at last.
Remarkable result of the present invention: the cutting of embedded film thermocouple thermometric cutter set of sensors, thermometric be in one, be sensor be again actuator.Embedded film thermocouple skin has high hardness spray coating protection, the serviceable life of having improved sensor, good economy performance.The pyrometer fire-end size is minimum, and the response time is short, can reach the submicrosecond level.Compensating wire is hidden in the cutter head, and antijamming capability is strong.Therefore can fast, accurately, stably measure the cutting temperature at point of a knife place.
Description of drawings
Accompanying drawing 1 is film thermocouple arrangement of temperature sensor figure.Accompanying drawing 2 is SiO 2The location drawing of dielectric film and film thermocouple knife face behind cutter.Accompanying drawing 3 is that the multi-layer compound film thermopair embeds relation structure diagram, wherein 1-high-speed steel or wimet cutter hub, 2-SiO 2Dielectric film, 3-NiCr membrane electrode, 4-NiSi membrane electrode, 5-Si 3N 4Protective seam, the high temperature resistant conductive silver glue of 6-, 6 '-high temperature resistant conductive silver glue, 7-NiCr compensating wire, 8-NiSi compensating wire, 9-insulating gel; B-film thermocouple hot junction, the C-groove.
Accompanying drawing 4 film thermocouple temperature sensors and knife bar wiring layout.Wherein 1-high-speed steel or wimet cutter hub, 7-NiCr compensating wire, 8-NiSi compensating wire, 10-knife bar, 11-be by cut spare, 12-pressing plate, 13-mica sheet, 14-plate washer.
Embodiment
Below in conjunction with technical scheme and accompanying drawing, describe specific implementation process of the present invention in detail, it is as follows to make embedded film thermocouple thermometric cutter sensor concrete steps:
The first step: preparation cutter hub 1
When adopting high speed steel material, with accurate wire cutting machine tool high speed steel tool bit is processed into the cutter hub 1 of standard clamped cutting bit sheet form, as shown in Figure 1.Knife face A grinds from coarse to fine with № 240, № 400, № 600, № 800, № 1000 waterproof abrasive papers respectively with cutter hub 1 back, is polished to minute surface with granularity less than the water-soluble diamond paste of 0.1 μ m at last.When adopting Hardmetal materials, the wimet tool section is processed into standard clamped cutting bit sheet form cutter hub 1 with accurate wire cutting machine tool, as shown in Figure 1; Blade 1 back knife face A is used the polishing of high speed boart boart turbine, be polished to minute surface with granularity less than the water-soluble diamond paste of 0.1 μ m at last.During cleaning, earlier with acetone, alcohol wash, use resistance value greater than 13M Ω washed with de-ionized water again high-speed steel or wimet cutter hub 1, it all is to finish on supersonic wave cleaning machine that three steps cleaned, and puts into vacuum chamber after drying up with nitrogen and closes tight.
Second step: carry out SiO 2Insulator film deposition:
1), vacuumize, open slowly to open behind the mechanical pump and take out valve in advance and slightly vacuumize, when vacuum tightness reaches 17Pa, open molecular pump, and close and take out valve in advance, the molecular pump rotating speed begins to increase, until 24000 rev/mins, vacuum chamber bled reaches 5.0 * 10 up to vacuum tightness -3Below the Pa.
2), sputter clean; Open circulating cooling system, regulate D08-3C/ZM triple channel Flow Measurement Display Meter, feeding purity to vacuum chamber is 99.999% Ar gas, and controlling its flow is certain value, open GNL-120 type ECR magnetic field power supply, two power supplys make electric current be approximately 77A about the adjusting vacuum chamber.Open the program control microwave source of MPG-2010C type, programming is set to mode of operation 1, microwave power P=850W, and the time is provided with as required, starts preheated one-section and exports microwave after the time.Open and be added in on-chip SY type 500W radio frequency power source, the self-bias that produces on substrate is for-200V or add dc negative bias voltage, like this Ar +The high fast direction substrate of ion is carried out sputter clean about 10 minutes to substrate.
3), sputtering sedimentation; Regulate matching capacitance, self-bias is reduced to-90V~-80V between.Feed the O of certain flow 2Gas, its purity are 99.999%, vacuum tightness 1.1 * 10 at this moment -1This air pressure of Pa is called sputtering pressure.Open the radio frequency power source that is added on the target, regulate matching capacitance, make incident power P Go into=250W~350W, reflective power P Instead≤ 5W.On target, form self-bias and be-340V~-370V, at this moment can see the glow discharge phenomenon that vacuum chamber is interior, Ar +The ion bombarded silicon target, the silicon atom or the atomic group that sputter rush at substrate, at A face and O 2React and generate SiO 2Be deposited on the A surface, form SiO 2 Dielectric film 2.
4), with stove cooling according to the sputtering sedimentation time of setting, microwave source can automatically reset, plated film finishes.Close substrate radio frequency source, silicon target radio frequency source, magnetic field power supply, vacuum meter, molecular pump, O successively 2Gas and Ar gas, push-pull valve, shutdown valve.Molecular pump remains in operation under inertia and damping and effect, treats to close its power supply and circulating water cooling system after it stops.Workpiece can take out with the vacuum chamber cooling in about 2 hours.
The 3rd step: film thermocouple electrode NiCr and NiSi depositing of thin film
The deposition process of thermopair electrode film and SiO 2Thin film deposition is basic identical.Be divided into cleaning, vacuumize, sputter clean, sputtering sedimentation, with five steps of stove cooling.When a utmost point of blade 1 back knife face A deposition thermopair film, to cover up the place that does not need to plate NiCr film 3 with mask earlier; During plating NiSi film 4, need change another kind of target and corresponding mask.Two kinds of masks all form with stainless steel material warp cutting processing and sanding and polishing.Two masks have 1 * 3.5mm at the point of a knife place 2The coincidence zone, be film thermocouple hot junction B behind the plated film herein.Use two little square-masks the pin pad locations of film thermocouple to be covered magnetron sputtering Si 3N 4 Protective seam 5.
The 4th step: embedded film thermometric cutter sensor assembling
With the NiCr compensating wire 7 and membrane electrode 3 exposed pads bonding of high temperature resistant conductive silver glue 6, again with NiSi compensating wire 8 and membrane electrode 4 exposed pads bonding with φ 0.2mm.NiCr compensating wire 7 and NiSi compensating wire 8 are drawn by groove C, and groove C becomes the collection cutting after with insulating gel 9 embeddings, thermometric is the embedded type multi-layer compound film temperature sensor of one; As accompanying drawing 1, shown in the accompanying drawing 2.
During use, cutter head is contained on the pressure type clamped cutting bit bar 10, clamps with pressing plate 12.Insulate with mica sheet 13 between cutter head 1 and the knife bar 10.NiCr compensating wire 7, NiSi compensating wire 8 are drawn from knife bar 10 manufactured holes and groove, with baffle plate 14 sealings.NiCr compensating wire 7, NiSi compensating wire 8 link by twin-core shielding line and amplifying circuit and data acquisition, analyzing and processing link.During cutting, because the heat in metal cutting that produces raises the hot-side temperature of film thermocouple, the thermoelectrical potential in the loop is after subsequent conditioning circuit is handled and amplified.Send into computing machine through the high-speed collection card collection and convert temperature output to.

Claims (1)

1, the method for making of a kind of embedded type multi-layer compound film cutting temperature sensor of the present invention is characterized in that: carry out repeatedly SiO on cutter hub 2Insulator film deposition forms multi-layer compound film, and sputtering sedimentation NiCr membrane electrode (3) is formed film thermocouple with NiSi membrane electrode (4) then, and the film thermocouple of making is embedded in the protective seam, and the step of its making is as follows:
1), utilize accurate line cutting numerically-controlled machine high-speed steel or carbide cutter tool piece to be processed into the cutter hub (1) of standard clamped cutting bit sheet form, leave a groove (C) in cutter hub (1) bottom, back knife face (A) sanding and polishing with cutter hub (1), use the diamond paste looking-glass finish of granularity at last less than 0.1 μ m, cutter hub (1) is put into acetone, alcohol or resistance respectively greater than 13M Ω deionized water, use ultrasonic cleaning, put into vacuum chamber after cutter hub (1) is dried up with nitrogen;
2), adopt the microwave ECR plasma source to strengthen radio frequency reaction non-balance magnetically controlled sputter technology, operation in the following order: highly purified Si target is installed, is vacuumized, plasma sputtering cleans, and sputtering sedimentation cools off with stove; At last at cutter hub (1) back knife face (A) sputtering sedimentation ground floor SiO 2Dielectric film (2); To make SiO 2The cutter hub (1) of dielectric film (2) is put into the alcohol ultrasonic cleaning, and then puts vacuum chamber into, and sputter is twice under identical parameters; I.e. sputter three times under identical parameters forms three layers of compound inslation film;
3), unload Si target, installation NiCr target; Give and made SiO 2The cutter hub (1) of dielectric film (2) is installed the mask of NiCr, covers the position that does not need plated film; Adopt the microwave ECR plasma source to strengthen radio frequency reaction non-balance magnetically controlled sputter technology, sputtering sedimentation NiCr membrane electrode (3) after the stove cooling, takes out and puts into the alcohol ultrasonic cleaning; Unloading NiCr target is installed the NiSi target, and is taken off the NiCr mask, replaces with the NiSi mask, adopts the microwave ECR plasma source to strengthen radio frequency reaction non-balance magnetically controlled sputter technology, continues deposition NiSi membrane electrode (4); Form film thermocouple by NiCr membrane electrode (3) and NiSi membrane electrode (4), and form the hot junction (B) of film thermocouple at the point of a knife place by NiCr and NiSi double-layer films;
4), the Si target is installed, on the cold junction of NiCr membrane electrode (3), make the mask of a circle, also make the mask of a circle at the cold junction of NiSi film (4) simultaneously; Making SiO 2On the high-speed steel or wimet cutter hub (1) of dielectric film (2), NiCr film (3), NiSi film (4), utilize the microwave ECR plasma source to strengthen the radio frequency reaction non-balance magnetically controlled sputter and cover Si 3N 4Protective seam (5) is embedded into the film thermocouple of making in the protective seam; Remove above-mentioned two masks, the membrane electrode cold junction partly exposes;
5), with the cold junction exposed locations bonding of high temperature resistant conductive silver glue (6) with NiCr thermocouple wire (7) with the NiCr film (3) of φ 0.2mm; Use high temperature resistant conductive silver glue (6 ') with the cold junction exposed locations bonding of NiSi thermocouple wire (8) simultaneously with NiSi film (4);
6), NiCr thermocouple wire (7) and NiSi thermocouple wire (8) draw by groove (C), groove (C) is with insulating gel (9) embedding, makes the collection cutting at last, thermometric is the embedded type multi-layer compound film temperature probe of one.
CN200810012356A 2008-07-14 2008-07-14 Method for manufacturing embedded type multi-layer compound film cutting temperature sensor Expired - Fee Related CN100582698C (en)

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