CN101305495B - Level radar and method for manufacturing waveguide junction in level radar - Google Patents
Level radar and method for manufacturing waveguide junction in level radar Download PDFInfo
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- CN101305495B CN101305495B CN200680042265.1A CN200680042265A CN101305495B CN 101305495 B CN101305495 B CN 101305495B CN 200680042265 A CN200680042265 A CN 200680042265A CN 101305495 B CN101305495 B CN 101305495B
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- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 230000008878 coupling Effects 0.000 claims abstract description 46
- 238000010168 coupling process Methods 0.000 claims abstract description 46
- 238000005859 coupling reaction Methods 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 7
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/284—Electromagnetic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- Waveguides (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
According to one exemplary embodiment of the present invention, a waveguide junction is specified for a filling level radar, which junction has a printed circuit board in which a resonator is integrated. The resonator is used together with a coupling element to output radio-frequency waves from a supply line, which is likewise integrated in the printed circuit board, into a waveguide which is screwed to the printed circuit board. There is therefore no need for any external resonator.
Description
Related application
The present invention requires the priority of the U.S. Provisional Patent Application 60/736,460 of submitting on November 14th, 2005 and the German patent application 102005054233.6 of submitting on November 14th, 2005, and its content is incorporated herein by reference.
Technical field
The present invention relates to level gauging.Especially, the present invention relates to a kind of waveguide junction for fill level radar, a kind of fill level radar for determining the tank material level, with the application of waveguide junction for level gauging, and a kind of method for the manufacture of this waveguide junction.
Background technology
The published apparatus for measuring charge level that utilizes electromagnetic wave to measure material level has the electromagnetic electronic equipment of generation.The electromagnetic wave that generates for example is directed to antenna by coaxial conductor subsequently, and is coupled by corresponding Coupling device and is input in the antenna.
US0030141940A1 and US0030168674A1 have exemplarily addressed two kinds of little band waveguide junctions, and wherein high frequency substrate and coupling element all together stretch in the waveguide respectively.Yet in two documents, waveguide all must be sealed with resonator at the opposite side of circuit board.This resonator must very accurately align.For (in the identical pack situation of the radiation that antenna sends) reduces the size of device, what be worth expectation is to improve the electromagnetic frequency that generates.Yet, also improved thus the requirement for the electromagnetic electronic equipment of generation, and also improved the requirement to receiving element and analytic unit.Especially, it is important in this that the electromagnetic wave that realization will send in the waveguide maybe will be from electromagnetic more pure coupling input or the coupling output of waveguide reception, wherein should be coupled input or coupling output link to each other antenna with electronic equipment.
Summary of the invention
Task of the present invention is that improved coupling output or the coupling input of high frequency waves from conductor to waveguide is provided.
According to one embodiment of present invention, a kind of waveguide junction for fill level radar is provided, the coupling output unit that this waveguide junction comprises multilayer circuit board, is used for the lead-in wire of guide electromagnetic waves and is used for electromagnetic wave is outputed to from the lead-in wire coupling waveguide, this coupling output unit comprises the coupling element resonant cavity, and wherein this resonant cavity is integrated in the circuit board.
Therefore, waveguide junction has coupling device, and this coupling device is integrally embedded in the circuit board, does not need external resonator.Or rather, electromagnetic wave directly carries out in circuit board from the coupling output that goes between to waveguide.Be integrated in the circuit board by the output unit that will be coupled, can during the manufacture process of circuit board or the course of processing, integrally make the coupling output unit.Because be not designed for the external resonator of coupling output unit, thus the problem related with mechanical tolerance do not had at this yet, and this problem can occur in situation about resonator being installed on the circuit board.
Circuit board has a plurality of track plans (Leitungsebenen), and these track plans are connected with each other by electric penetrating part (Druchfuehrungen), and can support corresponding electronic unit.
According to another embodiment of the present invention, circuit board comprises ground floor and the second layer, and the output unit that wherein is coupled is integrated in the ground floor, and wherein the second layer has insulating material, and wherein the second layer is arranged on the ground floor, so that it covers the coupling output unit.
According to another embodiment of the present invention, waveguide junction comprises the 3rd layer in addition, and the 3rd layer is arranged between ground floor and the second layer, and wherein ground floor is embodied as the circuit board substrate material of insulation, and wherein the 3rd layer be thin metallide.
According to this embodiment of the invention, the resonator of the coupling output unit circuit board substrate material that is positioned at insulation wherein can cover with metallide.On this metallide, can the second layer be set in the mode of plate subsequently.Thus, form the sandwich-like thing that is consisted of by circuit board substrate and the second layer, between circuit board substrate and the second layer, be provided with metallide.This metallide is used as the ground plane (Masseflaeche) of the microstripline on the second layer on the one hand, on the other hand as the wave guide wall in the resonator of coupling output unit.
According to another embodiment of the present invention, ground floor contains metal.
In this case, need not the metallide of the 3rd layer of form.
According to another embodiment of the present invention, the coupling output unit is embodied as the coupling element that links to each other with resonator.
Resonator can be the cavity in the ground floor, and this cavity for example generates by etching technics, milling process or bore process etc.
According to another embodiment of the present invention, resonator has and the corresponding degree of depth of the thickness of ground floor.
In this case, the cavity of resonator for example can be simply, and (with the form of the through hole of ground floor) got out by ground floor, perhaps ground floor can be simply by complete erosion thoroughly.
According to another embodiment of the present invention, the second layer is high frequency substrate.
At this, for example can relate to Rogers RT Duroid.Thus, the coupling of the high frequency waves propagated in the second layer may be input in the resonator, so that high frequency waves can further be coupled and are input in (for example outside) waveguide.
According to another embodiment of the present invention, ground floor is high frequency substrate.
According to another embodiment of the present invention, resonator is filled with dielectric.
According to another embodiment of the present invention, the second layer has the penetrating part in the zone of coupling output unit, in order to provide pressure balance between resonator and environment.
Thus, when high temperature fluctuation occurring, can avoid the cracking of multilayer.Otherwise this temperature fluctuation meeting causes the huge pressure differential between resonator inside and the environment.
According to another embodiment of the present invention, lead-in wire is integrated in the second layer basically.
Possible is that coupling output unit and lead-in wire integrally are fabricated during the manufacture process of support plate in this way.In this case, the mechanical registeration between coupling output unit and the lead-in wire no longer is necessary, because these two is integrated in the support plate regularly.
According to another embodiment of the present invention, lead-in wire is implemented as little band.
According to another embodiment of the present invention, lead-in wire is implemented as for guiding has electromagnetic wave in the frequency between the 60GHz to 100GHz, and the output unit that wherein is coupled is implemented as for the electromagnetic wave that will have in the frequency between the 60GHz to 100GHz and outputs to waveguide from the lead-in wire coupling.
Thus, provide the coupling output of frequency electromagnetic waves from circuit board to waveguide, this coupling output is also implemented the frequency that surpasses 60GHz, and can the appearance problem related with mechanical tolerance or aligning at this.
According to another embodiment of the present invention, waveguide junction is integrally made in course of manufacturing printed circuit board.
According to another embodiment of the present invention, provide a kind of fill level radar, this fill level radar is implemented for the material level of determining tank.This fill level radar comprises: be used for emission and/or receive electromagnetic antenna, be used for electromagnetic wave is presented feeding means to antenna, wherein feeding means has in addition for the waveguide with electromagnetic wave transmission between antenna and lead-in wire, and wherein feeding means has above-mentioned waveguide junction.
This fill level radar does not have outside resonator, is input in the waveguide with the high frequency waves coupling that will be generated.Or rather, resonator directly is integrated in the circuit board.Thus, the tolerance issues of having avoided resonator to install.In addition, reduced the number of machine components, this causes again mounting cost to reduce.Especially, this fill level radar also is suitable for surpassing the high frequency radiation of 60GHz.
According to another embodiment of the present invention, waveguide links to each other with support plate by fixture, so that electromagnetic wave can output to the waveguide from the lead-in wire coupling by the coupling output unit.
In addition, the present invention has also illustrated and will be used for according to waveguide junction of the present invention the application of level gauging.
In addition, a kind of method for the manufacture of this waveguide junction is provided, ground floor wherein is provided, made up and be used for electromagnetic wave is outputed to resonator waveguide, the ground floor from the lead-in wire coupling, made up the second layer, and made up be used for guide electromagnetic waves, basically at the lead-in wire of the second layer, wherein resonator is integrated in the ground floor.
Thus, provide a kind of method, provide the whole waveguide junction of making during the circuit board fabrication process by the method.At this, resonator is the whole part of circuit board.
According to another embodiment of the present invention, the method also has the 3rd layer structure, and the 3rd layer is arranged between ground floor and the second layer, and wherein ground floor is embodied as the circuit board substrate material of insulation, and wherein the 3rd layer contain metal.
According to another embodiment of the present invention, the structure of coupling output unit comprises etch step, milling step or laser drill step, in case of necessity, has followed metallization step after this step.
Other embodiment of the present invention, task and advantage are by obtaining in the dependent claims.
Hereinafter with reference to accompanying drawing the preferred embodiments of the present invention are described.
Fig. 1 shows the schematic sectional view of waveguide junction according to an embodiment of the invention.
Fig. 2 shows the schematic sectional view of waveguide junction according to another embodiment of the present invention.
Fig. 3 shows the schematic plan of waveguide junction according to an embodiment of the invention.
Fig. 4 shows the schematic diagram of fill level radar according to another embodiment of the present invention.
Fig. 5 shows exemplary prior art.
View in the accompanying drawing is schematically and not to conform with ratio.During accompanying drawing was below described, identical or similar element used identical reference number.
That Fig. 1 shows is according to an embodiment of the invention, be used for the schematic sectional view of the waveguide junction of fill level radar.As seeing in Fig. 1, waveguide junction 100 mainly has circuit board 120, and this circuit board is made of a plurality of layers (104,105,115), and resonant cavity 102 is embedded in these layers.Downside at circuit board 120 is provided with the layer that high frequency substrate 105 consists of tabularly.At high frequency substrate 105 microstripline 107 (to this also can referring to Fig. 3) is arranged, this microstripline is used for electromagnetic wave is transferred to coupling element 121 from signal source (not shown in Figure 1).Coupling element 121 for example is the extension of microstripline 107, and this extension guides in the waveguide that is made of guide blocks (Hohlleiterstueck) 103 resonant cavity 102.
Lead-in wire 107 for example also may be embodied as strip line or implements in tri-plate (Triplate).In tri-plate, lead-in wire 107 is arranged in internal layer.
Waveguide 103 is connected on the high frequency substrate 105, and wherein this high frequency substrate for example can be Rogers RT Duroid or teflon (Teflon) or another insulating material.Waveguide can be adhered on the substrate 105 at this.Perhaps as shown in Figure 1, waveguide can screw up with waveguide junction 100 by fixture 110,111, riveted joint, bolt are connected, and is perhaps otherwise fixing.In present case, fixture 111 is flanges, and it links to each other with waveguide is fastening.Fixture 110 for example is screw rod, and this screw rod passes sandwich-like thing 120 and locks with corresponding nut 116 overleaf.
Resonant cavity is for example made by milling or boring.If forward little size to, then particularly also can consider lithographic method, as in the course of manufacturing printed circuit board or employed in the semiconductor processing techniques.Especially, by photolithographic structures and lithographic method, can be implemented in micrometer range or more among a small circle in size.
Another kind of possibility for the manufacture of resonator is laser drill, wherein by laser beam circuit board material is removed.
During making waveguide junction 100, resonant cavity 102 is introduced in the board layer 104.Board layer 104 for example can be glass fiber-reinforced epoxy resin net (for example FR-4).If board layer 104 is made of insulating material, then be provided with metallide 106 at the back side of board layer 104, this metallide can be applied in after the resonant cavity 102 of leaving a blank out.Subsequently, high frequency substrate 105 is adhered to, and this high frequency substrate 105 for example has the thickness of 0.127mm.Nature, according to electromagnetic frequency or requirement, other thickness also may.
According to one embodiment of present invention, the degree of depth 112 of resonant cavity is corresponding to the thickness 113 of board layer 104.In present case, the degree of depth 112 of resonant cavity is less than the thickness 113 of board layer 104.The diameter of resonant cavity 102 is for example corresponding to the diameter of waveguide 103.
In addition, designed passage (via) 108, it passes high frequency substrate 105 metal level 106 between high frequency substrate 105 and the board layer 104 is linked to each other with the back side 117 of high frequency substrate 105.This path 10 8 is for example implemented circularly.Nature, other cross sections also are possible.In addition, path 10 8 can be used for Quasi-Waveguide 103.For this reason, waveguide 103 can have locking pin, and it is coupled in the recess of path 10 8.Yet this locking pin 118 is optional.
Waveguide junction is formed by circuit board 120, and wherein this circuit board is embodied as multilayer circuit board (Multilayer).Multilayer circuit board comprises board layer 104 and the setting board layer 115 thereon that supports resonant cavity 102 at this, and this board layer 115 is for example implemented by exotic material (for example FR-4).Between two board layers 104,115, for example be provided with metal level 119.In addition, passage 114 (via) can be set, it is connected with the metallide on the downside of the upside of the board layer 115 on top and high frequency substrate 105 and/or with layer 119 or 106 conduction of inside.
Upside at board layer 115 can arrange electronic unit 122,109, and these electronic units for example can be analytical electron equipment, perhaps also can be for the electronic equipment that generates high frequency waves.
In addition, resonant cavity can be filled with suitable dielectric (for example teflon or circuit board material).
Fig. 2 shows the schematic sectional view of waveguide junction according to another embodiment of the present invention.Waveguide junction shown in Fig. 2 corresponds essentially to the waveguide junction among Fig. 1.Yet layer 104 is not to be embodied as insulating circuit board at this, but is embodied as metallic plate, and this metallic plate has the hole that mills out for resonant cavity 102.
Because the enforcement metal of plate 104, conduction is so need not metal level 106 between plate 104 and high frequency substrate 105.Fastening screw 110 can be directly and metallic plate 104 screw up, perhaps otherwise be fixed on the metallic plate 104.Fastening screw 110 is unnecessary by the penetrating part of whole multilayer circuit board 120.
Fig. 3 shows the schematic diagram of waveguide junction according to an embodiment of the invention with vertical view.As can see from Figure 3, little band waveguide junction has lead-in wire, and this lead-in wire is embodied as microstripline by the metallide 107 of band shape at high frequency substrate 105 back sides.This lead-in wire is used for frequency electromagnetic waves is guided to coupling element 121 and resonant cavity 102 (and reverse leading) from signal source.
In addition, designed path 10 8,302,303,304,305,306,307, they are connected to each other to two metallization object planes on the upside of major general's high frequency substrate 105 and the downside.These passages also can pass through whole circuit board, and thus a plurality of metal layers (for example 105,119) are connected to each other.These path 10s 8,302 to 307 for example can be implemented circularly, and advantageously, additionally can also be used for the aligning purpose of waveguide 103.For this reason, corresponding locking pin 118 can be installed in waveguide 103.Yet this is not must be necessary, because waveguide 103 also can otherwise be adjusted.
In addition, can see hole 301 in Fig. 3, it is used for the air balance between resonant cavity and environment or waveguide.
Little size with waveguide junction can be for the frequency of for example 60GHz to 100GHz and is designed.Little band waveguide junction according to the present invention also can be implemented for higher frequency simply, and its mode is that size is correspondingly reduced.
Fig. 4 shows the schematic diagram of fill level radar according to an embodiment of the invention.Be designed for the fill level radar of determining the material level in the tank and comprise for emission or receive electromagnetic wave 403,404 antenna 401 at this, and comprise for the feeding means 402 of electromagnetic wave being presented to antenna.Feeding means has waveguide 103 in addition, is used at antenna 401 and the transmission electromagnetic wave 403,404 between 107 that goes between.In addition, feeding means 402 has such as the little band waveguide junction described at Fig. 1 to 3.
Figure 5 illustrates from microstripline 107 to waveguide 103 a kind of published knot.High-frequency signal by the microstripline guiding arrives waveguide 103 by coupling element 121, and this waveguide one side is with resonator 102 sealings.Resonator for example is embodied as and covers 501, and it has the blind hole as resonant cavity.This lid 501 now or be screwed onto, adhere to, snap into or otherwise method be fixed on the circuit board 105.At this, note the accurate aligning of cover gab and waveguide openings.Simultaneously, locating circuit board accurately.Another disadvantage of this device is, cannot placing component in the scope of lid 501 at the back side of circuit board 105.
Addedly, it is to be noted that " comprising " do not get rid of other features or step, " one " or " one " does not get rid of a plurality of.It is to be noted in addition, also can be combined with other features or the step of other above-described embodiments with reference to the described feature of one of above-described embodiment or step.Reference marker in the claims should not be considered as restriction.
Claims (13)
1. fill level radar of be used for determining the material level of tank, described fill level radar comprises:
Be used for emission and/or receive electromagnetic wave (403; 404) antenna (401);
Be used for electromagnetic wave (403; 404) present feeding means (402) to antenna (401);
Wherein feeding means (402) has waveguide (103), and this waveguide (103) is used for making electromagnetic wave (403; 404) transmission between antenna (401) and lead-in wire (107); And
Wherein feeding means (402) has for electromagnetic wave is outputed to the waveguide junction of waveguide from lead-in wire coupling, and wherein said waveguide junction comprises:
Printed circuit board (PCB) (120), wherein said printed circuit board (PCB) (120) comprise on ground floor (104), the second layer (105) and the second layer (105) back side or the second layer (105) in the lead-in wire (107) that is used for guide electromagnetic waves;
The coupling output unit that comprises coupling element (121) resonant cavity (102) is used for electromagnetic wave is outputed to waveguide (103) from lead-in wire (107) coupling;
Wherein resonant cavity (102) is integrated in the ground floor (104) as cavity;
Wherein the second layer (105) has insulating material;
Wherein ground floor (104) has insulating material and the metallide (106) of the form with the 3rd layer wherein is set at the back side of ground floor (104), this metallide (106) is as the ground plane of lead-in wire (107) and as the wave guide wall in the resonant cavity (102), and this metallide (106) is arranged between ground floor (104) and the second layer (105);
Wherein the second layer (105) is arranged under the ground floor (104), so that the second layer (105) covers resonant cavity (102).
2. fill level radar according to claim 1,
Wherein resonant cavity (102) has the degree of depth (112) corresponding to the thickness (113) of ground floor (104).
3. fill level radar according to claim 1 and 2,
Wherein the second layer (105) is high frequency substrate.
4. fill level radar according to claim 1 and 2,
Wherein ground floor (104) is high frequency substrate.
5. fill level radar according to claim 1 and 2,
Wherein resonant cavity (102) is filled with dielectric.
6. fill level radar according to claim 1 and 2,
Wherein the second layer (105) has penetrating part (301) in the zone of coupling output unit, in order to provide pressure balance between resonant cavity (102) and environment.
7. fill level radar according to claim 1 and 2,
Wherein lead-in wire (107) is integrated in the second layer (105).
8. fill level radar according to claim 1 and 2,
Wherein lead-in wire (107) is implemented as little band.
9. fill level radar according to claim 1 and 2,
Wherein lead-in wire (107) is implemented as for guiding and has electromagnetic wave in the frequency between the 60GHz to 100GHz, and
The output unit that wherein is coupled is implemented as for the electromagnetic wave that will have in the frequency between the 60GHz to 100GHz and outputs to waveguide (103) from the lead-in wire coupling.
10. fill level radar according to claim 1 and 2,
Wherein waveguide (103) is by fixture (110; 111) link to each other with printed circuit board (PCB) (120), so that electromagnetic wave (403; 404) can output to the waveguide (103) from lead-in wire (107) coupling by the coupling output unit.
11. fill level radar according to claim 1 and 2,
Wherein waveguide junction is integrally made in course of manufacturing printed circuit board.
12. one kind for the manufacture of the method for each the described waveguide junction in 11 according to claim 1, said method comprising the steps of:
Printed circuit board (PCB) (120) is provided, and wherein said printed circuit board (PCB) (120) comprises ground floor (104) and the second layer (105);
Make up the resonant cavity as cavity in the ground floor;
To be arranged on the second layer (105) back side or the second layer (105) with its whole length for the lead-in wire of guide electromagnetic waves;
The metallide (106) of the form with the 3rd layer is set at the back side of ground floor (104), and this metallide is applied in after the resonant cavity of leaving a blank out;
Wherein the second layer (105) is arranged under the ground floor (104), so that the second layer (105) covers resonant cavity (102);
Wherein the second layer (105) has insulating material;
Wherein ground floor (104) has insulating material and wherein this metallide (106) is as the ground plane of lead-in wire (107) and as the wave guide wall in the resonant cavity (102), and this metallide (106) is arranged between ground floor (104) and the second layer (105).
13. method according to claim 12,
Wherein the structure of the resonant cavity in ground floor comprises etch step, milling step or laser drill step.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73646005P | 2005-11-14 | 2005-11-14 | |
| US60/736,460 | 2005-11-14 | ||
| DE102005054233.6 | 2005-11-14 | ||
| DE200510054233 DE102005054233A1 (en) | 2005-11-14 | 2005-11-14 | Waveguide junction for level radar, has decoupling unit with coupling unit and resonating cavity for decoupling of electromagnetic waves into waveguide, where resonating cavity is integrated in printed circuit board |
| PCT/EP2006/010863 WO2007054355A1 (en) | 2005-11-14 | 2006-11-13 | Waveguide junction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101305495A CN101305495A (en) | 2008-11-12 |
| CN101305495B true CN101305495B (en) | 2013-01-16 |
Family
ID=37982682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200680042265.1A Active CN101305495B (en) | 2005-11-14 | 2006-11-13 | Level radar and method for manufacturing waveguide junction in level radar |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101305495B (en) |
| DE (1) | DE102005054233A1 (en) |
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| DE102012104075A1 (en) * | 2012-05-09 | 2013-11-14 | Endress + Hauser Gmbh + Co. Kg | Device for determining and / or monitoring at least one process variable of a medium |
| DE102014117315A1 (en) * | 2014-11-26 | 2016-06-02 | Endress + Hauser Gmbh + Co. Kg | Device for transmitting signals from a housing opening of a metallic housing |
| DE102015113224A1 (en) * | 2015-08-11 | 2017-02-16 | Endress + Hauser Gmbh + Co. Kg | Radar Level Transmitter |
| DE102015119690A1 (en) * | 2015-11-13 | 2017-05-18 | Endress + Hauser Gmbh + Co. Kg | Radar-based level sensor |
| EP3355419B1 (en) * | 2017-01-25 | 2019-03-27 | Rosenberger Hochfrequenztechnik GmbH & Co. KG | Connector for connecting a waveguide with at least one electric conductor |
| CN110582891A (en) * | 2017-02-03 | 2019-12-17 | Ami 研发有限责任公司 | Dielectric traveling wave waveguide with varactors for controlling beam direction |
| DE102017203832B3 (en) | 2017-03-08 | 2018-05-03 | Vega Grieshaber Kg | Housing for a high-frequency chip |
| EP3450931B1 (en) * | 2017-08-28 | 2022-10-05 | VEGA Grieshaber KG | Hollow line coupling for a fill level radar |
| HUE049220T2 (en) * | 2017-12-04 | 2020-09-28 | Grieshaber Vega Kg | Printed circuit board for use in a radar fill level measuring device with hollow wire coupling |
| CN108801398B (en) * | 2018-06-27 | 2019-11-05 | 福州盛博电子有限公司 | A kind of 120GHz frequency modulated continuous wave radar level meter and distance measuring method |
| CN211045436U (en) * | 2019-07-07 | 2020-07-17 | 深南电路股份有限公司 | Circuit board |
| DE102020112787A1 (en) | 2020-01-13 | 2021-07-29 | Infineon Technologies Ag | High frequency device with high frequency chip and waveguide structure |
| DE102020102037A1 (en) * | 2020-01-28 | 2021-07-29 | Krohne Messtechnik Gmbh | Radar array |
| DE102020133198B4 (en) | 2020-12-11 | 2023-10-05 | Endress+Hauser SE+Co. KG | High-frequency module for a level measuring device and level measuring device |
| DE102021201394A1 (en) | 2021-02-15 | 2022-08-18 | Vega Grieshaber Kg | TWO-PIECE WAVEGUIDE CONNECTION DEVICE |
| DE102021118191A1 (en) | 2021-07-14 | 2023-01-19 | Vega Grieshaber Kg | high frequency radar module |
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|---|---|---|---|---|
| US5770981A (en) * | 1995-03-31 | 1998-06-23 | Nec Corporation | Composite microwave circuit module having a pseudo-waveguide structure |
| EP0874415A2 (en) * | 1997-04-25 | 1998-10-28 | Kyocera Corporation | High-frequency package |
| WO2001088488A1 (en) * | 2000-05-13 | 2001-11-22 | Endress + Hauser Gmbh + Co. Kg. | Level meter |
| JP2003174263A (en) * | 2001-12-07 | 2003-06-20 | Murata Mfg Co Ltd | Multilayer electronic component |
-
2005
- 2005-11-14 DE DE200510054233 patent/DE102005054233A1/en not_active Withdrawn
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2006
- 2006-11-13 CN CN200680042265.1A patent/CN101305495B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770981A (en) * | 1995-03-31 | 1998-06-23 | Nec Corporation | Composite microwave circuit module having a pseudo-waveguide structure |
| EP0874415A2 (en) * | 1997-04-25 | 1998-10-28 | Kyocera Corporation | High-frequency package |
| WO2001088488A1 (en) * | 2000-05-13 | 2001-11-22 | Endress + Hauser Gmbh + Co. Kg. | Level meter |
| JP2003174263A (en) * | 2001-12-07 | 2003-06-20 | Murata Mfg Co Ltd | Multilayer electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101305495A (en) | 2008-11-12 |
| DE102005054233A1 (en) | 2007-05-16 |
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