CN101305516B - Method for manufacturing sound boundary wave apparatus, and sound boundary wave apparatus - Google Patents
Method for manufacturing sound boundary wave apparatus, and sound boundary wave apparatus Download PDFInfo
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- CN101305516B CN101305516B CN2006800415959A CN200680041595A CN101305516B CN 101305516 B CN101305516 B CN 101305516B CN 2006800415959 A CN2006800415959 A CN 2006800415959A CN 200680041595 A CN200680041595 A CN 200680041595A CN 101305516 B CN101305516 B CN 101305516B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/0222—Details of interface-acoustic, boundary, pseudo-acoustic or Stonely wave devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/09—Elastic or damping supports
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
This invention provides a method for manufacturing an elastic boundary wave apparatus in which an external terminal in an elastic boundary wave element and a part for electrically connecting the external terminal to the external are reliably reinforced, and, at the same time, the entry of moisture and the like through the interface of the first and second media in the elastic boundary wave element is less likely to take place. This method comprises the steps of providing a curing resin sheet in which at least one via hole electrode (20a, 20b) is provided so as to extend from one main plane tothe other main plane, providing an elastic boundary wave element (10) provided on one main plane of the curing resin sheet so that the external terminals (16a, 16b) in the elastic boundary wave element (10) are electrically connected to the via hole electrodes (20a, 20b), then pushing the elastic boundary wave element (10) into the curing resin sheet so that the curing resin sheet covers at leasta part, which appears on the outer surface of the boundary between the first and second media (11, 12) in the elastic boundary wave element (10), and then curing the curing resin sheet to prepare a resin sheet cured product (18).
Description
Technical field
The present invention relates to have utilized the manufacturing approach and the acoustic interfacial wave device of the acoustic interfacial wave device of the acoustic boundary wave of propagating at first, second vectorial interface; More specifically, relate to and improved manufacturing approach and the acoustic interfacial wave device that is used for the acoustic interfacial wave device of the structure of acoustic boundary wave component productsization.
Background technology
In the past, mobile phone with RF filter and VCO with resonator or TV receiver VIF filter etc. in, adopted various acoustic surface wave devices.On the other hand, because acoustic interfacial wave device is compared with surface acoustic wave, not only can realize the simplification of packaging structure, and can promote miniaturization, so get most of the attention.
In following patent documentation 1, a kind of acoustic boundary wave element shown in Figure 12 is disclosed for example.In the acoustic boundary wave element 501, IDT electrode 504 and reflector 505,506 are arranged in the interface configurations of first medium 502 and second medium 503.And range upon range of on second medium 503 have a sound absorbing layer 507.
And, for the acoustic boundary wave element chip 512 that is covered, improve anti-environmental characteristicses such as moisture-proof, be provided with outer dress resin bed 518.
Patent documentation 1:WO2005/069486A1
In acoustic interfacial wave device 511,, preferably in the A of space, fill bottom potting resin (underfill resin) for the state that above-mentioned acoustic boundary wave element 512 is engaged with substrate 513 keeps stablely.For example, when in semiconductor device etc., carrying semiconductor element chip on the substrate,, can fill above-mentioned bottom potting resin mostly in order to strengthen the electrical connections of convexity etc. through convexity etc.
Yet, in the acoustic interfacial wave device 511 that patent documentation 1 is put down in writing, utilize protruding 514a, 514b that acoustic boundary wave element chip 512 is engaged with substrate 513, be provided with space A, but be difficult in the A of this space, fill the bottom potting resin.Even want before forming outer dress resin bed 518, to fill the bottom potting resin, because the space between protruding 514a, 514b is little and gap space A is also very little, so, potting resin bottom being difficult to fill reliably.
Under the insufficient situation of the filling of bottom potting resin; When acoustic interfacial wave device 511 being installed to tellite etc. through reflow soldering method etc.; Under the situation that protruding 514a, 514b are made up of scolding tin, because of the protruding 514a of the heat that is endowed, 514b meeting local dissolution.Therefore, might cause protruding 514a and protruding 514b short circuit.
On the other hand, shown in figure 12, in the acoustic boundary wave element 501, form IDT electrode 504 etc. at first, second medium 502, interface between 503, expose in the side of acoustic boundary wave element 501 at this interface.Therefore, moisture etc. might be invaded from the interface portion of exposing in the side of acoustic boundary wave element 501.For this reason, must be shown in figure 13, with around the acoustic boundary wave element chip 512, side especially, cover through above-mentioned outer dress resin bed 518.
Summary of the invention
The objective of the invention is to eliminate the defective of above-mentioned prior art; A kind of manufacturing approach and acoustic interfacial wave device that can easily obtain the acoustic interfacial wave device of acoustic interfacial wave device is provided, and this acoustic interfacial wave device has through resin cured matter can strengthen being used to be electrically connected the outside terminal of acoustic boundary wave element and the structure of the conductivity coupling part that is connected with outside terminal reliably.
Other purposes of the present invention are; Providing a kind of not only can be covered around outside terminal and the electrical connections that is connected with outside terminal of above-mentioned acoustic boundary wave element through resin cured matter reliably; It is strengthened, and the manufacturing approach of the outstanding acoustic interfacial wave device of the moisture part intrusion that is difficult to expose from the side of the acoustic boundary wave element at the interface between first, second medium of acoustic boundary wave element etc., anti-environmental characteristics, and this acoustic interfacial wave device.
The manufacturing approach of acoustic interfacial wave device involved in the present invention comprises: prepare the operation of acoustic boundary wave element, this acoustic boundary wave element has: first medium; Be laminated in first vectorial second medium; Be configured at least one the IDT electrode on the interface between first, second medium; With the outside terminal that is connected and is used for being connected with said IDT electrode electricity with external electric; Prepare the operation of curable resin sheet, this curable resin sheet has at least one that be configured to from side's interarea penetrates into the opposing party's interarea and crosses pore electrod; According on side's interarea of said curable resin sheet, the said outside terminal of said acoustic boundary wave element and said via hole electrode electricity ways of connecting dispose the operation of said acoustic boundary wave element; According to the mode that the part of by said curable resin sheet the interface between first, second medium of said acoustic boundary wave element being exposed at the outer surface of acoustic boundary wave element at least covers, said acoustic boundary wave element is pushed into the operation of said curable resin sheet; With the operation that said curable resin sheet is solidified.
A certain particular aspects in the manufacturing approach of acoustic interfacial wave device involved in the present invention; Utilize the acoustic boundary wave element that also has the convexity that engages and give prominence to said outside terminal downwards; As said acoustic boundary wave element; In with the operation of acoustic boundary wave arrangements of components to side's interarea of said curable resin sheet; The convex configuration that will be connected with said outside terminal is crossed on the pore electrod said, and outside terminal is connected with the via hole electrode electricity, the acoustic boundary wave element is being pushed in the operation of said curable resin sheet; The mode of crossing pore electrod according to said convexity being pressed into said curable resin sheet is pushed into said acoustic boundary wave element in the said curable resin sheet.
A certain particular aspects in the manufacturing approach of acoustic interfacial wave device involved in the present invention; In the operation of preparing said curable resin sheet; Preparation is at the structure of supporting mass upper support curable resin sheet, and the manufacturing approach of this acoustic interfacial wave device also comprises makes said curable resin sheet solidify the operation of removing said supporting mass afterwards.
Another particular aspects in the manufacturing approach of acoustic interfacial wave device involved in the present invention; In the operation of preparing said curable resin sheet; Preparation is crossed pore electrod and is provided with the mode that installation this electrode terminal pad with the installation base plate of electrode terminal pad is electrically connected at side's interarea according to said, and said curable resin sheet is configured to the structure on the installation base plate.
Another particular aspects in the manufacturing approach of acoustic interfacial wave device involved in the present invention; The compressional wave in the sheet that obtains that is cured through said curable resin sheet and the velocity of sound of shear wave are lower than the velocity of sound of compressional wave of propagating in first medium of said acoustic boundary wave element and second medium and shear wave.
In another other particular aspects of the manufacturing approach of acoustic interfacial wave device involved in the present invention, said acoustic boundary wave element also possesses the sound absorbing layer that the outer surface first, second vectorial side is provided with.
Another other particular aspects in the manufacturing approach of acoustic interfacial wave device involved in the present invention; When being pushed into said acoustic boundary wave element in the said curable resin sheet; Under folder is established the state of illusory convexity, said acoustic boundary wave element is pushed in the said curable resin sheet, the height of this illusory convexity equates with following distance: the distance between the said curable resin of the opposition side interarea that is pushed into the side in the said curable resin sheet of the said acoustic boundary wave element after being pressed into and acoustic interfacial wave device and the opposed side of this interarea is unilateral.
In the another particular aspects of the manufacturing approach of acoustic interfacial wave device involved in the present invention, the face that contacts with said curable resin sheet of said acoustic boundary wave element is by surface treatment.
Acoustic interfacial wave device involved in the present invention possesses: the acoustic boundary wave element, and it has: first medium; Be laminated in first vectorial second medium; Be configured at least one the IDT electrode on the interface between first, second medium; And outside terminal, it is connected with said IDT electrode electricity, and is drawn out to first, second medium in order to be connected with external electric wherein on the interarea of the vectorial and said interface of side opposition side; With the resin sheet solidfied material; The pore electrod of crossing that it is configured to be connected with the said outside terminal of said acoustic boundary wave element penetrates into the opposing party's interarea from side's interarea; And, be configured to arrive the side of said acoustic boundary wave element according to the mode that the part that the interface between said first, second medium is exposed at the outer surface of acoustic boundary wave element covers.
Another aspect according to acoustic interfacial wave device involved in the present invention also possesses: the acoustic boundary wave element, and it has: first medium; Be laminated in first vectorial second medium; Be configured at least one the IDT electrode on the interface between first, second medium; And outside terminal, it is connected with said IDT electrode electricity, and is drawn out to first, second medium in order to be connected with external electric wherein on the interarea of the vectorial and said interface of side opposition side; The resin sheet solidfied material; The pore electrod of crossing that it is configured to be connected with the said outside terminal of said acoustic boundary wave element penetrates into the opposing party's interarea from side's interarea; And, be configured to arrive the side of said acoustic boundary wave element according to the mode that the part that the interface between said first, second medium is exposed at the outer surface of acoustic boundary wave element covers; With the installation base plate that is fixed in said resin sheet solidfied material; Said installation base plate is provided with the through hole electrode that an end is connected with said via hole electrode electricity; The end of the opposition side of an end that is connected with said via hole electrode electricity of this through hole electrode arrives on said installation base plate and the face face opposition side that is equipped with said resin sheet solidfied material one side.
Aspect acoustic interfacial wave device involved in the present invention a certain specific; Said acoustic boundary wave element also possesses and is laminated in first medium and/or second vectorial sound absorbing layer; The said pore electrod of crossing connects this sound absorbing layer; According to this sound absorbing layer and the overlapping mode of said resin sheet solidfied material, the acoustic boundary wave element is laminated in said resin sheet solidfied material.
(invention effect)
In the manufacturing approach of acoustic interfacial wave device involved in the present invention; Be provided with according to the mode that penetrates into the opposing party's interarea from side's interarea on this side interarea of at least one curable resin sheet of crossing pore electrod; Disposed after the acoustic boundary wave element according to the outside terminal of acoustic boundary wave element and above-mentioned via hole electrode electricity ways of connecting; The mode that covers according to the part of by the curable resin sheet interface between first, second medium of acoustic boundary wave element being exposed at the outer surface of acoustic boundary wave element at least; The acoustic boundary wave element is pushed in the curable resin sheet, then perhaps simultaneously, the curable resin sheet is solidified while be pressed into.Therefore, around the above-mentioned part of crossing pore electrod that the outside terminal of above-mentioned acoustic boundary wave element and being provided with is electrically connected with outside terminal, solidfied material that can being cured property resin sheet is covered reliably.Thus, the pore electrod excessively that can fully strengthen the outside terminal of acoustic boundary wave element and be electrically connected with outside terminal.And, can omit miscellaneous operation that the bottom potting resin is filled, can easily add the part that good general's acoustic boundary wave element is connected with external electric.
On this basis; Because the interface between first, second medium of above-mentioned acoustic boundary wave element is covered by the solidfied material of above-mentioned curable resin sheet in the part that the outer surface of acoustic boundary wave element exposes reliably; So, can obtain the outstanding acoustic interfacial wave device of anti-environmental characteristics.
In the manufacturing approach of acoustic interfacial wave device of the present invention; Utilize the protruding acoustic boundary wave element of band from convex side configuration acoustic boundary wave element; The mode of crossing pore electrod push the curable resin sheet according to convexity is pushed into the acoustic boundary wave element under the situation of curable resin sheet, can obtain the acoustic interfacial wave device that the part that is connected with external electric of acoustic boundary wave element is reinforced.
Among the present invention; In the operation of preparing the curable resin sheet; Also possess preparation and the structure of curable resin sheet is arranged at the supporting mass upper support, and when after the curable resin sheet solidifies, removing the operation of supporting mass, the operation till proceeding to the curing of curable resin sheet on the supporting mass easily.
In the operation of preparing the curable resin sheet; When crossing pore electrod and be provided with the mode that installation this electrode terminal pad with the installation base plate of electrode terminal pad is electrically connected according to above-mentioned; When being configured in the curable resin sheet on the installation base plate, can easily obtain being connected to the structure on the installation base plate by crossing the outside terminal of pore electrod with above-mentioned acoustic boundary wave element.
The compressional wave in the resin cured matter that obtains that is cured through the curable resin sheet and the velocity of sound of shear wave; Under the low situation of the velocity of sound of compressional wave of propagating in first medium of acoustic boundary wave element and second medium and shear wave, can carry out sound-absorbing to undesirable ripple based on above-mentioned resin sheet solidfied material.That is,, also can suppress spuious, can obtain good frequency characteristic even sound absorbing layer is not set through other approach.
When the acoustic boundary wave element also possesses the sound absorbing layer that is provided with at first, second vectorial side's outer surface, can suppress undesirable wave propagation through sound absorbing layer, thus, can reduce spuious.
In the time will the acoustic boundary wave element being pushed in the curable resin sheet; Under folder is established the state of illusory convexity, the acoustic boundary wave element is pushed in the said curable resin sheet, the height of this illusory convexity equates with following distance: the distance between the said curable resin of the opposition side interarea that is pushed into the side in the said curable resin sheet of the said acoustic boundary wave element after being pressed into and acoustic interfacial wave device and the opposed side of this interarea is unilateral.Under this situation, can be through illusory convexity, with the solidfied material of acoustic boundary wave element, with the positive engagement such as installation base plate that are positioned at acoustic boundary wave element opposition side across the curable resin sheet.Promptly; Because the distance between two interareas of the height of above-mentioned illusory convexity and above-mentioned curable resin sheet equates; So, can make the end that engages a side opposition side with the acoustic boundary wave element of illusory convexity, expose face at the face opposition side that joins with the acoustic boundary wave element of curable resin sheet; Thus, illusory convexity capable of using with the acoustic boundary wave element reliably with other part bonding such as installation base plate.
The face that contacts with the curable resin sheet to the acoustic boundary wave element has carried out under the surface-treated situation; Can improve the connecting airtight property of the solidfied material of acoustic boundary wave element and curable resin sheet; Be suppressed at wave reflection at the interface between the two, thus, can prevent the reduction of frequency characteristic.
In acoustic interfacial wave device involved in the present invention, through the pore electrod of crossing that is arranged at the resin sheet solidfied material outside terminal of acoustic boundary wave element is connected with external electric, therefore, outside terminal and being strengthened reliably by above-mentioned resin sheet solidfied material on every side of pore electrod excessively.Thus, can strengthen reliably the electrical connections that the outside terminal of boundary wave element and outside terminal and installation base plate etc. are connected, even implement to install through reflow soldering method etc., these electrical connections also are difficult to produce deterioration or undesirable short circuit.And, owing to the boundary between first, second medium is covered by above-mentioned resin sheet solidfied material, so anti-environmental characteristics also improves effectively.
And; On the interarea of the interarea opposition side that contacts with the acoustic boundary wave element of above-mentioned resin sheet solidfied material, be fixed with installation base plate; The through hole electrode that is arranged at installation base plate is connected with the above-mentioned via hole electrode electricity of resin sheet solidfied material; The end that is connected a side opposition side with the via hole electrode electricity at through hole electrode; Arrive under the situation of installation base plate and the face face opposition side that is equipped with resin sheet solidfied material one side, the acoustic interfacial wave device that can carry out mounted on surface from above-mentioned installation base plate side at tellite etc. can be provided.
In acoustic interfacial wave device of the present invention; The acoustic boundary wave element also possesses and is layered in first medium and/or second vectorial sound absorbing layer; Cross pore electrod and connect sound absorbing layer; The acoustic boundary wave element layer being laminated under the situation on the resin sheet solidfied material according to sound absorbing layer and the overlapping mode of resin sheet solidfied material, can carry out sound-absorbing to undesirable ripple through the existence of sound absorbing layer, can reduce spuious thus.
Description of drawings
Fig. 1 is that the master of the related acoustic interfacial wave device of first embodiment of the invention looks cutaway view.
Fig. 2 is used for the master that the employed acoustic boundary wave element of acoustic interfacial wave device shown in Figure 1 describes is looked cutaway view.
Fig. 3 (a) and (b) be to be used for stereogram and the main cutaway view of looking that the manufacturing approach to the acoustic interfacial wave device of execution mode shown in Figure 1 describes.
Fig. 4 (a) and (b) be the cutaway view of the expression operation that a plurality of acoustic boundary wave elements is pushed into the curable resin sheet and be used for the signal master that pore electrod describes that crosses who is arranged at the curable resin sheet is looked cutaway view.
Fig. 5 (a) and (b) be used to explain with the acoustic boundary wave element be pushed into the operation that forms outer dress resin bed after the curable resin sheet, and each master of the operation after forming outer dress resin bed, cut off by each acoustic interfacial wave device unit look cutaway view.
Fig. 6 is that the master of variation of the acoustic boundary wave element of expression first execution mode looks cutaway view.
Fig. 7 is used to explain that the master of the acoustic interfacial wave device of second execution mode looks cutaway view.
Fig. 8 is that the master of the related acoustic interfacial wave device of third embodiment of the invention looks cutaway view.
Fig. 9 is that the master of variation of the employed acoustic boundary wave element of acoustic interfacial wave device of expression the 3rd execution mode looks cutaway view.
Figure 10 is used to explain that the master of another variation of the employed acoustic boundary wave element of acoustic interfacial wave device of the present invention looks cutaway view.
Figure 11 (a)～(c) is used for each main cutaway view of looking that the manufacturing approach to the acoustic interfacial wave device that utilized illusory convexity (dummy bump) describes.
Figure 12 is used to explain that the signal master of existing acoustic boundary wave element looks cutaway view.
Figure 13 is used to explain that the signal master of an example of existing acoustic interfacial wave device looks cutaway view.
Among the figure: 1-acoustic interfacial wave device, 10,10A-acoustic boundary wave element, the 11-first medium layer, the 12-second medium layer, 13-IDT electrode; 14,15-electrode, 16a, 16b-cross pore electrod, 17-installation base plate, 17A-installation base plate, 18-curable resin sheet; 18A-resin sheet solidfied material, the 19-diaphragm, 20-crosses pore electrod, and 20a, 20b-cross pore electrod, the 21-pressing plate; The resin-coated layer of 22-, 23a, 23b-through hole electrode, 24, the 25-terminal electrode, 26, the 27-connection electrode, 32-sound absorbing layer; 33,34-crosses pore electrod, and 35, the 36-electrode, below the 42-resin sheet solidfied material, 42a-resin sheet solidfied material 42,43a, 43b-cross pore electrod; 45,46-terminal electrode, 51-acoustic interfacial wave device, 52A-resin sheet solidfied material, 53, the 54-metal bump, 55-sound absorbing layer; 57,58-crosses pore electrod, 61-installation base plate, 62, the 63-metal film, 64, the illusory convexity of 65-.
Embodiment
Below, through describing, come clear and definite the present invention with reference to the accompanying drawing specific embodiments of the invention.
With reference to Fig. 1～Figure 15, the manufacturing approach of the related acoustic interfacial wave device of first embodiment of the invention is described.
At first, prepare acoustic boundary wave element 10 shown in Figure 2.Acoustic boundary wave element 10 has the first medium layer 11 and the range upon range of structure of the second medium layer 12.In this execution mode, the first medium layer 11 is by LiNbO
3Piezoelectricity monocrystal substrates such as monocrystal substrate constitute.In addition, first medium 11 also can be formed by the piezoelectric beyond the piezoelectric monocrystal.
In first medium 11 and second medium 12 at the interface, be formed with IDT electrode 13 and the electrode that is connected with IDT electrode 13 14,15.In acoustic boundary wave element 10, through excitation IDT electrode 13, the acoustic boundary wave of propagating at the interface of 11,12 of first, second mediums capable of using.In acoustic boundary wave element 10, owing to the ripple that is utilized is propagated at the interface of 11,12 of first, second mediums, so, can carry out mechanical support through the face with above-mentioned interface opposition side of first, second medium 11,12.
In second medium 12, be provided with from said interface and cross pore electrod 16a, 16b with the face of the above-mentioned interface opposition side of second medium 12, below promptly.Cross pore electrod 16a, 16b has after the inner peripheral surface of through hole has formed conducting film, through plating method by the structure in the metal filled through hole.In addition, cross not special qualification of formation method of pore electrod 16a, 16b, also can form pore electrod 16a, 16b through other method.
The upper end of crossing pore electrod 16a, 16b is electrically connected with electrode 14,15 respectively.And, cross pore electrod 16a, 16b arrive second medium 12 below.
In this execution mode, shown in Fig. 3 (a), prepared parent installation base plate 17, a plurality of acoustic boundary wave elements 10 have been installed on installation base plate 17.Constitute not special qualification of material of above-mentioned parent installation base plate 17.For example can adopt pottery, synthetic resin or glass etc. such as metal, aluminium such as stainless steel.
On above-mentioned parent installation base plate 17, be formed with the electrode terminal pad (land) that is electrically connected with above-mentioned pore electrod 16a, the 16b excessively of acoustic boundary wave element 10.To narrate in the back for this electrode terminal pad etc.
In Fig. 3 (a) and (b), omitted the diagram of the electrode terminal pad etc. of formation on installation base plate 17.
In this execution mode, on parent installation base plate 17, disposed parent curable resin sheet 18.Represent though in Fig. 3 (a) and (b), omit diagram ground, in Fig. 4 (b), amplify the details of having represented parent curable resin sheet.Parent curable resin sheet 18 utilizes and softens based on heating, shows flowability, and the heat-curing resin constituent that solidifies based on further heating then forms.As such heat-curing resin constituent, for example preferably use heat-curing resins such as epoxy resin and contain the resin combination of inorganic fillings.
In this execution mode, above-mentioned heat-curing resin constituent contains epoxy resin, curing agent for epoxy resin and inorganic fillings.Can use carbon, silicon, tungsten etc. as above-mentioned inorganic fillings.Through containing inorganic fillings, can control the flowability of heating process, and can improve the intensity and the dimensional stability of solidifying the back solidfied material.
In addition, in the present invention, the curable resin constituent that constitutes the curable resin sheet also can not contain inorganic fillings.
And, as above-mentioned curable resin constituent, can adopt the suitable resin combination that shows flowability and solidify based on heating through the enforcement cured.That is, be not limited to the heat-curing resin constituent, can also use the light-cured resin constituent that solidifies through the irradiation of light as resin combination.
Shown in Fig. 4 (b), above-mentioned curable resin sheet 18 is configured on the parent installation base plate 17.In these parent curable resin sheet 18 laminated diaphragm 19 is arranged.As diaphragm 19,, then can use the film that constitutes by suitable synthetic resin material as long as before using, can protect the surface of curable resin sheet 18.As such film, can suitably adopt the synthetic resin film that constitutes by PETG or polypropylene etc.
Then, form a plurality of pore electrod 20a, the 20b of crossing shown in Fig. 4 (b). Cross pore electrod 20a, 20b forms through hole through carrying out machining or laser radiation etc. from diaphragm 19 sides at above-mentioned curable resin sheet 18, then, filled conductive cream and it is solidified to form in through hole.As this conductive paste, can suitably adopt metal dust and the above-mentioned inserts and the together mixing cream that forms of solvent that will constitute by Ag, Cu or their alloy.
Above-mentioned through hole can adopt appropriate method such as etching methods such as the method for having utilized laser such as carbonic acid gas laser, PRK, chemical etching or mechanical processing method to form.And the formation of above-mentioned through hole can be carried out before curable resin sheet 18 being laminated in installation base plate 17.In a word, preferably form through hole according to the mode that connects diaphragm 19 and curable resin sheet 18 both sides.
The filling of conductive paste in above-mentioned through hole can be pushed (squeezing) and carry out through coating electrically conductive cream above said protection film 19 then.Then, after conductive paste being filled in the above-mentioned through hole, conductive paste is carried out drying, curing.
In addition, make that conductive paste is dry, under the state that solidifies owing to can not solidify because of heating, so, cross sclerosis fully of pore electrod 20a, 20b, when the acoustic boundary wave element of stating is backward pushed, cross pore electrod 20a, 20b can be out of shape.
Above the curable resin sheet 18 prepared as stated, peel off diaphragm 19.Then, shown in Fig. 3 (a) and (b), a plurality of acoustic boundary wave elements 10 are configured on the curable resin sheet 18.In Fig. 3 (a) and (b), as stated, illustrate curable resin sheet 18 briefly, and omitted the above-mentioned diagram of crossing pore electrod 20.
Above-mentioned acoustic boundary wave element 10 is being configured to 18 last times of curable resin sheet, according to the lower end of crossing pore electrod 16a, 16b shown in Figure 2 respectively with the mode of crossing pore electrod 20a, 20b butt, acoustic boundary wave element 10 is positioned.That is, according to side below first medium 11 of acoustic boundary wave element 10, above-mentioned cross pore electrod 16a, 16b respectively with the mode of crossing pore electrod 20a, 20b butt of above-mentioned curable resin sheet 18, acoustic boundary wave element 10 is positioned.Under this state, shown in Fig. 4 (a), smooth pressing plate 21 below the butt is pushed into acoustic boundary wave element 10 in the curable resin sheet 18 above acoustic boundary wave element 10.
This amount of being pressed into is as shown in Figure 1, is controlled so as to the part that expose in the side of acoustic boundary wave element 10 at the interface of 11,12 of first, second mediums of acoustic boundary wave element 10, and the solidfied material of being cured property resin sheet 18 covers.That is, shown in Fig. 4 (a), when acoustic boundary wave element 10 enters into curable resin sheet 18 based on pushing, also be coated with curable resin sheet 18 in the side of acoustic boundary wave element 10.And the mode that being cured property of the part resin sheet 18 that exposes in the side of acoustic boundary wave element 10 according to above-mentioned interface covers is controlled the above-mentioned amount of being pressed into.
In order to make curable resin sheet 18 easy deformation when above-mentioned being pressed into, preferably being heating and curing property resin sheet, carry out above-mentioned being pressed into improving under the mobile state.That is,, in advance the stand (stage) that disposes above-mentioned installation base plate 17 is heated in order to make curable resin sheet 18 softening.Thus, above-mentioned curable resin constituent 18 softens based on heating, and curable resin sheet 18 is heated to the degree that flowability is enhanced.Preferably except the following stand that disposes to above-mentioned parent installation base plate 17 heats, also heater is thermally bonded to the pressing plate 21 with the top butt of said acoustic boundary wave element 10.Under this situation,, make acoustic boundary wave element 10 be heated because heat is transmitted to acoustic boundary wave element 10 from pressing plate 21, so, the flowability of the curable resin sheet 18 that contacts with acoustic boundary wave element 10 can further be improved.Therefore, can easily above-mentioned acoustic boundary wave element 10 be pushed in the curable resin sheet 18.
And, when curable resin sheet 18 has can carry out above-mentioned be pressed into mobile swimmingly the time heating that needn't be used to improve above-mentioned flowability at normal temperatures.
When carrying out above-mentioned being pressed into, fully do not solidify owing to cross pore electrod 20a, 20b, so, if be pressed into, then can deform by outside terminal 16a, 16b, can contact reliably with outside terminal 16a, 16b.
Then, above-mentioned curable resin sheet 18 is solidified.In this execution mode, owing to form curable resin sheet 18 through the heat-curing resin constituent, so the heating condition that takes place to solidify with this heat-curing resin constituent heats curable resin sheet 18.Make curable resin sheet 18 completely crued operations based on heating, can carry out simultaneously with the operation that acoustic boundary wave element 10 is pushed into above-mentioned curable resin sheet 18.
Through curable resin sheet 18 is solidified, pore electrod 20a, 20b also can solidify based on heating excessively.
Like this, the curable resin sheet is cured, and becomes the resin sheet solidfied material.
Then, shown in Fig. 5 (a), on resin sheet solidfied material 18A, form resin-coated layer 22 according to the mode that covers acoustic boundary wave element 10.Resin-coated layer 22 can be through drippage, the curing of aqueous resin, or based on the formation such as modelling of transfer printing (transfer) formation device.In addition, also can pass through lamination (laminate) resin identical or identical resin combination, form resin-coated layer 22 with the resin that constitutes above-mentioned curable resin sheet 18.Resin-coated layer 22 forms the outer surface that above-mentioned acoustic boundary wave element 10 is exposed and covers.Then, shown in Fig. 5 (b),, obtain acoustic interfacial wave device 1 cutting off by the part of single-point line expression.This cut-out can utilize slicing machine suitable shearing devices such as (dicer) to carry out.
Fig. 1 is as stated and the master of the acoustic interfacial wave device of this execution mode that obtains looks cutaway view.In acoustic interfacial wave device 1,, on the installation base plate 17A that obtains through cut-out parent installation base plate 17, acoustic boundary wave element 10 is installed across resin sheet solidfied material 18A.Can know by Fig. 1, on installation base plate 17A, be formed with through hole electrode 23a, 23b.Below through hole electrode 23a, 23b are formed into above installation base plate 17A.On the other hand, below installation base plate 17A, be formed with the terminal electrode 24,25 that is used to realize mounted on surface.Terminal electrode 24,25 is electrically connected with the lower end of through hole electrode 23a, 23b.
And the upper end of through hole electrode 23a, 23b is electrically connected with the top connection electrode that is arranged on installation base plate 17A 26,27.This connection electrode 26,27 is electrically connected with the lower end of crossing pore electrod 20a, 20b respectively.The upper end of crossing pore electrod 20a, 20b is electrically connected with pore electrod 16a, the 16b excessively of acoustic boundary wave element 10.Therefore, in acoustic interfacial wave device 1, because mistake pore electrod 16a, the 16b of terminal electrode 24,25 and acoustic boundary wave element 10 be electrically connected, so, can utilize terminal electrode 24,25, on tellite etc., carry out mounted on surface.
On the other hand, expose in the side of acoustic boundary wave element 10 at the interface that is formed with IDT electrode 15 of acoustic boundary wave element 10, and the part that expose in the side at this interface is covered by resin sheet solidfied material 18A.Therefore, moisture etc. is difficult to invade from above-mentioned interface.
And above-mentioned resin sheet solidfied material 18A is cured based on hot curing, has enough mechanical strengths.Therefore, can be fully and through crossing pore electrod 20a, 20b reliably to strengthening around the electrical connections of acoustic boundary wave element 10 and installation base plate 17A.And, when acoustic boundary wave element 10 is equipped on installation base plate, need not fill the miscellaneous operation that is used to strengthen the bottom potting resin of electrical connections and makes its curing.
Therefore, according to this execution mode,, can form the electrical connections of acoustic boundary wave element 10 and installation base plate 17A, and can fully strengthen this electrical connections not needing like the filling of bottom potting resin and solidifying under the situation of such miscellaneous operation.Under this situation; Cross pore electrod 20a, 20b owing to strengthened as electrical connections by resin sheet solidfied material 18A; So, when acoustic interfacial wave device 1 being installed on tellite etc., even the heat of being applied in through reflow soldering method etc.; Above-mentioned electrical connections can local dissolution yet, and is difficult to produce short circuit etc.Thereby, can improve the reliability when installing.
And as stated, the part of exposing at outer surface owing to the interface of acoustic boundary wave element 10 is covered by resin sheet solidfied material 18A reliably, so, can also improve moisture-proof and anti-environmental characteristics.
In addition, in this execution mode, the upper section that is not covered by above-mentioned resin sheet solidfied material 18A is covered by resin-coated layer 22, and thus, the whole outer surface of acoustic boundary wave element 10 is covered reliably, can further improve anti-environmental characteristics.
In addition, in acoustic interfacial wave device shown in Figure 11, acoustic boundary wave element 10 has had the structure of first, second medium 11,12 range upon range of, but acoustic boundary wave element 31 that kind that also can be as shown in Figure 6, and range upon range of below second medium 12 have a sound absorbing layer 32.Under this situation, formed pore electrod 33,34 according to the mode that connects sound absorbing layer 32.The upper end of crossing pore electrod 33,34 is connected with above-mentioned pore electrod 16a, 16b excessively, and the lower end of crossing pore electrod 33,34 is electrically connected with electrode 35,36.This electrode 35,36 has constituted the outside terminal of the acoustic boundary wave element of invention.
Therefore, electrode 35,36 is electrically connected with pore electrod 20a, the 20b excessively that are arranged on resin sheet solidfied material 18A shown in Figure 1.
Like this, also can replace the acoustic boundary wave element 10 of above-mentioned execution mode, and use acoustic boundary wave element 31 with sound absorbing layer 32.Above-mentioned sound absorbing layer 32 to be propagated spuious (spurious) that the ripple that comes causes and is provided with in order to reduce from second medium 12.Therefore; The acoustic impedance of sound absorbing layer 32 preferably has the acoustic impedance value between the acoustic impedance of acoustic impedance and resin sheet solidfied material 18A of second medium 12; Thus; Propagate the ripple that comes from second medium 12 and can be prevented to propagate into the above-mentioned interface side of acoustic boundary wave element 10 by second medium 12 and the interface of sound absorbing layer 32 and the boundary reflection of sound absorbing layer 32 and resin sheet solidfied material 18A.Therefore, can obtain spuious few good frequency characteristic.
Material to constituting above-mentioned sound absorbing layer 32 as long as satisfy the relation of above-mentioned acoustic impedance value, does not then have special qualification, for example can enumerate synthetic resin etc.
Fig. 7 is that the master of the acoustic interfacial wave device that obtains of the manufacturing approach of the acoustic interfacial wave device of expression through second embodiment of the invention looks cutaway view.In this execution mode, acoustic interfacial wave device 41 is identical with the situation of first execution mode, has also used acoustic boundary wave element 10.But, range upon range of below acoustic boundary wave element 10 have a resin sheet solidfied material 42, in resin sheet solidfied material 42, was provided with pore electrod 43a, 43b.The upper end and mistake pore electrod 16a, the 16b that cross pore electrod 43a, 43b are connected.On the other hand, the lower end of crossing pore electrod 43a, 43b arrive resin sheet solidfied material 42 below.And, be in mode according to following 42a with one side with resin sheet solidfied material 42, below resin sheet solidfied material 42, be embedded with terminal electrode 45,46.That is, the following 42a of the following and resin sheet solidfied material 42 of terminal electrode 45,46 becomes with one side.And the lower end of crossing pore electrod 43a, 43b is electrically connected with terminal electrode 45,46.
Above-mentioned resin sheet solidfied material 42 is identical with the situation of first execution mode, is configured to the part of exposing in the side at the interface that is formed with IDT electrode 15 of acoustic boundary wave element 10 is covered.
As this execution mode, for the following 43a with terminal electrode 45,46 and resin sheet solidfied material 43 forms with one side, as long as adopt following method.
That is, on as the stand of supporting mass, form terminal electrode 45,46.For the formation of this terminal electrode 45,46, can adopt suitable film forming method such as sputtering method or vapor deposition etc.
Form terminal electrode 45, after 46, through coating curing property resin combination and make it dry, forming the curable resin sheet.Then, on the curable resin sheet, formed pore electrod 43a, 43b.Then, being heating and curing property resin sheet, same with first execution mode under this state, through pushing acoustic boundary wave element 10 from the top, and then the curable resin sheet is heated, thereby can obtain resin sheet solidfied material 42.In this case, make resin sheet solidfied material 42 softening, to be pressed into acoustic boundary wave element 10 under the mobile state having improved, to get final product to cover the part that the curable resin sheet exposes in the side at the interface of above-mentioned acoustic boundary wave element 10 as long as wait based on heating.Then,, the curable resin sheet is solidified, can form resin sheet solidfied material 42 based on heating through under the state that has been pressed into acoustic boundary wave element 10 as stated, being cured.Afterwards, following through with resin sheet solidfied material 42, the following 42a of resin sheet solidfied material 42 is become with simultaneously below terminal electrode 45,46 from separating as the stand of supporting mass.
This execution mode is also same with first execution mode, can through resin sheet solidfied material 42 strengthen reliably acoustic boundary wave element 10 cross pore electrod 16a, 16b, be the part that is connected with external electric of outside terminal and the conduct of acoustic boundary wave element 10 mistake pore electrod 43a, 43b and terminal electrode 45,46 around.And, can be by resin sheet solidfied material 42 part that above-mentioned interface exposes in the side that is covered reliably.Therefore, identical with the situation of first execution mode, reliability and the outstanding acoustic interfacial wave device of anti-environmental characteristics can be provided.
Fig. 8 is used for the master that the related acoustic interfacial wave device of third embodiment of the invention describes is looked cutaway view.
In acoustic interfacial wave device 51, metal bump 53,54 engages with the lower end of crossing pore electrod 16a, 16b of acoustic boundary wave element 10.During fabrication, identical with the situation of first execution mode, can remove the diaphragm on the curable resin sheet 18.Then, there is the acoustic boundary wave element 10 of metal bump 53,54 to be configured on the curable resin sheet with engaging below, and likewise pushes with the situation of first execution mode.As a result, be pushed into according to metal bump 53,54 and cross pore electrod 20a, 20b in the curable resin sheet, cross the mode that the height dimension of pore electrod 20a, 20b reduces, make and softened, improved mobile curable resin sheet distortion based on heating.Thus, metal bump 53,54 can be with pore electrod 20a, 20b contact reliably excessively.Then, make it to solidify, formed resin sheet solidfied material 18A through the curable resin sheet is further heated.
Like this; Acoustic boundary wave element 10 can also further possess metal bump 53,54 below; Also same under this situation with the situation of first execution mode, can through resin sheet solidfied material 18A add reliably part that good general's acoustic boundary wave element 10 is connected with external electric around.
In addition, in acoustic interfacial wave device shown in Figure 8 51, used acoustic boundary wave element 10, but also can be as shown in Figure 9, the acoustic boundary wave element 56 that further is provided with sound absorbing layer 55 used.Under this situation, joint has metal bump 53,54 below sound absorbing layer 55, in sound absorbing layer 55, is formed with the pore electrod 57,58 excessively that engages with metal bump.Perhaps, also can form the metal bump of size that runs through sound absorbing layer 55 and arrive the below as metal bump 53,54.That is, also can be pre-formed, form sound absorbing layer 55 then the metal bump 53,54 of Fig. 9 and the metal bump of mistake pore electrod 57,58 incorporate sizes.
In addition, sound absorbing layer 55 also can likewise constitute with above-mentioned sound absorbing layer 32.
Figure 10 is that the master of employed acoustic boundary wave element 10A looks cutaway view in the manufacturing approach of acoustic interfacial wave device of expression four embodiment of the invention.Employed acoustic boundary wave element 10 is roughly the same in the acoustic boundary wave element 10A and first execution mode.Therefore, give same reference marks and omit its explanation to identical part.
Shown in Figure 11 (a), prepare installation base plate 61. Form electrode 26,27 and the terminal electrode 24,25 that is electrically connected with through hole electrode 23a, 23b below on installation base plate 61, reaching respectively.
This execution mode is with the difference of first execution mode, on installation base plate 61, is formed with metal film 62,63, and on this metal film 62,63, engaging has illusory metal bump 64,65. Preferable alloy film 62,63 is to form with above-mentioned electrode 26,27 identical materials, identical operation.But metal film 62,63 also can utilize other material to form through different operations.
The purpose that is provided with of metal film 62,63 is metal bump 64,65 is bonded on the installation base plate 61 securely.Metal bump the 64, the 65th, illusory convexity, it is provided with purpose and is: acoustic boundary wave element 10 is engaged with installation base plate 61 with desirable height and position.In addition, shown in figure 10, below acoustic boundary wave element 10A, also be formed with metal film 66,67.
Shown in Figure 11 (a), make acoustic boundary wave element 10A from the top and softened, improved mobile curable resin sheet 18 butts, and be pressed into based on heating.Then, being heating and curing property resin sheet 18 makes its curing.Like this, shown in Figure 11 (c), can be identical with the situation of first execution mode, obtain the acoustic interfacial wave device 71 that electrical connections is strengthened by resin sheet solidfied material 18A.Here, because metal bump 64,65 forms illusory convexity, so, can easily control the amount of being pressed into when acoustic boundary wave element 10A is pushed into the curable resin sheet.
In addition; In this execution mode; Metal bump 64,65 as illusory convexity is formed on installation base plate 61 sides, but also can shown in Figure 11 (b), in advance metal bump 64,65 be engaged with the following of acoustic boundary wave element 10; With likewise above-mentioned, control to the curable resin sheet by the fashionable amount of being pressed into.
Claims (10)
1. the manufacturing approach of an acoustic interfacial wave device comprises:
Prepare the operation of acoustic boundary wave element, this acoustic boundary wave element has: first medium; Be laminated in first vectorial second medium; Be configured at least one the IDT electrode on the interface between first, second medium; With the outside terminal that is connected and is used for being connected with said IDT electrode electricity with external electric;
Prepare the operation of curable resin sheet, this curable resin sheet has at least one that be configured to from side's interarea penetrates into the opposing party's interarea and crosses pore electrod;
According on side's interarea of said curable resin sheet, the said outside terminal of said acoustic boundary wave element and said via hole electrode electricity ways of connecting dispose the operation of said acoustic boundary wave element;
According to the mode that the part of by said curable resin sheet the interface between first, second medium of said acoustic boundary wave element being exposed at the outer surface of acoustic boundary wave element at least covers, said acoustic boundary wave element is pushed into the operation of said curable resin sheet; With
The operation that said curable resin sheet is solidified.
2. the manufacturing approach of acoustic interfacial wave device according to claim 1 is characterized in that,
Utilize the acoustic boundary wave element that also has the convexity that engages and give prominence to said outside terminal downwards, as said acoustic boundary wave element,
In with the operation of acoustic boundary wave arrangements of components to side's interarea of said curable resin sheet, the convex configuration that will be connected with said outside terminal is crossed on the pore electrod said, outside terminal is connected with the via hole electrode electricity,
The acoustic boundary wave element is being pushed in the operation of said curable resin sheet, the mode of crossing pore electrod according to said convexity being pressed into said curable resin sheet is pushed into said acoustic boundary wave element in the said curable resin sheet.
3. the manufacturing approach of acoustic interfacial wave device according to claim 1 and 2 is characterized in that,
In the operation of preparing said curable resin sheet, prepare structure at supporting mass upper support curable resin sheet,
The manufacturing approach of this acoustic interfacial wave device also comprises makes said curable resin sheet solidify the operation of removing said supporting mass afterwards.
4. the manufacturing approach of acoustic interfacial wave device according to claim 1 and 2 is characterized in that,
In the operation of preparing said curable resin sheet; Preparation is crossed pore electrod and is provided with the mode that installation this electrode terminal pad with the installation base plate of electrode terminal pad is electrically connected at side's interarea according to said, and said curable resin sheet is configured to the structure on the installation base plate.
5. the manufacturing approach of acoustic interfacial wave device according to claim 1 and 2 is characterized in that,
The compressional wave in the sheet that obtains that is cured through said curable resin sheet and the velocity of sound of shear wave are lower than the velocity of sound of compressional wave of propagating in first medium of said acoustic boundary wave element and second medium and shear wave.
6. the manufacturing approach of acoustic interfacial wave device according to claim 1 and 2 is characterized in that,
Said acoustic boundary wave element also possesses the sound absorbing layer that on first, second vectorial side's outer surface, is provided with.
7. the manufacturing approach of acoustic interfacial wave device according to claim 1 and 2 is characterized in that,
When being pushed into said acoustic boundary wave element in the said curable resin sheet; Under folder is established the state of illusory convexity, said acoustic boundary wave element is pushed in the said curable resin sheet, the height of this illusory convexity equates with following distance: the distance between the said curable resin of the opposition side interarea that is pushed into the side in the said curable resin sheet of the said acoustic boundary wave element after being pressed into and acoustic interfacial wave device and the opposed side of this interarea is unilateral.
8. the manufacturing approach of acoustic interfacial wave device according to claim 1 and 2 is characterized in that,
The face that contacts with said curable resin sheet to said acoustic boundary wave element carries out surface treatment.
9. acoustic interfacial wave device possesses:
The acoustic boundary wave element, it has: first medium; Be laminated in first vectorial second medium; Be configured at least one the IDT electrode on the interface between first, second medium; And outside terminal, it is connected with said IDT electrode electricity, and is drawn out to first, second medium in order to be connected with external electric wherein on the interarea of the vectorial and said interface of side opposition side;
The resin sheet solidfied material; The pore electrod of crossing that it is configured to be connected with the said outside terminal of said acoustic boundary wave element penetrates into the opposing party's interarea from side's interarea; And, be configured to arrive the side of said acoustic boundary wave element according to the mode that the part that the interface between said first, second medium is exposed at the outer surface of acoustic boundary wave element covers; With
Be fixed in the installation base plate of said resin sheet solidfied material;
Said installation base plate is provided with the through hole electrode that an end is connected with said via hole electrode electricity; The end of the opposition side of an end that is connected with said via hole electrode electricity of this through hole electrode arrives on said installation base plate and the face face opposition side that is equipped with said resin sheet solidfied material one side.
10. acoustic interfacial wave device according to claim 9 is characterized in that,
Said acoustic boundary wave element also possesses and is laminated in first medium and/or second vectorial sound absorbing layer; The said pore electrod of crossing connects this sound absorbing layer; According to this sound absorbing layer and the overlapping mode of said resin sheet solidfied material, the acoustic boundary wave element is laminated in said resin sheet solidfied material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP327772/2005 | 2005-11-11 | ||
| JP2005327772 | 2005-11-11 | ||
| PCT/JP2006/320279 WO2007055080A1 (en) | 2005-11-11 | 2006-10-11 | Method for manufacturing elastic boundary wave apparatus, and elastic boundary wave apparatus |
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| CN101305516A CN101305516A (en) | 2008-11-12 |
| CN101305516B true CN101305516B (en) | 2012-08-22 |
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| JP (1) | JP4631912B2 (en) |
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| WO (1) | WO2007055080A1 (en) |
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| JP4992908B2 (en) | 2006-11-13 | 2012-08-08 | 株式会社村田製作所 | Boundary acoustic wave element, boundary acoustic wave device, and method of manufacturing boundary acoustic wave device |
| WO2010029657A1 (en) | 2008-09-09 | 2010-03-18 | 株式会社村田製作所 | Elastic wave device |
| US11437563B2 (en) | 2017-07-17 | 2022-09-06 | Samsung Electro-Mechanics Co., Ltd. | Acoustic wave device and method of manufacturing the same |
| KR102449356B1 (en) * | 2017-07-17 | 2022-10-04 | 삼성전기주식회사 | Acoustic wave device and manufacturing method thereof |
| CN111121843B (en) * | 2019-12-18 | 2021-03-02 | 上海交通大学 | Integrated packaging structure and packaging method of surface acoustic wave sensor |
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| JP3537400B2 (en) * | 2000-03-17 | 2004-06-14 | 松下電器産業株式会社 | Semiconductor built-in module and method of manufacturing the same |
| JP2004007051A (en) * | 2002-05-30 | 2004-01-08 | Mitsubishi Electric Corp | Sealing member, and method for producing surface acoustic wave apparatus by using the same |
| JP3815424B2 (en) * | 2002-11-08 | 2006-08-30 | 株式会社村田製作所 | Boundary acoustic wave device |
| KR100850861B1 (en) * | 2004-01-19 | 2008-08-06 | 가부시키가이샤 무라타 세이사쿠쇼 | Acoustic boundary wave device |
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| WO2007055080A1 (en) | 2007-05-18 |
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